TI BQ24314DSJ Overvoltage and overcurrent protection ic and li charger front-end protection ic Datasheet

bq24314
bq24316
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SLUS763 – JULY 2007
OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND
Li+ CHARGER FRONT-END PROTECTION IC
•
•
•
•
•
•
•
•
Provides Protection for Three Variables:
– Input Overvoltage
– Input Overcurrent (User-Programmable)
– Battery Overvoltage
30V Maximum Input Voltage
Supports up to 1.5A Input Current
High Immunity Against False Triggering Due
to Voltage Spikes
Robust Against False Triggering Due to
Current Transients
Thermal Shutdown
Status Indication – Fault Condition
Available in Space-Saving Small 8 Lead 2×2
SON and 12 Lead 4x3 SON Packages
APPLICATIONS
•
•
•
•
•
Smart Phones
PDAs
MP3 Players
Low-Power Handheld Devices
Bluetooth Headsets
DESCRIPTION
The bq24314 and bq24316 are highly integrated circuits designed to provide protection to Li-ion batteries from
failures of the charging circuit. The IC continuously monitors the input voltage, the input current, and the battery
voltage. In case of an input overvoltage condition, the IC immediately removes power from the charging circuit by
turning off an internal switch. In the case of an overcurrent condition, it limits the system current at the threshold
value, and if the overcurrent persists, switches the pass element OFF after a blanking period. Additionally, the IC
also monitors its own die temperature and switches off if it becomes too hot. The input overcurrent threshold is
user-programmable.
The IC can be controlled by a processor and also provides status information about fault conditions to the host.
APPLICATION SCHEMATIC
AC Adapter
1 IN
VDC
OUT 8
1 mF
1 mF
GND
Charging
Circuit
bq24316DSG
SYSTEM
VBAT 6
ILIM
VSS
FAULT 4
7
2
CE 5
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2007, Texas Instruments Incorporated
PRODUCT PREVIEW
FEATURES
1
bq24314
bq24316
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SLUS763 – JULY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SIMPLIFIED BLOCK DIAGRAM
IN
OUT
Charge Pump,
Bandgap,
Bias Generator
ISNS
ILIM
ILIMREF
OFF
PRODUCT PREVIEW
ILIMREF - D
tBLANK(OCP)
ISNS
FAULT
5.85 V (bq24314)
6.80 V (bq24316)
COUNTER, CONTROL,
AND STATUS
VIN
CE
VUVLO
tDGL(PGOOD)
VIN
THERMAL
SHUTDOWN
tGDL(BOVP)
4.35 V
VBAT
VSS
TERMINAL FUNCTIONS
TERMINAL
NAME
I/O
DESCRIPTION
1
I
Input power, connect to external DC supply. Connect external 1μF capacitor (minimum) to VSS. For
the 12 pin (DSJ-suffix) device, ensure that pins 1 and 2 are connected together on the PCB at the
device.
10, 11
8
O
Output terminal to the charging system. Connect external 1μF capacitor (minimum) to VSS.
8
6
I
Battery voltage sense input. Connect to pack positive terminal through a resistor.
DSJ
DSG
1, 2
OUT
VBAT
IN
2
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TERMINAL
I/O
DESCRIPTION
DSJ
DSG
9
7
I/O
Input overcurrent threshold programming. Connect a resistor to VSS to set the overcurrent
threshold.
CE
7
5
I
Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down.
FAULT
4
4
O
Open-drain output, device status. FAULT = Low indicates that the input FET has been turned off
due to input overvoltage or input overcurrent conditions, or because the battery voltage is outside
safe limits.
VSS
3
2
–
Ground terminal
NC
5, 6, 12
3
ILIM
Thermal
PAD
These pins may have internal circuits used for test purposes. Do not make any external connections
at these pins for normal operation.
–
There is an internal electrical connection between the exposed thermal pad and the VSS pin of the
device. The thermal pad must be connected to the same potential as the VSS pin on the printed
circuit board. Do not use the thermal pad as the primary ground input for the device. The VSS pin
must be connected to ground at all times.
IN 1
8
7
VSS 2
NC 3
IN 1
12 NC
IN 2
11
OUT
10
OUT
OUT
ILIM
VSS 3
bq24314DSG
bq24316DSG
6
bq24314DSJ
bq24316DSJ
VBAT
FAULT 4
FAULT 4
5
PRODUCT PREVIEW
NAME
CE
9 ILIM
NC 5
8 VBAT
NC 6
7 CE
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Input voltage
PIN
VALUE
IN (with respect to VSS)
–0.3 to 30
OUT (with respect to VSS)
–0.3 to 12
ILIM, FAULT, CE, VBAT (with respect to VSS)
–0.3 to 7
UNIT
V
Input current
IN
2.0
A
Output current
OUT
2.0
A
Output sink current
FAULT
15
mA
Junction temperature, TJ
–40 to 150
°C
Storage temperature, TSTG
–65 to 150
°C
300
°C
Lead temperature (soldering, 10 seconds)
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
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SLUS763 – JULY 2007
PACKAGE DISSIPATION RATINGS
PART NO.
