Austin AS4SD2M32DGX-6ET 512k x 32 x 4 banks (64-mb) synchronous sdram Datasheet

SDRAM
Austin Semiconductor, Inc.
512K x 32 x 4 Banks (64-Mb)
PIN ASSIGNMENT
(Top View)
Synchronous SDRAM
86-Pin TSOPII
FEATURES
• Full Military temp (-55°C to 125°C) processing available
• Configuration: 512K x 32 x 4 banks
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can be
changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8 or full page
• Auto Precharge, includes CONCURRENT AUTO
PRECHARGE and Auto Refresh Modes
• Self Refresh Mode (IT & ET)
• 64ms, 4,096 cycle refresh (IT & ET)
• <16ms 4,096 cycle refresh (XT)
• WRITE Recovery (tWR = “2 CLK”)
• LVTTL-compatible inputs and outputs
• Single +3.3V ±0.3V power supply
OPTIONS
MARKING
• Plastic TSOPII-EX
•
•
AS4SD2M32
DGX
Timing (Cycle Time)
6.0ns CL=3
7.0ns CL=3
7.5ns CL=3
-6
-7
-7.5
Operating Temperature Ranges
-Industrial Temp (-40°C to 85° C)
-Enhanced Temp (-45°C to +105°C)
-Extended Temp (-55°C to 125°C)
IT
ET
XT***
VDD
1
86
DQ0
2
85
VDDQ
3
84
VSSQ
DQ1
4
83
DQ14
DQ2
5
82
DQ13
VSSQ
6
81
VDDQ
DQ3
7
80
DQ12
DQ4
8
79
VDDQ
9
78
VSSQ
DQ5
10
77
DQ10
DQ6
11
76
DQ9
VSSQ
12
75
VDDQ
DQ7
13
74
DQ8
NC
14
73
VDD
15
72
VSS
DQM0
16
71
DQM1
WE
17
70
NC
CAS
18
69
NC
RAS
19
68
CLK
CS
20
67
CKE
NC
21
66
A9
BA0
22
65
A8
BA1
23
64
A7
A10
24
63
A6
A0
25
62
A5
A1
26
61
A4
A2
27
60
A3
DQM2
28
59
DQM3
VDD
29
58
VSS
NC
30
57
NC
DQ16
31
56
DQ31
VSSQ
32
55
VDDQ
DQ17
33
54
DQ30
DQ18
34
53
VDDQ
35
52
VSSQ
DQ19
36
51
DQ28
DQ20
37
50
DQ27
VSS
DQ15
DQ11
NC
DQ29
VSSQ
38
49
VDDQ
DQ21
39
48
DQ26
DQ22
40
47
VDDQ
41
46
VSSQ
DQ23
42
45
DQ24
VDD
43
44
VSS
DQ25
2M x 32
Configuration
512K x 32 x 4
Refresh Count
4K
Row Addressing
4K (A0-A10)
Bank Addressing
4 (BA0, BA1)
Column Addressing
256 (A0-A7)
KEY TIMING PARAMETERS
SPEED
CLOCK
ACCESS TIME
GRADE FREQUENCY CL = 2** CL = 3**
SETUP
TIME
1.5ns
HOLD
TIME
0.8ns
For more products and information
please visit our web site at
www.austinsemiconductor.com
**CL = CAS (READ) latency
***Consult Factory
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1
SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
GENERAL DESCRIPTION
The 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is internally
configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock
signal, CLK). Each of the 16,777,216-bit banks is organized as
2,048 rows by 256 columns by 32 bits.
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command,
which is then followed by a READ or WRITE command. The
address bits registered coincident with the ACTIVE command
are used to select the bank and row to be accessed (BA0, BA1
select the bank; A0-A10 select the row). The address bits registered coincident with the READ or WRITE command are used
to select the starting column location for the burst access.
The SDRAM provides for programmable READ or WRITE
burst lengths of 1, 2, 4, or 8 locations, or the full page, with a
burst terminate option. An auto precharge function may be
enabled to provide a self-timed row precharge that is initiated at
the end of the burst sequence.
The 64Mb SDRAM uses an internal pipelined architecture
to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows
the column address to be changed on every clock cycle to
achieve a high-speed, fully random operation. Precharging one
bank while accessing one of the other three banks will hide the
precharge cycles and provide seamless, high-speed, randomaccess operation.
The 64Mb SDRAM is designed to operate in 3.3V memory
systems. An auto refresh mode is provided, along with a powersaving, power-down mode. All inputs and outputs are LVTTLcompatible.
SDRAMs offer substantial advances in DRAM operating
performance, including the ability to synchronously burst data
at a high data rate with automatic column-address generation,
the ability to interleave between internal banks to hide precharge
time and the capability to randomly change column addresses
on each clock cycle during a burst access.
FUNCTIONAL BLOCK DIAGRAM
DQM0-3
DATA IN
BUFFER
COMMAND
DECODER
&
CLOCK
GENERATOR
32
11
DQ 0-31
SELF
VDD/VDDQ
DATA OUT
BUFFER
REFRESH
A10
CONTROLLER
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
32
REFRESH
CONTROLLER
MODE
REGISTER
GND/GNDQ
32
32
11
MULTIPLEXER
REFRESH
COUNTER
ROW
ADDRESS
LATCH
11
11
ROW
ADDRESS
BUFFER
ROW DECODER
CLK
CKE
CS
RAS
CAS
WE
2048
2048
2048
2048
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
256
(x 32)
COLUMN
ADDRESS LATCH
BANK CONTROL LOGIC
BURST COUNTER
COLUMN DECODER
COLUMN
ADDRESS BUFFER
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
2
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
PIN DESCRIPTIONS
PIN NUMBER
SYMBOL
68
CLK
67
CKE
TYPE
DESCRIPTION
Clock: CLK is driven by the system clock. All SDRAM input
signals are sampled on the positive edge of CLK. CLK also
Input
increments the internal burst counter and controls the output
registers.
Clock Enable: CKE activates (HIGH) and deactivates (LOW) the
CLK signal. Deactivating the clock provides PRECHARGE
POWER-DOWN and SLEF REFRESH operation (all banks idle),
ACTIVE POWER-DOWN (row active in any bank) or CLOCK
SUSPEND operation (burst/access in progress). CKE is
Input
synchronous except after the device enters power-down and self
refresh modes, where CKE becomes asynchronous until after
exiting the same mode. The input buffers, including CLK, are
disabled during power-down and self refresh modes, providing low
standby power. CKE may be tied HIGH.
Chip Select: CS\ enables (registered LOW) and disables
(registered HIGH) the command decoder. All commands are
masked when CS\ is registered HIGH. CS\ provides for external
bank selection on systems with multiple banks. CS\ in considered
part of the command code.
Command Inputs: WE\, CAS\ and RAS\ (along with CS\) define
the command being entered.
Input/Output Mask: DQM is an input mask signal for write
accesses and an output enable signal for read accesses. Input
data is masked when DWM is sampled HIGH during a WRITE
cycle. The outptu buffers are placed in a High-Z state (two-clock
latency) when DQM is sampled HIGH during a READ cycle.
DQM0 corresponds to DQ0-7, DQM2 to DQ16-23, DQM3 to
DQ24-31
Bank Address Inputs: BA0 and BA1 define to which bank the
ACTIVE, READ, WRITE, or PRECHARGE command is being
applied.
20
CS\
Input
17, 18, 19
WE\, CAS\,
RAS\
Input
16,71,28,59
DQM0, DQM1,
DQM2, DQM3
Input
22, 23
BA0, BA1
Input
25, 26, 27, 60, 61, 62, 63, 64,
65, 66, 24
A0 - A10
Address Inputs: A0-A12 are sampled during the ACTIVE
command (row address A0-A12) and READ/WRITE command
(column-address A0-A8; with A10 defining auto precharge) to
select one location out of the memory array in the respective
Input
bank. A10 is sampled during a PRECHARGE command to
determine if all banks are to be prechaged (A10 [HIGH]) or bank
selected by (A10 [LOW]). The address inputs also provide the
op-code during LOAD MODE REGISTER COMMAND.
