Intel EE80C186XL20 16-bit high-integration embedded processor Datasheet

80C186XL/80C188XL
16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS
Y
Low Power, Fully Static Versions of
80C186/80C188
Y
Operation Modes:
Ð Enhanced Mode
Ð DRAM Refresh Control Unit
Ð Power-Save Mode
Ð Direct Interface to 80C187
(80C186XL Only)
Ð Compatible Mode
Ð NMOS 80186/80188 Pin-for-Pin
Replacement for Non-Numerics
Applications
Y
Integrated Feature Set
Ð Static, Modular CPU
Ð Clock Generator
Ð 2 Independent DMA Channels
Ð Programmable Interrupt Controller
Ð 3 Programmable 16-Bit Timers
Ð Dynamic RAM Refresh Control Unit
Ð Programmable Memory and
Peripheral Chip Select Logic
Ð Programmable Wait State Generator
Ð Local Bus Controller
Ð Power-Save Mode
Ð System-Level Testing Support (High
Impedance Test Mode)
Y
Completely Object Code Compatible
with Existing 8086/8088 Software and
Has 10 Additional Instructions over
8086/8088
Y
Speed Versions Available
Ð 25 MHz (80C186XL25/80C188XL25)
Ð 20 MHz (80C186XL20/80C188XL20)
Ð 12 MHz (80C186XL12/80C188XL12)
Y
Direct Addressing Capability to
1 MByte Memory and 64 Kbyte I/O
Y
Available in 68-Pin:
Ð Plastic Leaded Chip Carrier (PLCC)
Ð Ceramic Pin Grid Array (PGA)
Ð Ceramic Leadless Chip Carrier
(JEDEC A Package)
Y
Available in 80-Pin:
Ð Quad Flat Pack (EIAJ)
Ð Shrink Quad Flat Pack (SGFP)
Y
Available in Extended Temperature
Range ( b 40§ C to a 85§ C)
The Intel 80C186XL is a Modular Core re-implementation of the 80C186 microprocessor. It offers higher speed
and lower power consumption than the standard 80C186 but maintains 100% clock-for-clock functional compatibility. Packaging and pinout are also identical.
272431-1
*Other brands and names are the property of their respective owners.
Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or
copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make
changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.
June, 2002
COPYRIGHT© INTEL CORPORATION, 2002
Order Number: 272431-005
80C186XL/80C188XL
16-Bit High-Integration Embedded Processors
CONTENTS
PAGE
INTRODUCTION ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4
80C186XL CORE ARCHITECTURE ÀÀÀÀÀÀÀÀ 4
80C186XL Clock Generator ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4
Bus Interface Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5
80C186XL PERIPHERAL
ARCHITECTURE ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5
Chip-Select/Ready Generation Logic ÀÀÀÀÀÀÀ 5
DMA Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 6
Timer/Counter Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 6
Interrupt Control Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 6
Enhanced Mode Operation ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 6
Queue-Status Mode ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 6
DRAM Refresh Control Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7
Power-Save Control ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7
Interface for 80C187 Math Coprocessor
(80C186XL Only) ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7
ONCE Test Mode ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7
PACKAGE INFORMATION ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8
Pin Descriptions ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8
80C186XL/80C188XL Pinout
Diagrams ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 16
ELECTRICAL SPECIFICATIONS ÀÀÀÀÀÀÀÀÀ 22
Absolute Maximum Ratings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 22
DC SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 22
Power Supply Current ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 23
2
CONTENTS
PAGE
AC SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 24
Major Cycle Timings (Read Cycle) ÀÀÀÀÀÀÀÀÀ 24
Major Cycle Timings (Write Cycle) ÀÀÀÀÀÀÀÀÀ 26
Major Cycle Timings (Interrupt
Acknowledge Cycle) ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 27
Software Halt Cycle Timings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 28
Clock Timings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 29
Ready, Peripheral and Queue Status
Timings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 30
Reset and Hold/HLDA Timings ÀÀÀÀÀÀÀÀÀÀÀÀ 31
AC TIMING WAVEFORMS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 36
AC CHARACTERISTICS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 37
EXPLANATION OF THE AC
SYMBOLS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 39
DERATING CURVES ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 40
80C186XL/80C188XL EXPRESS ÀÀÀÀÀÀÀÀÀ 41
80C186XL/80C188XL EXECUTION
TIMINGS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 41
INSTRUCTION SET SUMMARY ÀÀÀÀÀÀÀÀÀÀ 42
REVISION HISTORY ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 48
ERRATA ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 48
PRODUCT IDENTIFICATION ÀÀÀÀÀÀÀÀÀÀÀÀÀ 48
272431– 2
80C186XL/80C188XL
NOTE:
Pin names in parentheses applies to 80C188XL.
Figure 1. 80C186XL/80C188XL Block Diagram
3
80C186XL/80C188XL
(2a)
272431 – 3
272431 – 4
(2b)
Note 1:
XTAL Frequency
L1 Value
20 MHz
12.0 mH g 20%
25 MHz
8.2 mH g 20%
32 MHz
4.7 mH g 20%
40 MHz
3.0 mH g 20%
LC network is only required when using a third
overtone crystal.
Figure 2. Oscillator Configurations (see text)
INTRODUCTION
Unless specifically noted, all references to the
80C186XL apply to the 80C188XL. References to
pins that differ between the 80C186XL and the
80C188XL are given in parentheses.
The following Functional Description describes the
base architecture of the 80C186XL. The 80C186XL
is a very high integration 16-bit microprocessor. It
combines 15–20 of the most common microprocessor system components onto one chip. The
80C186XL is object code compatible with the
8086/8088 microprocessors and adds 10 new instruction types to the 8086/8088 instruction set.
The 80C186XL has two major modes of operation,
Compatible and Enhanced. In Compatible Mode the
80C186XL is completely compatible with NMOS
80186, with the exception of 8087 support. The Enhanced mode adds three new features to the system
design. These are Power-Save control, Dynamic
RAM refresh, and an asynchronous Numerics Coprocessor interface (80C186XL only).
80C186XL CORE ARCHITECTURE
80C186XL Clock Generator
The 80C186XL provides an on-chip clock generator
for both internal and external clock generation. The
clock generator features a crystal oscillator, a divideby-two counter, synchronous and asynchronous
ready inputs, and reset circuitry.
4
The 80C186XL oscillator circuit is designed to be
used either with a parallel resonant fundamental or
third-overtone mode crystal, depending upon the
frequency range of the application. This is used as
the time base for the 80C186XL.
The output of the oscillator is not directly available
outside the 80C186XL. The recommended crystal
configuration is shown in Figure 2b. When used in
third-overtone mode, the tank circuit is recommended for stable operation. Alternately, the oscillator
may be driven from an external source as shown in
Figure 2a.
The crystal or clock frequency chosen must be twice
the required processor operating frequency due to
the internal divide by two counter. This counter is
used to drive all internal phase clocks and the external CLKOUT signal. CLKOUT is a 50% duty cycle
processor clock and can be used to drive other system components. All AC Timings are referenced to
CLKOUT.
Intel recommends the following values for crystal selection parameters.
Temperature Range:
Application Specific
ESR (Equivalent Series Resistance):
60X max
7.0 pF max
C0 (Shunt Capacitance of Crystal):
C1 (Load Capacitance):
20 pF g 2 pF
Drive Level:
2 mW max
80C186XL/80C188XL
Bus Interface Unit
The 80C186XL provides a local bus controller to
generate the local bus control signals. In addition, it
employs a HOLD/HLDA protocol for relinquishing
the local bus to other bus masters. It also provides
outputs that can be used to enable external buffers
and to direct the flow of data on and off the local
bus.
The bus controller is responsible for generating 20
bits of address, read and write strobes, bus cycle
status information and data (for write operations) information. It is also responsible for reading data
from the local bus during a read operation. Synchronous and asynchronous ready input pins are provided to extend a bus cycle beyond the minimum four
states (clocks).
The 80C186XL bus controller also generates two
control signals (DEN and DT/R) when interfacing to
external transceiver chips. This capability allows the
addition of transceivers for simple buffering of the
multiplexed address/data bus.
spond to bus cycles. An offset map of the 256-byte
control register block is shown in Figure 3.
Chip-Select/Ready Generation Logic
The 80C186XL contains logic which provides
programmable chip-select generation for both memories and peripherals. In addition, it can be
programmed to provide READY (or WAIT state) generation. It can also provide latched address bits A1
and A2. The chip-select lines are active for all memory and I/O cycles in their programmed areas,
whether they be generated by the CPU or by the
integrated DMA unit.
The 80C186XL provides 6 memory chip select outputs for 3 address areas; upper memory, lower
memory, and midrange memory. One each is provided for upper memory and lower memory, while four
are provided for midrange memory.
OFFSET
Relocation Register
During RESET the local bus controller will perform
the following action:
# Drive DEN, RD and WR HIGH for one clock cy-
DAH
DMA Descriptors Channel 1
D0H
cle, then float them.
# Drive S0– S2 to the inactive state (all HIGH) and
then float.
# Drive LOCK HIGH and then float.
# Float AD0–15 (AD0–8), A16–19 (A9–A19), BHE
CAH
DMA Descriptors Channel 0
C0H
(RFSH), DT/R.
