NXP ADC1006S070H Single 10 bits adc, up to 55 mhz or 70 mhz Datasheet

ADC1006S055/070
Single 10 bits ADC, up to 55 MHz or 70 MHz
Rev. 02 — 12 August 2008
Product data sheet
1. General description
The ADC1006S055/070 are a family of Bipolar CMOS (BiCMOS) 10-bit Analog-to-Digital
Converters (ADC) optimized for a wide range of applications such as cellular
infrastructures, professional telecommunications, imaging, and digital radio. It converts
the analog input signal into 10-bit binary coded digital words at a maximum sampling rate
of 70 MHz. All static digital inputs (SH, CE and OTC) are Transistor-Transistor Logic (TTL)
and CMOS compatible and all outputs are CMOS compatible. A sine wave clock input
signal can also be used.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
10-bit resolution
Sampling rate up to 70 MHz
−3 dB bandwidth of 245 MHz
5 V power supplies and 3.3 V output power supply
Binary or two’s complement CMOS outputs
In-range CMOS compatible output
TTL and CMOS compatible static digital inputs
TTL and CMOS compatible digital outputs
Differential AC or Positive Emitter-Coupled Logic (PECL) clock input; TTL compatible
Power dissipation 550 mW (typical)
Low analog input capacitance (typical 2 pF), no buffer amplifier required
Integrated sample-and-hold amplifier
Differential analog input
External amplitude range control
Voltage controlled regulator included
−40 °C to +85 °C ambient temperature
3. Applications
High-speed analog-to-digital conversion for:
n Cellular infrastructure
n Professional telecommunication
n Digital radio
n Radar
n Medical imaging
n Fixed network
n Cable modem
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
n Barcode scanner
n Cable Modem Termination System (CMTS)/Data Over Cable Service Interface
Specification (DOCSIS)
4. Quick reference data
Table 1.
Quick reference data
VCCA = V2 to V44, V3 to V4 and V41 to V40 = 4.75 V to 5.25 V; VCCD = V37 to V38 and
V15 to V17 = 4.75 V to 5.25 V; VCCO = V33 to V34 = 3.0 V to 3.6 V; AGND and DGND shorted
together; Tamb = −40 °C to +85 °C; VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V;
VI(cm) = VCCA3 − 1.6 V; typical values measured at VCCA = VCCD = 5 V and VCCO = 3.3 V,
Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
VCCA
analog supply voltage
4.75
5.0
5.25
V
VCCD
digital supply voltage
4.75
5.0
5.25
V
VCCO
output supply voltage
3.0
3.3
3.6
V
ICCA
analog supply current
-
78
87
mA
ICCD
digital supply current
-
27
30
mA
ICCO
output supply current
fclk = 20 MHz;
fi = 400 kHz
-
3
4
mA
INL
integral non-linearity
fclk = 20 MHz;
fi = 400 kHz
-
±0.65
±1.12
LSB
DNL
differential non-linearity
fclk = 20 MHz;
fi = 400 kHz
(no missing code
guaranteed)
-
±0.12
±0.27
LSB
fclk(max)
maximum clock
frequency
ADC1006S055H
55
-
-
MHz
ADC1006S070H
70
-
-
MHz
total power dissipation
fclk = 55 MHz;
fi = 20 MHz
-
550
660
mW
Ptot
Conditions
Min
Typ
Max
Unit
5. Ordering information
Table 2.
Ordering information
Type number
Package
Sampling
frequency
(MHz)
Name
Description
Version
ADC1006S055H
QFP44
plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 × 10 × 1.75 mm
SOT307-2 55
ADC1006S070H
QFP44
plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 × 10 × 1.75 mm
SOT307-2 70
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
2 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
6. Block diagram
VCCA1
VCCA3 VCCA4
2
3
CLKN
41
CLK
VCCD1
VCCD2
37
15
36
35
CE
OTC
19
18
6 to 10, 13,
14, 16, 31, 32
n.c.
21 D9
CLOCK DRIVER
FSREF
VREF
12
VREF
REFERENCE
23 D7
24 D6
11
25 D5
AMP
CMOS
OUTPUTS
sample and - hold
INN
SH
CMADC
DEC
LATCHES
28 D2
42
29 D1
s
39
30 D0
33
1
CMADC
REFERENCE
OVERFLOW/
UNDERFLOW
LATCH
5
ADC1006S055/070
44
4
AGND1
40
AGND3 AGND4
data
outputs
26 D4
27 D3
ANALOG-TO-DIGITAL
CONVERTER
43
IN
MSB
22 D8
CMOS
OUTPUT
20
17
34
DGND1 DGND2
OGND
38
LSB
VCCO
IR
014aaa464
Fig 1. Block diagram
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
3 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
7. Pinning information
34 OGND
35 CLKN
36 CLK
37 VCCD1
38 DGND1
39 SH
40 AGND4
41 VCCA4
42 IN
43 INN
44 AGND1
7.1 Pinning
CMADC
1
33 VCCO
VCCA1
2
32 n.c.
VCCA3
3
31 n.c.
AGND3
4
30 D0
DEC
5
n.c.
6
n.c.
7
27 D3
n.c.
8
26 D4
n.c.
9
25 D5
n.c. 10
24 D6
VREF 11
23 D7
29 D1
D8 22
28 D2
D9 21
IR 20
CE 19
OTC 18
DGND2 17
n.c. 16
VCCD2 15
n.c. 14
n.c. 13
FSREF 12
ADC1006S055/070
014aaa442
Fig 2. Pin configuration
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
CMADC
1
regulator output common mode ADC input
VCCA1
2
analog supply voltage 1 (5 V)
VCCA3
3
analog supply voltage 3 (5 V)
AGND3
4
analog ground 3
DEC
5
decoupling node
n.c.
