MSW310x-310 SP3T PIN Diode Switch Rev. V1 Features Wide Frequency Range: 50 MHz to 4 GHz, in 2 bands Surface Mount SP3T Switch in Compact Outline: 8 mm L x 5 mm W x 2.5 mm H Higher Average Power Handling than Plastic Packaged MMIC Switches: 158 W CW High RF Peak Power: 500 W Low Insertion Loss: 0.45 dB High IIP3: 65 dBm Operates From Positive Voltage Only: 5 V & 28 V to 125 V RoHS* Compliant CS310 Functional Schematic Description The MSW3100-301 (50 MHz - 1 GHz) and MSW3101-301 (400 MHz - 4 GHz) series of surface mount silicon PIN diode SP3T switches can be used for high power transmit/receive (TR) symmetrical switching or active receiver protection. These switches are manufactured using a proven hybrid manufacturing process incorporating high voltage PIN diodes and passive devices integrated on a ceramic substrate. These low profile, compact, surface mount components offer superior small and large signal performance compared to that of MMIC devices in QFN packages. The SP3T switches are designed in a symmetrical topology to enable switched RF port to be used as the high-input-power -handling port, to minimize insertion loss and to maximize isolation performance. The very low thermal resistance (<25ºC/W) of the PIN diodes in these devices enables them to reliably handle RF incident power levels of 50 dBm CW and RF peak incident power levels of 57 dBm in cold switching applications. The thick I layers of the PIN diodes (>100 µm), coupled with their long minority carrier lifetime (>2 µs), produces input third order intercept point (IIP3) greater than 65 dBm. These MSW310x-310 Series SP3T switches are designed to be used in high average and peak power switch applications, operating from 50 MHz to 4 GHz in two bands, which utilize high volume, surface mount, solder re-flow manufacturing. These products are durable and capable of reliably operating in military, commercial, and industrial environments. Ordering Information Part Number Package MSW3100-301-T tube MSW3100-301-R 250 or 500 piece reel MSW3100-301-W Waffle pack MSW3101-301-T tube MSW3101-301-R 250 or 500 piece reel MSW3101-301-W Waffle pack MSW3100-301-E RF evaluation board MSW3101-301-E RF evaluation board * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 MSW3100-310 Electrical Specifications: TA = +25°C, PIN = 0 dBm, Z0 = 50 Ω Parameter Test Conditions Units Min. Typ. Max. Frequency — MHz 50 — 1000 Insertion Loss Bias State 1: port J0 to J1 Bias State 2: port J0 to J2 Bias State 2: port J0 to J3 dB — 0.4 0.6 Return Loss Bias State 1: port J0 to J1 Bias State 2: port J0 to J2 Bias State 2: port J0 to J3 dB 18 20 — Isolation Bias State 1: port J0 to J1 Bias State 2: port J0 to J2 Bias State 2: port J0 to J3 dB 50 53 — CW Incident Power1 Source & Load VSWR = 1.5:1 dBm — — 50 Peak Incident Power1 Source & Load VSWR = 1.5:1 Pulse Width = 10 µs, Duty Cycle = 1% dBm — — 57 Switching Time2 10% -90% RF Voltage, TTL rep rate = 100 kHz µs — 2 3 Input IP3 F1 = 500 MHz, F2 = 510 MHz P1 = P2 = 10 dBm Measure on path biased to low loss state dBm 60 65 — MSW3101-310 Electrical Specifications: TA = +25°C, PIN = 0 dBm, Z0 = 50 Ω Parameter Test Conditions Units Min. Typ. Max. Frequency — MHz 400 — 4000 Insertion Loss Bias State 1: port J0 to J1 Bias State 2: port J0 to J2 Bias State 2: port J0 to J3 dB — 0.6 0.8 Return Loss Bias State 1: port J0 to J1 Bias State 2: port J0 to J2 Bias State 2: port J0 to J3 dB 14 15 — Isolation Bias State 1: port J0 to J1 Bias State 2: port J0 to J2 Bias State 2: port J0 to J3 dB 32 34 — CW Incident Power1 Source & Load VSWR = 1.5:1 dBm — — 50 Peak Incident Power1 Source & Load VSWR = 1.5:1 Pulse Width = 10 µs, Duty Cycle = 1% dBm — — 57 Switching Time2 10% -90% RF Voltage, TTL rep rate = 100 kHz µs — 2 3 Input IP3 F1 = 500 MHz, F2 = 510 MHz P1 = P2 = 10 dBm Measure on path biased to low loss state dBm 60 65 — 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 1. PIN diode DC reverse voltage to maintain high resistance in the OFF PIN diode is determined by RF