# Drive ALE LOW
# Drive HLDA LOW.
RD/QSMD, UCS, LCS, MCS0/PEREQ, MCS1/
ERROR and TEST/BUSY pins have internal pullup
devices which are active while RES is applied. Excessive loading or grounding certain of these pins
causes the 80C186XL to enter an alternative mode
of operation:
# RD/QSMD low results in Queue Status Mode.
# UCS and LCS low results in ONCE Mode.
# TEST/BUSY low (and high later) results in Enhanced Mode.
80C186XL PERIPHERAL
ARCHITECTURE
All the 80C186XL integrated peripherals are controlled by 16-bit registers contained within an internal 256-byte control block. The control block may be
mapped into either memory or I/O space. Internal
logic will recognize control block addresses and re-
FEH
A8H
Chip-Select Control Registers
A0H
66H
Time 2 Control Registers
60H
5EH
Time 1 Control Registers
58H
56H
Time 0 Control Registers
50H
3EH
Interrupt Controller Registers
20H
Figure 3. Internal Register Map
The 80C186XL provides a chip select, called UCS,
for the top of memory. The top of memory is usually
used as the system memory because after reset the
80C186XL begins executing at memory location
FFFF0H.
5
80C186XL/80C188XL
The 80C186XL provides a chip select for low memory called LCS. The bottom of memory contains the
interrupt vector table, starting at location 00000H.
mum of 8 clocks), one cycle to fetch data and the
other to store data.
The 80C186XL provides four MCS lines which are
active within a user-locatable memory block. This
block can be located within the 80C186XL 1 Mbyte
memory address space exclusive of the areas defined by UCS and LCS. Both the base address and
size of this memory block are programmable.
Timer/Counter Unit
The 80C186XL can generate chip selects for up to
seven peripheral devices. These chip selects are active for seven contiguous blocks of 128 bytes above
a programmable base address. The base address
may be located in either memory or I/O space.
The 80C186XL can generate a READY signal internally for each of the memory or peripheral CS lines.
The number of WAIT states to be inserted for each
peripheral or memory is programmable to provide
0–3 wait states for all accesses to the area for
which the chip select is active. In addition, the
80C186XL may be programmed to either ignore external READY for each chip-select range individually
or to factor external READY with the integrated
ready generator.
Upon RESET, the Chip-Select/Ready Logic will perform the following actions:
# All chip-select outputs will be driven HIGH.
# Upon leaving RESET, the UCS line will be programmed to provide chip selects to a 1K block
with the accompanying READY control bits set at
011 to insert 3 wait states in conjunction with external READY (i.e., UMCS resets to FFFBH).
# No other chip select or READY control registers
have any predefined values after RESET. They
will not become active until the CPU accesses
their control registers.
DMA Unit
The 80C186XL DMA controller provides two independent high-speed DMA channels. Data transfers
can occur between memory and I/O spaces (e.g.,
Memory to I/O) or within the same space (e.g.,
Memory to Memory or I/O to I/O). Data can be
transferred either in bytes (8 bits) or in words (16
bits) to or from even or odd addresses.
NOTE:
Only byte transfers are possible on the 80C188XL.
Each DMA channel maintains both a 20-bit source
and destination pointer which can be optionally incremented or decremented after each data transfer
(by one or two depending on byte or word transfers).
Each data transfer consumes 2 bus cycles (a mini6
The 80C186XL provides three internal 16-bit programmable timers. Two of these are highly flexible
and are connected to four external pins (2 per timer).
They can be used to count external events, time external events, generate nonrepetitive waveforms,
etc. The third timer is not connected to any external
pins, and is useful for real-time coding and time delay applications. In addition, the third timer can be
used as a prescaler to the other two, or as a DMA
request source.
Interrupt Control Unit
The 80C186XL can receive interrupts from a number
of sources, both internal and external. The
80C186XL has 5 external and 2 internal interrupt
sources (Timer/Couners and DMA). The internal interrupt controller serves to merge these requests on
a priority basis, for individual service by the CPU.
Enhanced Mode Operation
In Compatible Mode the 80C186XL operates with all
the features of the NMOS 80186, with the exception
of 8087 support (i.e. no math coprocessing is possible in Compatible Mode). Queue-Status information
is still available for design purposes other than 8087
support.
All the Enhanced Mode features are completely
masked when in Compatible Mode. A write to any of
the Enhanced Mode registers will have no effect,
while a read will not return any valid data.
In Enhanced Mode, the 80C186XL will operate with
Power-Save, DRAM refresh, and numerics coprocessor support (80C186XL only) in addition to all the
Compatible Mode features.
If connected to a math coprocessor (80C186XL
only), this mode will be invoked automatically. Without an NPX, this mode can be entered by tying the
RESET output signal from the 80C186XL to the
TEST/BUSY input.
Queue-Status Mode
The queue-status mode is entered by strapping the
RD pin low. RD is sampled at RESET and if LOW,
the 80C186XL will reconfigure the ALE and WR pins
to be QS0 and QS1 respectively. This mode is available on the 80C186XL in both Compatible and Enhanced Modes.
80C186XL/80C188XL
DRAM Refresh Control Unit
The Refresh Control Unit (RCU) automatically generates DRAM refresh bus cycles. The RCU operates
only in Enhanced Mode. After a programmable period of time, the RCU generates a memory read request to the BIU. If the address generated during a
refresh bus cycle is within the range of a properly
programmed chip select, that chip select will be activated when the BIU executes the refresh bus cycle.
Power-Save Control
The 80C186XL, when in Enhanced Mode, can enter
a power saving state by internally dividing the processor clock frequency by a programmable factor.
This divided frequency is also available at the
CLKOUT pin.
All internal logic, including the Refresh Control Unit
and the timers, have their clocks slowed down by
the division factor. To maintain a real time count or a
fixed DRAM refresh rate, these peripherals must be
re-programmed when entering and leaving the power-save mode.
Interface for 80C187 Math
Coprocessor (80C186XL Only)
In Enhanced Mode, three of the mid-range memory
chip selects are redefined according to Table 1 for
use with the 80C187. The fourth chip select, MCS2
functions as in compatible mode, and may be programmed for activity with ready logic and wait states
accordingly. As in Compatible Mode, MCS2 will function for one-fourth a programmed block size.
Table 1. MCS Assignments
Compatible
Mode
MCS0
MCS1
MCS2
MCS3
Enhanced Mode
PEREQ
ERROR
MCS2
NPS
Processor Extension Request
NPX Error
Mid-Range Chip Select
Numeric Processor Select
ONCE Test Mode
To facilitate testing and inspection of devices when
fixed into a target system, the 80C186XL has a test
mode available which allows all pins to be placed in
a high-impedance state. ONCE stands for ‘‘ON Circuit Emulation’’. When placed in this mode, the
80C186XL will put all pins in the high-impedance
state until RESET.
The ONCE mode is selected by tying the UCS and
the LCS LOW during RESET. These pins are sampled on the low-to-high transition of the RES pin.
The UCS and the LCS pins have weak internal pullup resistors similar to the RD and TEST/BUSY pins
to guarantee ONCE Mode is not entered inadvertently during normal operation. LCS and UCS must
be held low at least one clock after RES goes high
to guarantee entrance into ONCE Mode.
7
80C186XL/80C188XL
PACKAGE INFORMATION
This section describes the pin functions, pinout and
thermal characteristics for the 80C186XL in the
Quad Flat Pack (QFP), Plastic Leaded Chip Carrier
(PLCC), Leadless Chip Carrier (LCC) and the Shrink
Quad Flat Pack (SQFP). For complete package
specifications and information, see the Intel Packaging Outlines and Dimensions Guide (Order Number:
231369).
Pin Descriptions
Each pin or logical set of pins is described in Table
3. There are four columns for each entry in the Pin
Description Table. The following sections describe
each column.
Column 1: Pin Name
In this column is a mnemonic that describes the pin function. Negation of the
signal name (i.e., RESIN) implies that
the signal is active low.
Column 2: Pin Type
A pin may be either power (P), ground
(G), input only (I), output only (O) or input/output (I/O). Please note that some
pins have more than one function.
Column 3: Input Type (for I and I/O types only)
These are two different types of input
pins on the 80C186XL: asynchronous
and synchronous. Asynchronous pins
require that setup and hold times be met
only to guarantee recognition. Synchronous input pins require that the setup
and hold times be met to guarantee
8
proper operation. Stated simply, missing
a setup or hold on an asynchronous pin
will result in something minor (i.e., a timer count will be missed) whereas missing a setup or hold on a synchronous pin
result in system failure (the system will
‘‘lock up’’).
An input pin may also be edge or level
sensitive.
Column 4: Output States (for O and I/O types
only)
The state of an output or I/O pin is dependent on the operating mode of the
device. There are four modes of operation that are different from normal active
mode: Bus Hold, Reset, Idle Mode, Powerdown Mode. This column describes
the output pin state in each of these
modes.
The legend for interpreting the information in the Pin
Descriptions is shown in Table 2.
As an example, please refer to the table entry for
AD7:0. The ‘‘I/O’’ signifies that the pins are bidirectional (i.e., have both an input and output function).
The ‘‘S’’ indicates that, as an input the signal must
be synchronized to CLKOUT for proper operation.
The ‘‘H(Z)’’ indicates that these pins will float while
the processor is in the Hold Acknowledge state.