6
not connected
n.c.
7
not connected
n.c.
8
not connected
n.c.
9
not connected
n.c.
10
not connected
VREF
11
reference voltage input
FSREF
12
full-scale reference output
n.c.
13
not connected
n.c.
14
not connected
VCCD2
15
digital supply voltage 2 (5 V)
n.c.
16
not connected
DGND2
17
digital ground 2
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
4 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Table 3.
Pin description …continued
Symbol
Pin
Description
OTC
18
control input two’s complement output; active HIGH
CE
19
chip enable input (CMOS level; active LOW)
IR
20
in-range output
D9
21
data output; bit 9 (Most Significant Bit (MSB))
D8
22
data output; bit 8
D7
23
data output; bit 7
D6
24
data output; bit 6
D5
25
data output; bit 5
D4
26
data output; bit 4
D3
27
data output; bit 3
D2
28
data output; bit 2
D1
29
data output; bit 1
D0
30
data output; bit 0 (Least Significant Bit (LSB))
n.c.
31
not connected
n.c.
32
not connected
VCCO
33
output supply voltage (3.3 V)
OGND
34
output ground
CLKN
35
complementary clock input
CLK
36
clock input
VCCD1
37
digital supply voltage 1 (5 V)
DGND1
38
digital ground 1
SH
39
sample-and-hold enable input (CMOS level; active HIGH)
AGND4
40
analog ground 4
VCCA4
41
analog supply voltage 4 (5 V)
IN
42
analog input voltage
INN
43
complementary analog input voltage
AGND1
44
analog ground 1
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Min
Max
Unit
analog supply voltage
[1]
−0.3
+7.0
V
digital supply voltage
[1]
−0.3
+7.0
V
VCCO
output supply voltage
[1]
∆VCC
supply voltage difference
VCCA
VCCD
Parameter
Conditions
Vi(IN)
input voltage on pin IN
Vi(INN)
input voltage on pin INN
−0.3
+7.0
V
VCCA − VCCD
−1.0
+1.0
V
VCCD − VCCO
−1.0
+4.0
V
VCCA − VCCO
−1.0
+4.0
V
0.3
VCCA
V
0.3
VCCA
V
referenced to
AGND
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
5 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Vi(clk)(p-p)
peak-to-peak clock input
voltage
differential clock
drive at pins
35 and 36
-
VCCD
V
IO
output current
-
10
mA
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tj
junction temperature
-
150
°C
[1]
The supply voltages VCCA, VCCD and VCCO may have any value between −0.3 V and +7.0 V provided that
the supply voltage differences ∆VCC are respected.
9. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Condition
Value
Unit
Rth(j-a)
thermal resistance from junction to
ambient
in free air
75
K/W
10. Characteristics
Table 6.
Characteristics
VCCA = V2 to V44, V3 to V4 and V41 to V40 = 4.75 V to 5.25 V; VCCD = V37 to V38 and V15 to V17 = 4.75 V to 5.25 V;
VCCO = V33 to V34 = 3.0 V to 3.6 V; AGND and DGND shorted together; Tamb = −40 °C to +85 °C;
VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V; VI(cm) = VCCA3 − 1.6 V; typical values measured at VCCA = VCCD = 5 V
and VCCO = 3.3 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Test[1] Min
Conditions
Typ
Max
Unit
Supplies
VCCA
analog supply
voltage
4.75
5.0
5.25
V
VCCD
digital supply
voltage
4.75
5.0
5.25
V
VCCO
output supply
voltage
3.0
3.3
3.6
V
ICCA
analog supply
current
I
-
78
87
mA
ICCD
digital supply
current
I
-
27
30
mA
ICCO
output supply
current
fclk = 20 MHz; fi = 400 kHz
I
-
3
4
mA
fclk = 55 MHz; fi = 20 MHz
I
-
9.5
12
mA
total power
dissipation
fclk = 55 MHz; fi = 20 MHz
-
550
660
mW
Ptot
Inputs
CLK and CLKN (referenced to DGND)[2]
VIL
LOW-level input
voltage
PECL mode; VCCD = 5 V
I
3.19
-
3.52
V
TTL mode
C
0
-
0.8
V
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
6 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Table 6.