PACKAGE
BQ24314DSG
BQ24316DSG
2×2 SON
BQ24314DSJ
BQ24316DSJ
4×3 SON
RθJC
RθJA
TA ≤ 25°C
POWER RATING
DERATING FACTOR
TA > 25°C
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
VIN
Input voltage range
IIN
Input current, IN pin
IOUT
Output current, OUT pin
RILIM
OCP Programming resistor
TJ
Junction temperature
MIN
MAX
3.3
26
V
1.5
A
1.5
UNIT
A
16.67
83.33
kΩ
0
125
°C
ELECTRICAL CHARACTERISTICS
PRODUCT PREVIEW
over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IN
VUVLO
Under-voltage lock-out, input
power detected threshold
CE = Low or High, VIN: 2V → 3V
2.5
2.8
V
VHYS-UVLO
Hysteresis on UVLO
CE = Low or High, VIN: 3V → 2V
200
300
mV
TDGL(PGOOD)
Deglitch time, input power detected CE = Low or High. Time measured from VIN
status
0V → 5V 1μs rise-time, to output turning ON
IDD
Operating current
CE = Low, No load on OUT pin,
VIN < 6V
ISTDBY
Standby current
CE = High, VIN < 6V
8
ms
600
μA
55
μA
INPUT TO OUTPUT CHARACTERISTICS
VDO
Drop-out voltage IN to OUT
CE = Low, VIN = 5V, IOUT = 1A
300
mV
INPUT OVERVOLTAGE PROTECTION
VOVP
Input overvoltage protection
threshold (bq24314)
5.67
5.85
6.00
V
Input overvoltage protection
threshold (bq24316)
6.60
6.80
7.00
V
tPD(OVP)
Input OV propagation delay
CE = Low
VHYS-OVP
Hysteresis on OVP
CE = Low or High, VIN: 7.5V → 5V
tON(OVP)
Recovery time from input
overvoltage condition
CE = Low, Time measured from
VIN 7.5V → 5V, 1μs fall-time
1
μs
60
mV
8
ms
INPUT OVERCURRENT PROTECTION
IOCP
Input overcurrent protection
threshold range
CE = Low, RILIM = 16.67kΩ to 83.33kΩ
ΔIOCP
OCP threshold accuracy
CE = Low, RILIM = 16.67kΩ to 83.33kΩ
IOCP
Input overcurrent protection
threshold
CE = Low, RILIM = 25kΩ
KILIM
Current limit programming:
IOCP = KILIM ÷ RILIM
tBLANK(OCP)
Blanking time, input overcurrent
detected
tON(OCP)
Recovery time from input
overcurrent condition
CE = Low
CE = Low
300
1500
mA
1070
mA
±10 %
930
1000
25000
AΩ
176
μs
64
ms
BATTERY OVERVOLTAGE PROTECTION
4
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SLUS763 – JULY 2007
ELECTRICAL CHARACTERISTICS (continued)
over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
BVOVP
Battery overvoltage protection
threshold
CE = Low, VIN > 4.3V
VHYS-BOVP
Hysteresis on BVOVP
CE = Low, VIN > 4.3V
IVBAT
Input bias current on VBAT pin
TDGL(BOVP)
Deglitch time, battery overvoltage
detected
MIN
TYP
MAX
4.30
4.35
4.4
270
V
mV
20
CE = Low, VIN > 4.3V
UNIT
nA
μs
176
THERMAL PROTECTION
TJ(OFF)
Thermal shutdown temperature
TJ(OFF-HYS)
Thermal shutdown hysteresis
140
150
°C
°C
20
LOGIC LEVELS ON CE
VIL
Low-level input voltage
0
VIH
High-level input voltage
1.4
0.4
V
IIL
Low-level input current
VCE = 0V
1
μA
IIH
High-level input current
VCE = 1.8V
10
μA
ISINK = 5mA
0.4
V
V
VOL
Output low voltage
TYPICAL OPERATING PERFORMANCE
For Figure 1 through Figure 4, VIN = 5 V to 12 V, COUT = 0.47 μF, ROUT = 33 Ω, RILIM = 25 kΩ, Channel 1 = VIN,
Channel 2 = VOUT, Channel 4 = FAULT
VIN = 5 V to 12 V,
COUT = 0.47 mF,
ROUT = 33 W,
Ch 1 = VIN
RILIM = 25 kW
Ch 1 = VIN
VIN = 5 V to 12 V,
COUT = 0.47 mF,
ROUT = 33 W,
RILIM = 25 kW
Ch 2 = VOUT
Ch 4 = FAULT
Figure 1. bq24314 OVP Response for Input Step, tR = 1 μs
Ch 2 = VOUT
Ch 4 = FAULT
Figure 2. bq24314 OVP Response for Input Step, tR = 20
μs
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PRODUCT PREVIEW
LOGIC LEVELS ON FAULT
