BOARDCOM HSMS-2804 Surface mount rf schottky barrier diode Datasheet

HSMS-280x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
Features
These Schottky diodes are specifically designed for both
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS-280x series
of diodes is optimized for high voltage applications.
x Surface Mount Packages
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent sites
on the wafer, assuring the highest degree of match.
x Single, Dual and Quad Versions
x High Breakdown Voltage
x Low FIT (Failure in Time) Rate*
x Six-sigma Quality Level
x Tape and Reel Options Available
x Lead-free
*
Package Lead Code Identification, SOT-323 (Top View)
For more information see the Surface Mount Schottky Reliability
Data Sheet.
Package Lead Code Identification, SOT-363 (Top View)
HIGH ISOLATION
UNCONNECTED PAIR
SERIES
SINGLE
C
COMMON
CATHODE
B
COMMON
ANODE
E
6
5
1
2
4
K
3
COMMON
CATHODE QUAD
F
UNCONNECTED
TRIO
6
5
1
2
5
4
6
5
1
2
3
1
2
6
BRIDGE
QUAD
5
L
3
COMMON
ANODE QUAD
6
M
4
4
6
3
1
4
N
3
RING
QUAD
5
4
Package Lead Code Identification, SOT-23/SOT-143 (Top View)
SINGLE
3
SERIES
3
1
1
#0
2
UNCONNECTED
PAIR
3
4
1
#5
2
#2
2
BRIDGE
QUAD
3
4
1
#8
2
COMMON
ANODE
3
1
#3
2
COMMON
CATHODE
3
1
#4
2
1
2
P
2
R
3
Pin Connections and Package Marking, SOT-363
2
3
6
GUx
1
5
4
Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
Absolute Maximum Ratings[1] TC = 25°C
Symbol
Parameter
Unit
SOT-23/SOT-143
SOT-323/SOT-363
If
Forward Current (1 μs Pulse)
PIV
Peak Inverse Voltage
Amp
1
1
V
Same as VBR
Same as VBR
Tj
Junction Temperature
°C
150
150
Tstg
Storage Temperature
°C
-65 to 150
-65 to 150
Tjc
Thermal Resistance[2]
°C/W
500
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications TA = 25°C, Single Diode [3]
Part
Number
HSMS[4]
2800
2802
2803
2804
2805
2808
Package
Marking
Code
A0
A2
A3
A4
A5
A8
Lead
Code
0
2
3
4
5
8
280B
280C
280E
280F
A0
A2
A3
A4
B
C
E
F
280K
AK
K
280L
AL
280M
H
280N
N
280P
AP
280R
O
Test Conditions
L
M
N
P
R
Configuration
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Bridge Quad[4]
Single
Series
Common Anode
Common Cathode
High Isolation
Unconnected Pair
Unconnected Trio
Common Cathode Quad
Common Anode Quad
Bridge Quad
Ring Quad
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Forward
Voltage
VF (mV)
Maximum
Forward
Voltage
VF (V) @ IF (mA)
Maximum
Reverse
Leakage
IR (nA) @ VR (V)
Maximum
Capacitance
CT (pF)
Typical
Dynamic
Resistance
RD (Ω) [5]
70
410
1.0 @ 15
200 @ 50
2.0
35
IR = 10 mA
IF = 1 mA
VF = 0 V
f = 1 MHz
IF = 5 mA
Notes:
1. DVF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. DCTO for diodes in pairs and quads is 0.2 pF maximum.
3. Effective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance.”
5. R D = RS + 5.2 Ω at 25°C and I f = 5 mA.
2
Quad Capacitance
A
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument effectively isolates
individual diode branches from the others, allowing
accurate capacitance measurement of each branch or
each diode. The conditions are: 20 mV R.M.S. voltage at 1
MHz. Avago defines this measurement as “CM”, and it is
equivalent to the capacitance of the diode by itself. The
equivalent diagonal and adjacent capacitances can then
be calculated by the formulas given below.
In a quad, the diagonal capacitance is the capacitance
between points A and B as shown in the figure below.
The diagonal capacitance is calculated using the following formula
C1 x C2 + _______
C3 x C4
CDIAGONAL = _______
C1 + C2
C3
C2
C4
C
B
The equivalent adjacent capacitance is the capacitance
between points A and C in the figure below. This capacitance is calculated using the following formula
1
CADJACENT = C1 + ____________
1 + ––
1 + ––
1
––
C2 C3 C4
This information does not apply to cross-over quad
diodes.