Characteristics …continued
VCCA = V2 to V44, V3 to V4 and V41 to V40 = 4.75 V to 5.25 V; VCCD = V37 to V38 and V15 to V17 = 4.75 V to 5.25 V;
VCCO = V33 to V34 = 3.0 V to 3.6 V; AGND and DGND shorted together; Tamb = −40 °C to +85 °C;
VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V; VI(cm) = VCCA3 − 1.6 V; typical values measured at VCCA = VCCD = 5 V
and VCCO = 3.3 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Conditions
Test[1] Min
Typ
Max
Unit
VIH
HIGH-level input
voltage
PECL mode; VCCD = 5 V
I
3.83
-
4.12
V
TTL mode
C
2.0
-
VCCD
V
IIL
LOW-level input
current
VCLK or VCLKN = 3.19 V
C
−10
-
-
µA
IIH
HIGH-level input
current
VCLK or VCLKN = 3.83 V
C
-
-
10
µA
Vi(dif)(p-p)
peak-to-peak
differential input
voltage
AC driving mode;
DC voltage level = 2.5 V
C
1
1.5
2.0
V
Ri
input resistance
fclk = 55 MHz
D
2
-
-
kΩ
Ci
input capacitance
fclk = 55 MHz
D
-
-
2
pF
OTC, SH and CE (referenced to DGND); see Table 7 and 8
VIL
LOW-level input
voltage
I
0
-
0.8
V
VIH
HIGH-level input
voltage
I
2.0
-
VCCD
V
IIL
LOW-level input
current
VIL = 0.8 V
I
−20
-
-
µA
IIH
HIGH-level input
current
VIH = 2.0 V
I
-
-
20
µA
IN and INN (referenced to AGND); see Table 7, VVREF = VCCA3 − 1.75 V
IIL
LOW-level input
current
SH = HIGH
C
-
10
-
µA
IIH
HIGH-level input
current
SH = HIGH
C
-
10
-
µA
Ri
input resistance
fi = 20 MHz
D
-
14
-
MΩ
Ci
input capacitance
fi = 20 MHz
D
-
450
-
fF
VI(cm)
common-mode
input voltage
VI(IN) = VI(INN)
output code 512
C
VCCA3 − 1.7 VCCA3 − 1.6
VCCA3 − 1.2 V
Voltage controlled regulator output CMADC
VO(cm)
common-mode
output voltage
I
-
VCCA3 − 1.6
-
V
Iload
load current
I
-
1
2
mA
C
-
VCCA3 − 1.75 -
V
C
-
0.3
10
µA
C
-
1.9
-
V
Voltage input
Vref[3]
Vref
reference voltage
Iref
reference current
Vi(dif)(p-p)
peak-to-peak
differential input
voltage
full-scale fixed voltage;
fi = 20 MHz; fclk = 55 MHz
VI(IN)(p-p) − VI(INN)(p-p);
Vref = VCCA3 − 1.75 V;
VI(cm) = VCCA3 − 1.6 V
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
7 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Table 6.
Characteristics …continued
VCCA = V2 to V44, V3 to V4 and V41 to V40 = 4.75 V to 5.25 V; VCCD = V37 to V38 and V15 to V17 = 4.75 V to 5.25 V;
VCCO = V33 to V34 = 3.0 V to 3.6 V; AGND and DGND shorted together; Tamb = −40 °C to +85 °C;
VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V; VI(cm) = VCCA3 − 1.6 V; typical values measured at VCCA = VCCD = 5 V
and VCCO = 3.3 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Test[1] Min
Conditions
Typ
Max
Unit
Voltage controlled regulator output FSREF
VO(ref)
reference output
voltage
VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V I
-
VCCA3 − 1.75 -
V
Digital outputs D9 to D0 and IR (referenced to OGND)
VOL
LOW-level output
voltage
IOL = 2 mA
I
0
-
0.5
V
VOH
HIGH-level output
voltage
IOH = −0.4 mA
I
VCCO − 0.5
-
VCCO
V
Io
output current
3-state output level between I
0.5 V and VCCO
−20
-
+20
µA
Switching characteristics; Clock frequency fclk; see Figure 3
fclk(min)
minimum clock
frequency
SH = HIGH
C
-
-
7
MHz
fclk(max)
maximum clock
frequency
ADC1006S055H
I
55
-
-
MHz
ADC1006S070H
C
70
-
-
MHz
tw(clk)H
HIGH clock pulse
width
fi = 20 MHz
C
6.8
-
-
ns
tw(clk)L
LOW clock pulse
width
fi = 20 MHz
C
6.8
-
-
ns
Analog signal processing; 50 % clock duty factor; VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V; see Table 7
Linearity
INL
integral
non-linearity
fclk = 20 MHz; fi = 400 kHz
I
-
±0.65
±1.12
LSB
DNL
differential
non-linearity
fclk = 20 MHz; fi = 400 kHz
(no missing code
guaranteed)
I
-
±0.12
±0.27
LSB
Eoffset
offset error
VCCA = VCCD = 5 V;
VCCO = 3.3 V; Tamb = 25 °C;
output code = 512
C
−25
+5
+25
mV
EG
gain error
spread from
device to device;
VCCA = VCCD = 5 V;
VCCO = 3.3 V; Tamb = 25 °C
C
−7
-
+7
%FS
−3 dB; full-scale input
C
220
245
-
MHz
Bandwidth (fclk = 55 MHz)[4]
B
bandwidth
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
8 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Table 6.