frequency, incident power, and VSWR as well as by the characteristics of the diode. The minimum reverse bias voltage values are provided in this datasheet. The input signal level applied for small signal testing is approximately 0 dBm. 2. Switching Speed ( 50 % TTL – 10/90 % RF Voltage ) is a function of the PIN diode driver performance as well as the characteristics of the diode. An RC “current spiking network” is used on the driver output to provide a transient current to rapidly remove stored charge from the PIN diode. Typical component values are: R = 50 to 220 Ω and C = 470 to 1,000 pF. MACOMs MPD3T28125-700 is the recommended PIN diode driver to interface with the MSW3100-310, MSW3101-310 SP3T switches. Truth Table Port J0 - J1 Port J0 - J2 Port J0 - J3 Bias: J1 Bias: J2 Bias: J2 Bias: B1 Bias: B2 Bias: B3 Bias: J0 Low Loss Isolation Isolation 0 V, -100 mA +27 V, 0 mA +27 V, 0 mA +27 V, 0 mA 0 V, -25 mA 0 V, -25 mA +5 V, +100 mA Isolation Low Loss Isolation +27 V, 0 mA 0 V, -100 mA +27 V, 0 mA 0 V, -25 mA +27 V, 0 mA 0 V, -25 mA +5 V, +100 mA Isolation Isolation Low Loss +27 V, 0 mA +27 V, 0 mA 0 V, -100 mA 0 V, -25 mA 0 V, -25 mA +27 V, 0 mA +5 V, +100 mA RF Bias Network Component Values Part # Frequency (MHz) Inductors DC Blocking Capacitors RF Bypass Capacitors MSW3100-310 50 - 1000 4.7 µH 0.1 µF 0.1 µF MSW3101-310 400 - 4000 82 nH 22 pF 270 pF 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 Minimum Reverse Bias Voltage3: PINC = 125 W CW, Z0 = 50 Ω with 1.5:1 VSWR Part # 20 MHz 100 MHz 200 MHz 400 MHz 1 GHz 4 GHz MSW3100-310 125 V 25 V 85 V 55 V 28 V N/A MSW3101-310 N/A N/A 125 V 85 V 55 V 28 V 3. N/A denotes the switch is not recommended for that frequency band. The minimum reverse bias voltage required to maintain a PIN diode out of conduction in the presence of a large RF signal is given by: Where: |VDC| |VRF| FMHz D WMILS = = = = = magnitude of the minimum DC reverse bias voltage magnitude of the peak RF voltage (including the effects of the VSWR) lowest RF signal frequency expressed in MHz duty factor of the RF signal thickness of the diode I layer, expressed in mils (thousands of an inch) R. Caverly and G. Hiller, ―Establishing the Minimum Reverse Bias for a PIN Diode in a High Power Switch, IEEE Transactions on Microwave Theory and Techniques, Vol.38, No.12, December 1990 4 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 Absolute Maximum Ratings Parameter Forward Current Reverse Voltage Forward Diode Voltage CW Incident Power Handling4 Peak Incident Power Handling4 Conditions Absolute Maximum J1, J2, J3 port B1, B2, B3 port J1, J2, J3 port B1, B2, B3 port 250 mA 150 mA IF = 250 mA 1.2 V J0, J1, J2, J3 port Source & Load VSWR = 1.5:1, TC = 85°C, cold switching J0, J1, J2, J3 port Source & Load VSWR = 1.5:1, TC = 85°C, cold switching, Pulse Width = 10 µs, Duty Cycle = 1% 125 V 50 dBm 57 dBm Total Dissipated RF & DC Power4 TC = 85°C, cold switching 5W Junction Temperature — +175°C Operating Temperature — -65°C to +125°C Storage Temperature — -65°C to +150°C Assembly Temperature t = 10 s +260°C 4. Backside RF and DC grounding area of device must be completely solder attached to the RF circuit board vias for proper electrical and thermal circuit grounding. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity These electronic devices are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these Class 1C (HBM) devices. The moisture sensitivity level (MSL) rating for this part is MSL 1. Environmental Capabilities The MSW204x-204 diode is capable of meeting the environmental requirements of MIL-STD-202 and MIL-STD-750. 