2,4,5,7,8,10,11,13,74,76,77,
79,80,82,83,85,31,33,34,36,3
7,39,40,42,45,47,48,50,51,53
,54,56
DQ0 - DQ31
I/O
14, 21, 30, 57, 69, 70, 73
NC
---
3,9,35,41,49,55,75,81
VDDQ
6,12,32,38,46,52,78,84
VSSQ
1,15,29,43
VDD
Supply Power Supply: +3.3V ±0.3V
44,58,72,86
VSS
Supply Ground
AS4SD2M32
Rev. 1.0 1/08
Data Input/Output: Data bus
No Connect: These pins should be left unconnected.
DQ Power: Isolated DQ power to the die for improved noise
Supply
immunity.
DQ Ground: Isolated DQ ground to the die for imporved noise
Supply
immunity.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
3
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
FUNCTIONAL DESCRIPTION
selection of a burst length, a burst type, a CAS latency, an
operating mode and a write burst mode, as shown in Figure 1.
The mode register is programmed via the LOAD MODE
REGISTER command and will retain the stored information until
it is programmed again or the device loses power.
Mode register bits M0 - M2 specify the burst length, M3
specifies the type of burst (sequential or interleaved), M4 - M6
specify the CAS latency, M7 and M8 specify the operating
mode, M9 specifies the write burst mode, and M10, M11 and
M12 are reserved for future use.
The mode register must be loaded when all banks are idle,
and the controller must wait the specified time before initiating
the subsequent operation. Violating either of these requirements will result in unspecified operation.
In general, the 64Mb SDRAMs are quad-bank DRAMs
that operate at 3.3V and include a synchronous interface (all
signals are registered on the positive edge of the clock signal,
CLK). Each of the 16,777,216-bit banks is organized as 2,048
rows by 256 columns by 32 bits.
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for a
programmed number of locations in a programmed sequence.
Accesses begin with the registration of an ACTIVE command,
which is then followed by a READ or WRITE command. The
address bits registered coincident with the ACTIVE command
are used to select the bank and row to be accessed (BA0 and
BA1 select the bank, A0 - A10 select the row). The address bits
(A0 - A7) registered coincident with the READ or WRITE
command are used to select the starting column location for the
burst access.
Prior to normal operation, the SDRAM must be initialized.
The following sections provide detailed information covering
device initialization, register definition, command descriptions
and device operation.
Burst Length
Read and write accesses to the SDRAM are burst oriented,
with the burst length being programmable, as shown in Figure
1. The burst length determines the maximum number of column
locations that can be accessed for a given READ or WRITE
command. Burst lengths of 1, 2, 4, or 8 locations are available
for both the sequential and the interleaved burst types, and a
full-page burst is available for the sequential types. The fullpage burst is used in conjunction with the BURST TERMINATE command to generate arbitrary burst lengths.
Reserved states should not be used as unknown operation or incompatibility with future versions may result.
When a READ or WRITE command is issued, a block of
columns equal to the burst length is effectively selected. All
accesses for that burst take place within this block, meaning
that the burst will wrap within the block if a boundary is reached.
The clock is uniquely selected by A1-A8 when the burst length
is set to two; by A2-A7 when the burst length is set to four, and
by A3-A7 when the burst length is set to eight. The remaining
(least significant) address bit(s) is (are) used to select the starting location within the block. Full-page bursts wrap within the
page if the boundary is reached.
Initialization
SDRAMs must be powered up and initialized in a predefined
manner. Operational procedures other than those specified
may result in undefined operation. Once power is applied to
VDD and VDDQ (simultaneously) and the clock is stable (stable
clock is defined as a signal cycling within timing constraints
specified for the clock pin), the SDRAM requires a 100μs delay
prior to issuing any command other than a COMMAND
INHIBIT or NOP. Starting at some point during this 100μs
period and continuing at least through the end of this period,
COMMAND INHIBIT or NOP commands should be applied.
Once the 100μs delay has been satisfied with at least one
COMMAND INHIBIT or NOP command having been applied,
a PRECHARGE command should be applied. All banks must
then be precharged, thereby placing the device in the all banks
idle state.
Once in the idle state, two AUTO REFRESH cycles must
be preformed. After the AUTO REFRESH cycles are complete,
the SDRAM is ready for mode register programming. Because
the mode register will power up in an unknown state, it should
be loaded prior to applying any operational command.
Burst Type
Accesses within a given burst may be programmed to be
either sequential or interleaved; this is referred to as the burst
type and is selected via bit M3.
The ordering of accesses within a burst is determined by
the burst length, the burst type and the starting column address, shown in table 1.
Register Definition
MODE REGISTER
The mode register is used to define the specific mode of
operation of the SDRAM. This definition includes the
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
4
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
FIGURE 1: Mode Register Definition TABLE 1: Burst Definition
BURST
LENGTH
BA1
BA0
2
4
8
Full
Page
(y)
STARTING
ORDER OF ACCESSES WITHIN A BURST
COLUMN TYPE = SEQUENTIAL TYPE = INTERLEAVED
A0
0
0-1
0-1
1
1-0
1-0
A1 A0
0 0
0-1-2-3
0-1-2-3
0 1
1-2-3-0
1-0-3-2
1 0
2-3-0-1
2-3-0-1
1 1
3-0-1-2
3-2-1-0
A2 A1 A0
0 0 0
0-1-2-3-4-5-6-7
0-1-2-3-4-5-6-7
0 0 1
1-2-3-4-5-6-7-0
1-0-3-2-5-4-7-6
0 1 0
2-3-4-5-6-7-0-12-3-0-1-6-7-4-5
0 1 1
3-4-5-6-7-0-1-2
3-2-1-0-7-6-5-4
1 0 0
4-5-6-7-0-1-2-3
4-5-6-7-0-1-2-3
1 0 1
5-6-7-0-1-2-3-4
5-4-7-6-1-0-3-2
1 1 0
6-7-0-1-2-3-4-5
6-7-4-5-2-3-0-1
1 1 1
7-0-1-2-3-4-5-6
7-6-5-4-3-2-1-0
Cn, Cn+1, Cn+2, Cn+3,
n=A0-A7
Cn+4…
Not Supported
(location 0-y)
…Cn-1,
Cn…
NOTES:
1. For full-page access: y=512
2. For a burst length of two, A1-A7 select the block-of-two burst;
A0 selects the starting column within the block.
3. For a burst length of four, A2-A7 select the block-of-four burst;
A0-A1 selects the starting column within the block.
4. For a burst length of eight, A3-A7 select the block-of-eight burst;
A0-A2 selects the starting column within the block.
5. For a full-page burst, the full row is selected and A0-A7 select the
starting column.
6. Whenever a boundary of the block is reached within a given
sequence above, the following access wraps within the block.
7. For a burst length of one, A0-A7 select the unique column to be
accessed, and mode register bit M3 is ignored.
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
5
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
CAS Latency
The CAS latency is the delay, in clock cycles, between the
registration of a READ command and the availability of the first
piece of output data. The latency can be set to two or three
clocks.
If a READ command is registered at clock edge n, and the
latency is m clocks, the data will be available by clock edge
n + m. The DQs will start driving as a result of the clock edge
one cycle earlier (n + m - 1), and provided that the relevant
access times are met, the data will be valid by clock edge n + m.
For example, assuming that the clock cycle time is such that all
relevant access times are met, if a READ command is registered
at T0 and the latency is programmed to two clocks, the DQs will
start driving after T1 and the data will be valid by T2, as shown
in Figure 2. Table 2 below indicates the operating frequencies
at which each CAS latency setting can be used.
Reserved states should not be used as unknown
operation or incompatibility with future versions may result.
Operating Mode
The normal operating mode is selected by setting M7 and
M8 to zero; the other combinations of values for M7 and M8
are reserved for future use and/or test modes. The programmed
burst length applies to both READ and WRITE bursts.
Test modes are reserved states should not be used
because unknown operation or incompatibility with future
versions may result.
FIGURE 2: CAS Latency
TABLE 2: CAS Latency
Write Burst Mode
When M9=0, the burst length programmed via M0-M2
applies to both READ and WRITE bursts; when M9=1, the
programmed burst length applies to READ bursts, but write
accesses are single-location (non-burst) accesses.
