LIGITEK LG-197GBR-CT-3C2 Led smd Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-197GBR-CT-3C2
DATA SHEET
DOC. NO : QW0905-LG-197GBR-CT-3C2_A
REV.
:
A
DATE
:
16 - Nov. - 2016
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/14
PART NO. LG-197GBR-CT-3C2
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with infrared and vapor phase reflow solder process.
Descriptions:
1. The LG-197 SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
PART NO
LG-197GBR-CT-3C2
MATERIAL
COLOR
Emitted
AlGaInP
Red
lnGaN
Green
lnGaN
Blue
Lens
Water Clear
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Page 2/14
PART NO. LG-197GBR-CT-3C2
Package Dimensions
1.5
0.55
2
3
Soldering
Terminal
0.25
0.18
0.4
Die1
1.1
1.6
Die3
0.8
Die2
0.4
RESIN
1
4
0.6
PCB
3
+
-
-
-
4 2 1
R B G
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
2.2
0.9
0.5
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
-
1.5
0.6
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Page 3/14
PART NO. LG-197GBR-CT-3C2
Absolute Maximum Ratings at Ta=25℃
Parameter
Ratings
Symbol
UNIT
DGM
DBK
HRF
Power Dissipation
PD
108
72
72
mW
Peak Forward Current
Duty 1/10@10KHz
IFP
100
100
90
mA
Forward Current
IF
30
20
30
mA
Reverse Current @5V
Ir
50
50
10
μA
Electrostatic Discharge
ESD
500
500
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
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Page 4/14
PART NO. LG-197GBR-CT-3C2
Typical Electrical & Optical Characteristics (Ta=25℃)
Items
Luminous Intensity
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Symbol
Iv
λD
△λ
VF
2θ 1/2
Min.
Typ. Max. UNIT
DGM 200
500
----
DBK
50
125
----
HRF
32
80
----
DGM
----
525
----
DBK
----
470
----
HRF
----
630
----
DGM
----
36
----
DBK
----
30
----
HRF
----
20
----
DGM
2.8
----
3.6
DBK
2.8
----
3.6
HRF
1.5
----
2.4
DGM
----
140
----
DBK
----
140
----
HRF
----
140
----
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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Page 5/14
PART NO. LG-197GBR-CT-3C2
Luminous Intensity Classification
BIN CODE
DGM
Min.
Max.
S
200
320
T
320
500
U
500
800
BIN CODE
DBK
Iv(mcd) at 20mA
Min.
Max.
P
50
80
Q
80
125
R
125
200
S
200
320
BIN CODE
HRF
Iv(mcd) at 20mA
Iv(mcd) at 20mA
Min.
Max.
N
32
50
P
50
80
Q
80
125
R
125
200
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PART NO. LG-197GBR-CT-3C2
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
4.0
3.0
5.0
10
1.0
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Current vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Current(mA)
40
30
20
10
0
20
40
60
80
Relative Intensity@20mA
0.5
0.0
Wavelength (nm)
2.0
1.5
1.0
0.5
0.0
-20
0
20
40
60
Fig.6 Directive Radiation
1.0
550
2.5
80
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
500
3.0
-40
100
Ambient Temperature (Ta°C)
450
1000
Forward Current(mA)
Forward Voltage(V)
0
100
600
100
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Page 7/14
PART NO. LG-197GBR-CT-3C2
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1
10
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Current vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Current(mA)
40
30
20
10
0
20
40
60
80
100
Ambient Temperature (Ta°C)
Relative Intensity@20mA
1.0
0.5
0.0
450
500
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
400
1000
Forward Current(mA)
Forward Voltage(V)
0
100
550
Fig.6 Directive Radiation
100
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Page 8/14
PART NO. LG-197GBR-CT-3C2
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
3.0
2.5
2.0
1.5
1.0
0.5
0
1.0
1.5
2.5
2.0
3.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Current vs. Temperature
40
3.0
Relative Intensity@20mA
Normalize@25℃
Forward Current(mA)
1000
Forward Current(mA)
Forward Voltage(V)
30
20
10
0
0
20
40
60
80
100
Ambient Temperature (Ta°C)
1.0
0.5
0
550
600
650
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
100
700
Fig.6 Directive Radiation
100
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Page 9/14
PART NO. LG-197GBR-CT-3C2
Carrier Tape Dimensions
4.0±0.2
0.23
2.0
1.75
-
3.5±0.2
8.0±0.3
1.75
5.3
0.7
1.65
4.0±0.2
+
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
‧ Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-197GBR-CT-3C2
8.0mm tape,7"reel
4000 devices
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Page 10/14
PART NO. LG-197GBR-CT-3C2
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
BIN : Luminous Intensity
PART :
LG-197GBR-CT-3C2
LOT :
GS11370168
QTY(PCS):
4000
VF:2.8-3.6
BIN/HUE :
U-Q-P
VF:1.5-2.4
VF:2.8-3.6
VF : Forward Voltage
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.4
0.2
0.6
2.0±0.5
178±1.5
60±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
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Page 11/14
PART NO. LG-197GBR-CT-3C2
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
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PART NO. LG-197GBR-CT-3C2
Page 12/14
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280 ℃ 3 sec one time only.
3 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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Page 13/14
PART NO. LG-197GBR-CT-3C2
Precautions For Use:
Storage time:
1. Calculated shelf life before opening is 18 months at < 30°C and < 90% relative humidity (RH)
2. After bag is opened, devices which will be subjected to reflow soldering or other high
temperature processes must be
a) Assemblied within one years in an environment of ≦ 30°C / 60% RH, or
b) Stored at ambient of 10% RH or less
3. Devices are required baking before assembly if:
a) Humidity Indicator Card reads >10% (for level 2a -5a)
or >60% (for level 2) at ambient temperature 23±5°C
b) 2.a) or 2.b) doesn't meet
4. If baking is required, devices should be baked for >72 hours at 60±5°C/ 5% RH.Performing baking
only once, and using the baked devices within 72 hours..
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 14/14
PART NO. LG-197GBR-CT-3C2
Reliability Test:
Classification
Test Item
Test Condition
Sample
Size
Operating Life Test
1.Ta=25°C
2.If=20mA
3.t=1000 hrs (-24hrs,+72hrs)
22
High Temperature
Storage Test
1.Ta=100°C±5°C
2.t=1000 hrs (-24hrs,+72hrs)
22
Low Temperature
Storage Test
1.Ta=-40°C±5°C
2.t=1000 hrs (-24hrs,+72hrs)
22
High Temperature
High Humidity
Storage Test
1.Ta=85°C
2.RH=85%
3.t=1000hrs(-24hrs,+72hrs)
22
1.Ta=100°C±5°C ~ -40°C±5°C
20min/ 10sec / 20min
2.total 100 cycles
22
1.100°C±5°C ~ -40°C±5°C
30mins / 5mins / 30mins
2.100 Cyeles
22
Endurance
Test
Thermal Shock Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.T=260°C Max. 10sec.Max.
2. 6 Min
22
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