Characteristics …continued
VCCA = V2 to V44, V3 to V4 and V41 to V40 = 4.75 V to 5.25 V; VCCD = V37 to V38 and V15 to V17 = 4.75 V to 5.25 V;
VCCO = V33 to V34 = 3.0 V to 3.6 V; AGND and DGND shorted together; Tamb = −40 °C to +85 °C;
VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V; VI(cm) = VCCA3 − 1.6 V; typical values measured at VCCA = VCCD = 5 V
and VCCO = 3.3 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Test[1] Min
Parameter
Conditions
second harmonic
level
ADC1006S055H (fclk = 55 MHz)
Typ
Max
Unit
Harmonics
α2H
fi = 4.43 MHz
C
-
−77
-
dBFS
fi = 10 MHz
C
-
−76
-
dBFS
fi = 15 MHz
C
-
−75
-
dBFS
fi = 20 MHz
I
-
−73
-
dBFS
ADC1006S070H (fclk = 70 MHz)
α3H
fi = 4.43 MHz
C
-
−75
-
dBFS
fi = 10 MHz
C
-
−74
-
dBFS
fi = 15 MHz
C
-
−70
-
dBFS
third harmonic level ADC1006S055H (fclk = 55 MHz)
fi = 4.43 MHz
C
-
−73
-
dBFS
fi = 10 MHz
C
-
−73
-
dBFS
fi = 15 MHz
C
-
−73
-
dBFS
fi = 20 MHz
I
-
−72
-
dBFS
ADC1006S070H (fclk = 70 MHz)
Total harmonic
THD
fi = 4.43 MHz
C
-
−73
-
dBFS
fi = 10 MHz
C
-
−73
-
dBFS
fi = 15 MHz
C
-
−72
-
dBFS
distortion[5]
total harmonic
distortion
ADC1006S055H (fclk = 55 MHz)
fi = 4.43 MHz
C
-
−68
-
dBFS
fi = 10 MHz
C
-
−68
-
dBFS
fi = 15 MHz
C
-
−68
-
dBFS
fi = 20 MHz
I
-
−68
-
dBFS
ADC1006S070H (fclk = 70 MHz)
fi = 4.43 MHz
C
-
−67
-
dBFS
fi = 10 MHz
C
-
−67
-
dBFS
fi = 15 MHz
C
-
−66
-
dBFS
shorted input; SH = HIGH;
fclk = 55 MHz
C
-
0.12
-
LSB
Thermal noise
Nth(RMS)
RMS thermal noise
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
9 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Table 6.
Characteristics …continued
VCCA = V2 to V44, V3 to V4 and V41 to V40 = 4.75 V to 5.25 V; VCCD = V37 to V38 and V15 to V17 = 4.75 V to 5.25 V;
VCCO = V33 to V34 = 3.0 V to 3.6 V; AGND and DGND shorted together; Tamb = −40 °C to +85 °C;
VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V; VI(cm) = VCCA3 − 1.6 V; typical values measured at VCCA = VCCD = 5 V
and VCCO = 3.3 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Test[1] Min
Conditions
Typ
Max
Unit
Signal-to-noise ratio[6]
S/N
signal-to-noise ratio ADC1006S055H (fclk = 55 MHz)
fi = 4.43 MHz
C
-
60
-
dBFS
fi = 10 MHz
C
-
60
-
dBFS
fi = 15 MHz
C
-
60
-
dBFS
fi = 20 MHz
I
-
59.5
-
dBFS
ADC1006S070H (fclk = 70 MHz)
fi = 4.43 MHz
C
-
60
-
dBFS
fi = 10 MHz
C
-
60
-
dBFS
fi = 15 MHz
C
-
59
-
dBFS
Spurious free dynamic range; see Figure 7, 13 and 14
SFDR
spurious free
dynamic range
ADC1006S055H (fclk = 55 MHz)
fi = 4.43 MHz
C
-
71
-
dBFS
fi = 10 MHz
C
-
70
-
dBFS
fi = 15 MHz
C
-
70
-
dBFS
fi = 20 MHz
I
-
70
-
dBFS
ADC1006S070H (fclk = 70 MHz)
fi = 4.43 MHz
C
-
70
-
dBFS
fi = 10 MHz
C
-
69
-
dBFS
fi = 15 MHz
C
-
68
-
dBFS
Effective number of bits[7]
ENOB
effective number of
bits
ADC1006S055H (fclk = 55 MHz)
fi = 4.43 MHz
C
-
9.5
-
bit
fi = 10 MHz
C
-
9.5
-
bit
fi = 15 MHz
C
-
9.5
-
bit
fi = 20 MHz
I
-
9.5
-
bit
ADC1006S070H (fclk = 70 MHz)
fi = 4.43 MHz
C
-
9.5
-
bit
fi = 10 MHz
C
-
9.5
-
bit
fi = 15 MHz
C
-
9.4
-
bit
Intermodulation; (fclk = 55 MHz; fi = 20
MHz)[8]
αIM
intermodulation
suppression
C
-
−69
-
dBFS
IMD3
third-order
intermodulation
distortion
C
-
−79
-
dBFS
fi = 20 MHz; VI = ±16 LSB at C
code 512
-
10−14
-
times/
sample
Bit error rate (fclk = 55 MHz)
BER
bit error rate
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
10 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Table 6.
Characteristics …continued
VCCA = V2 to V44, V3 to V4 and V41 to V40 = 4.75 V to 5.25 V; VCCD = V37 to V38 and V15 to V17 = 4.75 V to 5.25 V;
VCCO = V33 to V34 = 3.0 V to 3.6 V; AGND and DGND shorted together; Tamb = −40 °C to +85 °C;
VI(IN)(p-p) − VI(INN)(p-p) = 1.9 V; VVREF = VCCA3 − 1.75 V; VI(cm) = VCCA3 − 1.6 V; typical values measured at VCCA = VCCD = 5 V
and VCCO = 3.3 V, Tamb = 25 °C and CL = 10 pF; unless otherwise specified.
Symbol
Parameter
Conditions
Test[1] Min
Typ
Max
Unit
Timing (CL = 10 pF)[9]
td(s)
sampling delay time
C
-
0.25
1
ns
th(o)
output hold time
C
4
6.4
-
ns
td(o)
output delay time
C
-
9.0
13
ns
3-state output delay times; see Figure 4
tdZH
float to active HIGH
delay time
C
-
5.1
9.0
ns
tdZL
float to active LOW
delay time
C
-
7.0
11
ns
tdHZ
active HIGH to float
delay time
C
-
9.7
14
ns
tdLZ
active LOW to float
delay time
C
-
9.5
13
ns
[1]
D = guaranteed by design; C = guaranteed by characterization; I = 100 % industrially tested.
