Maxim MAX1280 400ksps/300ksps, single-supply, low-power, 8-channel, serial 12-bit adcs with internal reference Datasheet

19-1684; Rev 0; 5/00
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
The MAX1280/MAX1281 are available in 20-pin TSSOP
packages. These devices are higher-speed versions of
the MAX146/MAX147 (for more information, see the
respective data sheet).
Applications
Portable Data Logging
Features
♦ 8-Channel Single-Ended or 4-Channel
Pseudo-Differential Inputs
♦ Internal Multiplexer and Track/Hold
♦ Single-Supply Operation
+4.5V to +5.5V (MAX1280)
+2.7V to +3.6V (MAX1281)
♦ Internal +2.5V Reference
♦ 400ksps Sampling Rate (MAX1280)
♦ Low Power 2.5mA (400ksps)
1.3mA (Reduced-Power Mode)
0.9mA (Fast Power-Down Mode)
2µA (Full Power-Down)
♦ SPI/QSPI/MICROWIRE/TMS320-Compatible
4-Wire Serial Interface
♦ Software-Configurable Unipolar or Bipolar Inputs
♦ 20-Pin TSSOP Package
Ordering Information
TEMP.
RANGE
PART
MAX1280BCUP
MAX1280BEUP
0°C to +70°C
-40°C to +85°C
PINPACKAGE
INL
(LSB)
20 TSSOP
20 TSSOP
±1
±1
Ordering Information continued at end of data sheet.
Pin Configuration
TOP VIEW
CH0 1
20 VDD1
Data Acquisition
CH1 2
19 VDD2
Medical Instruments
CH2 3
Battery-Powered Instruments
CH3 4
Pen Digitizers
CH4 5
Process Control
CH5 6
15 SSTRB
CH6 7
14 DOUT
CH7 8
13 GND
COM 9
12 REFADJ
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
18 SCLK
MAX1280
MAX1281
17
CS
16 DIN
11 REF
SHDN 10
TSSOP
________________________________________________________________ Maxim Integrated Products
1
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
MAX1280/MAX1281
General Description
The MAX1280/MAX1281 12-bit ADCs combine an 8-channel analog-input multiplexer, high-bandwidth track/hold,
and serial interface with high conversion speed and low
power consumption. The MAX1280 operates from a single
+4.5V to +5.5V supply; the MAX1281 operates from a single +2.7V to +3.6V supply. Both devices’ analog inputs
are software configurable for unipolar/bipolar and singleended/pseudo-differential operation.
The 4-wire serial interface connects directly to
SPI™/QSPI™/MICROWIRE™ devices without external
logic. A serial strobe output allows direct connection to
TMS320-family digital signal processors. The MAX1280/
MAX1281 use an external serial-interface clock to perform successive-approximation analog-to-digital conversions. Both parts feature an internal +2.5V reference
and a reference-buffer amplifier with a ±1.5% voltageadjustment range. An external reference with a 1V to
VDD1 range may also be used.
The MAX1280/MAX1281 provide a hard-wired SHDN
pin and four software-selectable power modes (normal
operation, reduced power, fast power-down, and full
power-down). These devices can be programmed to
automatically shut down at the end of a conversion or to
operate with reduced power. When using the powerdown modes, accessing the serial interface automatically powers up the devices, and the quick turn-on time
allows them to be powered down between all conversions. This technique can cut supply current to under
100µA at reduced sampling rates.
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
ABSOLUTE MAXIMUM RATINGS
VDD_ to GND ............................................................ -0.3V to +6V
VDD1 to VDD2 ........................................................ -0.3V to +0.3V
CH0–CH7, COM to GND.......................... -0.3V to (VDD1 + 0.3V)
REF, REFADJ to GND .............................. -0.3V to (VDD1 + 0.3V)
Digital Inputs to GND .............................................. -0.3V to +6V
Digital Outputs to GND ............................ -0.3V to (VDD2 + 0.3V)
Digital Output Sink Current .................................................25mA
Continuous Power Dissipation (TA = +70°C)
20-Pin TSSOP (derate 7.0mW/°C above +70°C) .........559mW
Operating Temperature Ranges
MAX128_BCUP .................................................. 0°C to +70°C
MAX128_BEUP ............................................... -40°C to +85°C
Storage Temperature Range ............................ -60°C to +150°C
Lead Temperature (soldering, 10s) ................................ +300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS—MAX1280
(VDD1 = VDD2 = +4.5V to +5.5V, COM = GND, fSCLK = 6.4MHz, 50% duty cycle, 16 clocks/conversion cycle (400ksps), external
+2.5V at REF, REFADJ = VDD1, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
±1.0
LSB
DC ACCURACY (Note 1)
12
Resolution
Relative Accuracy (Note 2)
INL
Differential Nonlinearity
DNL
Bits
±1.0
LSB
Offset Error
±6.0
LSB
Gain Error (Note 3)
±6.0
LSB
No missing codes over temperature
Gain-Error Temperature
Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset-Error
Matching
±0.1
LSB
DYNAMIC SPECIFICATIONS (100kHz sine-wave input, 2.5Vp-p, 400ksps, 6.4MHz clock, bipolar input mode)
Signal-to-Noise plus Distortion
Ratio
SINAD
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
Up to the 5th harmonic
70
dB
-81
dB
80
dB
fIN1 = 99kHz, fIN2 = 102kHz
76
dB
Channel-to-Channel Crosstalk
(Note 4)
fIN = 200kHz, VIN = 2.5Vp-p
-78
dB
Full-Power Bandwidth
-3dB point
6
MHz
Full-Linear Bandwidth
SINAD > 68dB
350
kHz
Intermodulation Distortion
IMD
CONVERSION RATE
Conversion Time (Note 5)
tCONV
Track/Hold Acquisition Time
tACQ
2.5
10
Aperture Delay
Duty Cycle
2
fSCLK
ns
ns
<50
Aperture Jitter
Serial Clock Frequency
µs
468
ps
0.5
6.4
MHz
40
60
%
_______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
(VDD1 = VDD2 = +4.5V to +5.5V, COM = GND, fSCLK = 6.4MHz, 50% duty cycle, 16 clocks/conversion cycle (400ksps), external
+2.5V at REF, REFADJ = VDD1, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ANALOG INPUTS (CH7–CH0, COM)
Input Voltage Range, SingleEnded and Differential (Note 6)
VREF
Unipolar, VCOM = 0
VCH_
Multiplexer Leakage Current
Bipolar, VCOM or VCH_ = VREF/2,
referenced to COM or CH_
±VREF/2
On/off leakage current, VCH_ = 0 or VDD1
±0.001
Input Capacitance