R(Z) indicates that these pins will float while RESIN
is low.
All pins float while the processor is in the ONCE
Mode (with the exception of X2).
80C186XL/80C188XL
Table 2. Pin Description Nomenclature
Symbol
Description
P
G
I
O
I/O
Power Pin (apply a VCC voltage)
Ground (connect to VSS)
Input only pin
Output only pin
Input/Output pin
S(E)
S(L)
A(E)
A(L)
Synchronous, edge sensitive
Synchronous, level sensitive
Asynchronous, edge sensitive
Asynchronous, level sensitive
H(1)
H(0)
H(Z)
H(Q)
H(X)
Output driven to VCC during bus hold
Output driven to VSS during bus hold
Output floats during bus hold
Output remains active during bus hold
Output retains current state during bus hold
R(WH)
R(1)
R(0)
R(Z)
R(Q)
R(X)
Output weakly held at VCC during reset
Output driven to VCC during reset
Output driven to VSS during reset
Output floats during reset
Output remains active during reset
Output retains current state during reset
9
80C186XL/80C188XL
Table 3. Pin Descriptions
Pin
Name
Pin
Type
Input
Type
Output
States
Pin Description
VCC
P
System Power: a 5 volt power supply.
VSS
G
System Ground.
RESET
O
H(0)
R(1)
A(E)
RESET Output indicates that the CPU is being reset, and can
be used as a system reset. It is active HIGH, synchronized
with the processor clock, and lasts an integer number of
clock periods corresponding to the length of the RES signal.
Reset goes inactive 2 clockout periods after RES goes
inactive. When tied to the TEST/BUSY pin, RESET forces
the processor into enhanced mode. RESET is not floated
during bus hold.
X1
I
X2
O
H(Q)
R(Q)
CLKOUT
O
H(Q)
R(Q)
RES
I
A(L)
An active RES causes the processor to immediately
terminate its present activity, clear the internal logic, and
enter a dormant state. This signal may be asynchronous to
the clock. The processor begins fetching instructions
approximately 6(/2 clock cycles after RES is returned HIGH.
For proper initialization, VCC must be within specifications
and the clock signal must be stable for more than 4 clocks
with RES held LOW. RES is internally synchronized. This
input is provided with a Schmitt-trigger to facilitate power-on
RES generation via an RC network.
TEST/BUSY
(TEST)
I
A(E)
The TEST pin is sampled during and after reset to determine
whether the processor is to enter Compatible or Enhanced
Mode. Enhanced Mode requires TEST to be HIGH on the
rising edge of RES and LOW four CLKOUT cycles later. Any
other combination will place the processor in Compatible
Mode. During power-up, active RES is required to configure
TEST/BUSY as an input. A weak internal pullup ensures a
HIGH state when the input is not externally driven.
TESTÐIn Compatible Mode this pin is configured to operate
as TEST. This pin is examined by the WAIT instruction. If the
TEST input is HIGH when WAIT execution begins, instruction
execution will suspend. TEST will be resampled every five
clocks until it goes LOW, at which time execution will
resume. If interrupts are enabled while the processor is
waiting for TEST, interrupts will be serviced.
BUSY (80C186XL Only)ÐIn Enhanced Mode, this pin is
configured to operate as BUSY. The BUSY input is used to
notify the 80C186XL of Math Coprocessor activity. Floating
point instructions executing in the 80C186XL sample the
BUSY pin to determine when the Math Coprocessor is ready
to accept a new command. BUSY is active HIGH.
NOTE:
Pin names in parentheses apply to the 80C188XL.
10
Crystal Inputs X1 and X2 provide external connections for a
fundamental mode or third overtone parallel resonant crystal
for the internal oscillator. X1 can connect to an external
clock instead of a crystal. In this case, minimize the
capacitance on X2. The input or oscillator frequency is
internally divided by two to generate the clock signal
(CLKOUT).
Clock Output provides the system with a 50% duty cycle
waveform. All device pin timings are specified relative to
CLKOUT. CLKOUT is active during reset and bus hold.
80C186XL/80C188XL
Table 3. Pin Descriptions (Continued)
Pin
Name
Pin
Type
Input
Type
TMR IN 0
TMR IN 1
I
A(L)
A(E)
TMR OUT 0
TMR OUT 1
O
DRQ0
DRQ1
I
A(L)
DMA Request is asserted HIGH by an external device
when it is ready for DMA Channel 0 or 1 to perform a
transfer. These signals are level-triggered and internally
synchronized.
NMI
I
A(E)
The Non-Maskable Interrupt input causes a Type 2
interrupt. An NMI transition from LOW to HIGH is
latched and synchronized internally, and initiates the
interrupt at the next instruction boundary. NMI must be
asserted for at least one CLKOUT period. The NonMaskable Interrupt cannot be avoided by programming.
INT0
INT1/SELECT
I
A(E)
A(L)
I/O
A(E)
A(L)
Maskable Interrupt Requests can be requested by
activating one of these pins. When configured as inputs,
these pins are active HIGH. Interrupt Requests are
synchronized internally. INT2 and INT3 may be
configured to provide active-LOW interruptacknowledge output signals. All interrupt inputs may be
configured to be either edge- or level-triggered. To
ensure recognition, all interrupt requests must remain
active until the interrupt is acknowledged. When Slave
Mode is selected, the function of these pins changes
(see Interrupt Controller section of this data sheet).
INT2/INTA0
INT3/INTA1/IRQ
A19/S6
A18/S5
A17/S4
A16/S3
(A8–A15)
AD0–AD15
(AD0–AD7)
Output
States
Timer Inputs are used either as clock or control signals,
depending upon the programmed timer mode. These
inputs are active HIGH (or LOW-to-HIGH transitions are
counted) and internally synchronized. Timer Inputs must
be tied HIGH when not being used as clock or retrigger
inputs.
H(Q)
R(1)
O
Pin Description
H(1)
R(Z)
H(Z)
R(Z)
Timer outputs are used to provide single pulse or
continuous waveform generation, depending upon the
timer mode selected. These outputs are not floated
during a bus hold.
Address Bus Outputs and Bus Cycle Status (3 – 6)
indicate the four most significant address bits during T1.
These signals are active HIGH.
During T2, T3, TW and T4, the S6 pin is LOW to indicate
a CPU-initiated bus cycle or HIGH to indicate a DMAinitiated or refresh bus cycle. During the same T-states,
S3, S4 and S5 are always LOW. On the 80C188XL,
A15 – A8 provide valid address information for the entire
bus cycle.
I/O
S(L)
H(Z)
R(Z)
Address/Data Bus signals constitute the time
multiplexed memory or I/O address (T1) and data (T2,
T3, TW and T4) bus. The bus is active HIGH. For the
80C186XL, A0 is analogous to BHE for the lower byte of
the data bus, pins D7 through D0. It is LOW during T1
when a byte is to be transferred onto the lower portion
of the bus in memory or I/O operations.
NOTE:
Pin names in parentheses apply to the 80C188XL.
11
80C186XL/80C188XL
Table 3. Pin Descriptions (Continued)
Pin
Name
BHE
(RFSH)
Pin
Type
Input
Type
O
Output
States
H(Z)
R(Z)
Pin Description
The BHE (Bus High Enable) signal is analogous to A0 in that it is
used to enable data on to the most significant half of the data bus,
pins D15 – D8. BHE will be LOW during T1 when the upper byte is
transferred and will remain LOW through T3 and TW. BHE does not
need to be latched. On the 80C188XL, RFSH is asserted LOW to
indicate a refresh bus cycle.
In Enhanced Mode, BHE (RFSH) will also be used to signify DRAM
refresh cycles. A refresh cycle is indicated by both BHE (RFSH) and
A0 being HIGH.
80C186XL BHE and A0 Encodings
BHE
Value
A0
Value
0
0
0
1
1
1
0
1
Function
Word Transfer
Byte Transfer on upper half of data bus
(D15 – D8)
Byte Transfer on lower half of data bus (D7 – D0)
Refresh
ALE/QS0
O
H(0)
R(0)
Address Latch Enable/Queue Status 0 is provided by the processor
to latch the address. ALE is active HIGH, with addresses guaranteed
valid on the trailing edge.
WR/QS1
O
H(Z)
R(Z)
Write Strobe/Queue Status 1 indicates that the data on the bus is to
be written into a memory or an I/O device. It is active LOW. When
the processor is in Queue Status Mode, the ALE/QS0 and WR/QS1
pins provide information about processor/instruction queue
interaction.
RD/QSMD
O
ARDY
I
H(Z)
R(1)
A(L)
S(L)
QS1
QS0
Queue Operation
0
0
1
1
0
1
1
0
No queue operation
First opcode byte fetched from the queue
Subsequent byte fetched from the queue
Empty the queue
Read Strobe is an active LOW signal which indicates that the
processor is performing a memory or I/O read cycle. It is guaranteed
not to go LOW before the A/D bus is floated. An internal pull-up
ensures that RD/QSMD is HIGH during RESET. Following RESET
the pin is sampled to determine whether the processor is to provide
ALE, RD, and WR, or queue status information. To enable Queue
Status Mode, RD must be connected to GND.