C3 + C4
Linear Equivalent Circuit, Diode Chip
Rj
RS
Cj
RS = series resistance (see Table of SPICE parameters)
C j = junction capacitance (see Table of SPICE parameters)
8.33 X 10-5 nT
Rj =
Ib + Is
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.
3
C1
SPICE Parameters
Parameter
Units
HSMS-280x
BV
V
75
CJ0
pF
1.6
EG
eV
0.69
IBV
A
E-5
IS
A
3.00E-08
N
1.08
RS
Ω
30
PB
V
0.65
PT
2
M
0.5
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
1000
10,000
10
1
TA = +125C
TA = +75C
TA = +25C
TA = –25C
0
1000
100
TA = +125C
TA = +75C
TA = +25C
10
1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
0
VF – FORWARD VOLTAGE (V)
20
30
40
30
IF - FORWARD CURRENT (mA)
1.5
1
0.5
0
0
10
20
30
40
VR – REVERSE VOLTAGE (V)
Figure 4. Total Capacitance vs. Reverse
Voltage.
50
30
IF (Left Scale)
10
10
VF (Right Scale)
1
0.3
0.2
1
0.4
0.6
0.8
1.0
1.2
10
1
10
I F – FORWARD CURRENT (mA)
Figure 3. Dynamic Resistance vs. Forward
Current.
Figure 2. Reverse Current vs. Reverse Voltage
at Temperatures.
2
100
1
0.1
50
VR – REVERSE VOLTAGE (V)
Figure 1. Forward Current vs. Forward Voltage
at Temperatures.
C T – CAPACITANCE (pF)
10
0.3
1.4
VF - FORWARD VOLTAGE (V)
Figure 5. Typical Vf Match, Pairs and Quads.
VF - FORWARD VOLTAGE DIFFERENCE (mV)
0.1
0.01
4
RD – DYNAMIC RESISTANCE ()
100,000
I R – REVERSE CURRENT (nA)
I F – FORWARD CURRENT (mA)
100
100
Applications Information Introduction —
Product Selection
0.026
Avago’s family of Schottky products provides unique
solutions to many design problems.
The first step in choosing the right product is to select the
diode type. All of the products in the HSMS-280x family
use the same diode chip, and the same is true of the
HSMS-281x and HSMS-282x families. Each family has a different set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS-280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (Rs). In applications which
do not require high voltage the HSMS-282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance. The HSMS-281x
family is a hybrid Schottky (as is the HSMS-280x), offering
lower 1/f or flicker noise than the HSMS-282x family.
In general, the HSMS-282x family should be the designer’s
first choice, with the -280x family reserved for high voltage
applications and the HSMS-281x family for low flicker
noise applications.
0.079
0.039
0.022
Dimensions in inches
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT363 (SC-70, 6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance
for package placement by automated assembly equipment without adding parasitics that could impair the
performance.
0.026
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT323 (SC-70) package is shown in Figure 6 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the performance.
0.079
0.039
0.018
Dimensions in inches
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363
Products.
Table 1. Typical SPICE Parameters
Parameter
Units
HSMS-280x
HSMS-281x
HSMS-282x
BV
V
75
25
15
CJ0
pF
1.6
1.1
0.7
EG
eV
0.69
0.69
0.69
IBV
A
1 E-5
1 E-5
1 E-4
IS
A
3 E-8
4.8 E-9
2.2 E-8
1.08
1.08
1.08
RS
Ω
30
10
6
PB (VJ)
V
0.65
0.65
0.65
N
PT (XTI)
2
2
2
M
0.5
0.5
0.5
5
SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
zones. The preheat zones increase the temperature of the
board and components to prevent thermal shock and
begin evaporating solvents from the solder paste. The
reflow zone briefly elevates the temperature sufficiently
to produce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to components due to thermal shock. The maximum temperature
in the reflow zone (TMAX) should not exceed 260°C.
Avago’s SOT diodes have been qualified to the timetemperature profile shown in Figure 8. This profile is
representative of an IR reflow type of surface mount assembly process.