±1
18
V
µA
pF
INTERNAL REFERENCE
REF Output Voltage
VREF
TA = +25°C
2.480
REF Short-Circuit Current
REF Output Temperature
Coefficient
TC VREF
Load Regulation (Note 7)
2.500
V
30
mA
±15
ppm/°C
0.1
0 to 1mA output load
2.520
2.0
mV/mA
Capacitive Bypass at REF
4.7
10
µF
Capacitive Bypass at REFADJ
0.01
10
µF
REFADJ Output Voltage
REFADJ Input Range
For small adjustments, from 1.22V
REFADJ Buffer Disable
Threshold
To power down the internal reference
1.22
V
±100
mV
1.4
VDD1
2.05
Buffer Voltage Gain
V
V/V
EXTERNAL REFERENCE (Reference buffer disabled, reference applied to REF)
REF Input Voltage Range
(Note 8)
1.0
VREF = 2.500V, fSCLK = 6.4MHz
REF Input Current
VDD1 +
50mV
200
V
350
VREF = 2.500V, fSCLK = 0
320
In power-down, fSCLK = 0
5
µA
mA
DIGITAL INPUTS (DIN, SCLK, CS, SHDN)
Input High Voltage
VINH
Input Low Voltage
VINL
Input Hysteresis
3.0
VHYST
Input Leakage
IIN
Input Capacitance
CIN
V
0.8
V
±1
µA
0.2
VIN = 0 or VDD2
V
15
pF
DIGITAL OUTPUTS (DOUT, SSTRB)
Output Voltage Low
VOL
ISINK = 5mA
Output Voltage High
VOH
ISOURCE = 1mA
Three-State Leakage Current
Three-State Output Capacitance
IL
CS = 5V
COUT
CS = 5V
0.4
V
±10
µA
4
V
15
pF
_______________________________________________________________________________________
3
MAX1280/MAX1281
ELECTRICAL CHARACTERISTICS—MAX1280 (continued)
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
ELECTRICAL CHARACTERISTICS—MAX1280 (continued)
(VDD1 = VDD2 = +4.5V to +5.5V, COM = GND, fSCLK = 6.4MHz, 50% duty cycle, 16 clocks/conversion cycle (400ksps), external
+2.5V at REF, REFADJ = VDD1, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
5.5
V
POWER SUPPLY
Positive Supply Voltage
(Note 9)
Supply Current
VDD1,
VDD2
IVDD1 +
IVDD2
4.5
VDD1 =
VDD2 = 5.5V
Supply Current
Power-Supply Rejection
PSR
Operating mode (Note 10)
2.5
4.0
Reduced-power mode (Note 11)
1.3
2.0
Fast power-down (Note 11)
0.9
1.5
Full power-down (Note 11)
2
10
µA
±0.5
±2.0
mV
VDD1 = VDD2 = 5V ±10%, midscale input
mA
ELECTRICAL CHARACTERISTICS—MAX1281
(VDD1 = VDD2 = +2.7V to +3.6V, COM = GND, fSCLK = 4.8MHz, 50% duty cycle, 16 clocks/conversion cycle (300ksps), external
+2.5V at REF, REFADJ = VDD1, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
±1.0
LSB
±1.0
LSB
Offset Error
±6.0
LSB
Gain Error (Note 3)
±6.0
LSB
DC ACCURACY (Note 1)
12
Resolution
Relative Accuracy (Note 2)
INL
Differential Nonlinearity
DNL
Bits
No missing codes over temperature
Gain-Error Temperature
Coefficient
±1.6
ppm/°C
Channel-to-Channel OffsetError Matching
±0.2
LSB
DYNAMIC SPECIFICATIONS (75kHz sine-wave input, 2.5Vp-p, 300ksps, 4.8MHz clock, bipolar input mode)
Signal-to-Noise plus
Distortion Ratio
SINAD
Total Harmonic Distortion
THD
Spurious-Free Dynamic
Range
SFDR
Up to the 5th harmonic
70
dB
-81
dB
80
dB
fIN1 = 73kHz, fIN2 = 77kHz
76
dB
Channel-to-Channel Crosstalk
(Note 4)
fIN = 150kHz, VIN = 2.5Vp-p
-78
dB
Full-Power Bandwidth
-3dB point
3
MHz
Full-Linear Bandwidth
SINAD > 68dB
250
kHz
Intermodulation Distortion
4
IMD
_______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
(VDD1 = VDD2 = +2.7V to +3.6V, COM = GND, fSCLK = 4.8MHz, 50% duty cycle, 16 clocks/conversion cycle (300ksps), external
+2.5V at REF, REFADJ = VDD1, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CONVERSION RATE
Conversion Time (Note 5)
tCONV
Normal operating mode
Track/Hold Acquisition Time
tACQ
Normal operating mode
3.3
µs
625
ns
Aperture Delay
10
ns
Aperture Jitter
<50
ps
Serial Clock Frequency
fSCLK
Normal operating mode
Duty Cycle
0.5
4.8
MHz
40
60
%
ANALOG INPUTS (CH7–CH0, COM)
Input Voltage Range, SingleEnded and Differential (Note 6)
VREF
Unipolar, VCOM = 0
VCH_
Multiplexer Leakage Current
Bipolar, VCOM or VCH_ = VREF/2,
referenced to COM or CH_
±VREF/2
On/off leakage current, VCH_ = 0 or AVDD
±0.001
Input Capacitance
±1
18
V
µA
pF
INTERNAL REFERENCE
REF Output Voltage
VREF
TA = +25°C
2.480
REF Short-Circuit Current
REF Output Temperature
Coefficient
TC VREF
Load Regulation (Note 7)
4.7
Capacitive Bypass at REFADJ
0.01
REFADJ Output Voltage
For small adjustments, from 1.22V
REFADJ Buffer Disable
Threshold
To power down the internal reference
2.520
mA
±15
ppm/°C
2.0
mV/mA
10
µF
10
µF
1.22
V
±100
mV
1.4
VDD1 - 1
2.05
Buffer Voltage Gain
V
15
0.1
0 to 0.75mA output load
Capacitive Bypass at REF
REFADJ Input Range
2.500
V
V/V
EXTERNAL REFERENCE (Reference buffer disabled, reference applied to REF)
REF Input Voltage Range
(Note 8)
1.0
200
VREF = 2.500V, fSCLK = 4.8MHz
REF Input Current
VDD1 +
50mV
V
350
VREF = 2.500V, fSCLK = 0
320
In power-down, fSCLK = 0
5
µA
DIGITAL INPUTS (DIN, SCLK, CS, SHDN)
Input High Voltage
VINH
Input Low Voltage
VINL
Input Hysteresis
2.0
0.2
VHYST
Input Leakage
IIN
Input Capacitance
CIN
V
0.8
V
±1
VIN = 0 or VDD2
15
V
µA
pF
_______________________________________________________________________________________
5
MAX1280/MAX1281
ELECTRICAL CHARACTERISTICS—MAX1281 (continued)
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
ELECTRICAL CHARACTERISTICS—MAX1281 (continued)
(VDD1 = VDD2 = +2.7V to +3.6V, COM = GND, fSCLK = 4.8MHz, 50% duty cycle, 16 clocks/conversion cycle (300ksps), external
+2.5V at REF, REFADJ = VDD1, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
0.4
V
±10
µA
DIGITAL OUTPUTS (DOUT, SSTRB)
Output Voltage Low
VOL
ISINK = 5mA
Output Voltage High
VOH
ISOURCE = 0.5mA
Three-State Leakage Current
Three-State Output
Capacitance
IL
CS = 3V
COUT
CS = 3V
VDD2 - 0.5V
V
15
pF
POWER SUPPLY
Positive Supply Voltage
(Note 9)
VDD1,
VDD2
Supply Current
IVDD1 +
IVDD2
2.7
Operating mode (Note 10)
Power-Supply Rejection
PSR
Reduced-power mode (Note 11)
VDD1 =
VDD2 = 3.6V Fast power-down (Note 11)
Full power-down (Note 11)
VDD1 = VDD2 = 2.7V to 3.6V, midscale input
3.6
V
2.5
3.5
1.3
2.0
0.9
1.5
2
±0.5
10
±2.0
µA
mV
TYP
MAX
UNITS
mA
TIMING CHARACTERISTICS—MAX1280
(Figures 1, 2, 6, 7; VDD1 = VDD2 = +4.5V to +5.5V; TA = TMIN to TMAX; unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
SCLK Period