SPEED
-6
-7
-75
AS4SD2M32
Rev. 1.0 1/08
ALLOWABLE OPERATING
FREQUENCY (MHz)
CAS
CAS
LATENCY = 2
LATENCY = 3
100
166
100
143
100
133
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6
SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
ACTIVE
The ACTIVE command is used to open (or activate) a row
in a particular bank for a subsequent access. The value on the
BA0, BA1 inputs selects the bank, and the address provided
on inputs A0-A10 selects the row. The row remains active (or
open) for accesses until a PRECHARGE command is issued to
that bank. A PRECHARGE command must be issued before
opening a different row in the same bank.
COMMANDS
Truth Table 1 provides a quick reference of available
commands. This is followed by a written description of each
command. Three additional Truth Tables appear following the
Operation section; these tables provide current state/next state
information.
COMMAND INHIBIT
The COMMAND INHIBIT function prevents new
commands from being executed by the SDRAM, regardless of
whether the CLK signal is enabled. The SDRAM is effectively
deselected. Operations already in progress are not affected.
READ
The READ command is used to initiate a burst read access
to an active row. The value on the BA0, BA1 inputs selects the
bank, and the address provided on inputs A0-A8 selects the
starting column location. The value on input A10 determines
whether or not auto precharge is used. If auto precharge is
selected, the row being accessed will be precharged at the end
of the READ burst; if auto precharge is not selected, the row
will remain open for subsequent accesses. Read data appears
on the DQs subject to the logic level on the DQM inputs two
clocks earlier. If a given DQM signal was registered HIGH, the
corresponding DQs will be High-Z two clocks later; if the DQM
signal was registered LOW, the DQs will provide valid data.
NO OPERATION (NOP)
The NO OPERATION (NOP) command is used to perform a
NOP to an SDRAM which is selected (CS\ is LOW). This
prevents unwanted commands from being registered during
idle or wait states. Operations already in progress are not
affected.
LOAD MODE REGISTER
The mode register is loaded via inputs A0-A9, BA0, BA1 . See
mode register heading in the Register Definition section. The
LOAD MODE REGISTER command can only be issued when
all banks are idle, and a subsequent executable command cannot be issued until tMRD is met.
WRITE
The WRITE command is used to initiate a burst write
access to an active row. The value on the BA0, BA1 inputs
TRUTH TABLE 1: COMMANDS AND DQM OPERATION1
FUNCTION
COMMAND INHIBIT (NOP)
NO OPERATION (NOP)
ACTIVE (Select bank and activate row)
READ (Select bank and column, and start READ burst)
CS\ RAS\ CAS\ WE\
H
X
X
X
L
H
H
H
L
L
H
H
L
H
L
H
WRITE (Select bank and column, and start WRITE burst)
BURST TERMINATE
PRECHARGE (Deactivate row in bank or banks)
AUTO REFRESH or SELF REFRESH
(Enter self refresh mode)
LOAD MODE REGISTER
Write Enable/Output Enable
Write Inhibit/Output High-Z
DQM
ADDR
DQs NOTES
X
X
X
X
X
X
X
Bank/Row
X
3
8
Bank/Col
X
4
L/H
8
L
L
L
H
H
L
L
H
H
L
L
L
L/H
X
X
L
L
L
H
X
L
-
L
-
L
-
L
-
X
L
H
Bank/Col Valid
X
Active
Code
X
X
X
Op-Code
X
Active
High-Z
4
5
6, 7
2
8
8
NOTE:
1. CKE is HIGH for all commands shown except SELF REFRESH.
2. A0-A9, BA0, BA1 define the op-code written to the mode register, and A12 should be driven LOW.
3. A0-A10 provide row address, and BA0, BA1 determine which bank is made active.
4. A0-A7 provide column address; A10 HIGH enables the auto precharge feature (nonpersistent), while A10 LOW disables the auto precharge
feature; BA0, BA1 determine which bank is being read from or written to.
5. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0, BA1 are “Don’t Care.”
6. This command is AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW.
7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE.
8. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay).
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7
SDRAM
Austin Semiconductor, Inc.
registered READ or WRITE command prior to the BURST
TERMINATE command will be truncated, as shown in the
Operation section of this data sheet.
WRITE (continued)
selects the bank, and the address provided on inputs A0-A8
selects the starting column location. The value on input A10
determines whether or not auto precharge is used. If auto
precharge is selected, the row being accessed will be precharged
at the end of the WRITE burst; if auto precharge is not
selected, the row will remain open for subsequent accesses.
Input data appearing on the DQs is written to the memory array
subject to the DQM input logic level appearing coincident with
the data. If a given DQM signal is registered LOW, the
corresponding data will be written to memory; if the DQM
signal is registered HIGH, the corresponding data inputs will be
ignored, and a WRITE will not be executed to that byte/column
location.
AUTO REFRESH (IT & ET Temp options ONLY)
AUTO REFRESH is used during normal operation of the
SDRAM and is analogous to CAS\-BEFORE-RAS\ (CBR)
REFRESH in conventional DRAMs. This command is
nonpersistent, so it must be issued each time a refresh is
required. All active banks must be precharged prior to issuing
an AUTO REFRESH command. The AUTO REFRESH
command should not be issued until the minimum tRP has been
met after the PRECHARGE command as shown in the
Operations section.
The addressing is generated by the internal refresh
controller. This makes the address bits “Don’t Care” during an
AUTO REFRESH command. The 64Mb SDRAM requires 4,096
AUTO REFRESH cycles every 64ms (tREF), regardless of width
operation. Providing a distributed AUTO REFRESH command
every 7.81μs will meet the refresh requirement and ensure that
each row is refreshed. Alternatively, 4,096 AUTO REFRESH
commands can be issued in a burst at the minimum cycle rate
(tRFC), once every 64ms.
PRECHARGE
The PRECHARGE command is used to deactivate the open
row in a particular bank or the open row in all banks. The
bank(s) will be available for a subsequent row access a specified time (tRP) after the PRECHARGE command is issued. Input
A10 determines whether one or all banks are to be precharged,
an in the case where only one bank is to be precharged, inputs
BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as
“Don’t Care.” Once a bank has been precharged, it is in the idle
state and must be activated prior to any READ or WRITE commands being issued to that bank.
SELF REFRESH (IT & ET Temp options ONLY)
The SELF REFRESH command can be used to retain data
in the SDRAM, even if the rest of the system is powered down.
When in the self refresh mode, the SDRAM retains data
without external clocking. The SELF REFRESH command is
initiated like and AUTO REFRESH command except CKE is
disabled (LOW). Once the SELF REFRESH command is
registered, all the inputs to the SDRAM become “Don’t Care”
with the exception of CKE, which must remain LOW.
Once self refresh mode is engaged, the SDRAM provides
its own internal clocking, causing it to perform its own AUTO
REFRESH cycles. The SDRAM must remain in self refresh
mode for a minimum period equal to tRAS and may remain in
self refresh mode for an indefinite period beyond that.
The procedure for exiting self refresh requires a sequence
of commands. First, CLK must be stable (stable clock is defined
as a signal cycling within timing constraints specified for the
clock pin) prior to CKE going back HIGH. Once CKE is HIGH,
the SDRAM must have NOP commands issued (a minimum of
two clocks) for tXSR because time is required for the
completion of any internal refresh in progress.
Upon exiting the self refresh mode, an AUTO REFRESH
commands should be immediately be performed for all addresses.
The SELF REFRESH and AUTO REFRESH option are available
with the IT and ET temperature options. They are not available
with the XT temperature options.
AUTO PRECHARGE
Auto precharge is a feature which performs the same
individual-bank PRECHARGE functions described above,
without requiring an explicit command. This is accomplished
by using A10 to enable auto precharge in conjunction with a
specific READ or WRITE command. A PRECHARGE of the
bank/row that is addressed with the READ or WRITE
command is automatically performed upon completion of the
READ or WRITE burst, except in the full-page burst mode,
where AUTO PRECHARGE does not apply. Auto precharge is
nonpersistent in that it is either enabled or disabled for each
individual READ or WRITE command.