[2]
The circuit has two clock inputs: CLK and CLKN. There are 5 modes of operation:
a) PECL mode 1: (DC level vary 1 : 1 with VCCD) CLK and CLKN inputs are at differential PECL levels.
b) PECL mode 2: (DC level vary 1 : 1 with VCCD) CLK input is at PECL level and sampling is taken on the falling edge of the clock input
signal. A DC level of 3.65 V has to be applied on CLKN decoupled to GND via a 100 nF capacitor.
c) PECL mode 3: (DC level vary 1 : 1 with VCCD) CLKN input is at PECL level and sampling is taken on the rising edge of the clock input
signal. A DC level of 3.65 V has to be applied on CLK decoupled to GND via a 100 nF capacitor.
d) Differential AC driving mode 4: When driving the CLK input directly and with any AC signal of minimum 1 V (p-p) and with a DC level
of 2.5 V, the sampling takes place at the falling edge of the clock signal. When driving the CLKN input with the same signal, sampling
takes place at the rising edge of the clock signal. It is recommended to decouple the CLKN or CLK input to DGND via a 100 nF
capacitor.
e) TTL mode 1: CLK input is at TTL level and sampling is taken on the falling edge of the clock input signal. In that case CLKN pin has
to be connected to the ground.
[3]
The ADC input range can be adjusted with an external reference connected to VREF pin. This voltage has to be referenced to VCCA;
see Figure 12.
[4]
The −3 dB analog bandwidth is determined by the 3 dB reduction in the reconstructed output, the input being a full-scale sine wave.
[5]
Total Harmonic Distortion (THD) is obtained with the addition of the first five harmonics:
2
2
2
2
( α 2H ) + ( α 3H ) + ( α 4H ) + ( α ) + ( α 6H )
2
THD = 20 log ---------------------------------------------------------------------------------------------------------------------------------------2
( a 1H )
where α1H is the fundamental harmonic referenced at 0 dB for a full-scale sine wave input; see Figure 6.
[6]
Signal-to-noise ratio (S/N) takes into account all harmonics above five and noise up to Nyquist frequency; see Figure 8.
[7]
Effective number of bits are obtained via a Fast Fourier Transform (FFT). The calculation takes into account all harmonics and noise up
to half of the clock frequency (Nyquist frequency). Conversion to SIgnal-to_Noise_Distortion ratio (SINAD) is given by
SINAD = ENOB × 6.02 + 1.76 dB; see Figure 5.
[8]
Intermodulation measured relative to either tone with analog input frequencies of 20 MHz and 20.1 MHz. The two input signals have the
same amplitude and the total amplitude of both signals provides full-scale to the converter (−6 dB below full scale for each input signal).
IMD3 is the ratio of the RMS value of either input tone to the RMS value of the worst case third order intermodulation product.
[9]
Output data acquisition: the output data is available after the maximum delay of td(o); see Figure 3.
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
11 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
11. Additional information relating to Table 6
Table 7.
Output coding with differential inputs (typical values to AGND);
Vi(IN)(p-p) − Vi(INN)(p-p) = 1.9 V, VVREF = VCCA3 − 1.75 V
Code
Vi(a)(p-p)
(V)
Underflow
< 3.125
0
3.125
1
IR
Binary outputs
D9 to D0
Two’s complement
outputs[1] D9 to D0
> 4.075
0
00 0000 0000
10 0000 0000
4.075
1
00 0000 0000
10 0000 0000
-
-
1
00 0000 0001
10 0000 0001
↓
-
-
↓
↓
↓
511
3.6
3.6
1
01 1111 1111
11 1111 1111
↓
-
-
↓
↓
↓
1022
-
-
1
11 1111 1110
01 1111 1110
1023
4.075
3.125
1
11 1111 1111
01 1111 1111
Overflow
> 4.075
< 3.125
0
11 1111 1111
01 1111 1111
[1]
Vi(a)(p-p)
(V)
Two’s complement reference is inverted MSB.
Table 8.
Mode selection
OTC
CE
D0 to D9 and IR
0
0
binary; active
1
0
two’s complement; active
X[1]
1
high-impedance
[1]
X = don’t care.
Table 9.
Sample-and-hold selection
SH
Sample-and-hold
1
active
0
inactive; tracking mode
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
12 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
sample N
sample N + 1
sample N + 2
tw(clk)H
tw(clk)L
HIGH
50 %
LOW
CLK
sample N
sample N + 1
sample N + 2
IN
th(o)
td(s)
DATA
D0 TO D9
DATA
N−2
DATA
N−1
HIGH
50 %
LOW
DATA
N+1
DATA
N
td(o)
014aaa465
Fig 3. Timing diagram
VCCD
50 %
CE
0V
tdHZ
tdZH
HIGH
90 %
output
data
50 %
LOW
tdZL
tdLZ
HIGH
output
data
50 %
LOW
10 %
VCCO
ADC1006S
070
3.3 kΩ
S1
15 pF
TEST
S1
tdLZ
VCCO
tdZL
VCCO
tdHZ
OGND
tdZH
CE
OGND
014aaa443
(1) frequency on pin CE = 100 kHz.
Fig 4. Timing diagram and test conditions of 3-state output delay time
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
13 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
014aaa444
9.70
ENOB
(bit)
014aaa445
−63
THD
(dB)
−65
9.60
(1)
−67
9.50
(1)
(2)
−69
9.40
(2)
−71
9.30
0
5
10
15
20
25
fi (MHz)
0
(1) 55 MHz.