tCP
156
ns
SCLK Pulse Width High
tCH
62
ns
SCLK Pulse Width Low
tCL
62
ns
DIN to SCLK Setup
tDS
35
ns
DIN to SCLK Hold
tDH
0
ns
CS Fall to SCLK Rise Setup
tCSS
35
ns
SCLK Rise to CS Rise Hold
tCSH
0
ns
SCLK Rise to CS Fall Ignore
tCSO
35
ns
CS Rise to SCLK Rise Ignore
tCS1
35
ns
SCLK Rise to DOUT Hold
tDOH
CLOAD = 20pF
10
20
SCLK Rise to SSTRB Hold
tSTH
CLOAD = 20pF
10
20
SCLK Rise to DOUT Valid
tDOV
CLOAD = 20pF
SCLK Rise to SSTRB Valid
tSTV
CLOAD = 20pF
CS Rise to DOUT Disable
tDOD
CLOAD = 20pF
10
CS Rise to SSTRB Disable
tSTD
CLOAD = 20pF
10
CS Fall to DOUT Enable
tDOE
CLOAD = 20pF
CS Fall to SSTRB Enable
tSTE
CLOAD = 20pF
CS Pulse Width High
tCSW
6
100
_______________________________________________________________________________________
ns
ns
80
ns
80
ns
65
ns
65
ns
65
ns
65
ns
ns
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
(Figures 1, 2, 6, 7; VDD1 = VDD2 = +2.7V to +3.6V; TA = TMIN to TMAX; unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SCLK Period
tCP
208
ns
SCLK Pulse Width High
tCH
83
ns
SCLK Pulse Width Low
tCL
83
ns
DIN to SCLK Setup
tDS
45
ns
DIN to SCLK Hold
tDH
0
ns
CS Fall to SCLK Rise Setup
tCSS
45
ns
SCLK Rise to CS Rise Hold
tCSH
0
ns
SCLK Rise to CS Fall ignore
tCSO
45
ns
CS Rise to SCLK Rise Ignore
tCS1
45
ns
SCLK Rise to DOUT Hold
tDOH
CLOAD = 20pF
13
20
SCLK Rise to SSTRB Hold
tSTH
CLOAD = 20pF
1
20
SCLK Rise to DOUT Valid
tDOV
CLOAD = 20pF
SCLK Rise to SSTRB Valid
tSTV
CLOAD = 20pF
CS Rise to DOUT Disable
tDOD
CLOAD = 20pF
13
CS Rise to SSTRB Disable
tSTD
CLOAD = 20pF
13
CS Fall to DOUT Enable
tDOE
CS Fall to SSTRB Enable
tSTE
CS Pulse Width High
tCSW
ns
ns
100
ns
100
ns
85
ns
85
ns
CLOAD = 20pF
85
ns
CLOAD = 20pF
85
ns
100
ns
Note 1: MAX1280 tested at VDD1 = VDD2 = +5V, MAX1281 tested at VDD1 = VDD2 = +3V; COM = GND; unipolar single-ended
input mode.
Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the gain error and offset
error have been nulled.
Note 3: Offset nulled.
Note 4: Ground “on” channel; sine wave applied to all “off” channels.
Note 5: Conversion time is defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle.
Note 6: The absolute voltage range for the analog inputs (CH7–CH0, and COM) is from GND to VDD1.
Note 7: External load should not change during conversion for specified accuracy. Guaranteed specification of 2mV/mA is a result
of production test limitations.
Note 8: ADC performance is limited by the converter’s noise floor, typically 300µVp-p.
Note 9: Electrical characteristics are guaranteed from VDD1(MIN) = VDD2(MIN) to VDD1(MAX) = VDD2(MAX). For operations beyond
this range, see the Typical Operating Characteristics. For guaranteed specifications beyond the limits, contact the factory.
Note 10: AIN = midscale. Unipolar mode. MAX1280 tested with 20pF on DOUT, 20pF on SSTRB, and fSCLK = 6.4MHz, 0 to 5V.
MAX1281 tested with same loads, fSCLK = 4.8MHz, 0 to 3V. DOUT = FFF hex.
Note 11: SCLK = DIN = GND, CS = VDD1.
_______________________________________________________________________________________
7
MAX1280/MAX1281
TIMING CHARACTERISTICS—MAX1281
Typical Operating Characteristics
(MAX1280: VDD1 = VDD2 = 5.0V, fSCLK = 6.4MHz; MAX1281: VDD1 = VDD2 = 3.0V, fSCLK = 4.8MHz; CLOAD = 20pF, 4.7µF capacitor
at REF, 0.01µF capacitor at REFADJ, TA = +25°C, unless otherwise noted.)
INTEGRAL NONLINEARITY
vs. DIGITAL OUTPUT CODE
SUPPLY CURRENT vs. SUPPLY
VOLTAGE (CONVERTING)
DIFFERENTIAL NONLINEARITY
vs. DIGITAL OUTPUT CODE
0.4
SUPPLY CURRENT (mA)
0.2
DNL (LSB)
0.1
0
0
-0.2
-0.1
2.5
2.0
-0.4
-0.2
-0.3
-0.6
0
500 1000 1500 2000 2500 3000 3500 4000 4500
1.5
0
500 1000 1500 2000 2500 3000 3500 4000 4500
2.5
3.0
3.5
4.0
4.5
5.0
5.5
DIGITAL OUTPUT CODE
DIGITAL OUTPUT CODE
SUPPLY VOLTAGE (V)
SUPPLY CURRENT vs. TEMPERATURE
SUPPLY CURRENT vs. SUPPLY
VOLTAGE (STATIC)
SUPPLY CURRENT vs. TEMPERATURE
(STATIC)
2.8
2.6
2.4
MAX1281
2.2
1.5
MAX1280 (PD1 = 1, PD0 = 1)
2.0
SUPPLY CURRENT (mA)
MAX1280
NORMAL OPERATION (PD1 = PD0 = 1)
2.0
SUPPLY CURRENT (mA)
3.0
2.5
MAX1280/1-05
2.5
MAX1280/1-04
3.2
SUPPLY CURRENT (mA)
3.0
REDP (PD1 = 1, PD0 = 0)
1.0
FASTDP (PD1 = 0, PD0 = 1)
MAX1280/1-06
INL (LSB)
0.3
0.2
3.5
MAX1280/1-03
0.4
MAX1280/1-02
0.6
MAX1280/1-01
0.5
MAX1281 (PD1 = 1, PD0 = 1)
1.5
MAX1280 (PD1 = 1, PD0 = 0)
MAX1281 (PD1 = 1, PD0 = 0)
1.0
0.5
0.5
0
0
MAX1280 (PD1 = 0, PD0 = 1)
MAX1281 (PD1 = 0, PD0 = 1)
2.0
-20
0
20
40
60
80
100
3.0
3.5
4.0
4.5
5.0
5.5
-20
0
20
40
60
TEMPERATURE (°C)
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
3
2
MAX1280
2.0
1.5
MAX1281
1.0
0.5
1
3.0
3.5
4.0
4.5
SUPPLY VOLTAGE (V)
5.0
5.5
5.0
5.5
2.5003
2.5001
2.4999
2.4997
0
0
100
MAX1280/1-09
SHUTDOWN CURRENT (µA)
4
(PD1 = PD0 = 0)
80
2.5005
MAX1280/1-08
2.5
MAX1280/1-07
(PD1 = PD0 = 0)
2.5
-40
SUPPLY VOLTAGE (V)
5
8
2.5
TEMPERATURE (°C)
REFERENCE VOLTAGE (V)
-40
SHUTDOWN CURRENT (µA)
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
2.4995
-40
-20
0
20
40
60
TEMPERATURE (°C)
80
100
2.5
3.0
3.5
4.0
4.5
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
REFERENCE VOLTAGE
vs. TEMPERATURE
OFFSET ERROR vs. SUPPLY VOLTAGE
2.4994
-1.0
-1.5
2.4992
-2.0
-2.5
-20
0
20
40
60
80
100
MAX1280/1-12
-1.5
-2.5
2.7
3.0
3.3
3.6
-40
-15
VDD (V)
TEMPERATURE (°C)
35
60
85
GAIN ERROR vs. TEMPERATURE
GAIN ERROR vs. SUPPLY VOLTAGE
1
10
TEMPERATURE (°C)
0.5
MAX1280/1-13
MAX1281
0
0
GAIN ERROR (LSB)
-40
-1.0
-2.0
2.4990
2.4988
-0.5
MAX1280/1-14
MAX1281
0
OFFSET ERROR (LSB)
-0.5
OFFSET ERROR (LSB)
2.4998
GAIN ERROR (LSB)
REFERENCE VOLTAGE (V)
MAX1280
OFFSET ERROR vs. TEMPERATURE
0.5
MAX1280/1-11
2.5000
2.4996
0
MAX1280/1-10
2.5002
-1
-2
-0.5
-1.0
-1.5
-2.0
-3
2.7
3.0
3.3
VDD (V)
3.6
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
9
MAX1280/MAX1281
Typical Operating Characteristics (continued)
(MAX1280: VDD1 = VDD2 = 5.0V, fSCLK = 6.4MHz; MAX1281: VDD1 = VDD2 = 3.0V, fSCLK = 4.8MHz; CLOAD = 20pF, 4.7µF capacitor
at REF, 0.01µF capacitor at REFADJ, TA = +25°C, unless otherwise noted.)
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
MAX1280/MAX1281
Pin Description
PIN
NAME
FUNCTION
1–8
CH0–CH7
9
COM
Ground Reference for Analog Inputs. COM sets zero-code voltage in single-ended mode. Must be
stable to ±0.5LSB.
10
SHDN
Active-Low Shutdown Input. Pulling SHDN low shuts down the device, reducing supply current to 2µA
(typ).
Sampling Analog Inputs
11
REF
Reference-Buffer Output/ADC Reference Input. Reference voltage for analog-to-digital conversion.
In internal reference mode, the reference buffer provides a +2.500V nominal output, externally
adjustable at REFADJ. In external reference mode, disable the internal buffer by pulling REFADJ to
VDD1.
12
REFADJ
Input to the Reference-Buffer Amplifier. To disable the reference-buffer amplifier, tie REFADJ to VDD1.
13
GND
Analog and Digital Ground
14
DOUT
Serial Data Output. Data is clocked out at SCLK’s rising edge. High impedance when CS is high.
15
SSTRB
Serial Strobe Output. SSTRB pulses high for one clock period before the MSB decision. High impedance when CS is high.
16
DIN
Serial Data Input. Data is clocked in at SCLK’s rising edge.
17
CS
Active-Low Chip Select. Data will not be clocked into DIN unless CS is low. When CS is high, DOUT
and SSTRB are high impedance.
18
SCLK
Serial Clock Input. Clocks data in and out of the serial interface and sets the conversion speed. (Duty
cycle must be 40% to 60%.)
19
VDD2
Positive Supply Voltage
20
VDD1
Positive Supply Voltage
VDD2
VDD2
DOUT
DOUT
CLOAD
20pF
6k
CLOAD
20pF
GND
GND
a) High-Z to VOH and VOL to VOH
b) High-Z to VOL and VOH to VOL
Figure 1. Load Circuits for Enable Time
10
6k
6k
DOUT
DOUT
CLOAD
20pF
6k
GND
a) VOH to High-Z
Figure 2. Load Circuits for Disable Time
______________________________________________________________________________________
CLOAD
20pF
GND
b) VOL to High-Z
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
The MAX1280/MAX1281 analog-to-digital converters
(ADCs) use a successive-approximation conversion technique and input track/hold (T/H) circuitry to convert an
analog signal to a 12-bit digital output. A flexible serial
interface provides easy interface to microprocessors
(µPs). Figure 3 shows a functional diagram of the
MAX1280/MAX1281.
Pseudo-Differential Input
The equivalent input circuit of Figure 4 shows the
MAX1280/MAX1281’s input architecture, which is composed of a T/H, input multiplexer, input comparator,
switched-capacitor DAC, and reference.
In single-ended mode, the positive input (IN+) is connected to the selected input channel and the negative
input (IN-) is set to COM. In differential mode, IN+ and
IN- are selected from the following pairs: CH0/CH1,
CH2/CH3, CH4/CH5, and CH6/CH7. Configure the
channels according to Tables 2 and 3.
The MAX1280/MAX1281 input configuration is pseudodifferential in that only the signal at IN+ is sampled. The
return side (IN-) is connected to the sampling capacitor
while converting and must remain stable within ±0.5LSB
(±0.1LSB for best results) with respect to GND during a
conversion.
If a varying signal is applied to the selected IN-, its amplitude and frequency must be limited to maintain accuracy.
The following equations determine the relationship
between the maximum signal amplitude and its frequency
CS
SCLK
DIN
SHDN
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
in order to maintain ±0.5LSB accuracy. Assuming a sinusoidal signal at IN-, the input voltage is determined by:
(
The maximum voltage variation is determined by:
max
10
1
2
3
4
5
6
7
8
dνIN1LSB
VREF
= VIN- 2πf ≤
=
12
dt
t CONV
2 t CONV
(
)
A 650mVp-p 60Hz signal at IN- will generate ±0.5LSB
of error when using a +2.5V reference voltage and a
2.5µs conversion time (15/fSCLK). When a DC reference
voltage is used at IN-, connect a 0.1µF capacitor to
GND to minimize noise at the input.
During the acquisition interval, the channel selected as
the positive input (IN+) charges capacitor CHOLD. The
acquisition interval spans three SCLK cycles and ends
on the falling SCLK edge after the last bit of the input
control word has been entered. At the end of the acquisition interval, the T/H switch opens, retaining charge
on CHOLD as a sample of the signal at IN+. The conversion interval begins with the input multiplexer switching
CHOLD from IN+ to IN-. This unbalances node ZERO at
the comparator’s input. The capacitive DAC adjusts
during the remainder of the conversion cycle to restore
node ZERO to V DD1 /2 within the limits of 12-bit
resolution. This action is equivalent to transferring a
12pF x (VIN+ - VIN-) charge from CHOLD to the binaryweighted capacitive DAC, which in turn forms a digital
representation of the analog input signal.
GND
17
18
16
)
νIN- = VIN- sin(2πft)
INPUT
SHIFT
REGISTER
REF
INT
CLOCK
CONTROL
LOGIC
CH0
CH1
OUTPUT
SHIFT
REGISTER
ANALOG
INPUT
MUX
14
15
DOUT
SSTRB
T/H
CLOCK
IN 12-BIT
SAR
ADC OUT
REF
9
+1.22V
REFERENCE
REFADJ 12
REF 11
17k
A ≈ 2.05*
Figure 3. Functional Diagram
CH6
CH7
20
19
13
+2.500V
MAX1280
MAX1281
CH2
CH3
CH4
CH5
VDD1
CH8
INPUT
MUX
CAPACITATIVE
DAC
CHOLD
12pF
CSWITCH*
6pF
RIN
800Ω
HOLD
TRACK AT THE SAMPLING INSTANT,
THE MUX INPUT SWITCHES FROM
THE SELECTED IN+ CHANNEL TO
THE SELECTED IN- CHANNEL.
VDD2
GND
COMPARATOR
ZERO
VDD1/2
SINGLE-ENDED MODE: IN+ = CH0–CH7, IN- = COM.
PSEUDO-DIFFERENTIAL MODE: IN+ AND IN- SELECTED FROM
PAIRS OF CH0/CH1, CH2/CH3, CH4/CH5, AND CH6/CH7.
*INCLUDES ALL INPUT PARASITICS
Figure 4. Equivalent Input Circuit
______________________________________________________________________________________
11
MAX1280/MAX1281
Detailed Description
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
Track/Hold
Input Bandwidth
The T/H enters its tracking mode on the falling clock
edge after the fifth bit of the 8-bit control word has been
shifted in. It enters its hold mode on the falling clock
edge after the eighth bit of the control word has been
shifted in. If the converter is set up for single-ended
inputs, IN- is connected to COM and the converter converts the “+” input. If the converter is set up for differential inputs, the difference of [(IN+) - (IN-)] is converted.
At the end of the conversion, the positive input connects back to IN+ and CHOLD charges to the input signal.
The time required for the T/H to acquire an input signal
is a function of how quickly its input capacitance is
charged. If the input signal’s source impedance is high,
the acquisition time lengthens, and more time must be
allowed between conversions. The acquisition time,
tACQ, is the maximum time the device takes to acquire
the signal and is also the minimum time needed for the
signal to be acquired. It is calculated by the following
equation:
The ADC’s input tracking circuitry has a 6MHz
(MAX1280) or 3MHz (MAX1281) small-signal bandwidth, so it is possible to digitize high-speed transient
events and measure periodic signals with bandwidths
exceeding the ADC’s sampling rate by using undersampling techniques. To avoid high-frequency signals
being aliased into the frequency band of interest, antialias filtering is recommended.
tACQ = 9 ✕ (RS + RIN) ✕ 12pF
where RIN = 800Ω, RS = the source impedance of the
input signal; tACQ is never less than 468ns (MAX1280)
or 625ns (MAX1281). Note that source impedances
below 2kΩ do not significantly affect the ADC’s AC performance.
Analog Input Protection
Internal protection diodes, which clamp the analog
input to VDD1 and GND, allow the channel input pins to
swing from GND - 0.3V to VDD1 + 0.3V without damage. However, for accurate conversions near full scale,
the inputs must not exceed VDD1 by more than 50mV or
be lower than GND by 50mV.
If the analog input exceeds 50mV beyond the supplies, do not allow the input current to exceed 2mA.
Quick Look
To quickly evaluate the MAX1280/MAX1281’s analog
performance, use the circuit of Figure 5. The MAX1280/
MAX1281 require a control byte to be written to DIN
before each conversion. Connecting DIN to VDD2 feeds
in control bytes of $FF (HEX), which trigger singleended unipolar conversions on CH7 without powering
down between conversions. The SSTRB output pulses
OSCILLOSCOPE
MAX1280
MAX1281
0V TO
2.500V
ANALOG
INPUT 0.01µF
CH7
VDD1
VDD2
+3V or +5V
0.1µF
SCLK
10µF
GND
COM
SSTRB
CS
REFADJ
0.01µF
DOUT*
SCLK
TO VDD2
DIN
2.5V
EXTERNAL CLOCK
DOUT
REF
4.7µF
SSTRB
SHDN
TO VDD2
CH1
CH2
CH3
CH4
*FULL-SCALE ANALOG INPUT, CONVERSION RESULT = $FFF (HEX)
Figure 5. Quick-Look Circuit
12
______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
MAX1280/MAX1281
CS
tACQ
SCLK
1
4
8
9
12
16
20
24
SEL SEL SEL UNI/ SGL/
PD1 PD0
2
1
0 BIP DIF
DIN
START
SSTRB
HIGH-Z
HIGH-Z
RB2
RB1
RB3
HIGH-Z
HIGH-Z
DOUT
B11 B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
ACQUISITION
IDLE
CONVERSION
IDLE
Figure 6. Single-Conversion Timing
high for one clock period before the MSB of the 12-bit
conversion result is shifted out of DOUT. Varying the
analog input to CH7 will alter the sequence of bits from
DOUT. A total of 16 clock cycles is required per conversion. All transitions of the SSTRB and DOUT outputs
typically occur 20ns after the rising edge of SCLK.
clock frequency from 500kHz to 6.4MHz (MAX1280) or
4.8MHz (MAX1281).
1) Set up the control byte and call it TB1. TB1 should
be of the format 1XXXXXXX binary, where the Xs
denote the particular channel, selected conversion
mode, and power mode.
Starting a Conversion
2) Use a general-purpose I/O line on the CPU to pull
CS low.
Start a conversion by clocking a control byte into DIN.
With CS low, each rising edge on SCLK clocks a bit from
DIN into the MAX1280/MAX1281’s internal shift register.
After CS falls, the first arriving logic “1” bit defines the
control byte’s MSB. Until this first “start” bit arrives, any
number of logic “0” bits can be clocked into DIN with no
effect. Table 1 shows the control-byte format.
The MAX1280/MAX1281 are compatible with SPI/QSPI
and MICROWIRE devices. For SPI, select the correct
clock polarity and sampling edge in the SPI control registers: set CPOL = 0 and CPHA = 0. MICROWIRE, SPI,
and QSPI all transmit a byte and receive a byte at the
same time. Using the Typical Operating Circuit, the
simplest software interface requires only three 8-bit
transfers to perform a conversion (one 8-bit transfer to
configure the ADC, and two more 8-bit transfers to
clock out the 12-bit conversion result). See Figure 17
for MAX1280/MAX1281 QSPI connections.
Simple Software Interface
Make sure the CPU’s serial interface runs in master
mode, so the CPU generates the serial clock. Choose a
3) Transmit TB1 and, simultaneously, receive a byte
and call it RB1. Ignore RB1.
4) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB2.
5) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB3.
6) Pull CS high.
Figure 6 shows the timing for this sequence. Bytes RB2
and RB3 contain the result of the conversion, padded
with three leading zeros and one trailing zero. The total
conversion time is a function of the serial-clock frequency and the amount of idle time between 8-bit
transfers. To avoid excessive T/H droop, make sure the
total conversion time does not exceed 120µs.
Digital Output
In unipolar input mode, the output is straight binary
(Figure 14). For bipolar input mode, the output is two’s
complement (Figure 15). Data is clocked out on the rising edge of SCLK in MSB-first format.
______________________________________________________________________________________
13
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
Table 1. Control-Byte Format
BIT 7
(MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
(LSB)
START
SEL2
SEL1
SEL0
UNI/BIP
SGL/DIF
PD1
PD0
BIT
NAME
7 (MSB)
START
The first logic “1” bit after CS goes low defines the beginning of the control byte.
DESCRIPTION
6
5
4
SEL2
SEL1
SEL0
These three bits select which of the eight channels are used for the conversion (Tables 2 and 3).
3
UNI/BIP
1 = unipolar, 0 = bipolar. Selects unipolar or bipolar conversion mode. In unipolar mode, an
analog input signal from 0 to VREF can be converted; in bipolar mode, the differential signal can
range from -VREF/2 to +VREF/2.
2
SGL/DIF
1 = single ended, 0 = differential. Selects single-ended or differential conversions. In singleended mode, input signal voltages are referred to COM. In differential mode, the voltage
difference between two channels is measured (Tables 2 and 3).
1
0 (LSB)
PD1
PD0
Select operating mode.
PD1
PD0
Mode
0
0
Full power-down
0
1
Fast power-down
1
0
Reduced Power
1
1
Normal Operation
Table 2. Channel Selection in Single-Ended Mode (SGL/DIF = 1)
SEL2
0
SEL1
0
SEL0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
CH0
+
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
–
+
–
+
–
+
–
+
–
+
–
+
–
+
–
Table 3. Channel Selection in Psuedo-Differential Mode (SGL/DIF = 0)
SEL2
SEL1
SEL0
CH0
CH1
0
0
0
+
–
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
14
–
CH2
CH3
+
–
CH4
CH5
+
–
CH6
CH7
+
–
–
+
+
–
+
–
+
______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
MAX1280/MAX1281
CS
tCSW
tCSS
tCH
tCP
tCL
tCSO
tCSH
tCS1
SCLK
tDS
tDH
tDOH
DIN
tDOV
tDOD
tDOE
DOUT
tSTE
tSTH
tSTV
tSTD
SSTRB
Figure 7. Detailed Serial-Interface Timing
Serial Clock
The external serial clock not only shifts data in and out,
but also drives the analog-to-digital conversion steps.
SSTRB pulses high for one clock period after the last bit
of the control byte. Successive-approximation bit decisions are made and appear at DOUT on each of the next
12 SCLK falling edges (Figure 6). SSTRB and DOUT go
into a high-impedance state when CS goes high; after
the next CS rising edge, SSTRB outputs a logic low.
Figure 7 shows the detailed serial-interface timing.
The conversion must complete in 120µs or less, or
droop on the sample-and-hold capacitors may degrade
conversion results.
Data Framing
The falling edge of CS does not start a conversion. The
first logic high clocked into DIN is interpreted as a start
bit and defines the first bit of the control byte. A conversion starts on SCLK’s falling edge after the eighth bit of
the control byte (the PD0 bit) is clocked into DIN. The
start bit is defined as follows:
The first high bit clocked into DIN with CS low any
time the converter is idle, e.g., after VDD1 and VDD2
are applied.
OR
The first high bit clocked into DIN after bit 6 of a conversion in progress is clocked onto the DOUT pin.
Once a start bit has been recognized, the current conversion may only be terminated by pulling SHDN low.
The fastest the MAX1280/MAX1281 can run with CS
held low between conversions is 16 clocks per conversion. Figure 8 shows the serial-interface timing necessary to perform a conversion every 16 SCLK cycles. If
CS is tied low and SCLK is continuous, guarantee a
start bit by first clocking in 16 zeros.
Applications Information
Power-On Reset
When power is first applied, and if SHDN is not pulled
low, internal power-on reset circuitry activates the
MAX1280/MAX1281 in normal operating mode, ready to
convert with SSTRB = low. The MAX1280/MAX1281
require 10µs to reset after the power supplies stabilize;
no conversions should be initiated during this time. If
CS is low, the first logic 1 on DIN is interpreted as a
start bit. Until a conversion takes place, DOUT shifts out
zeros. Additionally, wait for the reference to stabilize
when using the internal reference.
Power Modes
You can save power by placing the converter in one of
the two low-current operating modes or in full powerdown between conversions. Select the power mode
through bit 1 and bit 0 of the DIN control byte (Tables 1
and 4), or force the converter into hardware shutdown
by driving SHDN to GND.
The software power-down modes take effect after the
conversion is completed; SHDN overrides any software
power mode and immediately stops any conversion in
______________________________________________________________________________________
15
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
CS
DIN
S
S
CONTROL BYTE 0
1
8
12
CONTROL BYTE 1
16 1
5
S
8
12
CONTROL BYTE 2
16 1
5
S
8
12
16 1
B11
B6
ETC
5
SCLK
DOUT
HIGH-Z
B11
B6
B0
B11
CONVERSION RESULT 0
SSTRB
B6
B0
CONVERSION RESULT 1
HIGH-Z
Figure 8. Continuous 16-Clock/Conversion Timing
Table 4. Software-Controlled Power Modes
TOTAL SUPPLY CURRENT
PD1/PD0
MODE
CIRCUIT SECTIONS*
CONVERTING
AFTER
CONVERSION
INPUT COMPARATOR
REFERENCE
00
Full Power-Down
(FULLPD)
2.5mA
2µA
Off
Off
01
Fast Power-Down
(FASTPD)
2.5mA
0.9mA
Reduced Power
On
10
Reduced-Power
Mode (REDPD)
2.5mA
1.3mA
Reduced Power
On
11
Operating Mode
2.5mA
2.0mA
Full Power
On
*Circuit operation between conversions; during conversion, all circuits are fully powered up.
progress. In software power-down mode, the serial
interface remains active, waiting for a new control byte
to start conversion and switch to full-power mode.
Once the conversion is completed, the device goes
into the programmed power mode until a new control
byte is written.
The power-up delay is dependent on the power-down
state. Software low-power modes will be able to start
conversion immediately when running at decreased
clock rates (see Power-Down Sequencing). During
power-on reset, when exiting software full power-down
mode or exiting hardware shutdown, the device goes
immediately into full-power mode and is ready to convert after 2µs when using an external reference. When
using the internal reference, wait for the typical power16
up delay from a full power-down (software or hardware), as shown in Figure 9.
Software Power-Down
Software power-down is activated using bits PD1 and
PD0 of the control byte. When software shutdown is
asserted, the ADC completes the conversion in
progress and powers down into the specified lowquiescent-current state (2µA, 0.9mA, or 1.3mA).
The first logic 1 on DIN is interpreted as a start bit and
puts the MAX1280/MAX1281 into their full-power mode.
Following the start bit, the data input word or control
byte also determines the next power-down state. For
example, if the DIN word contains PD1 = 0 and PD0 =
1, a 0.9mA power-down starts after the conversion.
______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
Hardware Power-Down
Pulling SHDN low places the converter in hardware
power-down. Unlike software power-down mode, the
conversion is terminated immediately. When returning
to normal operation from SHDN with an external reference, the MAX1280/MAX1281 can be considered fully
powered-up within 2µs of actively pulling SHDN high.
When using the internal reference, the conversion
should be initiated only after the reference has settled;
its recovery time depends on the external bypass
capacitors and shutdown duration.
Power-Down Sequencing
The MAX1280/MAX1281’s automatic power-down
modes can save considerable power when operating at
REFERENCE POWER-UP DELAY (ms)
1.50
1.25
1.00
0.75
0.50
0.25
0
0.0001
0.001
0.01
0.1
1
10
TIME IN SHUTDOWN (s)
Figure 9. Reference Power-Up Delay vs. Time in Shutdown
Using Full Power-Down Mode
Full power-down mode (FULLPD) achieves the lowest
power consumption at up to 1000 conversions per
channel per second. Figure 10a shows the MAX1281’s
power consumption for 1- or 8-channel conversions
using full power-down mode (PD1 = PD0 = 0), with the
internal reference and the maximum clock speed. A
0.01µF bypass capacitor plus the internal 17kΩ reference resistor at REFADJ forms an RC filter with a 200µs
time constant. To achieve full 12-bit accuracy, 10 time
constants or 2ms are required after power-up if the
bypass capacitor is fully discharged between conversions. Waiting this 2ms in FASTPD mode or reducedpower mode (REDP) instead of full power-down mode
can further reduce power consumption. This is
achieved by using the sequence shown in Figure 12a.
Figure 10b shows the MAX1281’s power consumption
for 1- or 8-channel conversions using FULLPD mode
(PD1 = PD0 = 0), an external reference, and the maximum clock speed. One dummy conversion to power-up
the device is needed, but no wait-time is necessary to
start the second conversion, thereby achieving lower
power consumption at up to the full sampling rate.
Using Fast Power-Down and
Reduced-Power Modes
FASTPD and REDP modes achieve the lowest power
consumption at speeds close to the maximum sample
rate. Figure 11 shows the MAX1281’s power consumption in FASTPD mode (PD1 = 0, PD0 = 1), REDP mode
(PD1 = 1, PD0 = 0), and (for comparison) normal
operating mode (PD = 1, PD0 = 1). The figure shows
10,000
1000
MAX1281
VDD1 = VDD2 = 3.0V
CLOAD = 20pF
CODE = 101010000000
SUPPLY CURRENT (µA)
SUPPLY CURRENT (µA)
less than maximum sample rates. Figures 10 and 11
show the average supply current as a function of the
sampling rate.
100
8 CHANNELS
10
1 CHANNEL
MAX1281
VDD1 = VDD2 = 3.0V
CLOAD = 20pF
CODE = 101010000000
1000
8 CHANNELS
100
1 CHANNEL
10
1
1
0.1
1
10
100
1k
10k
SAMPLING RATE (sps)
Figure 10a. Average Supply Current vs. Sample Rate (Using
FULLPD and Internal Reference)
1
10
100
1k
10k
100k
SAMPLING RATE (sps)
Figure 10b. Average Supply Current vs. Sampling Rate (Using
FULLPD and External Reference)
______________________________________________________________________________________
17
MAX1280/MAX1281
Table 4 details the four power modes with the corresponding supply current and operating sections. For
data rates achievable in software power-down modes,
see Power-Down Sequencing.
power consumption using the specified power-down
mode, with the internal reference and the maximum
clock speed. The clock speed in FASTPD or REDP
should be limited to 4.8MHz for the MAX1280/
MAX1281. FULLPD mode may provide increased power
savings in applications where the MAX1280/
MAX1281 are inactive for long periods of time, but
where intermittent bursts of high-speed conversions are
required.
Internal and External References
The MAX1280/MAX1281 can be used with an internal
or external reference. An external reference can be
connected directly at REF or at the REFADJ pin.
2.5
NORMAL OPERATION
SUPPLY CURRENT (mA)
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
An internal buffer is designed to provide 2.5V at REF for
both the MAX1280/MAX1281. The internally trimmed
1.22V reference is buffered with a gain of +2.05V/V.
2.0
REDP
FASTPD
1.5
Internal Reference
The MAX1280/MAX1281’s full-scale range with the internal reference is 2.5V for unipolar inputs and ±1.25V for
bipolar inputs. The internal reference voltage is
adjustable to ±100mV with the circuit of Figure 13.
1.0
MAX1281, VDD1 = VDD2 = 3.0V
CLOAD = 20pF
CODE = 101010000000
0.5
0
50
200
150
100
250
300
External Reference
An external reference can be placed at either the input
(REFADJ) or the output (REF) of the internal referencebuffer amplifier. The REFADJ input impedance is typically 17kΩ. At REF, the DC input resistance is a minimum of
350
SAMPLING RATE (sps)
Figure 11. Average Supply Current vs. Sampling Rate (Using
REPD, FASTPD, and Normal Operation and Internal Reference)
WAIT 2ms (10 x RC)
0 0
1
DIN
1 0
1
REDP
FULLPD
0 0
1
FULLPD
DUMMY CONVERSION
1.22V
1
1.22V
RE FADJ
0V
γ = RC = 17kΩ x 0.01µF
2.5V
2.5V
REF
0V
2.5mA
IVDD1 + IVDD2
2.5mA
2.5mA
1.3mA OR 0.9mA
0mA
0mA
Figure 12a. Full Power-Down Timing
1 0
1
DIN
REF
0 1
1
REDP
REDPD
FASTPD
2.5V (ALWAYS ON)
2.5mA
IVDD1 + IVDD2
1 0
1
2.5mA
0.9mA
2.5mA
0.9mA
1.3mA
Figure 12b. Reduced-Power/Fast Power-Down Timing
18
______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
MAX1280/MAX1281
+3.3V
OUTPUT CODE
24k
MAX1281
510k
100k
12
011 . . . 111
FS = VREF + VCOM
2
011 . . . 110
ZS = COM
REFADJ
-VREF
+ VCOM
2
V
1LSB = REF
4096
-FS =
000 . . . 010
0.01µF
000 . . . 001
000 . . . 000
111 . . . 111
111 . . . 110
Figure 13. MAX1281 Reference-Adjust Circuit
111 . . . 101
OUTPUT CODE
100 . . . 001
100 . . . 000
FULL-SCALE
TRANSITION
11 . . . 111
- FS
11 . . . 110
COM*
+FS - 1LSB
INPUT VOLTAGE (LSB)
11 . . . 101
*VCOM ≤ VREF / 2
FS = VREF + VCOM
ZS = VCOM
V
1LSB = REF
4096
00 . . . 011
00 . . . 010
tions occur halfway between successive-integer LSB
values. Output coding is binary, with 1LSB = 610µV
for unipolar and bipolar operation.
Layout, Grounding, and Bypassing
00 . . . 001
00 . . . 000
0 1
(COM)
Figure 15. Bipolar Transfer Function, Full Scale (FS) =
VREF / 2 + VCOM, Zero Scale (ZS) = VCOM
2
3
INPUT VOLTAGE (LSB)
FS
FS - 3/2LSB
Figure 14. Unipolar Transfer Function, Full Scale (FS) = VREF
+ VCOM, Zero Scale (ZS) = VCOM
18kΩ. During conversion, an external reference at REF
must deliver up to 350µA DC load current and have 10Ω
or less output impedance. If the reference has a higher
output impedance or is noisy, bypass it close to the REF
pin with a 4.7µF capacitor.
Using the REFADJ input makes buffering the external
reference unnecessary. To use the direct REF input,
disable the internal buffer by connecting REFADJ to
VDD1.
Transfer Function
Table 5 shows the full-scale voltage ranges for unipolar
and bipolar modes. Figure 14 depicts the nominal,
unipolar input/output (I/O) transfer function, and Figure
15 shows the bipolar I/O transfer function. Code transi-
For best performance, use printed circuit boards; wirewrap boards are not recommended. Board layout
should ensure that digital and analog signal lines are
separated from each other. Do not run analog and digital (especially clock) lines parallel to one another, or
digital lines underneath the ADC package.
Figure 16 shows the recommended system ground
connections. Establish a single-point analog ground
(star ground point) at GND. Connect all analog grounds
to the star ground. Connect the digital system ground
to star ground at this point only. For lowest-noise operation, the ground return to the star ground’s power supply should be low impedance and as short as possible.
High-frequency noise in the VDD1 power supply may
affect the high-speed comparator in the ADC. Bypass
the supply to the star ground with 0.1µF and 10µF
capacitors, located close to pin 20 of the MAX1280/
MAX1281. Minimize capacitor lead lengths for best
supply-noise rejection. If the power supply is very
noisy, a 10Ω resistor can be connected as a lowpass
filter (Figure 16).
