PREPARED
BY:
DATE:
/I6 /sq
xm
7-a Usda
APPROVED BY:
DATE:
1 /t/
PS
Ji”!
FKL.,+
w
ELECTRO~C
coh4PONENTS GROUP
.
SHARP CORPORATION
DEVICE SPECIFICATION
DG99f5040
ISSUE
J&16/99
PAGE
REPRESENTATIVE
10 Pages
DIVISION:
Opto-Electronic Devices Division
SPECIFICATION
/
SPEC.No.
FOR
Light Emitting Diode
MODEL No.
GL5ZV44
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment
* Audio visual equipment
* Home appliance
* Telecommunication equipment (Terminal)
* Measuring equipment
I
L * Tooling machines * Computers
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
1
L * Other safety equipment
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment
* Telecommunication equipment (for trunk lines)
* AMedical equipment
C * Nuclear power control equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S
‘DATE:
BY:
APPROVAL
DATE:
PRESENTED
c2-L.i
//8/
BY:
c%..mJ
M.Katoh,
Department General Manager of
Engineering DeptJII
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
099
DG996040
MODEL No.
Jun/16/99
PAGE
GL5ZV44
GL5ZV44
Snecification
1. Application
‘l”h.k spxi.fication applies to the light emitting dicde &vice Model No. GL5ZV44.
[AlGahP (dicing or scribe/brake type) Amber LED device]
2. Outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4.
3-l. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability .,.....................................................
4-l. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
Refer to the attached sheet Page 5.
5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifxa of defect
6. Supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Refer to the attached sheet Page 7-8.
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7 ~ecau~onsforuse.............‘...............’.............’...
7-1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
.7-4. For cleaning
Refer to the attached sheet Page 9- 10.
l/10
DG996040
Jun/l6/W
MODEL No.
I
PAGE
GLSZV44
‘d
$1
ln
0’
Pin connectioIls
Q. Anode
0. cathode
I
9.
kA.bte) Unspecified
310
tol. to be *O&KU
(Note) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mal
Matelial
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Finish
Lead : Sn plated or wave soldering
Drawing
51106021
No.
I Jun/16/99
J?G996040
1 PAGE
GL5ZV44
I
3. Ratings and characteristics
(Note 1) Duty ratio=1/1O,Pulse width=&lms
(Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Forward
Curve
Current
Derating
Curve
120
3
h
g
z
2
2
g
100
80
60
40
b
:
?Y
Lz
20
01
-25
’
0
Ambient
’
25
I
50
Temperature
I
75 85100
Ta(“CI
125
Ambient
Temperature
TarC)
3/10
JunA6/99
DG996040
PAGE
MODEL No.
I
Peak Forward Current
l/l00
3-4. Characteristics
1
Raito
Diagram(m)
Forward
Current
1.4
10
(Note 1)
vs.Forward
1.6
Forward
Relative
Luminous
Relative
Luminous
Intensity
vs. Ambient
Temperature
Voltage
( I F=2Orn4)
1.8
2
Voltage
Intensity
vs.
2.2
2.4
-60 -40 -20
2.6
Ambient
VFW
Froward
Voltage
CTa=25”C)
1000
.$
.-
100
I
2
10
ii
Oh
.E B
9
.J
.-
e
.z
B
1
0. 1
0.01
1
0. 1
Forward
4110
DR
(Ta=25"C)
1 1.2
1
vs. Duty Ratio
(Ta=25”C)
l/10
Duty
GL5ZV44
10
Current
loo
IFhA)
(Note 1) Above characteristic data are typical data and not a guarantteed data.
0 20 40 60 80
Temprature
Ta("C)_
100 120
JunJ16/!w
DG996040
PAGE
MODEL No.
I
GL5ZV44
5110
4. Reliability
The reliability of products shall be satisfied with items listed below.
Confidence level: 90%
Samples (n)
LTPD
Defective (C)
(%I
4-1. Test items and test conditions
Test items
Test conditions
Solderability
230f5”C, 5s
Prior disposition : Dip in rosin flux
n=ll,
C=O
20
Soldering
temperature
26O+sC,
n=ll,
C=O
20
n=ll,
C=O
20
n=lI,
C=O
20
Ss/each terminal
n=ll,
C=O
20
Weight:SN,O” + 90” + 0% -90” + 0”
/each terminal
n=ll,
c=O
20
Mechanical shock
Variable frequency
vibration
Terminal strength
(Tension)
Terminal strength
(Bend&9
5s
15 OOOm/s*,0.5ms,
3times 1 kX+Y Sz direction
2OOm/s*, 100 to 2 000 to lOOHz./sweep for 4min.
,&imesk.X,~Y,fZ
direction
Weight:lON,
Temperature cycling
-40@C(3Omin)~+100”C(3Omin),30
II&h temp’ and high
humidity storage
Ta=+60”C, 9O%RH, t=looOh
cycles
I
Operation life
ITa=25”C, IF MAX, t=lOOOh *3
I
10
n=22, C=O
10
n=22, C==O
10
I
n=22, C=O I
10
I
n=22, C==O I
10
I Iigh temperature storage Ta=lOO”c, t=lOOOh
LAW temperature storage ITa=-40”C, t=lOOOh
n=22, C=O
41-2. Measurement items and Failure judgement criteria * 1
Measurement
Symbol
Failure judgement criteria *2
Forward voltage
VF
v, > U.S.L. x 1.2
Reverse current
IR
Ia > U.S.L. x 2.0
Luminous intensity
Iv
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
!
% Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
Z Terminal strength : Package is not destroyed, and terminal is not slack
* 1: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF MAX.is shown by forward current of absolute maximum ratings.
Junl16l99
PAGE
DGW6040
MODELNo.
GL5ZV44
5. Incoming inspection
5-l. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling plan,normal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and classifica of defect
1No.
Test items
judgement criteria
:lassifica of defec
q
1
DiscoMection
Not emit light
2
Position of Cutting off
rim
Different from dimension
3
Reverse terminal
Different from dimension
4
Outline dimensions
Not satisfy outline specification
Characteristics
Over the limit value of specification at Vr, I,, and Iv
Cut off the rim
Exceed -0.2mm
Foreign substance
White point : Exceed d 0.3mm (on top view)
Black point : Exceed $0.3mm (on top view)
String form : Exceed 3.Omm (on top view)
Scratch
Exceed d 0.3mm or O.lmm x l.Omm (on top view)
Void
Exceed 4 0.3mm (on top view)
Uneven density of
for scattering
Extremely uneven density
11
Unbalanced center
Exceed fo.25mm from package center
12
Burr
Exceed +0.2mm againstprovided dimension
13
Insertion position of
terminal
Insertion position of terminal
mated
Major defect
Minor defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
L
No.
Test items
judgement criteria
classifica of defect
14
Chapped the surface
The surface chapped is striking for see the lamp top
Minor defect
15
Hollow the surface
The surface hollow is striking for see the lamp top
6/10
MODEL No.
GL5ZV44
PAGE
7110
6. Supplement
6-1. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One ProducfTyp.)
(Indication label sample)
SHIPHENT TABLE
PART No.
GL5ZV44
- Model number
*clCl --q ocln[7
QUANTITY
250
- Quantity of products
LOT No.
KA99B19
+Lotnumber*
0
O@
0
a
O-O c-Luminous intensity rank
dominant wavelength rank
SHARP’
MADE IN JAPAN
+ Production country
0
@
@
@
0
Production plant code(to be indicated alphabetically)
Support code
Year of production(the last two figures of the year)
(to be indicated alphabetically with January corresponding to A)
Month of production
Date of production(01 N 3 1)
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth: 225n~n, l-light:
6-2.Luminous intensity rank (Note 1)
I Rank
I
9omm
(T.a=25”c)
(Note 1) Tolerance:flS%
In regard to Iurninous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
Encase of the distribution of the Iuminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
(Ta=25@C)
6-3.Dominant wavelength rank (Note 2)
Dominant
wavelength
1
Unit
1
Condition 1
Rank
I
I
H
581.0
584.5
;
583.5
587.0
I
I- -- .
1~2urIlA
Ml
586.0
589.5
J
592.0
K
588.5
L
591.0
594.5
\
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
Do996040
MODEL. No.
GLSZV44
6-4. Environment
64 1. Ozonosphere destructive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requires following substance.
Restricted part: c2FCsJlalones,CCt,Trichloroethane(Methyc~~fo~)
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,.PBBs)
Junl16l99
PAGE
8110
Jun/16/99
DB96040
MODEL
PAGE
No.
g/10
GLSZV44
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-2-l installation
on a P W B
When mounting an LED lamp on a PWB,donot apply
physical stress to the lead pins.
*The lead pin pitch should match the PWEIpin-hole
pitch:absolutely
avoid widening or narrowing
the lead pins.
lhen positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 When an LED 1 is mounted directly on a P WB
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PWBwarp,cutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damage to
resin etc,,is found-When an LED lamp is mounted
on a double-sided PWB,the heat during soldering
affects the resin;therefore,keep
the LED lamp
more that 1.6mmafloat above the PWB.
7-2-3 Installation
using a holder
During an LED lamp positioning,when a holder is
used.a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation
to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.d hole of the case should
be designed not to subject the inside of resin
to any undue stress.
NG
l
Good
I
1
0
n
L 611
~
Jx996040
Juld16/9!I
PAGE
MODEL No.
I
GL5ZV44
7 - 3. S oldering Conditions
Solder_~ thi
--.e lead pins under the following conditions
1 Type of Soldering
! __--- -A- Conditions
. .. l.Manual soldering
1 295T*5C,
wlthin
3 seconds
2. Wave soldering
1 260°C+YC.
within
5
seconds
. mm”Preheating ‘fU”C tc) 8O’C, within 30 seconds
3. Auto soldering
Soldering 245”ct5”c, within 5 seconds
I
(Note> Avoid dipping resin into soldering bath
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection
may occur.
ins iron
7 - 4. For cleaning
(1)
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
( 2 > Ultrasonic
cleaning
( 3 > Applicable
solvent
The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time,PlRB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
Ethyl alcohol, Yethyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
I
lo/lo