(1) 55 MHz.
(2) 70 MHz.
(2) 70 MHz.
Fig 5. Effective Number Of Bits (ENOB) as a function
of input frequency (sample device)
014aaa446
73
SFDR
(dB)
5
10
20
25
fi (MHz)
Fig 6. Total Harmonic Distortion (THD) as a function
of input frequency (sample device)
014aaa447
60.0
S/N
(dB)
72
15
(1)
59.8
(1)
71
59.6
70
59.4
(2)
69
(2)
59.2
68
59.0
0
5
10
15
20
25
fi (MHz)
0
(1) 55 MHz.
(1) 55 MHz.
(2) 70 MHz.
(2) 70 MHz.
Fig 7. Spurious Free Dynamic Range (SFDR) as a
function of input frequency (sample device)
10
15
20
25
fi (MHz)
Fig 8. Signal-to-Noise Ratio (S/N) as a function of
input frequency (sample device)
ADC1006S055_070_2
Product data sheet
5
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
14 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
014aaa448
0
power
spectrum
(dB)
−40
−80
−120
−160
0
5
10
15
20
25
30
fi (MHz)
Fig 9.
Single-tone; fi = 20 MHz; fclk = 55 MHz
014aaa449
0
power
spectrum
(dB)
−40
−80
−120
−160
0
5
10
15
20
25
30
fi (MHz)
Fig 10. Two-tone; fi 1 = 20 MHz; fi 2 = 20.1 MHz; fclk = 55 MHz
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
15 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
014aaa450
1.00
output
range
(INL)
0.60
0.20
−0.20
−0.60
0
256
512
768
1024
output code
Fig 11. Integral Non-Linearity (INL)
014aaa451
0.30
DNL
(LSB)
0.20
0.10
0
−0.10
−0.20
0
256
512
768
1024
output code
Fig 12. Differential Non-Linearity (DNL)
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
16 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
014aaa452
80
SFDR
(dBFS)
60
(1)
(2)
40
(3)
20
−60
−50
−40
−30
−20
−10
0
Input amplitude (dBFS)
(1) fi = 4.43 MHz.
(2) fi = 20 MHz.
(3) SFDR = 80 dB.
Fig 13. SFDR as a function of input amplitude; Vi(IN)(p-p) − Vi(INN)(p-p) = 1.9 V; fclk = 40 MHz
014aaa453
80
SFDR
(dBFS)
60
(1)
40
(2)
(3)
20
−60
−50
−40
−30
−20
−10
0
Input amplitude (dBFS)
(1) fi = 4.43 MHz.
(2) fi = 20 MHz.
(3) SFDR = 80 dB.
Fig 14. SFDR as a function of input amplitude; Vi(IN)(p-p) − Vi(INN)(p-p) = 1.9 V; fclk = 55 MHz
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
17 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
75
(dB)
10.0
(bit)
(1)
70
9.5
(2)
65
9.0
60
8.5
(3)
55
8.0
50
7.5
45
7.0
40
6.5
35
1.3
1.4
1.5
1.6 1.7 1.8 1.9 2.0
VCCA − VVREF (V)
2.6
VI(IN)(p-p)
−
VI(INN)(p-p)
(V)
2.2
2.1
1.8
1.4
6.0
2.2
1.0
1.3
014aaa455
1.4
1.5
1.6 1.7 1.8 1.9
VCCA − VVREF (V)
2.0
2.1
2.2
014aaa456
(1) SFDR.
(2) ENOB.
(3) S/N.
Fig 15. SFDR, ENOB and S/N as a function of
VCCA − VVREF; fclk = 55 MHz; fi = 20 MHz
Fig 16. ADC full-scale; VI(IN)(p-p) − VI(INN)(p-p) as a
function of VCCA − VVREF
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
18 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
12. Application information
12.1 Application diagrams
220 nF
SH
mode
5V
100 nF
5V
100 nF
IN
1:1
100 Ω
CLK
100 Ω
INN
44
5V
100 nF
10 nF
43
42
41
40
39
38
37
36
35
5V
34
100 nF
1
33
2
32
n.c.
3
31
n.c.
4
30
D0 (LSB)
5
29
D1
28
D2
100 nF
ADC1006S055/070
n.c.
6
n.c.
7
27
D3
n.c.
8
26
D4
n.c.
9
25
D5
n.c.
10
24
D6
23
D7
VREF
11
12
13
14
15
16
n.c. n.c.
17
18
19
n.c.
20
21
22
D8
IR
D9
(MSB)
5V
100 nF
chip select input
output format select
014aaa457
The analog, digital and output supplies should be separated and decoupled.
Fig 17. Application diagram
MC100
ELT20
TTL
input
D
CLKN
PECL
CLK
270 Ω
ADC1006S
055/070
270 Ω
014aaa458
Fig 18. Application diagram for differential clock input PECL compatible using a TTL to
PECL translator
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
19 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
CLKN
TTL
input
CLK
ADC1006S
055/070
014aaa459
Fig 19. Application diagram for TTL single-ended clock
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
20 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
1
3
5
7
9
11
13
15
17
19
21
23
2
4
6
8
10
12
14
16
18
20
22
24
D3
B11
D2
12.2 Demonstration board
VCC
J2
C6
330 nF
CLK2
R4
50 Ω
33
AGND4
C17
10 nF
C9
VCCA4
IN
TR1 CMADC
INN
IN
AGND1
R9
100 Ω
41
15
42
14
43
13
44
12
1
2
3
4
5
6
7
8
9
C10
100 nF
C16
10 nF
S3
VCC
n.c.