Auto precharge ensures that the precharge is initiated at
the earliest valid stage within a burst. The user must not issue
another command to the same bank until the precharge time
(tRP) is completed. This is determined as if an explicit
PRECHARGE command was issued at the earliest possible time,
as described for each burst type in the Operation section of this
data sheet.
BURSTTERMINATE
The BURST TERMINATE command is used to truncate
either fixed-length or full-page bursts. The most recently
AS4SD2M32
Rev. 1.0 1/08
AS4SD2M32
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8
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
FIGURE 3: Activating a Specific
Row in a Specific Bank
OPERATION
BANK/ROW ACTIVATION
Before any READ or WRITE commands can be issued to a
bank within the SDRAM, a row in that bank must be “opened.”
This is accomplished via the ACTIVE command, which selects
both the bank and the row to be activated (see Figure 3).
After opening a row (issuing an ACTIVE command), a
READ or WRITE command may be issued to that row, subject
to the tRCD specification. tRCD (MIN) should be divided by the
clock period and rounded up to the next whole number to
determine the earliest clock edge after the ACTIVE command
on which a READ or WRITE command can be entered. For
example, a tRCD specification of 20ns with a 125 MHz clock
(8ns period) results in 2.5 clocks, rounded to 3. This is reflected
in Figure 4, which covers any case where 2 < tRCD (MIN)/
tCK < 3. (The same procedure is used to convert other specification limits from time units to clock cycles.)
A subsequent ACTIVE command to a different row in the
same bank can only be issued after the previous active row has
been “closed” (precharged). The minimum time interval
between successive ACTIVE commands to the same bank is
defined by tRC.
A subsequent ACTIVE command to another bank can be
issued while the first bank is being accessed, which results in a
reduction of total row-access overhead. The minimum time
interval between successive ACTIVE commands to different
banks is defined by tRRD.
A10
FIGURE 4: Example - Meeting tRCD (MIN) When 2 < tRCD (MIN)/ tCK < 3
AS4SD2M32
Rev. 1.0 1/08
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9
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
READs
READ bursts are initiated with a READ command, as shown
in Figure 5.
The starting column and bank addresses are provided with
the READ command, and auto precharge is either enabled or
disabled for that burst access. If auto precharge is enabled, the
row being accessed is precharged at the completion of the burst.
For the generic READ commands used in the following
illustrations, auto precharge is disabled.
During READ bursts, the valid data-out element from the
starting column address will be available following the CAS
latency after the READ command. Each subsequent data-out
element will be valid by the next positive clock edge. Figure 6
shows general timing for each possible CAS latency setting.
Upon completion of a burst, assuming no other commands
have been initiated, the DQs will go High-Z. A full-page burst
will continue until terminated. (At the end of the page, it will
wrap to the start address and continue.)
Data from any READ burst may be truncated with a
subsequent READ command, and data from a fixed-length READ
burst may be immediately followed by data from a READ
command. In either case, a continuous flow of data can be
maintained. The first data element from the new burst follows
either the last element of a complete burst or the last desired
data element of a longer burst that is being truncated. The new
READ command should be issued x cycles before the clock
edge at which the last desired data element is valid, where x
equals the CAS latency minus one. This is shown in Figure 7
for CAS latencies of two and three; data element n+3 is either
the last of a burst of four or the last desired of a longer burst.
The 64Mb SDRAM uses a pipelined architecture and therefore
does not require the 2n rule associated with a prefetch architecture. A READ command can be initiated on any clock cycle
following a previous READ command. Full-speed random read
accesses can be performed to the same bank, as shown in Figure 8, or each subsequent READ may be performed to different
bank.
FIGURE 5: READ Command
FIGURE 6: CAS Latency
CLK
CKE
CS\
RAS\
CAS\
WE\
A0-A7
A8, A9
A10
BA0, 1
AS4SD2M32
Rev. 1.0 1/08
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10
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
FIGURE 7: Consecutive READ Bursts
AS4SD2M32
Rev. 1.0 1/08
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11
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
FIGURE 8: Random READ Accesses
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
Data from any READ burst may be truncated with a
subsequent WRITE command, and data from a fixed-length
READ burst may be immediately followed by data from a WRITE
command (subject to bus turn-around limitations). The WRITE
burst may be initiated on the clock edge immediately following
the last (or last desired) data element from the READ burst,
provided that I/O contention can be avoided. In a given
system design, there may be a possibility that the device
driving the input data will go Low-Z before the SDRAM DQs
go High-Z. In this case, at least a single-cycle delay should
occur between the last read data and the WRITE command.
The DQM input is used to avoid I/O contention, as shown
in Figures 9 and 10. The DQM signal must be asserted (HIGH)
at least two clocks prior to the write command (DQM latency is
two clocks for output buffers) to suppress data-out from the
READ. Once the WRITE command is registered, the DQs will
go High-Z (or remain High-Z), regardless of the state of the
DQM signal; provided the DQM was active on the clock just
prior to the WRITE command that truncated the READ
command. If not, the second WRITE will be an invalid WRITE.
For example, if DQM was LOW during T4 in Figure 10, the
WRITEs at T5 and T7 would be valid, while the WRITE at T6
would be invalid.
The DQM signal must be de-asserted prior to the WRITE
command (DQM latency is zero clocks for input buffers) to
ensure that the written data is not masked. Figure 9 shows the
case where the clock frequency allows for bus contention to be
avoided without adding a NOP cycle, and Figure 10 shows the
case where the additional NOP is needed.
A fixed-length READ burst may be followed by, or trun-
cated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated), and a full-page
burst may be truncated with a PRECHARGE command to the
same bank. The PRECHARGE command should be issued x
cycles before the clock edge at which the last desired data
element is valid, where x equals the CAS latency minus one.
This is shown in Figure 11 for each possible CAS latency; data
element n+3 is either the last of a burst of four or the last desired
of a longer burst. Following the PRECHARGE command, a
subsequent command to the same bank cannot be issued until
tRP is met. Note that part of the row precharge time is hidden
during the access of the last data element(s).
In the case of a fixed-length burst being executed to
completion, a PRECHARGE command issued at the optimum
time (as described above) provides the same operation that
would result from the same fixed-length burst with auto
precharge. The disadvantage of the PRECHARGE command is
that it requires that the command and address buses be
available at the appropriate time to issue the command; the
advantage of the PRECHARGE command is that it can be used
to truncate fixed-length or full-page bursts.
Full-page READ bursts can be truncated with the BURST
TERMINATE command, and fixed-length READ bursts may be
truncated with a BURST TERMINATE command, provided that
auto precharge was not activated. The BURST TERMINATE
command should be issued x cycles before the clock edge at
which the last desired data element is valid, where x equals the
CAS latency minus one. This is shown in Figure 12 for each
possible CAS latency; data element n+3 is the last desired data
element of a longer burst.
FIGURE 9: READ to WRITE
FIGURE 10: READ to WRITE With
Extra Clock Cycle
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
FIGURE 11: READ to PRECHARGE
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
FIGURE 12: Terminating a READ Burst
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
WRITEs
WRITE bursts are initiated with a WRITE command, as
shown in Figure 13.
The starting column and blank addresses are provided with
the WRITE command, an auto precharge is either enabled or
disabled for that access. If auto precharge is enabled, the row
being accessed is precharged at the completion of the burst.
For the generic WRITE commands used in the following
illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will
be registered coincident with the WRITE command.
Subsequent data elements will be registered on each
successive positive clock edge. Upon completion of a fixedlength burst, assuming no other commands have been
initiated, the DQs will be ignored (see Figure 14). A full-page
burst will continue until terminated. (At the end of the page, it
will wrap to the start address and continue.)
AS4SD2M32
Data for any WRITE burst may be truncated with a
subsequent WRITE command, and data for a fixed-length
WRITE burst may be immediately followed by data for a WRITE
command. The new WRITE command can be issued on any
clock following the previous WRITE command, and the data
provided coincident with the new command applies to the new
command. An example is shown in Figure 15. Data n+1 is either
the last of a burst of two or the last desired of a longer burst.
The 64Mb SDRAM uses a pipelined architecture and
therefore does not require the 2n rule associated with a prefetch
architecture. A WRITE command can be initiated on any clock
cycle following a previous WRITE command. Full-speed random write accesses within a page can be performed to the same
bank, as shown in Figure 16, or each subsequent WRITE may
be preformed to a different bank.