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bq24316
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SLUS763 – JULY 2007
TYPICAL OPERATING PERFORMANCE (continued)
VIN = 5 V to 12 V,
COUT = 0.47 mF,
ROUT = 33 W,
Ch 1 = VIN
Ch 1 = VIN
RILIM = 25 kW
VIN = 5 V to 12 V,
COUT = 0.47 mF,
ROUT = 33 W,
RILIM = 25 kW
Ch 2 = VOUT
Ch 2 = VOUT
Ch 4 = FAULT
Ch 4 = FAULT
PRODUCT PREVIEW
Figure 3. bq24316 OVP Response for Input Step, tR = 1 μs
Figure 4. bq24316 OVP Response for Input Step, tR = 20
μs
VIN = 0 V to 9 V in 40 ms
V IN = 10 V to 5 V in 400 m s
Ch 2 = VOUT
Ch 1 = VIN
Ch 1 = VIN
Ch 2 = VOUT
Ch 4 = FAULT
Ch 4 = FAULT
Figure 5. bq24316 Response for Slow Input Ramp
Channel 1 = VIN, Channel 2 = VOUT, Channel 4 = FAULT,
VIN = 0V to 9V in 40ms
6
Figure 6. bq24316 Recovery From OVP
Channel 2 = VIN,
Channel 1 = VOUT, Channel 4 = FAULT, VIN = 10V to 5V in
400μs
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TYPICAL OPERATING PERFORMANCE (continued)
Ch 1 = Load Switch
VIN = 4.75 V,
ROUT = 11 W to 8 W,
RILIM = 50 kW
Ch 3 = IIN
PRODUCT PREVIEW
Figure 7. bq24316 OCP Response
Channel 1 = Load Switch, Channel 3 = IIN, VIN = 4.75V,
RILIM = 50kΩ, ROUT = 11Ω to 8Ω
TYPICAL APPLICATION CIRCUIT
(Terminal numbers shown are for the 2×2 DSG package)
AC Adapter
VDC
1
IN
OUT 8
CIN
COUT
GND
Charging
Circuit
bq24316DSG
SYSTEM
VBAT 6
VPU
RBAT
RPU
FAULT 4
ILIM
VSS
RFAULT
7
2
Host
Controller
CE 5
RCE
Figure 8. Simple Protection
DETAILED FUNCTIONAL DESCRIPTION
POWER DOWN
The device remains in power down mode when the input voltage at the IN pin is below the undervoltage
threshold VUVLO. The FET Q1 connected between IN and OUT pins is off, and the status output, FAULT, is set to
Hi-Z.
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POWER-ON RESET
The device resets when the input voltage at the IN pin exceeds the UVLO threshold. All internal counters and
other circuit blocks are reset.
OPERATION
The device continuously monitors the input voltage, the input current, and the battery voltage.
Input Overvoltage Protection
If the input voltage rises above VOVP, the internal FET is turned off, removing power from the circuit. The FAULT
pin is driven low. When the input voltage returns below VOVP – VHYS-OVP (but is still above VUVLO), the FET is
turned on again after a deglitch time of tON(OVP) to ensure that the input supply has stabilized.
Input Overcurrent Protection
The overcurrent threshold is programmed by a resistor RILIM connected from the ILIM pin to VSS. The
overcurrent threshold is given by IOCP = KILIM ÷ RILIM.
PRODUCT PREVIEW
If the load current tries to exceed the IOCP threshold, the device limits the current for a blanking duration of
tBLANK(OCP). If the load current returns to less than IOCP before tBLANK(OCP) times out, the device continues to
operate. However, if the overcurrent situation persists for tBLANK(OCP), the FET is turned off for a duration of
tON(OCP), and the FAULT pin is driven low. The FET is then turned on again after tON(OCP) and the current is
monitored all over again. Each time an OCP fault occurs, an internal counter is incremented. If 15 OCP faults
occur in one charge cycle, the FET is turned off permanently. The counter is cleared either by removing and
re-applying input power, or by disabling and re-enabling the device with the CE pin.