FL2
VCCD2
n.c.
C12
100 nF
n.c.
C5
330 nF
C18
10 nF
FSREF
FL1
B7
VCC
P2
VCCA
C7
330 nF
1 IN
1 kΩ
R7
VCCA
1.2 kΩ
R6
2.4 KΩ
VCC
VCC
ICI
C1
22 µF
(20 V)
DGND2
FL4
C14
100 nF
GND
OTC
C11
100 nF
5 kΩ
J4 2
S4
CE
S2
P1
BYD17G
D3
D9
IR
10 11
S1
VCCA
J4 1
D7
16
330 nF
12 V
D6
D5
D4
D1
D0
40
MCLT1_6T_KK81
C8
17
ADC1006S055/070
CMADC
R1
100 Ω
39
D8
VREF
S5
18
IC2
n.c.
SH
19
38
n.c.
VCCA
DGND1
20
37
n.c.
VCCD
10 nF
36
n.c.
VCCD1
21
n.c.
C19
35
DEC
CLK1
CLK
22
AGDN3
CLK1
34
VCCA3
CLKN
B5
31 30 29 28 27 26 25 24 23
VCCA1
J3
OGND
C13
100 nF
R3
100 Ω
32
n.c
VCCO
n.c
VCCO
C15
10 nF
FL3
J1 220 nF
B8
TM3
OUT 3
MC78MO5CDT
GND
C2
4.7 µF
(16 V)
R2
62 Ω
PMBT
2222A
VCCO
T1
R8
750 Ω
D1
LGT679
C3
1 µF
D2
BZV55C3V6
R5
4.7 kΩ
C4
1 µF
TP2
VCCO
014aaa460
C8 is close to TR1 pin.
Fig 20. Demonstration board schematic
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
21 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
TM2
R1
J1
J3
C9
B4
1
1
S5
TR1
S1
R3
34
P1
1
R9
C7
FL4
IC1
C10
B7
C11
TM3
D1 C3 D2
J4
2
1
B5
TP2
C4
1
C12
P2
C1
C2
23
112
R6
R8 R2 T1 R5
D3
IC2
C14
S2
R7
S3 S4
FL2
J2
C5
B8
R4
B11
TM1
1
014aaa466
Fig 21. Component placement (top side)
C6
FL3
C19
C15
C8
C13
C16
FL1
C17
C18
014aaa467
Fig 22. Component placement (underside)
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
22 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
1
014aaa461
Fig 23. Printed-circuit board layout (top layer)
2
014aaa462
Fig 24. Printed-circuit board layout (ground layer)
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
23 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
3
014aaa463
Fig 25. Printed-circuit board layout (power plane)
12.3 Alternative parts
The following alternative parts are also available:
Table 10.
Alternative parts
Type number
Description
Sampling frequency
ADC1206S040
Single 12 bits ADC
[1]
ADC1206S055
Single 12 bits ADC
[1]
55 MHz
ADC1206S070
Single 12 bits ADC
[1]
70 MHz
[1]
40 MHz
Pin to pin compatible
12.4 Recommended companion chip
The recommended companion chip is the TDA9901 wideband differential digital controlled
variable gain amplifier.
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
24 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
13. Support information
13.1 Definitions
13.1.1 Non-linearities
13.1.1.1
Integral Non-Linearity (INL)
It is defined as the deviation of the transfer function from a best fit straight line (linear
regression computation). The INL of the code i is obtained from the equation:
V I ( i ) – V I ( ideal )
INL ( i ) = -----------------------------------------S
(1)
n
where i = 0 ⋅ ( 2 – 1 ) and
S = slope of the ideal straight line = code width; i = code value.
13.1.1.2
Differential Non-Linearity (DNL)
It is the deviation in code width from the value of 1 LSB.
V I (i + 1) – V I (i)
DNL ( i ) = ----------------------------------------–1
S
(2)
n
where i = 0 ⋅ ( 2 – 2 )
13.1.2 Dynamic parameters (single tone)
Figure 26 shows the spectrum of a full-scale input sine wave with frequency ft, conforming
to coherent sampling (ft / fs = M / N, where M is the number of cycles and N is number of
samples, M and N being relatively prime), and digitized by the ADC under test.
magnitude
a1
SFDR
a3
ak
a2
measured output range (MHz)
fs/2
014aaa440
Fig 26. Spectrum of full-scale input sine wave with frequency ft
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
25 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
Remark: In the following equations, Pnoise is the power of the terms which include the
effects of random noise, non-linearities, sampling time errors, and ‘quantization noise’.
13.1.2.1
Signal-to-Noise And Distortion (SINAD)
The ratio of the output signal power to the noise and distortion power for a given sample
rate and input frequency, excluding the DC component:
P signal
SINAD [ dB ] = 10 log -----------------------------------------P noise + distortion
13.1.2.2
(3)
Effective Number Of Bits (ENOB)
It is derived from SINAD and gives the theoretical resolution an ideal ADC would require
to obtain the same SINAD measured on the real ADC. A good approximation gives:
ENOB = ( SINAD [ dB ] – ( 1.76 ) ) ⁄ ( 6.02 )
13.1.2.3
Total Harmonic Distortion (THD)
The ratio of the power of the harmonics to the power of the fundamental. For k-1
harmonics the THD is:
P harmonics
THD [ dB ] = 10 log --------------------------P signal
2
2
where P harmonics = α 2 + α 3 + α
(4)
2
k
and P signal = α
2
1
The value of k is usually 6 (i.e. calculation of THD is done on the first 5 harmonics).