FIGURE 14: WRITE Burst
FIGURE 13: WRITE Command
CLK
CKE
CS\
RAS\
CAS\
WE\
FIGURE 15: WRITE to WRITE
A0-A9
A10
BA0, 1
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
Data for any WRITE burst may be truncated with a
subsequent READ command, and data for a fixed-length WRITE
burst may be immediately followed by a READ command. Once
the READ command is registered, the data inputs will be
ignored, and WRITEs will not be executed. An example is shown
in Figure 17. Data n+1 is either the last of a burst of two or the
last desired of a longer burst.
Data for a fixed-length WRITE burst may be followed by,
or truncated with, a PRECHARGE command to the same bank
(provided that auto precharge was not activated), and a fullpage WRITE burst may be truncated with a PRECHARGE command to the same bank. The PRECHARGE command should be
issued tWR after the clock edge at which the last desired input
data element is registered. The auto precharge mode requires a
tWR of at least one clock plus time, regardless of frequency. In
addition, when truncating a WRITE burst, the DQM signal must
be used to mask input data for the clock edge prior to, and the
AS4SD2M32
clock edge coincident with, the PRECHARGE command. An
example is shown in Figure 18. Data n+1 is either the last of a
burst of two or the last desired of a longer burst. Following the
PRECHARGE command, a subsequent command to the same
bank cannot be issued until tRP is met. The precharge can be
issued coincident with the first coincident clock edge (T2 in
Figure 18) on an A1 Version and with the second clock on an
A2 Version (Figure 18).
In the case of a fixed-length burst being executed to
completion, a PRECHARGE command issued at the optimum
time (as described above) provides the same operation that
would result from the same fixed-length burst with auto
precharge. The disadvantage of the PRECHARGE command is
that is requires that the command and address buses be
available at the appropriate time to issue the command; the
advantage of the PRECHARGE command is that it can be used
to truncate fixed-length or full-page bursts.
FIGURE 16: Random WRITE Cycles
FIGURE 18: WRITE to PRECHARGE
FIGURE 17: WRITE to READ
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
Fixed-length or full-page WRITE bursts can be truncated
with the BURST TERMINATE command. When truncate a
WRITE burst, the input data applied coincident with the BURST
TERMINATE command will be ignored. The last data written
(provided that DQM is LOW at that time) will be the input data
applied one clock previous to the BURST TERMINATE
command. This is shown in Figure 19, where data n is the last
desired data element of a longer burst.
PRECHARGE
The PRECHARGE command (see Figure 20) is used to
deactivate the open row in a particular bank or the open row in
all banks. The bank(s) will be available for a subsequent row
access some specified time (tRP) after the PRECHARGE
command is issued. Input A10 determines whether one or all
banks are to be precharged, and in the case where only one
bank is to be precharged, inputs BA0, BA1 select the bank.
When all banks are to be precharged, inputs BA0, BA1 are
treated as “Don’t Care”. Once a bank has been precharged, it
is in the idle state and must be activated prior to any READ or
WRITE commands being issued to that bank.
AS4SD2M32
POWER-DOWN
Power-down occurs if CKE is registered LOW coincident
with a NOP or COMMAND INHIBIT when no accesses are in
progress. If power-down occurs when all banks are idle, this
mode is referred to as precharge power-down; if power-down
occurs when there is a row active in any bank, this mode is
referred to as active power-down. Entering power-down
deactivates the input and output buffers, excluding CKE, for
maximum power saving while in standby. The device may not
remain in the power-down state longer then the refresh period
(64ms) since no refresh operations are performed in this mode.
The power-down state is exited by registering a NOP or
COMMAND INHIBIT and CKE HIGH at the desired clock edge
(meeting tCKS). See Figure 21.
FIGURE 20: PRECHARGE Command
FIGURE 19: Terminating a WRITE
Burst
A0-A9
FIGURE 21: Power-Down
AS4SD2M32
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SDRAM
Austin Semiconductor, Inc.
CLOCK SUSPEND
The clock suspend mode occurs when a column access/
burst is in progress and CKE is registered LOW. In the clock
suspend mode, the internal clock is deactivated, “freezing” the
synchronous logic.
For each positive clock edge on which CKE is sampled
LOW, the next internal positive clock edge is suspended. Any
command or data present on the input pins at the time of a
suspected internal clock edge is ignored; any data present on
the DQ pins remains driven; and burst counters are not
incremented, as long as the clock is suspended. (See examples
in Figure 22 and 23).
AS4SD2M32
Clock suspend more is exited by registering CKE HIGH;
the internal clock and related operation will resume on the
subsequent positive clock edge.
BURST READ/SINGLE WRITE
The burst read/single write mode is entered by
programming the write burst mode bit (M9) in the mode register
to a logic 1. In this mode, all WRITE commands result in the
access of a single column location (burst of one), regardless of
the programmed burst length. READ commands access
columns according to the programmed burst length and
sequence, just as in the normal mode of operation (M9 = 0).
FIGURE 22: Clock Suspend During WRITE Burst
FIGURE 23: Clock Suspend During READ Burst
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
CONCURRENT AUTO PRECHARGE
An access command (READ or WRITE) to another bank
while an access command with auto precharge enabled is
executing is not allowed by SDRAMs, unless the SDRAM
supports CONCURRENT AUTO PRECHARGE. ASI SDRAMs
support CONCURRENT AUTO PRECHARGE. Four cases
where CONCURRENT AUTO PRECHARGE occurs are defined
below.
AS4SD2M32
READ with Auto Precharge
1. Interrupted by a READ (with or without auto precharge); A
READ to bank m will interrupt a READ on bank n, CAS latency
later. The PRECHARGE to bank n will begin when the READ to
bank m is registered (Figure 24).
2. Interrupted by a WRITE (with or without auto precharge): A
WRITE to bank m will interrupt a READ on bank n when
registered. DQM should be used two clocks prior to the WRITE
command to prevent bus contention. The PRECHARGE to
bank n will begin when the WRITE to bank m is registered
(Figure 25).
FIGURE 24: READ With Auto Precharge Interrupted by a READ
FIGURE 25: READ With Auto Precharge Interrupted by a WRITE
AS4SD2M32
Rev. 1.0 1/08
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SDRAM
Austin Semiconductor, Inc.
WRITE with Auto Precharge
3. Interrupted by a READ (with or without auto precharge); A
READ to bank m will interrupt a WRITE on bank n when
registered, with the data-out appearing CAS latency later. The
PRECHARGE to bank n will begin after tWR is met, where tWR
begins when the READ to bank m is registered. The last valid
WRITE to bank n will be data-in registered one clock prior to
the READ to bank m (Figure 26).
AS4SD2M32
4. Interrupted by a WRITE (with or without auto precharge): A
WRITE to bank m will interrupt a WRITE on bank n when
registered. The PRECHARGE to bank n will begin after tWR is
met, where tWR begins when the WRITE to bank m is registered.
The last valid data WRITE to bank n will be data registered one
clock prior to the WRITE to bank m (Figure 26).
FIGURE 26: WRITE With Auto Precharge Interrupted by a READ
FIGURE 27: WRITE With Auto Precharge Interrupted by a WRITE
AS4SD2M32
Rev. 1.0 1/08
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21
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
TRUTH TABLE 2: CKE1,2,3,4
CKEn-1 CKEn
L
L
L
H
H
L
H
H
CURRENT STATE
Power-Down
Self Refresh
Clock Suspend
Power-Down
Self Refresh
Clock Suspend
All Banks Idle
All Banks Idle
Reading or Writing
COMMANDn
X
X
X
COMMAND INHIBIT or NOP
COMMAND INHIBIT or NOP
X
COMMAND INHIBIT or NOP
AUTO REFRESH
VALID
See Truth Table 3
ACTIONn
Maintain Power-Down
Maintain Self Refresh
Maintain Clock Suspend
Exit Power-Down
Exit Self Refresh
Exit Clock Suspend
Power-Down Entry
Self Refresh Entry
Clock Suspend Entry
NOTES
5
6
7
NOTES:
1. CKEn is the logic state of CKE at clock edge n; CKEn-1 was the state of CKE at the previous clock edge.
2. Current state is the state of the SDRAM immediately prior to clock edge n.
3. COMMANDn is the command registered at clock edge n, and ACTIONn is a result of COMMANDn.
4. All states and sequences not shown are illegal or reserved.
5. Exiting power-down at clock edge n will put the device in the all banks idle state in time for clock edge n+1 (provided
that tCKS is met).