Asynchronous Ready informs the processor that the addressed
memory space or I/O device will complete a data transfer. The
ARDY pin accepts a rising edge that is asynchronous to CLKOUT
and is active HIGH. The falling edge of ARDY must be synchronized
to the processor clock. Connecting ARDY HIGH will always assert
the ready condition to the CPU. If this line is unused, it should be tied
LOW to yield control to the SRDY pin.
NOTE:
Pin names in parentheses apply to the 80C188XL.
12
80C186XL/80C188XL
Table 3. Pin Descriptions (Continued)
Pin
Name
Pin
Type
Input
Type
Output
States
SRDY
I
S(L)
Ð
Synchronous Ready informs the processor that the addressed
memory space or I/O device will complete a data transfer. The
SRDY pin accepts an active-HIGH input synchronized to CLKOUT.
The use of SRDY allows a relaxed system timing over ARDY. This
is accomplished by elimination of the one-half clock cycle required
to internally synchonize the ARDY input signal. Connecting SRDY
high will always assert the ready condition to the CPU. If this line is
unused, it should be tied LOW to yield control to the ARDY pin.
LOCK
O
Ð
H(Z)
R(Z)
LOCK output indicates that other system bus masters are not to
gain control of the system bus. LOCK is active LOW. The LOCK
signal is requested by the LOCK prefix instruction and is activated
at the beginning of the first data cycle associated with the
instruction immediately following the LOCK prefix. It remains active
until the completion of that instruction. No instruction prefetching
will occur while LOCK is asserted.
S0
S1
S2
O
Ð
H(Z)
R(1)
Bus cycle status S0 – S2 are encoded to provide bus-transaction
information:
Pin Description
Bus Cycle Status Information
S2
S1
S0
Bus Cycle Initiated
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Interrupt Acknowledge
Read I/O
Write I/O
Halt
Instruction Fetch
Read Data from Memory
Write Data to Memory
Passive (no bus cycle)
S2 may be used as a logical M/IO indicator, and S1 as a DT/R
indicator.
HOLD
I
A(L)
Ð
HLDA
O
Ð
H(1)
R(0)
HOLD indicates that another bus master is requesting the local bus.
The HOLD input is active HIGH. The processor generates HLDA
(HIGH) in response to a HOLD request. Simultaneous with the
issuance of HLDA, the processor will float the local bus and control
lines. After HOLD is detected as being LOW, the processor will
lower HLDA. When the processor needs to run another bus cycle, it
will again drive the local bus and control lines.
In Enhanced Mode, HLDA will go low when a DRAM refresh cycle
is pending in the processor and an external bus master has control
of the bus. It will be up to the external master to relinquish the bus
by lowering HOLD so that the processor may execute the refresh
cycle.
NOTE:
Pin names in parentheses apply to the 80C188XL.
13
80C186XL/80C188XL
Table 3. Pin Descriptions (Continued)
Pin
Name
Pin
Type
Input
Type
Output
States
UCS
I/O
A(L)
H(1)
R(WH)
Upper Memory Chip Select is an active LOW output
whenever a memory reference is made to the defined
upper portion (1K – 256K block) of memory. The
address range activating UCS is software
programmable.
UCS and LCS are sampled upon the rising edge of
RES. If both pins are held low, the processor will enter
ONCE Mode. In ONCE Mode all pins assume a high
impedance state and remain so until a subsequent
RESET. UCS has a weak internal pullup that is active
during RESET to ensure that the processor does not
enter ONCE Mode inadvertently.
LCS
I/O
A(L)
H(1)
R(WH)
Lower Memory Chip Select is active LOW whenever a
memory reference is made to the defined lower portion
(1K – 256K) of memory. The address range activating
LCS is software programmable.
UCS and LCS are sampled upon the rising edge of
RES. If both pins are held low, the processor will enter
ONCE Mode. In ONCE Mode all pins assume a high
impedance state and remain so until a subsequent
RESET. LCS has a weak internal pullup that is active
only during RESET to ensure that the processor does
not enter ONCE mode inadvertently.
MCS0/PEREQ
MCS1/ERROR
I/O
A(L)
H(1)
R(WH)
Mid-Range Memory Chip Select signals are active LOW
when a memory reference is made to the defined midrange portion of memory (8K – 512K). The address
ranges activating MCS0 – 3 are software programmable.
On the 80C186XL, in Enhanced Mode, MCS0 becomes
a PEREQ input (Processor Extension Request). When
connected to the Math Coprocessor, this input is used
to signal the 80C186XL when to make numeric data
transfers to and from the coprocessor. MCS3 becomes
NPS (Numeric Processor Select) which may only be
activated by communication to the 80C187. MCS1
becomes ERROR in Enhanced Mode and is used to
signal numerics coprocessor errors.
MCS2
MCS3/NPS
O
H(1)
R(1)
PCS0
PCS1
PCS2
PCS3
PCS4
O
H(1)
R(1)
PCS5/A1
O
H(1)/H(X)
R(1)
NOTE:
Pin names in parentheses apply to the 80C188XL.
14
Pin Description
Peripheral Chip Select signals 0 – 4 are active LOW
when a reference is made to the defined peripheral
area (64 Kbyte I/O or 1 MByte memory space). The
address ranges activating PCS0 – 4 are software
programmable.
Peripheral Chip Select 5 or Latched A1 may be
programmed to provide a sixth peripheral chip select, or
to provide an internally latched A1 signal. The address
range activating PCS5 is software-programmable.
PCS5/A1 does not float during bus HOLD. When
programmed to provide latched A1, this pin will retain
the previously latched value during HOLD.
80C186XL/80C188XL
Table 3. Pin Descriptions (Continued)
Pin
Name
Pin
Type
Input
Type
Output
States
PCS6/A2
O
Ð
H(1)/H(X)
R(1)
Peripheral Chip Select 6 or Latched A2 may be programmed
to provide a seventh peripheral chip select, or to provide an
internally latched A2 signal. The address range activating
PCS6 is software-programmable. PCS6/A2 does not float
during bus HOLD. When programmed to provide latched A2,
this pin will retain the previously latched value during HOLD.
DT/R
O
Ð
H(Z)
R(Z)
Data Transmit/Receive controls the direction of data flow
through an external data bus transceiver. When LOW, data is
transferred to the procesor. When HIGH the processor
places write data on the data bus.
DEN
O
Ð
H(Z)
R(1,Z)
Data Enable is provided as a data bus transceiver output
enable. DEN is active LOW during each memory and I/O
access (including 80C187 access). DEN is HIGH whenever
DT/R changes state. During RESET, DEN is driven HIGH for
one clock, then floated.
N.C.
Ð
Ð
Ð
Pin Description
Not connected. To maintain compatibility with future
products, do not connect to these pins.
NOTE:
Pin names in parentheses apply to the 80C188XL.
15
80C186XL/80C188XL
Ceramic Leadless Chip Carrier (JEDEC Type A)
Contacts Facing Up
Contacts Facing Down
272431 – 5
Ceramic Pin Grid Array
Pins Facing Up
Pins Facing Down
272431 – 6
NOTE:
XXXXXXXXC indicates the Intel FPO number.
Figure 4. 80C186XL/80C188XL Pinout Diagrams
16
80C186XL/80C188XL
Shrink Quad Flat Pack
272431 – 22
NOTE:
XXXXXXXXC indicates the Intel FPO number.
Figure 4. 80C186XL/80C188XL Pinout Diagrams (Continued)
17
80C186XL/80C188XL
Plastic Leaded Chip Carrier
Contacts Facing Up
Contacts Facing Down
272431 – 7
80-Pin Quad Flat Pack (EIAJ)
Contacts
Facing Up
Contacts
Facing Down
272431 – 8
NOTE:
XXXXXXXXA indicates the Intel FPO number.
Figure 4. 80C186XL/80C288XL Pinout Diagrams (Continued)
18
80C186XL/80C188XL
Table 4. LCC/PLCC Pin Functions with Location
AD Bus
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8 (A8)
AD9 (A9)
AD10 (A10)
AD11 (A11)
AD12 (A12)
AD13 (A13)
AD14 (A14)
AD15 (A15)
A16/S3
A17/S4
A18/S5
A19/S6
Bus Control
17
15
13
11
8
6
4
2
16
14
12
10
7
5
3
1
68
67
66
65
ALE/QS0
BHE (RFSH)
S0
S1
S2
RD/QSMD
WR/QS1
ARDY
SRDY
DEN
DT/R
LOCK
HOLD
HLDA
Processor Control
61
64
52
53
54
62
63
55
49
39
40
48
50
51
RES
RESET
X1
X2
CLKOUT
TEST/BUSY
NMI
INT0
INT1/SELECT
INT2/INTA0
INT3/INTA1
24
57
59
58
56
47
46
45
44
42
41
Power and Ground
VCC
VCC
VSS
VSS
9
43
26
60
I/O
UCS
LCS
34
33
MCS0/PEREQ
MCS1/ERROR
MCS2
MCS3/NPS
38
37
36
35
PCS0
PCS1
PCS2
PCS3
PCS4
PCS5/A1
PCS6/A2
25
27
28
29
30
31
32
TMR IN 0
TMR IN 1
TMR OUT 0
TMR OUT 1
20
21
22
23
DRQ0
DRQ1
18
19
NOTE:
Pin names in parentheses apply to the 80C188XL.
