PL IA NT Features CO M ■ Two resistance-matched PTCs in a *R oH S ceramic housing Model CMF-SD is currently available, although not recommended for new designs. Model CMF-SDP is preferred. ■ Narrow resistance tolerance ■ RoHS compliant* CMF-SD Series - Telecom CPTC Resettable Fuses Electrical Characteristics Model CMF-SD10 CMF-SD25 CMF-SD25-10 CMF-SD35 CMF-SD35-10 CMF-SD35A CMF-SD35A-10 CMF-SD50 CMF-SD50-10 CMF-SD50A CMF-SD50A-10 Induction Voltage Withstand VAC 600 600 600 600 600 600 600 600 600 600 600 Rated Voltage Volts 220 230 220 230 230 230 230 230 230 230 230 Rated Resistance (RN) @ 25 °C Ohms Tolerance 10 ±20 % 25 ±20 % 25 ±10 % 35 ±20 % 35 ±10 % 35 ±20 % 35 ±10 % 50 ±20 % 50 ±10 % 50 ±20 % 50 ±10 % Resistance Matching in Housing Ohms ±1.0 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ± 0.5 Hold Current Amps @ 25 °C 0.150 0.130 0.130 0.100 0.100 0.100 0.100 0.090 0.090 0.090 0.090 Trip Current Amps @ 25 °C 0.360 0.260 0.260 0.200 0.200 0.200 0.200 0.190 0.190 0.190 0.190 Imax @ 230 VAC Amps 1 2.8 2.5 3 3 2.5 2.5 3 3 3 3 Time to Trip @ Imax / 230 VAC Seconds <4.5 < 0.3 < 0.3 < 0.2 < 0.2 < 0.2 < 0.2 < 0.1 < 0.1 < 0.1 < 0.1 Test Procedures And Requirements For Model CMF-SD Series Primary Test Protection Test Condition Requirements Mains Power Contact - ITU-T K.20, K.21.... None .............. 230 V rms, 10 ohms, 15 Min. .....................................................(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21 ............ None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. .....(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 % Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700 μs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. .................(Ri-Rf) / Ri < ±10 % Lightning Surge ................................................................... 10/1000 μs, 40 ohms, 1.0 kV, 30 Tests, every 3 Min. ................(Ri-Rf) / Ri < ±10 % Ri = R initial Rf = R final How to Order Typical Part Marking Represents total content. Layout may vary. PART IDENTIFICATION: 10 = CMF-SD10 25 = CMF-SD25 35 = CMF-SD35 50 = CMF-SD50 35A = CMF-SD35A 50A = CMF-SD50A 25K = CMF-SD25-10 35K = CMF-SD35-10 50K = CMF-SD50-10 35AK = CMF-SD35A-10 50AK = CMF-SD50A-10 50AL = CMF-SD50A-15 MANUFACTURER'S TRADEMARK 356G BI-WEEKLY DATE CODE: WEEK 13-14 = G YEAR CODE: 6 = 2006 CMF - SD 35 A -10 - 2 Product Designator Style SD = Surface Mount Dual Pkg. Rated Resistance (RN) 10, 25, 35, 50 (25, 35, 50 Ohms) Reduced Footprint and Height Option* Resistance Tolerance Option Blank = Standard (20 %) -10 = 10 % Packaging Options - 2 = Tape & Reel *Reduced footprint and height option currently unavailable for Model CMF-SD25. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Applications Used as a secondary overcurrent protection device in: ■ Customer Premise Equipment (CPE) ■ Central Office (CO) ■ Access equipment CMF-SD Series - Telecom CPTC Resettable Fuses Product Dimensions Recommended Pad Layout CMF-SD10 CMF-SD25 CMF-SD35 CMF-SD50 CMF-SD35A CMF-SD50A 9.00 (.354) MAX. 7.15 (.281) MAX. B 10.80 (.425) MAX. 8.50 (.355) MAX. C 10.20 (.402) MAX. 8.10 (.319) MAX. D 4.88 - 5.28 (.192 - .208) 3.25 - 3.65 (.128 - .144) E 2.41 - 2.61 (.095 - .103) 2.41 - 2.61 (.095 - .103) F 0.5 (.020) MAX. 0.5 (.020) MAX. G 2.5 (.098) 2.5 (.098) H 1.0 (.039) 1.0 (.039) A Dim. A B H G F B 1 2 A 3 G F 4 C D E E DIMENSIONS: MM (INCHES) COPLANARITY: 0.15 (.006) D C (Reduced value available on request.) Packaging Options - Tape and Reel: CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400 pcs. per reel; CMF-SD35A & CMF-SD50A = 500 pcs. per reel H 1 2 3 4 Dim. Solder Reflow Recommendations A 300 Preheating Soldering Cooling B 250 Temperature (°C) C 200 D 150 E 100 50 F 0 G 160–220 10–20 120 H CMF-SD10 CMF-SD25 CMF-SD35 CMF-SD50 10.0 (.394) 8.80 (.346) 3.20 (.126) 2.00 (.079) 2.60 (.102) 5.00 (.197) 7.60 (.299) 10.0 (.394) CMF-SD35A CMF-SD50A 8.00 (.315) 7.05 (.278) 2.75 (.108) 2.00 (.079) 2.51 (.099) 3.45 (.136) 5.95 (.234) 8.15 (.321) Time (seconds) Solder reflow • Recommended reflow methods: IR, vapor phase oven, hot air oven. • Devices are not designed to be wave soldered to the bottom side of the board. • Gluing the devices is not recommended. • Recommended maximum paste thickness is 0.25 mm (.010 inch). • Devices can be cleaned using standard industry methods and solvents. DIMENSIONS: MM (INCHES) Note: • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Rework • A device should not be reworked. CMF-SD SERIES, REV. O, 05/10 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CMF-SD Series Tape and Reel Specifications CMF-SD10 CMF-SD25-2 CMF-SD35-2 CMF-SD50-2 24.0 +0.30/-0.10 (0.945 +0.012/-0.004) 4.00 ± 0.10 (0.157 ± 0.004) 16.0 ± 0.10 (0.630 ± 0.004) 2.00 ± 0.10 (0.079 ± 0.004) 10.2 ± 0.10 (0.402 ± 0.004) 9.0 ± 0.10 (0.354 ± 0.004) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 11.5 ± 0.10 (0.453 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 0.50 (0.020) 0.1 (0.004) 11.0 ± 0.10 (0.433 ± 0.004) Tape Dimensions per EIA 481-2 W P0 P P2 A0 B0 D F E T max. T1 max. K0 CMF-SD25-2 CMF-SD35-2 CMF-SD50-2 D P0 P2 E CMF-SD35A-2 CMF-SD50A-2 24.0 ± 0.20 (0.945 ± 0.008) 4.00 ± 0.10 (0.157 ± 0.004) 12.0 ± 0.10 (0.472 ± 0.004) 2.00 ± 0.10 (0.079 ± 0.004) 7.30 ± 0.10 (0.287 ± 0.004) 8.30 ± 0.10 (0.327 ± 0.004) 1.5 ± 0.10 (0.059 ± 0.004) 11.5 ± 0.10 (0.453 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 0.50 ± 0.005 (0.020 ± 0.002) 0.1 (0.004) 8.80 ± 0.10 (0.346 ± 0.004) T F W 330 -2/+0 (12.99 -.079/+0) DIA. B0 P A0 K0 5° 16.4 +2.0/-0 (.646 +.079/-0) MAX. 22.4 (.882) CMF-SD35A-2 CMF-SD50A-2 D P2 P0 E 13.2 +0.2/-0 (.520 +.008/-0 100 ± 1.5 DIA. (3.94 ± .059) T K0 F W 330 -2/+0 (12.99 -.079/+0) 93° DIA. B0 3.45 (.136) 5.8 (.228) A0 1.0 (.039) P 0.5 (.020) DIMENSIONS: 2.5 (.098) MM (INCHES) 16.4 +2.0/-0 (.646 +.079/-0) MAX. 22.4 (.882) 13.2 +0.2/-0 (.520 +.008/-0 100 ± 1.5 (3.94 ± .059) DIA. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.