6. Exiting self refresh at clock edge n will put the device in the all banks idle state once tXSR is met. COMMAND INHIBIT or NOP
commands should be issued on any clock edges occurring during the tXSR period. A minimum of two NOP commands must be
provided during tXSR period.
7. After exiting clock suspend at clock edge n, the device will resume operation and recognize the next command at clock
edge n+1.
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
22
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
TRUTH TABLE 3: CURRENT STATE BANK n, COMMAND TO BANK n1,2,3,4,5,6
CURRENT STATE CS\ RAS\ CAS\ WE\
COMMAND (ACTION)
H
X
X
X COMMAND INHIBIT (NOP/Continue previous operation)
ANY
L
H
H
H NO OPERATION (NOP/Continue previous operation)
L
L
H
H ACTIVE (Select and active row)
L
L
L
H AUTO REFRESH
Idle
L
L
L
L LOAD MODE REGISTER
L
L
H
L PRECHARGE
L
H
L
H READ (Select column and start READ burst)
Row Active
L
H
L
L WRITE (Select column and start WRITE burst)
L
L
H
L PRECHARGE (Deactivate row in bank or banks)
L
H
L
H READ (Select column and start new READ burst)
Read
L
H
L
L WRITE (Select column and start WRITE burst)
(Auto Precharge
L
L
H
L PRECHARGE (Truncate READ burst, start PRECHARGE)
Disabled)
L
H
H
L BURST TERMINATE
L
H
L
H READ (Select column and start READ burst)
Write
L
H
L
L WRITE (Select column and start new WRITE burst)
(Auto Precharge
L
L
H
L PRECHARGE (Truncate WRITE burst, start PRECHARGE)
Disabled)
L
H
H
L BURST TERMINATE
NOTES
7
7
11
10
10
8
10
10
8
9
10
10
8
9
NOTES:
1. This table applies when CKEn-1 was HIGH and CKEn is HIGH (see Truth Table 2) and after tXSR has been met (if the previous
state was self refresh).
2. This table is bank-specific, except where noted, i.e., the current state is for a specific bank and the commands shown are those
allowed to be issued to that bank when in that state. Exceptions are covered in the notes below.
3. Current state definitions:
Idle:
The bank has been precharged, and tRP has been met.
Row Active:
A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no
register accesses are in progress.
Read:
A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been
terminated.
Write:
A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been
terminated.
4. The following states must not be interrupted by a command issued to the same bank. COMMAND INHIBIT or NOP commands,
or allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable
commands to the other bank are determined by its current state and Truth Table 3, and according to Truth Table 4.
Precharging:
Starts with registration of a PRECHARGE command and ends when tRP is met. Once tRP is met, the
bank will be in the idle state.
Row Activating:
Starts with registration of an ACTIVE command and ends when tRCD is met. Once tRCD is met, the
bank will be in the row active state.
Read w/ Auto
Precharge Enabled:
Starts with registration of a READ command with auto precharge enabled and ends when tRP has
been met. Once tRP is met, the bank will be in the idle state.
Write w/ Auto
Precharge Enabled:
Starts with registration of a WRITE command with auto precharge enabled and ends when tRP has
been met. Once tRP is met, the bank will be in the idle state.
(continued on next page)
AS4SD2M32
Rev. 1.0 1/08
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23
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
NOTES (continued):
5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be
applied on each positive clock edge during these states.
Refreshing:
Starts with registration of an AUTO REFRESH command and ends when tRC is met. Once tRC is met,
the SDRAM will be in the all banks idle state.
Accessing Mode
Register:
Starts with registration of a LOAD MODE REGISTER command and ends when tMRD has been met.
Once tMRD is met, the SDRAM will be in the all banks idle state.
Precharging All:
States with registration of a PRECHARGE ALL command and ends when tRP is met. Once tRP is met,
all banks will be in the idle state.
6. All states and sequences not shown are illegal or reserved.
7. Not bank-specific; requires that all banks are idle.
8. May or may not be bank-specific; if all banks are to be precharged, all must be in valid state for precharging.
9. Not bank-specific; BURST TERMINATE affects the most recent READ or WRITE burst, regardless of bank.
10. READs or WRITEs listed in the Command column include READs or WRITEs with auto precharge enabled and READs or
WRITEs with auto precharge disabled.
11. Does not affect the state of the bank and acts as a NOP to that bank.
AS4SD2M32
Rev. 1.0 1/08
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24
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
TRUTH TABLE 4: CURRENT STATE BANK n, COMMAND TO BANK m1,2,3,4,5,6
CURRENT STATE CS\ RAS\ CAS\ WE\
COMMAND (ACTION)
H
X
X
X COMMAND INHIBIT (NOP/Continue previous operation)
Any
L
H
H
H NO OPERATION (NOP/Continue previous operation)
Idle
X
X
X
X Any Command Otherwise Allowed to Bank m
L
L
H
H ACTIVE (Select and active row)
Row Activating,
L
H
L
H READ (Select column and start READ burst)
Active, or
L
H
L
L WRITE (Select column and start WRITE burst)
Precharging
L
L
H
L PRECHARGE
L
L
H
H ACTIVE (Select and active row)
Read
L
H
L
H READ (Select column and start new READ burst)
(Auto Precharge
L
H
L
L WRITE (Select column and start WRITE burst)
Disabled)
L
L
H
L PRECHARGE
L
L
H
H ACTIVE (Select and active row)
Write
L
H
L
H READ (Select column and start READ burst)
(Auto Precharge
L
H
L
L WRITE (Select column and start new WRITE burst)
Disabled)
L
L
H
L PRECHARGE
L
L
H
H ACTIVE (Select and active row)
Read
L
H
L
H READ (Select column and start new READ burst)
(with Auto
L
H
L
L WRITE (Select column and start WRITE burst)
Precharge)
L
L
H
L PRECHARGE
L
L
H
H ACTIVE (Select and active row)
Write
L
H
L
H READ (Select column and start READ burst)
(with Auto
L
H
L
L WRITE (Select column and start new WRITE burst)
Precharge)
L
L
H
L PRECHARGE
NOTES
7
7
7, 10
7, 11
9
7, 12
7, 13
9
7, 8, 14
7, 8, 15
9
7, 8, 16
7, 8, 17
9
NOTES:
1. This table applies when CKEn-1 was HIGH and CKEn is HIGH (see Truth Table 2) and after tXSR has been met (if the previous
state was self refresh).
2. This table describes alternate bank operation, except where noted; i.e., the current state is for bank n and the commands shown
are those allowed to be issued to bank m (assuming bank m is in such a state that the given command is allowable). Exceptions
are covered in the notes below.
3. Current state definitions:
Idle:
The bank has been precharged, and tRP has been met.
Row Active:
A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no
register accesses are in progress.
Read:
A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been
terminated.
Write:
A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been
terminated.
Read w/ Auto
Precharge Enabled:
Starts with registration of a READ command with auto precharge enabled and ends when tRP has
been met. Once tRP is met, the bank will be in the idle state.
Write w/ Auto
Precharge Enabled:
Starts with registration of a WRITE command with auto precharge enabled and ends when tRP has
been met. Once tRP is met, the bank will be in the idle state.
4. AUTO REFRESH, SELF REFRESH and LOAD MODE REGISTER commands may only be issued when all banks are idle.
5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state
only.
(continued on next page)
6. All states and sequences not shown are illegal or reserved.
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
25
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
NOTES (continued):
5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state
only.
6. All states and sequences not shown are illegal or reserved.
7. READs or WRITEs to bank m listed in the Command column include READs or WRITEs with auto precharge enabled and
READs or WRITEs with auto precharge disabled.
8. CONCURRENT AUTO PRECHARGE: bank n will initiate the auto precharge command when its burst has been interrupted by
bank m’s burst.