Table 5. LCC/PGA/PLCC Pin Locations with Pin Names
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
AD15 (A15)
AD7
AD14 (A14)
AD6
AD13 (A13)
AD5
AD12 (A12)
AD4
VCC
AD11 (A11)
AD3
AD10 (A10)
AD2
AD9 (A9)
AD1
AD8 (A8)
AD0
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
DRQ0
DRQ1
TMR IN 0
TMR IN 1
TMR OUT 0
TMR OUT 1
RES
PCS0
VSS
PCS1
PCS2
PCS3
PCS4
PCS5/A1
PCS6/A2
LCS
UCS
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
MCS3/NPS
MCS2
MCS1/ERROR
MCS0/PEREQ
DEN
DT/R
INT3/INTA1
INT2/INTA0
VCC
INT1/SELECT
INT0
NMI
TEST/BUSY
LOCK
SRDY
HOLD
HLDA
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
S0
S1
S2
ARDY
CLKOUT
RESET
X2
X1
VSS
ALE/QS0
RD/QSMD
WR/QS1
BHE (RFSH)
A19/S2
A18/S3
A17/S4
A16/S3
NOTE:
Pin names in parentheses apply to the 80C188XL.
19
80C186XL/80C188XL
Table 6. QFP Pin Functions with Location
AD Bus
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8 (A8)
AD9 (A9)
AD10 (A10)
AD11 (A11)
AD12 (A12)
AD13 (A13)
AD14 (A14)
AD15 (A15)
A16/S3
A17/S4
A18/S5
A19/S6
Bus Control
64
66
68
70
74
76
78
80
65
67
69
71
75
77
79
1
3
4
5
6
ALE/QS0
BHE (RFSH)
S0
S1
S2
RD/QSMD
WR/QS1
ARDY
SRDY
DEN
DT/R
LOCK
HOLD
HLDA
Processor Control
10
7
23
22
21
9
8
20
27
38
37
28
26
25
No Connection
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
2
11
14
15
24
43
44
62
63
RES
RESET
X1
X2
CLKOUT
TEST/BUSY
NMI
INT0
INT1/SELECT
INT2/INTA0
INT3/INTA1
55
18
16
17
19
29
30
31
32
35
36
Power and Ground
VCC
VCC
VCC
VCC
VSS
VSS
VSS
33
34
72
73
12
13
53
I/O
UCS
LCS
45
46
MCS0/PEREQ
MCS1/ERROR
MCS2
MCS3/NPS
39
40
41
42
PCS0
PCS1
PCS2
PCS3
PCS4
PCS5/A1
PCS6/A2
54
52
51
50
49
48
47
TMR IN 0
TMR IN 1
TMR OUT 0
TMR OUT 1
59
58
57
56
DRQ0
DRQ1
61
60
NOTE:
Pin names in parentheses apply to the 80C188XL.
Table 7. QFP Pin Locations with Pin Names
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
AD15 (A15)
N.C.
A16/S3
A17/S4
A18/S5
A19/S6
BHE/(RFSH)
WR/QS1
RD/QSMD
ALE/QS0
N.C.
VSS
VSS
N.C.
N.C.
X1
X2
RESET
CLKOUT
ARDY
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
S2
S1
S0
N.C.
HLDA
HOLD
SRDY
LOCK
TEST/BUSY
NMI
INT0
INT1/SELECT
VCC
VCC
INT2/INTA0
INT3/INTA1
DT/R
DEN
MCS0/PEREQ
MCS1/ERROR
NOTE:
Pin names in parentheses apply to the 80C188XL.
20
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
MCS2
MCS3/NPS
N.C.
N.C.
UCS
LCS
PCS6/A2
PCS5/A1
PCS4
PCS3
PCS2
PCS1
VSS
PCS0
RES
TMR OUT 1
TMR OUT 0
TMR IN 1
TMR IN 0
DRQ1
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
DRQ0
N.C.
N.C.
AD0
AD8 (A8)
AD1
AD9 (A9)
AD2
AD10 (A10)
AD3
AD11 (A11)
VCC
VCC
AD4
AD12 (A12)
AD5
AD13 (A13)
AD6
AD14 (A14)
AD7
80C186XL/80C188XL
Table 8. SQFP Pin Functions with Location
AD Bus
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8 (A8)
AD9 (A9)
AD10 (A10)
AD11 (A11)
AD12 (A12)
AD13 (A13)
AD14 (A14)
AD15 (A15)
A16/S3
A17/S4
A18/S5
A19/S6
Bus Control
1
3
6
8
12
14
16
18
2
5
7
9
13
15
17
19
21
22
23
24
ALE/QS0
BHE (RFSH)
S0
S1
S2
RD/QSMD
WR/QS1
ARDY
SRDY
DEN
DT/R
LOCK
HOLD
HLDA
Processor Control
29
26
40
39
38
28
27
37
44
56
54
45
43
42
No Connection
N.C.
N.C.
N.C.
N.C.
N.C.
4
25
35
55
72
RES
RESET
X1
X2
CLKOUT
TEST/BUSY
NMI
INT0
INT1/SELECT
INT2/INTA0
INT3/INTA1
73
34
32
33
36
46
47
48
49
52
53
Power and Ground
VCC
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VSS
VSS
VSS
10
11
20
50
51
61
30
31
41
70
80
I/O
UCS
LCS
62
63
MCS0/PEREQ
MCS1/ERROR
MCS2
MCS3/NPS
57
58
59
60
PCS0
PCS1
PCS2
PCS3
PCS4
PCS5/A1
PCS6/A2
71
69
68
67
66
65
64
TMR IN 0
TMR IN 1
TMR OUT 0
TMR OUT 1
77
76
75
74
DRQ0
DRQ1
79
78
NOTE:
Pin names in parentheses apply to the 80C188XL.
Table 9. SQFP Pin Locations with Pin Names
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
AD0
AD8 (A8)
AD1
N.C.
AD9 (A9)
AD2
AD10 (A10)
AD3
AD11 (A11)
VCC
VCC
AD4
AD12 (A12)
AD5
AD13 (A13)
AD6
AD14 (A14)
AD7
AD15 (A15)
VCC
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
A16/S3
A17/S4
A18/S5
A19/S6
N.C.
BHE (RFSH)
WR/QS1
RD/QSMD
ALE/QS0
VSS
VSS
X1
X2
RESET
N.C.
CLKOUT
ARDY
S2
S1
S0
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
VSS
HLDA
HOLD
SRDY
LOCK
TEST/BUSY
NMI
INT0
INT1/SELECT
VCC
VCC
INT2/INTA0
INT3/INTA1
DT/R
N.C.
DEN
MCS0/PEREQ
MCS1/ERROR
MCS2
MCS3/NPS
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
VCC
UCS
LCS
PCS6/A2
PCS5/A1
PCS4
PCS3
PCS2
PCS1
VSS
PCS0
N.C.
RES
TMR OUT 1
TMR OUT 0
TMR IN 1
TMR IN 0
DRQ1
DRQ0
VSS
NOTE:
Pin names in parentheses apply to the 80C188XL.
21
80C186XL/80C188XL
ELECTRICAL SPECIFICATIONS
NOTICE: This data sheet contains preliminary information on new products in production. The specifications are subject to change without notice. Verify with
your local Intel Sales office that you have the latest
data sheet before finalizing a design.
Absolute Maximum Ratings*
Ambient Temperature under Bias ÀÀÀÀ0§ C to a 70§ C
Storage Temperature ÀÀÀÀÀÀÀÀÀÀ b 65§ C to a 150§ C
Voltage on Any Pin with
Respect to Ground ÀÀÀÀÀÀÀÀÀÀÀÀ b 1.0V to a 7.0V
Package Power Dissipation ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ1W
Not to exceed the maximum allowable die temperature based on thermal resistance of the package.
DC SPECIFICATIONS
Symbol
*WARNING: Stressing the device beyond the ‘‘Absolute
Maximum Ratings’’ may cause permanent damage.
These are stress ratings only. Operation beyond the
‘‘Operating Conditions’’ is not recommended and extended exposure beyond the ‘‘Operating Conditions’’
may affect device reliability.
NOTICE: The specifications are subject to change
without notice.
TA e 0§ C to a 70§ C, VCC e 5V g 10%
Parameter
Min
Max
Units
0.2 VCC b 0.3
V
Test Conditions
VIL
Input Low Voltage
(Except X1)
b 0.5
VIL1
Clock Input Low
Voltage (X1)
b 0.5
0.6
V
VIH
Input High Voltage
(All except X1 and RES)
0.2 VCC a 0.9
VCC a 0.5
V
VIH1
Input High Voltage (RES)
3.0
VCC a 0.5
V
VIH2
Clock Input High
Voltage (X1)
3.9
VCC a 0.5
V
VOL
Output Low Voltage
0.45
V
IOL e 2.5 mA (S0, 1, 2)
IOL e 2.0 mA (others)
VOH
Output High Voltage
VCC
V
IOH e b 2.4 mA
@
2.4V (4)
VCC
V
IOH e b 200 mA
@
VCC b 0.5(4)
100
mA
@ 25 MHz, 0§ C
VCC e 5.5V(3)
90
mA
@ 20 MHz, 0§ C
VCC e 5.5V(3)
62.5
mA
@ 12 MHz, 0§ C
VCC e 5.5V (3)
100
mA
@ DC 0§ C
VCC e 5.5V
2.4
VCC b 0.5
ICC
Power Supply Current
ILI
Input Leakage Current
g 10
mA
@ 0.5 MHz,
0.45V s VIN s VCC
ILO
Output Leakage Current
g 10
mA
@ 0.5 MHz,
0.45V s VOUT s VCC(1)
VCLO
Clock Output Low
0.45
V
22
ICLO e 4.0 mA
80C186XL/80C188XL
DC SPECIFICATIONS (Continued) TA e 0§ C to a 70§ C, VCC e 5V g 10%
Symbol
Parameter
Min
Max
Units
Test Conditions
V
ICHO e b 500 mA
VCHO
Clock Output High
CIN
Input Capacitance
VCC b 0.5
10
pF
@
1 MHz(2)
CIO
Output or I/O Capacitance
20
pF
@
1 MHz(2)
NOTES:
1. Pins being floated during HOLD or by invoking the ONCE Mode.
2. Characterization conditions are a) Frequency e 1 MHz; b) Unmeasured pins at GND; c) VIN at a 5.0V or 0.45V. This
parameter is not tested.