13.1.2.4
Signal-to-Noise ratio (S/N)
The ratio of the output signal power to the noise power, excluding the harmonics and the
DC component.
P signal
S/N [ dB ] = 10 log ----------------P noise
13.1.2.5
(5)
Spurious Free Dynamic Range (SFDR)
The number SFDR specifies available signal range as the spectral distance between the
amplitude of the fundamental and the amplitude of the largest spurious (harmonic and
non-harmonic), excluding DC component.
α1
SFDR [ dB ] = 20 log ----------------max ( s )
ADC1006S055_070_2
Product data sheet
(6)
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
26 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
13.1.3 Intermodulation distortion
13.1.3.1
Spectral analysis (dual-tone)
magnitude
IMD3
measured output range (MHz)
fs/2
014aaa441
Fig 27. Spectral analysis (dual-tone)
From a dual-tone input sinusoid (ft1 and ft2, these frequencies being chosen according to
the coherence criterion), the intermodulation distortion products IMD2 and IMD3
(respectively, 2nd and 3rd-order components) are defined, as follows.
13.1.3.2
IMD2 (IMD3)
The ratio of the RMS value of either tone to the RMS value of the worst second (third)
order intermodulation product.
The total IMD is given by:
P intermod
IMD [ dB ] = 10 log ----------------------P signal
where,
P intermod = a
+a
2
( 2 f t1
im
2
2
(f
im t1
– f t2 ) – a
– f t2 ) + a
2
( 2 f t1
im
2
(f
im t1
+ f t2 ) + a
2
(f
im t1
– 2 f t2 ) + a
2
(f
im t1
+ 2 f t2 )
+ f t2 )
2
P signal = a ( f t1 ) + a ( f t2 ) and
a
2
(f )
im t
is the power in the intermodulation component at frequency ft.
13.1.4 Noise Power Ratio (NPR)
When using a notch-filtered broadband white-noise generator as the input to the ADC
under test, the NPR is defined as the ratio of the average out-of-notch to the in-notch
power spectral density magnitudes for the FFT spectrum of the ADC output sample set.
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
27 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
14. Package outline
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
c
y
X
A
33
23
34
22
ZE
e
E HE
A A2
wM
(A 3)
A1
θ
bp
Lp
pin 1 index
L
12
44
1
detail X
11
wM
bp
e
ZD
v M A
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
2.1
0.25
0.05
1.85
1.65
0.25
0.4
0.2
0.25
0.14
10.1
9.9
10.1
9.9
0.8
12.9
12.3
12.9
12.3
1.3
0.95
0.55
0.15
0.15
0.1
Z D (1) Z E (1)
1.2
0.8
1.2
0.8
θ
o
10
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
97-08-01
03-02-25
SOT307-2
Fig 28. Package outline SOT307-2 (QFP44)
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
28 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
15. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
ADC1006S055_070_2
20080812
Product data sheet
-
ADC1006S055_070_1
Modifications:
ADC1006S055_070_1
•
•
Corrections made to titles in Figure 13 and 14.
Corrections made to note in Figure 4.
20080611
Product data sheet
ADC1006S055_070_2
Product data sheet
-
-
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
29 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
ADC1006S055_070_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 12 August 2008
30 of 31
ADC1006S055/070
NXP Semiconductors
Single 10 bits ADC, up to 55 MHz or 70 MHz
18. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11
Additional information relating to Table 6 . . . 12
12
Application information. . . . . . . . . . . . . . . . . . 19
12.1
Application diagrams . . . . . . . . . . . . . . . . . . . 19
12.2
Demonstration board . . . . . . . . . . . . . . . . . . . 21
12.3
Alternative parts . . . . . . . . . . . . . . . . . . . . . . . 24
12.4
Recommended companion chip . . . . . . . . . . . 24
13
Support information . . . . . . . . . . . . . . . . . . . . 25
13.1
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
13.1.1
Non-linearities. . . . . . . . . . . . . . . . . . . . . . . . . 25
13.1.1.1 Integral Non-Linearity (INL) . . . . . . . . . . . . . . 25
13.1.1.2 Differential Non-Linearity (DNL) . . . . . . . . . . . 25
13.1.2
Dynamic parameters (single tone) . . . . . . . . . 25
13.1.2.1 Signal-to-Noise And Distortion (SINAD) . . . . . 26
13.1.2.2 Effective Number Of Bits (ENOB) . . . . . . . . . . 26
13.1.2.3 Total Harmonic Distortion (THD). . . . . . . . . . . 26
13.1.2.4 Signal-to-Noise ratio (S/N) . . . . . . . . . . . . . . . 26
13.1.2.5 Spurious Free Dynamic Range (SFDR) . . . . . 26
13.1.3
Intermodulation distortion . . . . . . . . . . . . . . . . 27
13.1.3.1 Spectral analysis (dual-tone) . . . . . . . . . . . . . 27
13.1.3.2 IMD2 (IMD3) . . . . . . . . . . . . . . . . . . . . . . . . . . 27
13.1.4
Noise Power Ratio (NPR) . . . . . . . . . . . . . . . . 27
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 28
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 29
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 30
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 30
16.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
16.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
16.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
17
Contact information. . . . . . . . . . . . . . . . . . . . . 30
18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 August 2008
Document identifier: ADC1006S055_070_2
Similar pages