9. Burst in bank n continues as initiated.
10. For a READ without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt
the READ on bank n, CAS latency later (Figure 7).
11. For a READ without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will
interrupt the READ on bank n when registered (Figures 9 and 10). DQM should be used one clock prior to the WRITE command
to prevent bus contention.
12. For a WRITE without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will
interrupt the WRITE on bank n when registered (Figure 17), with the data-out appearing CAS latency later. The last valid WRITE
to bank n will be data-in registered one clock prior to the READ on bank m.
13. For a WRITE without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will
interrupt the WRITE on bank n when registered (Figure 15). The last valid WRITE to bank n will be data-in registered one clock
prior to the READ to bank m.
14. For a READ with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt
the READ on bank n, CAS latency later. The PRECHARGE to bank n will begin when the READ to bank m is registered (Figure
25).
15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt
the READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention.
The PRECHARGE to bank n will begin when the WRITE to bank m is registered (Figure 25).
16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt
the WRITE on bank n when registered, with the data-out appearing CAS latency later. The PRECHARGE to bank n will begin after
tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE to bank n will be data-in registered
one clock prior to the READ to bank m (Figure 26).
17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt
the WRITE on bank n when registered. The PRECHARGE to bank n will begin after tWR is met, where tWR begins when the WRITE
to bank m is registered. The last valid WRITE to bank n will be data registered one clock prior to the WRITE to bank m (Figure 27).
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
26
SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
*Stresses greater than those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods
may affect reliability.
**Junction temperature depends upon package type, cycle time,
loading, ambient temperature and airflow, and humidity (plastics).
ABSOLUTE MAXIMUM RATINGS*
Voltage on VDD, VDDQ Supply
Relative to VSS...................................................-1V to +4.6V
Voltage on Inputs, NC or I/O Pins
Relative to VSS...................................................-1V to +4.6V
Operating Temperature, TA (IT)..................................-40°C to +85°C
Operating Temperature, TA (ET)..............................-45°C to +105°C
Operating Temperature, TA (XT)..............................-55°C to +125°C
Storage Temperature (plastic)..................................-55°C to +150°C
Power Dissipation...........................................................................1W
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS1,5,6
(VDD, VDDQ = +3.3V ±0.3V)
PARAMETER
SYMBOL
MIN
MAX
UNITS
VDD, VDDQ
3
3.6
V
Input High Voltage: Logic 1; All inputs
VIH
2.2
VDD+ 0.3
V
22
Input Low Voltage: Logic 0; All inputs
VIL
-0.3
0.8
V
22
II
-5
5
μA
IOZ
-5
5
μA
Output Levels:
Output High Voltage (IOUT = -4mA)
VOH
2.4
---
V
Output Low Voltage (IOUT = 4mA)
VOL
---
0.4
V
Supply Voltage
Input Leakage Current: Any input 0V < VIN < VDD
(All other pins not under test = 0V)
Output Leakage Current: DQs are disabled:
0V < VOUT < VDDQ
NOTES
IDD SPECIFICATIONS AND CONDITIONS1,5,6,11,13 (VDD, VDDQ = +3.3V ±0.3V)
PARAMETER
Operating Current: Active Mode;
Burst = 2; READ or WRITE; t RC = tRC (MIN)
SYMBOL MAX (-6)
UNITS
NOTES
IDD1
150
mA
3, 18,
19, 32
Standby Current: Power-Down Mode;
All banks idle; CKE = LOW
IDD2
8
mA
32
Standby Current: Active Mode;
CKE = HIGH; CS\ = HIGH; All banks active after tRCD met;
No accesses in progress
IDD3
8
mA
3, 12,
19, 32
Operating Current: Burst Mode; Continuous Burst;
READ or WRITE: All banks active
IDD4
185
mA
3, 18,
19, 32
tRFC = tRFC (MIN)
IDD5
300
mA
tRFC = 7.81 µs
IDD6
6
mA
3, 12,
18, 19,
32, 33
IDD7
1
mA
4, 35
Auto Refresh Current
CS\ = HIGH; CKE = HIGH
SELF REFRESH CURRENT: CKE < 0.2V
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
27
SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
CAPACITANCE2
SYM
MIN
MAX
UNITS
NOTES
Input Capacitance: CLK
PARAMETER
CI1
2
4
pF
29
Input Capacitance: All other input-only pins
CI2
2
4
pF
30
Input/Output Capacitance: DQs
CIO
4.0
5.0
pF
31
AC FUNCTIONAL CHARACTERISTICS5,6,7,8,9,11
UNITS
NOTES
READ/WRITE command to READ/WRITE command
PARAMETER
SYMBOL -6, -7, -75
tCCD
1
tCK
17
CKE to clock disable or power-down entry mode
tCKED
1
tCK
14
CKE to clock enable or power-down exit setup mode
tPED
1
tCK
14
DQM to input data delay
tDQD
0
tCK
17
DQM to data mask during WRITEs
tDQM
0
tCK
17
DQM to data high-impedance during READs
tDQZ
2
tCK
17
WRITE command to input data delay
tDWD
0
tCK
17
Data-in to ACTIVE command
tDAL
5
tCK
15, 21
Data-in to PRECHARGE command
tDPL
2
tCK
16, 21
Last data-in to burst STOP command
tBDL
1
tCK
17
Last data-in to new READ/WRITE command
tCDL
1
tCK
17
Last data-in to PRECHARGE command
tRDL
2
tCK
16, 21
LOAD MODE REGISTER command to ACTIVE or REFRESH command
tMRD
2
tCK
26
CL = 3
tROH(3)
3
tCK
17
CL = 2
tROH(2)
2
tCK
17
Data-out to high-impedance from PRECHARGE command
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
28
SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING
CONDITIONS5,6,8,9,11
-6
PARAMETER
Access time from CLK (pos. edge)
SYM
MIN
-7
MAX
CL = 3
tAC(3)
5.5
CL = 2
tAC(2)
7.5
MIN
8
-75
MAX
MIN
MAX
UNITS
NOTES
5.5
5.4
ns
27
8
8
ns
Address hold time
tAH
0.8
0.8
0.8
ns
Address setup time
tAS
1.5
1.5
1.5
ns
CLK high-level width
tCH
2
2.5
2.5
ns
CLK low-level width
tCL
2
2.5
2.5
ns
Clock cycle time
CL = 3
tCK(3)
6
7
7.5
ns
23
CL = 2
tCK(2)
10
10
10
ns
23
tCKH
0.8
0.8
0.8
ns
CKE hold time
CKE setup time
tCKS
1
1
1.5
ns
CS\, RAS\, CAS\, WE\, DQM hold time
tCMH
0.8
0.8
0.8
ns
CS\, RAS\, CAS\, WE\, DQM setup time
tCMS
1.5
1.5
1.5
ns
Data-in hold time
tDH
0.8
0.8
0.8
ns
Data-in setup time
tDS
1.5
1.5
1.5
ns
Data-out high-impedance time
CL = 3
tHZ(3)
5.5
5.5
5.5
ns
10
CL = 2
tHZ(2)
7.5
8
8
ns
10
Data-out low-impedance time
tLZ
0
0
0
ns
Data-out hold time (load)
tOH
2
2.5
3
ns
Data-out hold time (no load)
tOHN
1.3
1.5
1.8
ns
ACTIVE to PRECHARGE command
tRAS
37.5
ACTIVE to ACTIVE command
tRC
60
ACTIVE to READ or WRITE delay
tRCD
18
Refresh period (4,092 rows)
tREF
AUTO REFRESH period
tRFC
60
70
tRP
18
tRRD
12
PRECHARGE command period
ACTIVE bank a to ACTIVE bank b command
Transition time
WRITE recovery time
Exit SELF REFRESH to ACTIVE command
AS4SD2M32
Rev. 1.0 1/08
120K
120K
63
0.3
tWR
1 CLK +
6ns
1.2
70
37.5
120K
70
20
64/16
tT
tXSR
37.5
ns
ns
20
64/16
28
ns
ms
34
70
ns
35
20
20
ns
14
15
ns
0.3
1 CLK +
7ns
70
1.2
64 / 16
0.3
1.2
ns
7
1 CLK +
7.5ns
15
ns
24
ns
25
75
ns
20, 35
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
29
SDRAM
Austin Semiconductor, Inc.