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 Typical Performance Curves MSW3101-310 MSW3100-310 Insertion Loss Insertion Loss Isolation Isolation Return Loss Return Loss 6 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 SP3T Switch Evaluation Board Schematic SP3T Switch Evaluation Board Description Below is the description of MSW310x-310 SP3T series shunt switch module control using MPD3T28125-701 three channel pin diode driver. The switch module can also be controlled by using external voltage sources accordingly. The MSW310x-310 series shunt three throw switch can be fully controlled using MPD3T28125-701 three channel pin diode driver. Each driver section is connected to bias the series diode and the shunt diode of the switch arms. For example, in the configuration described below for the control of a symmetrical SP3T switch, driver output V1A biases the series diode connected between switch ports J0 and J1, the driver output V1B biases the shunt diode connected between switch ports J1 and B1. Similarly driver output V2A biases the series diode connected between switch ports J0 and J2, output V2B biases the shunt diode connected between switch ports J2 and B2 and output V3A biases the series diode connected between switch ports J0 and J3, the driver output V3B biases the shunt diode connected between switch ports J3 and B3. A typical symmetric switch with a driver interface is shown below. In this circuit, the MPD3T28125-701 driver is used to control the MSW3100-310 symmetrical SP3T switch. The switch is controlled to operate in one of three operational states, which are called State 1, State 2 and State 3. In the descriptions of States 1, 2 and 3 (below), it is assumed that +VCC1 = 5 V and + VCC2 = 28 V. 7 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 State 1 In State 1, the path from port J0 to J1 is in its low insertion loss condition. The paths from port J0 to port J2, and port J0 to port J3, are in their high isolation states. In State 1, the control voltage applied to CTL 1 is TTL-logic high, and the control voltages applied to CTL 2 and CTL 3 are TTL-logic low. CTL 1 logic forward biases the series PIN diode between the J0 and J1 ports by applying 0 V to the J1 bias input port (P1-J1), CTL2 & CTL 3 will re-verse bias the series diodes connected from port J0 to port J2, and from port J0 to port J3. The magnitude of the resultant bias current through the forward-biased diode is primarily determined by the voltage applied to the J0 bias port (P1-J0) (5 V nominal), the magnitude of the forward voltage across the PIN diode and the resistance of R1. This current is nominally 100 mA. At the same time, the shunt PIN diodes connected between port J2 and B2 and between port J3 and B3 are also forward biased by applying a high bias voltage, nominally 28 V, to the J2 and J3 bias ports (P1-J2, P1-J3) and 0 V to the B2 and B3 bias ports (P1-B2, P1-B3). The magnitudes of the bias currents through these diodes are primarily determined by the voltage applied to the J2 and J3 bias ports, the magnitudes of the forward voltage across each of the PIN diodes and the resistances of R4 and R5. These currents are nominally 25 mA each. Under this condition, the series PIN diodes connected between the J0 and J2 ports, between the J0 and J3 ports and the shunt diode between J1 and B1 are each reverse biased. The reverse bias voltage applied to non-conducting diodes must be sufficiently large to maintain each diode in its non- conducting, high impedance state when a large RF signal voltage may be present. For example, assume a large RF signal is present in the J0- to-J1 path. The reverse bias voltage across each of the series diodes in the other paths is the arithmetic difference of the bias voltage applied to the J2 bias port or J3 bias port and the DC forward voltage of the forward-biased J0-to-J1 series PIN diode. The minimum voltage required to maintain the series diode between ports J0 and J2 and the series diode between ports J0 and J3 out of conduction is a function of the magnitude of the RF voltage present, the standing wave present at the se-ries diode’s anode, the frequency of the RF signal and the characteristics of the series diode, among other factors. The minimum reverse bias voltage may be calculated as described in the “Minimum Reverse Bias Voltage” section. Truth Table SP3T Switch Operation with PIN Diode Driver (MPDT3T28125-701) Interface