These parameters are typical for a surface mount assembly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
tp
Tp
Critical Zone
T L to Tp
Ramp-up
Temperature
TL
Ts
Ts
tL
max
min
Ramp-down
ts
Preheat
25
t 25° C to Peak
Time
Figure 8. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Reflow Parameter
Lead-Free Assembly
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak)
3°C/ second max
Preheat
Temperature Min (TS(min))
150°C
Temperature Max (TS(max))
200°C
Time (min to max) (tS)
60-180 seconds
Temperature (TL)
217°C
Time (tL)
60-150 seconds
Ts(max) to TL Ramp-up Rate
Time maintained above:
3°C/second max
Peak Temperature (TP)
260 +0/-5°C
Time within 5 °C of actual Peak temperature (tP)
20-40 seconds
Ramp-down Rate
6°C/second max
Time 25 °C to Peak Temperature
8 minutes max
Note 1: All temperatures refer to topside of the package, measured on the package body surface
6
Part Number Ordering Information
Part Number
No. of
Devices
Container
HSMS-280x-TR2G
10000
13” Reel
HSMS-280x-TR1G
3000
7” Reel
HSMS-280x-BLKG
100
antistatic bag
x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R
Package Dimensions
Outline 23 (SOT-23)
Outline SOT-323 (SC-70 3 Lead)
e1
e2
e1
E
E
XXX
XXX
E1
E1
e
e
L
B
L
C
D
B
D
DIMENSIONS (mm)
A
A1
Notes:
XXX-package marking
Drawings are not to scale
7
DIMENSIONS (mm)
C
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
A
A1
Notes:
XXX-package marking
Drawings are not to scale
SYMBOL
A
A1
B
C
D
E1
e
e1
E
L
MIN.
MAX.
0.80
1.00
0.00
0.10
0.15
0.40
0.08
0.25
1.80
2.25
1.10
1.40
0.65 typical
1.30 typical
1.80
2.40
0.26
0.46
Package Dimensions (Continued)
Outline 143 (SOT-143)
Outline SOT-363 (SC-70 6 Lead)
e2
DIMENSIONS (mm)
e1
HE
B1
E
XXX
SYMBOL
E
D
HE
A
A2
A1
e
b
c
L
E
E1
e
D
MIN.
MAX.
1.15
1.35
1.80
2.25
1.80
2.40
0.80
1.10
0.80
1.00
0.00
0.10
0.650 BCS
0.15
0.30
0.08
0.25
0.10
0.46
L
B
e
C
A1
A2
DIMENSIONS (mm)
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
SYMBOL
A
A1
B
B1
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
c
A
b
L
For Outlines SOT-23, -323
Device Orientation
REEL
TOP VIEW
END VIEW
4 mm
CARRIER
TAPE
8 mm
USER
FEED
DIRECTION
ABC
For Outline SOT-143
ABC
For Outline SOT-363
TOP VIEW
END VIEW
TOP VIEW
4 mm
END VIEW
4 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
8
ABC
Note: "AB" represents package marking code.
"C" represents date code.
COVER TAPE
8 mm
ABC
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P2
D
E
P0
F
W
D1
t1
13.5° MAX
8° MAX
Ko
9° MAX
B0
A0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.05
0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 ± 0.002
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 +0.30- 0.10
0.229 ± 0.013
0.315 +0.012- 0.004
0.009 ± 0.0005
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K0
9° MAX
9° MAX
A0
B0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
3.19 ± 0.10
2.80 ± 0.10
1.31 ± 0.10
4.00 ± 0.10
1.00+ 0.25
0.126 ± 0.004
0.110 ± 0.004
0.052 ± 0.004
0.157 ± 0.004
0.039 + 0.010
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 +0.30- 0.10
0.254 ± 0.013
0.315+0.012- 0.004
0.0100± 0.0005
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
9
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P2
D
P0
E
F
W
C
D1
t1 (CARRIER TAPE THICKNESS)
Tt (COVER TAPE THICKNESS)
K0
An
A0
DESCRIPTION
B0
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
2.40 ± 0.10
2.40 ± 0.10
1.20 ± 0.10
4.00 ±0.10
1.00 + 0.25
0.094 ± 0.004
0.094 ± 0.004
0.047 ± 0.004
0.157 ± 0.004
0.039 + 0.010
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 ± 0.30
0.254 ± 0.02
0.315 ± 0.012
0.0100± 0.0008
COVER TAPE
WIDTH
TAPE THICKNESS
C
Tt
5.4 ± 0.10
0.062 ± 0.001
0.205 ± 0.004
0.0025± 0.00004
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
FOR SOT-323 (SC70-3 LEAD)
An
8° C MAX
ANGLE
FOR SOT-363 (SC70-6 LEAD)
An
10° C MAX
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5989-4020EN
AV02-0533EN - April 14, 2010
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