3. Current is measured with the device in RESET with X1 and X2 driven and all other non-power pins open.
4. RD/QSMD, UCS, LCS, MCS0/PEREQ, MCS1/ERROR and TEST/BUSY pins have internal pullup devices. Loading some
of these pins above IOH e b200 mA can cause the processor to go into alternative modes of operation. See the section on
Local Bus Controller and Reset for details.
Power Supply Current
Current is linearly proportional to clock frequency
and is measured with the device in RESET with X1
and X2 driven and all other non-power pins open.
Maximum current is given by ICC e 5 mA c freq.
(MHz) a IQL.
IQL is the quiescent leakage current when the clock
is static. IQL is typically less than 100 mA.
272431 – 9
Figure 5. ICC vs Frequency
23
80C186XL/80C188XL
AC SPECIFICATIONS
MAJOR CYCLE TIMINGS (READ CYCLE)
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
Min
Max
80C186XL20
Min
80C186XL12
Max
Min
Unit
Test
Conditions
Max
80C186XL GENERAL TIMING REQUIREMENTS (Listed More Than Once)
TDVCL
Data in Setup (A/D)
8
10
15
ns
TCLDX
Data in Hold (A/D)
3
3
3
ns
80C186XL GENERAL TIMING RESPONSES (Listed More Than Once)
TCHSV
Status Active Delay
3
20
3
25
3
35
ns
TCLSH
Status Inactive Delay
3
20
3
25
3
35
ns
TCLAV
Address Valid Delay
3
20
3
27
3
36
ns
TCLAX
Address Hold
0
TCLDV
Data Valid Delay
3
TCHDX Status Hold Time
10
0
20
3
0
27
10
ns
36
10
ns
ALE Active Delay
TLHLL
ALE Width
TCHLL
ALE Inactive Delay
TAVLL
Address Valid to ALE Low
TCLCH b 10
TCLCH b 10
TCLCH b 15
ns
Equal
Loading
TLLAX
Address Hold from ALE
Inactive
TCHCL b 8
TCHCL b 10
TCHCL b 15
ns
Equal
Loading
TAVCH
Address Valid to Clock High
TCLAZ
Address Float Delay
TCXCSX Chip-Select Hold from
Command Inactive
TCLCL b 15
TCLCL b 15
20
0
20
3
20
TCLCH b 10
3
TDXDL
0
TCLCL b 15
20
3
25
3
25
3
33
0
3
ns
ns
TCLAX
TCLCH b 10
20
ns
ns
25
0
TCLAX
TCLCH b 10
17
25
20
0
TCLAX
TCHCSX Chip-Select Inactive Delay
DEN Inactive to DT/R Low
20
ns
TCHLH
TCLCSV Chip-Select Active Delay
20
3
ns
ns
ns
30
0
ns
ns
TCVCTV Control Active Delay 1
3
17
3
22
3
37
ns
TCVDEX DEN Inactive Delay
3
17
3
22
3
37
ns
TCHCTV Control Active Delay 2
3
20
3
22
3
37
ns
TCLLV
3
17
3
22
3
37
ns
24
LOCK Valid/Invalid Delay
Equal
Loading
Equal
Loading
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
MAJOR CYCLE TIMINGS (READ CYCLE) (Continued)
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
Min
Max
80C186XL20
Min
Max
80C186XL12
Min
Unit
Test
Conditions
Max
80C186XL TIMING RESPONSES (Read Cycle)
TAZRL
Address Float
to RD Active
0
TCLRL
RD Active Delay
3
TRLRH
RD Pulse Width
2TCLCL b 15
TCLRH
RD Inactive Delay
TRHLH
RD Inactive
to ALE High
TCLCH b 14
TCLCH b 14
TCLCH b 14
ns
Equal
Loading
TRHAV
RD Inactive to
Address Active
TCLCL b 15
TCLCL b 15
TCLCL b 15
ns
Equal
Loading
3
0
20
3
0
27
2TCLCL b 20
20
3
3
ns
37
2TCLCL b 25
27
3
ns
ns
37
ns
25
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
MAJOR CYCLE TIMINGS (WRITE CYCLE)
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
Min
Max
80C186XL20
Min
Max
80C186XL12
Min
Max
Unit
Test
Conditions
80C186XL GENERAL TIMING RESPONSES (Listed More Than Once)
TCHSV
Status Active Delay
3
20
3
25
3
35
ns
TCLSH
Status Inactive Delay
3
20
3
25
3
35
ns
TCLAV
Address Valid Delay
3
20
3
27
3
36
ns
TCLAX
Address Hold
0
TCLDV
Data Valid Delay
3
TCHDX
Status Hold Time
10
TCHLH
ALE Active Delay
TLHLL
ALE Width
TCHLL
ALE Inactive Delay
TAVLL
Address Valid to ALE Low
TCLCH b 10
TCLCH b 10
TCLCH b 15
ns
Equal
Loading
TLLAX
Address Hold from ALE
Inactive
TCHCL b 10
TCHCL b 10
TCHCL b 15
ns
Equal
Loading
TAVCH
Address Valid to Clock High
0
0
0
ns
0
20
3
0
27
10
20
TCLCL b 15
3
36
10
20
TCLCL b 15
20
ns
ns
25
TCLCL b 15
20
ns
ns
25
3
TCVCTV Control Active Delay 1
3
20
3
25
3
37
ns
TCVCTX Control Inactive Delay
3
17
3
25
3
37
ns
TCLCSV Chip-Select Active Delay
3
20
3
25
3
33
ns
TCLCH b 10
TCHCSX Chip-Select Inactive Delay
3
TDXDL
DEN Inactive to DT/R Low
0
TCLLV
LOCK Valid/Invalid Delay
3
3
ns
TCLDOX Data Hold Time
TCXCSX Chip-Select Hold from
Command Inactive
3
ns
TCLCH b 10
17
3
TCLCH b 10
20
0
17
3
ns
3
ns
30
0
22
3
ns
ns
37
Equal
Loading
Equal
Loading
ns
80C186XL TIMING RESPONSES (Write Cycle)
TWLWH WR Pulse Width
2TCLCL b 15
2TCLCL b 20
2TCLCL b 25
ns
TWHLH WR Inactive to ALE High
TCLCH b 14
TCLCH b 14
TCLCH b 14
ns
Equal
Loading
TWHDX Data Hold after WR
TCLCL b 10
TCLCL b 15
TCLCL b 20
ns
Equal
Loading
TWHDEX WR Inactive to DEN Inactive TCLCH b 10
TCLCH b 10
TCLCH b 10
ns
Equal
Loading
26
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
MAJOR CYCLE TIMINGS (INTERRUPT ACKNOWLEDGE CYCLE)
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
Min
Max
80C186XL20
Min
80C186XL12
Max
Min
Unit
Test
Conditions
Max
80C186XL GENERAL TIMING REQUIREMENTS (Listed More Than Once)
TDVCL
Data in Setup (A/D)
8
10
15
ns
TCLDX
Data in Hold (A/D)
3
3
3
ns
80C186XL GENERAL TIMING RESPONSES (Listed More Than Once)
TCHSV
Status Active Delay
3
20
3
25
3
35
ns
TCLSH
Status Inactive Delay
3
20
3
25
3
35
ns
TCLAV
Address Valid Delay
3
20
3
27
3
36
ns
TAVCH
Address Valid to Clock High
0
0
0
ns
TCLAX
Address Hold
0
0
0
ns
TCLDV
Data Valid Delay
3
TCHDX Status Hold Time
10
20
3
27
10
36
ALE Active Delay
TLHLL
ALE Width
TCHLL
ALE Inactive Delay
TAVLL
Address Valid to ALE Low
TCLCH b 10
TCLCH b 10
TCLCH b 15
ns
Equal
Loading
TLLAX
Address Hold to ALE
Inactive
TCHCL b 10
TCHCL b 10
TCHCL b 15
ns
Equal
Loading
TCLAZ
Address Float Delay
TCLAX
20
TCLAX
20
TCLAX
25
ns
TCVCTV Control Active Delay 1
3
17
3
25
3
37
ns
TCVCTX Control Inactive Delay
3
17
3
25
3
37
ns
TDXDL
0
TCLCL b 15
20
ns
ns
TCHLH
DEN Inactive to DT/R Low
20
3
10
TCLCL b 15
20
25
TCLCL b 15
20
0
ns
ns
25
0
ns
ns
TCHCTV Control Active Delay 2
3
20
3
22
3
37
ns
TCVDEX DEN Inactive Delay
(Non-Write Cycles)
3
17
3
22
3
37
ns
TCLLV
3
17
3
22
3
37
ns
LOCK Valid/Invalid Delay
Equal
Loading
27
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
SOFTWARE HALT CYCLE TIMINGS
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
Min
Max
80C186XL20
Min
80C186XL12
Max
Min
Max
Unit
Test