NOTES:
1. All voltages referenced to VSS.
2. This parameter is sampled. VDD, VDDQ = +3.3V; f = 1 MHz, TA
= 25°C; pin under test biased at 1.4V.
3. IDD is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle time and the outputs open.
4. Enables on-chip refresh and address counters.
5. The minimum specifications are used only to indicate cycle
time at which proper operation over the full temperature range
is ensured:
(0°C < TA < +125°C for XT), (-40°C < TA < +85°C
for IT), and (-45°C < TA < +105°C for ET).
6. An initial pause of 100μs is required after power-up, followed
by two AUTO REFRESH commands, before proper device operation is ensured. (VDD and VDDQ must be powered up simultaneously. VSS and VSSQ must be at the same potential.) The
two AUTO REFRESH command wake-ups should be repeated
any time the tREF refresh requirement is
exceeded.
7. AC characteristics assume tT = 1ns.
8. In addition to meeting the transition rate specification, the
clock and CKE must transit between VIH and VIL (or between VIL
and VIH) in a monotonic manner.
9. Outputs measured at 1.5V with equivalent load:
Q
50pF
10. tHZ defines the time at which the output achieves the open
circuit condition; it is not a reference to VOH or VOL. The last
valid data element will meet tOH before going High-Z.
11. AC operating and IDD test conditions have VIL = 0V and VIH
= 3.0V using a measurement reference level of 1.5V. If the input
transition time is longer than 1ns, then the timing is measured
from VIL (MAX) and VIH (MIN) and no longer from the 1.5V
mid-point.
12. Other input signals are allowed to transition no more than
once every two clocks and are otherwise at valid VIH or VIL
levels.
13. IDD specifications are tested after the device is properly initialized.
14. Timing actually specified by tCKS; clock(s) specified as a
reference only at minimum cycle rate.
15. Timing actually specified by tWR plus tRP; clock(s) specified
as a reference only at minimum cycle rate.
16. Timing actually specified by tWR.
17. Required clocks are specified by JEDEC functionality and
are not dependent on any timing parameter.
AS4SD2M32
Rev. 1.0 1/08
AS4SD2M32
18. The IDD current will increase or decrease proportionally according to the amount of frequency alteration for the test condition.
19. Address transitions average one transition every two clocks.
20. CLK must be toggled a minimum of two times during this
period.
21. Based on tCK = 7.5ns for -75.
22. VIH overshoot: VIL (MAX) = VDDQ = 2V for a pulse width <
3ns, and the pulse width cannot be greater than one third of the
cycle rate. VIL undershoot: VIL (MIN) = -2V for a pulse width <
3ns.
23. The clock frequency must remain constant (stable clock is
defined as a signal cycling within timing constraints specified
for the clock pin) during access or precharge states (READ,
WRITE, including tWR, and PRECHARGE commands). CKE
may be used to reduce the data rate.
24. Auto precharge mode only. The precharge timing budget
(tRP) begins 7.5ns after the first clock delay, after the last WRITE
is executed. May not exceed limit set for precharge mode.
25. Precharge mode only.
26. JEDEC and PC100 specify three clock.
27. for -75 at CL = 3 with no load is 4.6ns and is guaranteed by
design.
28. Parameter guaranteed by design.
29. PC100 specifies a maximum of 4pF.
30. PC100 specifies a maximum of 5pF.
31. PC100 specifies a maximum of 6.5pF.
32. CL = 3 and tCK = 7.5ns.
33. CKE is HIGH during refresh command period tRFC (MIN) else
CKE is LOW. The IDD6 limit is actually a nominal value and
does not result in a fail value.
34. 64ms refresh for IT, ET temperature options, 16ms refresh
for XT temperature option.
35. Self refresh mode available for IT and ET only.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
30
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
INITIALIZE AND LOAD MODE REGISTER2
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
31
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
POWER DOWN MODE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
32
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
CLOCK SUSPEND MODE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
33
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
AUTO REFRESH MODE (IT & ET Temp options ONLY)
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
34
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
SELF REFRESH MODE (IT & ET Temp options ONLY)
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
35
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
READ - WITHOUT AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
36
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
READ - WITH AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
37
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
SINGLE READ - WITHOUT AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
38
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
SINGLE READ - WITH AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
39
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
ALTERNATING BANK READ ACCESSES1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
40
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
READ - FULL-PAGE BURST1
DQMx
A0-A9
1,024 (x16) locations within same row
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
41
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
READ - DQM OPERATION1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
42
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
WRITE - WITHOUT AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
43
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
WRITE - WITH AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
44
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
SINGLE WRITE - WITHOUT AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
45
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
SINGLE WRITE - WITH AUTO PRECHARGE1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
46
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
ALTERNATING BANK WRITE ACCESSES1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
47
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
WRITE - FULL-PAGE BURST
DQMx
A0-A9
1,024 (x16) locations within same row
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
48
SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
WRITE - DQM OPERATION1
DQMx
A0-A9
AS4SD2M32
Rev. 1.0 1/08
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
49
SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
MECHANICAL DEFINITIONS
(Package Designator DGX)
N
N/2+1
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and should be
E
E1
measured from the bottom of the
package.
4. Formed leads shall be planar with
respect to one another within 0.004
inches at the seating plane.
N/2
1
D
SEATING PLANE
A
ZD
b
e
Plastic TSOP (T - Type II)
Millimeters
Inches
Min
Max
Min
Max
Symbol
Ref. Std.
No. Leads (N)
A
A1
A2
b
C
D
E1
E
e
L
L1
ZD
α
AS4SD2M32
Rev. 1.0 1/08
—
1.20
0.05 0.15
—
—
0.30 0.45
0.12 0.21
22.02 22.42
10.03 10.29
11.56 11.96
0.80 BSC
0.40 0.60
—
—
0.71 REF
0°
8°
α
C
Plastic TSOP (T - Type II)
Millimeters
Inches
Symbol Min Max
Min
Max
Ref. Std.
No. Leads (N)
86
54
—
0.047
0.002 0.006
—
—
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
—
—
0°
L
A1
A
A1
A2
b
C
D
E1
E
e
L
L1
ZD
α
8°
—
1.20
0.05 0.15
0.95 1.05
0.17 0.27
0.12 0.21
22.02 22.42
10.16 BSC
11.56 11.96
0.50 BSC
0.40 0.60
0.80 REF
0.61 REF
0°
8°
—
0.047
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.400 BSC
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
0.024 BSC
0°
8°
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
50
SDRAM
AS4SD2M32
Austin Semiconductor, Inc.
ORDERING INFORMATION
Device Number
Speed
Grade
Screening
AS4SD2M32DGX-6IT
166MHz TSOPII-86LD
Industrial
AS4SD2M32DGX-7IT
143MHz TSOPII-86LD
Industrial
AS4SD2M32DGX-75IT
133MHz TSOPII-86LD
Industrial
AS4SD2M32DGX-6ET
166MHz TSOPII-86LD
Enhanced
AS4SD2M32DGX-7ET
143MHz TSOPII-86LD
Enhanced
AS4SD2M32DGX-75ET
133MHz TSOPII-86LD
Enhanced
AS4SD2M32DGX-6XT
166MHz TSOPII-86LD
Extended
AS4SD2M32DGX-7XT
143MHz TSOPII-86LD
Extended
AS4SD2M32DGX-75XT
133MHz TSOPII-86LD
Extended
*AVAILABLE PROCESSES
IT = Industrial Temperature Range
ET = Enhanced Temperature Range
XT = Extended (Military)
Temperature Range
AS4SD2M32
Rev. 1.0 1/08
Package
-40oC to +85oC
-45°C to +105°C
-55oC to +125oC
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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SDRAM
Austin Semiconductor, Inc.
AS4SD2M32
DOCUMENT TITLE
512K x 32 x 4 Banks (64-Mb) Synchronous SDRAM
REVISION HISTORY
Rev #
1.0
AS4SD2M32
Rev. 1.0 1/08
History
Initial Release
Release Date
January 2008
Status
Preliminary
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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