CTRL 1 CTRL 2 CTRL 3 RF Path Path Path State J0 - J1 J0 - J2 J0 - J2 VHIGH VLOW VLOW 1 Low Loss VLOW VHIGH VLOW 2 High Isolation Bias: J2 Bias: J2 Bias: B1 High High 0 V, +27 V, Isolation Isolation -100 mA 0 mA +27 V, 0 mA +27 V, 0 V, 0 V, +5 V, 0 mA -25 mA -25 mA +100 mA VLOW VLOW VHIGH 3 High High Isolation Isolation Low Loss Bias: J1 Bias: B2 Bias: B3 Bias: J0 High +27 V, 0 V, +27 V, 0 V, +27 V, 0 V, +5 V, Isolation 0 mA -100 mA 0 mA -25 mA 0 mA -25 mA +100 mA Low Loss +27 V, 0 mA +27 V, 0 V, 0 V, 0 V, +27 V, +5 V, 0 mA -100 mA -25 mA -25 mA 0 mA +100 mA 8 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 SP3T Switch Evaluation Board Description 9 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 State 2 State 3 In State 2, the path from port J0 to J2 is in its low insertion loss condition. The path from port J0 to port J1, and the path from port J0 to port J3, are in their high isolation states. In State 2, the control voltage applied to CTL 2 is TTL-logic high, and the control voltages applied to CTL 1 and CTL 3 are TTL-logic low, which forward biases the series PIN diode between the J0 and J2 ports by applying 0 V to the J2 bias input port (P1-J2), while reverse-biasing the series diodes connected from port J0 to port J1, and from port J0 to port J3. The magnitude of the resultant bias current through the forward-biased diode is primarily determined by the voltage applied to the J0 bias port (P1-J0) (5 V nominal), the magnitude of the forward voltage across the PIN diode and the resistance of R1. This current is nominally 100 mA. In State 3, the path from port J0 to J3 is in its low insertion loss condition. The path from port J0 to port J1, and the path from port J0 to port J2, is in their high isolation states. At the same time, the shunt PIN diodes connected between port J1 and B1 and between port J3 and B3 are also forward biased by applying a high bias voltage, nominally 28 V, to the J1 and J3 bias ports (P1-J1, P1-J3) and 0 V to the B1 and B3 bias ports (P1-B2, P1-B3). The magnitudes of the bias currents through these diodes are primarily determined by the voltage applied to the J1 and J3 bias ports, the magnitudes of the forward voltage across each of the PIN diodes and the resistances of R2 and R5. These currents are nominally 25 mA each. Under this condition, the series PIN diodes connected between the J0 and J1 ports, between the J0 and J3 ports and the shunt diode between J2 and B2 are each reverse biased. The reverse bias voltage applied to non-conducting diodes must be sufficiently large to maintain each diode in its non-conducting, high impedance state when a large RF signal voltage may be present. For example, assume a large RF signal is present in the J0-to-J2 path. The reverse bias voltage across each of the series diodes in the other paths is the arithmetic difference of the bias voltage applied to the J1 bias port or J3 bias port and the DC forward voltage of the forward-biased J0-to-J2 series PIN diode. In State 3, the control voltage applied to CTL 3 is TTL-logic high, and the control voltages applied to CTL 1 and CTL 2 are TTL-logic low, which forward biases the series PIN diode between the J0 and J3 ports by applying 0 V to the J3 bias input port (P1J3), while reverse-biasing the series diodes connected from port J0 to port J1, and from port J0 to port J2. The magnitude of the resultant bias current through the forward-biased diode is primarily determined by the voltage applied to the J0 bias port (P1-J0) (5 V nominal), the magnitude of the forward voltage across the PIN diode and the resistance of R1. This current is nominally 100 mA. At the same time, the shunt PIN diodes connected between port J1 and B1 and between port J3 and B2 are also forward biased by applying a high bias voltage, nominally 28 V, to the J1 and J2 bias ports (P1-J1, P1-J2) and 0 V to the B1 and B2 bias ports (P1-B2, P1-B2). The magnitudes of the bias currents through these diodes are primarily determined by the voltage