Conditions
80C186XL GENERAL TIMING REQUIREMENTS (Listed More Than Once)
TCHSV
Status Active Delay
3
20
3
25
3
35
ns
TCLSH
Status Inactive Delay
3
20
3
25
3
35
ns
TCLAV
Address Valid Delay
3
20
3
27
3
36
ns
TCHLH
ALE Active Delay
25
ns
TLHLL
ALE Width
TCHLL
ALE Inactive Delay
20
20
25
ns
TDXDL
DEN Inactive to DT/R Low
0
0
0
ns
37
ns
TCHCTV Control Active Delay 2
28
20
TCLCL b 15
3
20
TCLCL b 15
20
3
TCLCL b 15
22
3
ns
Equal
Loading
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
CLOCK TIMINGS
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
Min
80C186XL20
80C186XL12
Unit
Max
Min
Max
Min
Max
Test
Conditions
80C186XL CLKIN REQUIREMENTS(1)
TCKIN
CLKIN Period
20
%
25
%
40
%
ns
TCLCK
CLKIN Low Time
8
%
10
%
16
%
ns 1.5V(2)
TCHCK
CLKIN High Time
8
%
10
%
16
%
ns 1.5V(2)
TCKHL
CLKIN Fall Time
5
5
5
ns 3.5 to 1.0V
TCKLH
CLKIN Rise Time
5
5
5
ns 1.0 to 3.5V
17
17
21
ns
%
ns
80C186XL CLKOUT TIMING
TCICO
CLKIN to
CLKOUT Skew
TCLCL
CLKOUT Period
50
80
TCLCH
CLKOUT
Low Time
0.5 TCLCL b 5
0.5 TCLCL b 5
0.5 TCLCL b 5
ns CL e 100 pF(3)
TCHCL
CLKOUT
High Time
0.5 TCLCL b 5
0.5 TCLCL b 5
0.5 TCLCL b 5
ns CL e 100 pF(4)
40
%
TCH1CH2 CLKOUT
Rise Time
6
8
10
ns 1.0 to 3.5V
TCL2CL1 CLKOUT
Fall Time
6
8
10
ns 3.5 to 1.0V
NOTES:
1. External clock applied to X1 and X2 not connected.
2. TCLCK and TCHCK (CLKIN Low and High times) should not have a duration less than 40% of TCKIN.
3. Tested under worst case conditions: VCC e 5.5V. TA e 70§ C.
4. Tested under worst case conditions: VCC e 4.5V. TA e 0§ C.
29
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
READY, PERIPHERAL AND QUEUE STATUS TIMINGS
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
Min
Max
80C186XL20
Min
Max
80C186XL12 Unit
Min
Max
80C186XL READY AND PERIPHERAL TIMING REQUIREMENTS (Listed More Than Once)
TSRYCL
Synchronous Ready (SRDY)
Transition Setup Time(1)
8
10
15
ns
TCLSRY
SRDY Transition Hold Time(1)
8
10
15
ns
TARYCH
ARDY Resolution Transition
Setup Time(2)
8
10
15
ns
TCLARX
ARDY Active Hold Time(1)
8
10
15
ns
TARYCHL ARDY Inactive Holding Time
8
10
15
ns
TARYLCL Asynchronous Ready
(ARDY) Setup Time(1)
10
15
25
ns
TINVCH
INTx, NMI, TEST/BUSY,
TMR IN Setup Time(2)
8
10
15
ns
TINVCL
DRQ0, DRQ1 Setup Time(2)
8
10
15
ns
80C186XL PERIPHERAL AND QUEUE STATUS TIMING RESPONSES
TCLTMV
Timer Output Delay
17
22
33
ns
TCHQSV
Queue Status Delay
22
27
32
ns
NOTES:
1. To guarantee proper operation.
2. To guarantee recognition at clock edge.
30
Test
Conditions
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
RESET AND HOLD/HLDA TIMINGS
TA e 0§ C to a 70§ C, VCC e 5V g 10%
All timings are measured at 1.5V and 50 pF loading on CLKOUT unless otherwise noted.
All output test conditions are with CL e 50 pF.
For AC tests, input VIL e 0.45V and VIH e 2.4V except at X1 where VIH e VCC b 0.5V.
Values
Symbol
Parameter
80C186XL25
80C186XL20
80C186XL12
Min
Min
Min
Max
Max
Unit
Test
Conditions
Max
80C186XL RESET AND HOLD/HLDA TIMING REQUIREMENTS
TRESIN
RES Setup
15
15
15
ns
THVCL
HOLD Setup(1)
8
10
15
ns
80C186XL GENERAL TIMING RESPONSES (Listed More Than Once)
TCLAZ
Address Float Delay
TCLAX
20
TCLAX
20
TCLAX
25
ns
TCLAV
Address Valid Delay
3
20
3
22
3
36
ns
33
ns
3
33
ns
80C186XL RESET AND HOLD/HLDA TIMING RESPONSES
TCLRO
Reset Delay
TCLHAV
HLDA Valid Delay
17
TCHCZ
Command Lines Float Delay
22
25
33
ns
TCHCV
Command Lines Valid Delay
(after Float)
20
26
36
ns
3
17
22
3
22
NOTE:
1. To guarantee recognition at next clock.
31
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
272431 – 10
NOTES:
1. Status inactive in state preceding T4.
2. If latched A1 and A2 are selected instead of PCS5 and PCS6, only TCLCSV is applicable.
3. For write cycle followed by read cycle.
4. T1 of next bus cycle.
5. Changes in T-state preceding next bus cycle if followed by write.
Pin names in parentheses apply to the 80C188XL.
Figure 6. Read Cycle Waveforms
32
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
272431 – 11
NOTES:
1. Status inactive in state preceding T4.
2. If latched A1 and A2 are selected instead of PCS5 and PCS6, only TCLCSV is applicable.
3. For write cycle followed by read cycle.
4. T1 of next bus cycle.
5. Changes in T-state preceding next bus cycle if followed by read, INTA, or halt.
Pin names in parentheses apply to the 80C188XL.
Figure 7. Write Cycle Waveforms
33
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
272431 – 12
NOTES:
1. Status inactive in state preceding T4.
2. The data hold time lasts only until INTA goes inactive, even if the INTA transition occurs prior to TCLDX (min).
3. INTA occurs one clock later in Slave Mode.
4. For write cycle followed by interrupt acknowledge cycle.
5. LOCK is active upon T1 of the first interrupt acknowledge cycle and inactive upon T2 of the second interrupt acknowledge cycle.
6. Changes in T-state preceding next bus cycle if followed by write.
Pin names in parentheses apply to the 80C188XL.
Figure 8. Interrupt Acknowledge Cycle Waveforms
34
80C186XL/80C188XL
AC SPECIFICATIONS (Continued)
272431 – 13
NOTE:
1. For write cycle followed by halt cycle.
Pin names in parentheses apply to the 80C188XL.
Figure 9. Software Halt Cycle Waveforms
35
80C186XL/80C188XL
WAVEFORMS
272431 – 14
Figure 10. Clock Waveforms
272431 – 15
Figure 11. Reset Waveforms
272431 – 16
Figure 12. Synchronous Ready (SRDY) Waveforms
36
80C186XL/80C188XL
AC CHARACTERISTICS
272431 – 23
Figure 13. Asynchronous Ready (ARDY) Waveforms
272431 – 17
Figure 14. Peripheral and Queue Status Waveforms
37
80C186XL/80C188XL
AC CHARACTERISTICS (Continued)
272431 – 24
Figure 15. HOLDA/HLDA Waveforms (Entering Hold)
272431 – 18
Figure 16. HOLD/HLDA Waveforms (Leaving Hold)
38
80C186XL/80C188XL
EXPLANATION OF THE AC SYMBOLS
Each timing symbol has from 5 to 7 characters. The first character is always a ‘T’ (stands for time). The other
characters, depending on their positions, stand for the name of a signal or the logical status of that signal. The
following is a list of all the characters and what they stand for.
