HI-SINCERITY Spec. No. : HL200101 Issued Date : 2000.01.15 Revised Date : 2001.12.06 Page No. : 1/3 MICROELECTRONICS CORP. H1N5817 thru H1N5819 1.0 AMP. SCHOTTKY BARRIER RECTIFIERS Features • Low Forward Voltage Drop • High Current Capability • High Reliability • High Surge Current Capability Maximum Ratings Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Type Number H1N5817 H1N5818 H1N5819 Units Maximum Recurrent Peak Reverse Voltage 20 30 40 V Maximum RMS Voltage 14 21 28 V Maximum DC Blocking Voltage 20 30 40 V Maximum Average Forward Rectified Current 0.375"(9.5mm) Lead Length @ TL=90°C 1 A Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) 25 A Maximum Instantaneous Forward Voltage @ 1A 0.45 0.550 0.600 V Maximum Instantaneous Forward Voltage @ 3A 0.750 0.875 0.900 V 10 (@ Ta=100°C) mA mA Typical Thermal Resistance (Note 1) RθJA 50 °C /W Typical Junction Capacitance (Note 2) 110 pF Operating Temperature Range Tj -65 to +125 °C Storage Temperature Range TSTG -65 to +125 °C Maximum DC Reverse Current At Rated DC Blocking Voltage 1 (@ Ta=25°C) Note 1: Thermal resistance from junction to ambient vertical PC Board Mounting, 0.375”(9.5mm) lead length. Note 2: Measured at 1Mhz and applied reverse voltage of 4V D.C. H1N5817, H1N5818, H1N5819 HSMC Product Specification HI-SINCERITY Spec. No. : HL200101 Issued Date : 2000.01.15 Revised Date : 2001.12.06 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Fig.1 - Maximum Forward Current Derating Curve Fig.2 - Typical Junction Capactitance 1000 0.75 Capacitance (pF) Average Forward Current (A) 1.00 0.50 100 0.25 0.00 10 0 25 50 75 100 125 150 175 0.1 o Lead Temperature ( C) 10 100 Reverse Voltage (V) Fig.3 - Typical Forward Characteristics Fig.4 - Maximum Non-Repetitive Forward Surge Current 100 30 Peak Forward Surge Current (A) Instantaneous Forward Current (A) . 1 H1N5817 10 H1N5818,H1N5819 1 Tj=25oC Pulse Width=300us 1% Duty Cycle 0.1 25 20 8.3ms Single Half Sine Wave JIDIC Method 15 10 5 0 0.1 0.3 0.5 0.7 0.9 1.1 1.3 Forward Soltage (V) H1N5817, H1N5818, H1N5819 1.5 1.7 1.9 2.1 1 10 100 Number Of Cycles At 60Hz HSMC Product Specification HI-SINCERITY Spec. No. : HL200101 Issued Date : 2000.01.15 Revised Date : 2001.12.06 Page No. : 3/3 MICROELECTRONICS CORP. DO-41 Dimension E A B C D DO-41 Molded Plastic Package HSMC Package Code: L *: Typical Inches Min. Max. 0.0280 0.0340 1.0000 0.1600 0.2050 DIM A B C Millimeters Min. Max. 0.71 0.86 25.40 4.10 5.20 DIM D E Inches Min. Max. 1.0000 0.0800 0.1070 Millimeters Min. Max. 25.40 2.00 2.70 Notes: 1.Dimension and tolerance based on our Spec. dated May 28,1998. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H1N5817, H1N5818, H1N5819 HSMC Product Specification