Battery Overvoltage Protection
The battery overvoltage threshold BVOVP is internally set to 4.35V. If the battery voltage exceeds the BVOVP
threshold, the FET is turned off, and the FAULT pin is driven low. The FET is turned back on once the battery
voltage drops to BVOVP – VHYS-BOVP. Each time a battery overvoltage fault occurs, an internal counter is
incremented. If 15 such faults occur in one charge cycle, the FET is turned off permanently. The counter is
cleared either by removing and re-applying input power, or by disabling and re-enabling the device with the CE
pin.
THERMAL PROTECTION
If the junction temperature of the device exceeds TJ(OFF), the FET is turned off, and the FAULT pin is driven low.
The FET is turned back on when the junction temperature falls below TJ(OFF) – TJ(OFF-HYS).
8
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Power Down
All IC functions OFF
FAULT = HiZ
Any State
if V(IN) < V (UVLO),
go to Power Down
No
V(IN) > V(UVLO) ?
Any State
if CE = Hi,
go to Reset
Yes
Reset
Timers reset
Counters reset
FAULT = HiZ
FET off
No
V(IN) < V(OVP) ?
No
PRODUCT PREVIEW
CE = Low ?
Turn off FET
FAULT = Low
No
CE = Hi ?
Yes
Go to Reset
Yes
No
I < IOCP ?
No
Turn off FET
FAULT = Low
Incr OCP counter
Wait tON(OCP)
count <15 ?
Yes
No
CE = Hi ?
Yes
Go to Reset
No
Turn off FET
FAULT = Low
VBAT < BATOVP ?
No Incr BAT counter
count <15 ?
Yes
TJ < TJ(OFF) ?
No
Turn off FET
FAULT = Low
Yes
Turn on FET
FAULT = HiZ
Figure 9. Flow Diagram
CE Pin
The IC has an enable pin which can be used to enable or disable the device. When the CE pin is driven high, the
internal FET is turned off. When the CE pin is low, the FET is turned on if other conditions are safe. The CE pin
has an internal pulldown resistor and can be left floating. Note that the FAULT pin functionality is also disabled
when the CE pin is high.
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APPLICATION INFORMATION (WITH REFERENCE TO FIGURE 8)
Selection of RBAT
It is strongly recommended that the battery not be tied directly to the VBAT pin of the device, as under some
failure modes of the IC, the voltage at the IN pin may appear on the VBAT pin. This voltage can be as high as
30V, and applying 30V to the battery in case of the failure of the bq2431x can be hazardous. Connecting the
VBAT pin through RBAT prevents a large current from flowing into the battery in case of a failure of the IC. In the
interests of safety, RBAT should have a very high value. The problem with a large RBAT is that the voltage drop
across this resistor because of the VBAT bias current IVBAT causes an error in the BVOVP threshold. This error is
over and above the tolerance on the nominal 4.35V BVOVP threshold.
Choosing RBAT equal to 220kΩ is a good compromise. In the case of an IC failure, the maximum current flowing
into the battery would be (30V – 3V) ÷ 220kΩ = 123μA, which is low enough to be absorbed by the bias currents
of the system components. RBAT equal to 220kΩ would result in a worst-case voltage drop of RBAT × IVBAT =
4.4mV. This added to the internal tolerance of 50mV results in a total BVOVP threshold error of less than 55mV,
which should be acceptable in most applications.
Selection of RCE
The CE pin can be used to enable and disable the IC. If host control is not required, the CE pin can be tied to
ground or left un-connected, permanently enabling the device.
PRODUCT PREVIEW
In applications where external control is required, the CE pin can be controlled by a host processor. As in the
case of the VBAT pin (see above), the CE pin should be connected to the host GPIO pin through as large a
resistor as possible. The limitation on the resistor value is that the minimum VOH of the host GPIO pin less the
drop across the resistor should be greater than VIH of the bq2431× CE pin. The drop across the resistor is given
by RCE × IIH.
FAULT Pin
The FAULT pin is an open-drain output that goes low during OV, OC, and battery-OV events. If the application
does not require monitoring of the FAULT pin, it can be left unconnected. But if the FAULT pin has to be
monitored, it should be pulled high externally through RPU, and connected to the host through RFAULT. RFAULT
prevents damage to the host controller if the bq2431x fails (see above). The resistors should be of high value, in
practice values between 22kΩ and 100kΩ should be sufficient.
10
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
BQ24314DSGR
PREVIEW
SON
DSG
8
3000
TBD
Call TI
Call TI
BQ24316DSGR
PREVIEW
SON
DSG
8
3000
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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www.ti.com/audio
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www.ti.com/automotive
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www.ti.com/broadband
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www.ti.com/digitalcontrol
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logic.ti.com
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www.ti.com/military
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power.ti.com
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www.ti.com/opticalnetwork
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microcontroller.ti.com
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www.ti.com/security
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www.ti.com/telephony
Low Power
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www.ti.com/lpw
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www.ti.com/video
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www.ti.com/wireless
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