applied to the J1 and J2 bias ports, the magnitudes of the forward voltage across each of the PIN diodes and the resistances of R2 and R4. These currents are nominally 25 mA each. Under this condition, the series PIN diodes connected between the J0 and J1 ports, between the J0 and J2 ports and the shunt diode between J3 and B3 are each reverse biased. The reverse bias voltage applied to non-conducting diodes must be sufficiently large to maintain each diode in its non-conducting, high impedance state when a large RF signal voltage may be present. For example, assume a large RF signal is present in the J0-to-J3 path. The reverse bias voltage across each of the series diodes in the other paths is the arithmetic difference of the bias voltage applied to the J1 bias port or J2 bias port and the DC forward voltage of the forward-biased J0-to-J3 series PIN diode. 10 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 Calculations of Resistor Values The magnitude of the forward bias current applied to the series diode is set by the magnitude of the supply voltage +VCC1, which is nominally 5 V, the value of resistor R1 and the forward voltage of the series diode, VDIODE, among other factors. Given the desired current value, the resistance is given by the formula: The magnitude of the current through the shunt diode is set by the magnitude of the supply voltage +VCC2, the value of resistor in series with the shunt diode (R2 or R4 or R5)and the forward voltage of the shunt diode, VDIODE, among other factors. Given the desired current value, this resistance is given by the formula: It is important to note that the switch module evaluation board, as supplied from the factory, is not capable of handling RF input signals larger than 45 dBm. If performance of the switch under larger input signals is to be evaluated, an adequate heat sink must be properly attached to the evaluation board, and several of the passive components on the board must be changed in order to safely handle the dissipated power as well as the high bias voltage necessary for proper performance. Contact the factory for recommended components and heat sink. 11 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 SP3T Switch Evaluation Board Layout Evaluation Board Parts List MSW3100-310 Band 1 Part Value Case Style C1, C2, C5 - C10, C14, C15, C16, C19, C22, C25 - C28 0.1 µF 0603 5 C3, C4, C11, C12, C17, C18, C20, C21, C23, C24 0.1 µF 0603 L1 - L9 4.7 µH 0603 R1 39 Ω 2512 R2, R4, R5 1200 Ω 2512 MSW3101-310 Band 2 Part Value Case Style C1, C5, C7, C9, C13, C15, C19, C25, C27 22 pF 0603 C2, C6, C8, C10, C14, C16, C22, C26, C28 270 pF 0603 C3, C4, C11, C12, C17, C18, C20, C21, C23, C24 1000 pF 0603 L1 - L9 82 nH 0603 R1 39 Ω 2512 R2, R4, R5 1200 Ω 2512 5. Second bypass capacitor is optional. 12 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 Assembly Instructions SP3T PIN Diodes may be placed onto circuit boards with pick and place manufacturing equipment from tape and reel. The devices are attached to the circuit using conventional solder re-flow or wave soldering procedures with RoHS type or Sn 60 / Pb 40 type solders. 13 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 Outline (CS310)6,7 COMPANY LOGO DATE CODE PART NUMBER RF Circuit Solder footprint 6. Hatched metal area on circuit side of device is RF, DC and thermal grounded. 7. Vias should be solid copper fill and gold plated for optimum heat transfer from backside of switch module through Circuit Vias to metal thermal ground. 14 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx MSW310x-310 SP3T PIN Diode Switch Rev. V1 M/A-COM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM assumes no responsibility for errors or omissions in these materials. MACOM may make changes to specifications and product descriptions at any time, without notice. MACOM makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS. MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale. 15 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx