Material Content Data Sheet Sales Product Name BFQ 790 H6327 MA# MA001255708 Package PG-SOT89-4-3 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip noble metal non noble metal inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal < 10% gold tin silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver 7440-57-5 7440-31-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 8. May 2015 Weight [mg] 53.16 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.015 0.03 0.004 0.01 292 0.115 0.22 0.005 0.01 0.025 0.05 474 0.076 0.14 1423 25.112 47.22 47.42 472354 474346 0.056 0.11 0.11 1054 1054 0.269 0.51 75 0.26 2160 2. 3. 5056 4.032 7.58 22.579 42.47 50.56 424720 75843 505619 0.801 1.51 1.51 15072 15072 0.073 0.14 0.14 1382 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2527 95 Important Remarks: 1. Sum [ppm] 1382 1000000