______________________________________________________________________________________
19
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
Table 5. Full Scale and Zero Scale
UNIPOLAR MODE
BIPOLAR MODE
Full Scale
Zero Scale
Positive
Full Scale
Zero
Scale
Negative
Full Scale
VREF + VCOM
COM
VREF / 2
+ VCOM
VCOM
-VREF / 2
+ VCOM
connected with the MAX1280/MAX1281’s SCLK
input.
SUPPLIES
VDD1
VDD2
GND
R* = 10Ω
VDD1
GND
COM
VDD2
VDD
DGND
DIGITAL
CIRCUITRY
MAX1280
MAX1281
*OPTIONAL
Figure 16. Power-Supply Grounding Connection
2) The MAX1280/MAX1281’s CS pin is driven low by
the TMS320’s XF_ I/O port to enable data to be
clocked into the MAX1280/MAX1281’s DIN pin.
3) An 8-bit word (1XXXXX11) should be written to the
MAX1280/MAX1281 to initiate a conversion and
place the device into normal operating mode. See
Table 1 to select the proper XXXXX bit values for
your specific application.
4) The MAX1280/MAX1281’s SSTRB output is monitored through the TMS320’s FSR input. A falling
edge on the SSTRB output indicates that the conversion is in progress and data is ready to be received
from the MAX1280/MAX1281.
5) The TMS320 reads in one data bit on each of the
next 16 rising edges of SCLK. These data bits represent the 12-bit conversion result followed by four
trailing bits, which should be ignored.
6) Pull CS high to disable the MAX1280/MAX1281 until
the next conversion is initiated.
High-Speed Digital Interfacing with QSPI
The MAX1280/MAX1281 can interface with QSPI using
the circuit in Figure 17 (fSCLK = 4.0MHz, CPOL = 0,
CPHA = 0). This QSPI circuit can be programmed to do
a conversion on each of the eight channels. The result
is stored in memory without taxing the CPU, since QSPI
incorporates its own microsequencer.
TMS320LC3x Interface
Figure 18 shows an application circuit that interfaces
the MAX1280/MAX1281 to the TMS320 in external clock
mode. The timing diagram for this interface circuit is
shown in Figure 19.
Use the following steps to initiate a conversion in the
MAX1280/MAX1281 and to read the results:
1) The TMS320 should be configured with CLKX (transmit clock) as an active-high output clock and with
CLKR (TMS320 receive clock) as an active-high
input clock. CLKX and CLKR on the TMS320 are
20
Definitions
Integral Nonlinearity
Integral nonlinearity (INL) is the deviation of the values
on an actual transfer function from a straight line. This
straight line can be either a best-straight-line fit or a line
drawn between the endpoints of the transfer function,
once offset and gain errors have been nullified. The
static linearity parameters for the MAX1280/MAX1281
are measured using the endpoint method.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1LSB. A
DNL error specification of less than 1LSB guarantees
no missing codes and a monotonic transfer function.
Aperture Jitter
Aperture jitter (tAJ) is the sample-to-sample variation in
the time between the samples.
______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
ANALOG
INPUTS
VDD1
+3V OR +5V
1
CH0
VDD1 20
2
CH1
VDD2 19
(POWER SUPPLIES)
3
CH2
SCLK 18
SCK
4
CH3 MAX1280
MAX1281
0.1µF
10µF
CS 17
PCS0
DIN 16
MOSI
5
CH4
6
CH5
SSTRB 15
7
CH6
DOUT 14
8
CH7
GND 13
9
COM
REFADJ 12
10 SHDN
REF 11
MAX1280/MAX1281
+3V OR +5V
MC683XX
MISO
4.7µF
0.01µF
(GND)
Figure 17. QSPI Connections
Signal-to-Noise Ratio
XF
CLKX
For a waveform perfectly reconstructed from digital
samples, Signal-to-noise ratio (SNR) is the ratio of fullscale analog input (RMS value) to the RMS quantization
error (residual error). The ideal theoretical minimum
analog-to-digital noise is caused by quantization error
only and results directly from the ADC’s resolution (N
bits):
CS
SCLK
TMS320LC3x
MAX1280
MAX1281
CLKR
DX
DIN
DR
DOUT
FSR
SSTRB
SNR = (6.02 ✕ N + 1.76)dB
In reality, there are other noise sources besides quantization noise, including thermal noise, reference noise,
clock jitter, etc. Therefore, SNR is calculated by taking
the ratio of the RMS signal to the RMS noise, which
includes all spectral components minus the fundamental, the first five harmonics, and the DC offset.
Signal-to-Noise Plus Distortion
Figure 18. MAX1280/MAX1281-to-TMS320 Serial Interface
Signal-to-noise ratio plus distortion (SINAD) is the ratio
of the fundamental input frequency’s RMS amplitude to
RMS equivalent of all other ADC output signals.
SINAD (dB) = 20 ✕ log (SignalRMS / NoiseRMS)
Aperture Delay
Aperture delay (tAD) is the time defined between the
falling edge of the sampling clock and the instant when
an actual sample is taken.
______________________________________________________________________________________
21
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
CS
SCLK
DIN
SSTRB
START
SEL2
SEL1
SEL0
UNI/BIP SGI/DIF
PD1
PD0
HIGH IMPEDANCE
DOUT
MSB
B10
B1
B0
HIGH IMPEDANCE
Figure 19. MAX1280/MAX1281-to-TMS320 Serial Interface
Effective Number of Bits
Effective number of bits (ENOB) indicates the global
accuracy of an ADC at a specific input frequency and
sampling rate. An ideal ADC’s error consists of quantization noise only. With an input range equal to the fullscale range of the ADC, calculate the effective number
of bits as follows:
Ordering Information (continued)
TEMP.
RANGE
PART
MAX1281BCUP
MAX1281BEUP
ENOB = (SINAD - 1.76) / 6.02
0°C to +70°C
-40°C to +85°C
Total harmonic distortion (THD) is the ratio of the RMS
sum of the first five harmonics of the input signal to the
fundamental itself. This is expressed as:
20 TSSOP
20 TSSOP
±1
±1
+5V OR
+3V
CH0
0 TO
+2.5V
ANALOG
INPUTS
where V1 is the fundamental amplitude, and V2 through
V5 are the amplitudes of the 2nd- through 5th-order harmonics, respectively.
4.7µF
Spurious-Free Dynamic Range
0.01µF
Spurious-free dynamic range (SFDR) is the ratio of RMS
amplitude of the fundamental (maximum signal component) to the RMS value of the next-largest distortion
component.
INL
(LSB)
Typical Operating Circuit
Total Harmonic Distortion (THD)

2
2
2
2
2
 V2 + V3 + V4 + V4 + V5 


THD = 20 × log
V1
PINPACKAGE
VDD1
VDD
0.1µF
VDD2
MAX1280 GND
MAX1281
CH8
COM
REF
CS
SCLK
DIN
REFADJ
DOUT
SSTRB
SHDN
CPU
I/O
SCK (SK)
MOSI (SO)
MISO (SI)
VSS
___________________Chip Information
TRANSISTOR COUNT: 4286
PROCESS: BiCMOS
22
______________________________________________________________________________________
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
TSSOP.EPS
______________________________________________________________________________________
23
MAX1280/MAX1281
________________________________________________________Package Information
MAX1280/MAX1281
400ksps/300ksps, Single-Supply, Low-Power, 8-Channel,
Serial 12-Bit ADCs with Internal Reference
NOTES
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
24 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
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Printed USA
is a registered trademark of Maxim Integrated Products.