A:
Address
ARY: Asynchronous Ready Input
C:
Clock Output
CK:
CS:
Clock Input
Chip Select
CT:
Control (DT/R, DEN, . . . )
D:
DE:
Data Input
DEN
H:
Logic Level High
OUT: Input (DRQ0, TIM0, . . . )
L:
Logic Level Low or ALE
O:
QS:
R:
S:
Output
Queue Status (QS1, QS2)
RD Signal, RESET Signal
Status (S0, S1, S2)
SRY: Synchronous Ready Input
V:
W:
X:
Valid
WR Signal
No Longer a Valid Logic Level
Z:
Float
Examples:
TCLAV Ð Time from Clock low to Address valid
TCHLH Ð Time from Clock high to ALE high
TCLCSV Ð Time from Clock low to Chip Select valid
39
80C186XL/80C188XL
DERATING CURVES
Typical Output Delay Capacitive Derating
272431 – 19
Figure 17. Capacitive Derating Curve
Typical Rise and Fall Times for TTL Voltage Levels
272431 – 20
Figure 18. TTL Level Rise and Fall Times for Output Buffers
Typical Rise and Fall Times for CMOS Voltage Levels
272431 – 21
Figure 19. CMOS Level Rise and Fall Times for Output Buffers
40
80C186XL/80C188XL
80C186XL/80C188XL EXPRESS
The Intel EXPRESS system offers enhancements to
the operational specifications of the 80C186XL microprocessor. EXPRESS products are designed to
meet the needs of those applications whose operating requirements exceed commercial standards.
The 80C186XL EXPRESS program includes an extended temperature range. With the commercial
standard temperature range, operational characteristics are guaranteed over the temperature range of
0§ C to a 70§ C. With the extended temperature range
option, operational characteristics are guaranteed
over the range of b 40§ C to a 85§ C.
Package types and EXPRESS versions are identified
by a one or two-letter prefix to the part number. The
prefixes are listed in Table 10. All AC and DC specifications not mentioned in this section are the same
for both commercial and EXPRESS parts.
Table 10. Prefix Identification
Prefix
Package
Type
Temperature
Range
A
PGA
Commercial
N
PLCC
Commercial
R
LCC
Commercial
S
QFP
Commercial
SB
SQFP
Commercial
TA
PGA
Extended
TN
PLCC
Extended
TR
LCC
Extended
TS
QFP
Extended
80C186XL/80C188XL EXECUTION
TIMINGS
A determination of program execution timing must
consider the bus cycles necessary to prefetch instructions as well as the number of execution unit
cycles necessary to execute instructions. The following instruction timings represent the minimum execution time in clock cycles for each instruction. The
timings given are based on the following assumptions:
# The opcode, along with any data or displacement
required for execution of a particular instruction,
has been prefetched and resides in the queue at
the time it is needed.
# No wait states or bus HOLDs occur.
# All word-data is located on even-address boundaries (80C186XL only).
All jumps and calls include the time required to fetch
the opcode of the next instruction at the destination
address.
All instructions which involve memory accesses can
require one or two additional clocks above the minimum timings shown due to the asynchronous handshake between the bus interface unit (BIU) and execution unit.
With a 16-bit BIU, the 80C186XL has sufficient bus
performance to ensure that an adequate number of
prefetched bytes will reside in the queue (6 bytes)
most of the time. Therefore, actual program execution time will not be substantially greater than that
derived from adding the instruction timings shown.
The 80C188XL 8-bit BIU is limited in its performance
relative to the execution unit. A sufficient number of
prefetched bytes may not reside in the prefetch
queue (4 bytes) much of the time. Therefore, actual
program execution time will be substantially greater
than that derived from adding the instruction timings
shown.
41
80C186XL/80C188XL
INSTRUCTION SET SUMMARY
Function
Format
80C186XL
Clock
Cycles
80C188XL
Clock
Cycles
2/12
2/12*
Comments
DATA TRANSFER
MOV e Move:
Register to Register/Memory
1000100w
mod reg r/m
Register/memory to register
1000101w
mod reg r/m
Immediate to register/memory
1100011w
mod 000 r/m
data
Immediate to register
1 0 1 1 w reg
data
Memory to accumulator
1010000w
Accumulator to memory
Register/memory to segment register
Segment register to register/memory
2/9
2/9*
12/13
12/13
8/16-bit
data if w e 1
3/4
3/4
8/16-bit
addr-low
addr-high
8
8*
1010001w
addr-low
addr-high
9
9*
10001110
mod 0 reg r/m
2/9
2/13
10001100
mod 0 reg r/m
2/11
2/15
Memory
11111111
mod 1 1 0 r/m
16
20
Register
0 1 0 1 0 reg
10
14
Segment register
0 0 0 reg 1 1 0
9
13
Immediate
011010s0
10
14
PUSHA e Push All
01100000
36
68
20
24
10
14
8
12
51
83
4/17
4/17*
3
3
10
10*
8
8*
data if w e 1
PUSH e Push:
data
data if s e 0
POP e Pop:
Memory
10001111
Register
0 1 0 1 1 reg
Segment register
0 0 0 reg 1 1 1
POPA e Pop All
01100001
mod 0 0 0 r/m
(reg i 01)
XCHG e Exchange:
Register/memory with register
1000011w
Register with accumulator
1 0 0 1 0 reg
mod reg r/m
IN e Input from:
Fixed port
1110010w
Variable port
1110110w
port
OUT e Output to:
Fixed port
1110011w
Variable port
1110111w
XLAT e Translate byte to AL
11010111
LEA e Load EA to register
10001101
port
mod reg r/m
9
9*
7
7*
11
15
6
6
18
26
18
26
LDS e Load pointer to DS
11000101
mod reg r/m
(mod i 11)
LES e Load pointer to ES
11000100
mod reg r/m
(mod i 11)
LAHF e Load AH with flags
10011111
2
2
SAHF e Store AH into flags
10011110
3
3
PUSHF e Push flags
10011100
9
13
POPF e Pop flags
10011101
8
12
Shaded areas indicate instructions not available in 8086/8088 microsystems.
NOTE:
*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.
42
80C186XL/80C188XL
INSTRUCTION SET SUMMARY (Continued)
Function
Format
80C186XL
Clock
Cycles
80C188XL
Clock
Cycles
Comments
DATA TRANSFER (Continued)
SEGMENT e Segment Override:
CS
00101110
2
2
SS
00110110
2
2
DS
00111110
2
2
ES
00100110
2
2
3/10
3/10*
4/16
4/16*
3/4
3/4
3/10
3/10*
4/16
4/16*
3/4
3/4
3/15
3/15*
3
3
3/10
3/10*
4/16
4/16*
3/4
3/4
3/10
3/10*
4/16
4/16*
3/4
3/4*
3/15
3/15*
3
3
ARITHMETIC
ADD e Add:
Reg/memory with register to either
000000dw
mod reg r/m
Immediate to register/memory
100000sw
mod 0 0 0 r/m
data
Immediate to accumulator
0000010w
data
data if w e 1
data if s w e 01
8/16-bit
ADC e Add with carry:
Reg/memory with register to either
000100dw
mod reg r/m
Immediate to register/memory
100000sw
mod 0 1 0 r/m
data
0001010w
data
data if w e 1
Register/memory
1111111w
mod 0 0 0 r/m
Register
0 1 0 0 0 reg
Immediate to accumulator
data if s w e 01
8/16-bit
INC e Increment:
SUB e Subtract:
Reg/memory and register to either
001010dw
mod reg r/m
Immediate from register/memory
100000sw
mod 1 0 1 r/m
data
Immediate from accumulator
0010110w
data
data if w e 1
data if s w e 01
8/16-bit
SBB e Subtract with borrow:
Reg/memory and register to either
000110dw
mod reg r/m
Immediate from register/memory
100000sw
mod 0 1 1 r/m
data
Immediate from accumulator
0001110w
data
data if w e 1
Register/memory
1111111w
mod 0 0 1 r/m
Register
0 1 0 0 1 reg
data if s w e 01
8/16-bit
DEC e Decrement
CMP e Compare:
Register/memory with register
0011101w
mod reg r/m
3/10
3/10*
Register with register/memory
0011100w
mod reg r/m
3/10
3/10*
Immediate with register/memory
100000sw
mod 1 1 1 r/m
data
3/10
3/10*
Immediate with accumulator
0011110w
data
data if w e 1
NEG e Change sign register/memory
1111011w
mod 0 1 1 r/m
AAA e ASCII adjust for add
DAA e Decimal adjust for add
data if s w e 01
3/4
3/4
3/10
3/10*
00110111
8
8
00100111
4
4
AAS e ASCII adjust for subtract
00111111
7
7
DAS e Decimal adjust for subtract
00101111
4
4
MUL e Multiply (unsigned):
1111011w
26–28
35–37
32–34
41–43
26–28
35–37
32–34
41–43*
8/16-bit
mod 100 r/m
Register-Byte
Register-Word
Memory-Byte
Memory-Word
Shaded areas indicate instructions not available in 8086/8088 microsystems.
NOTE:
*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.
43
80C186XL/80C188XL
INSTRUCTION SET SUMMARY (Continued)
Function
Format
80C186XL
Clock
Cycles
80C188XL
Clock
Cycles
25–28
34–37
31–34
40–43
25–28
34–37
32–34
40–43*
22–25/
29–32
22–25/
29–32
29
38
35
44
29
38
35
44*
44–52
53–61
50–58
59–67
44-52
53–61
50–58
59–67*
Comments
ARITHMETIC (Continued)
IMUL e Integer multiply (signed):
1111011w
mod 1 0 1 r/m
Register-Byte
Register-Word
Memory-Byte
Memory-Word
IMUL e Integer Immediate multiply
(signed)
011010s1
mod reg r/m
DIV e Divide (unsigned):
1111011w
mod 1 1 0 r/m
data
data if s e 0
Register-Byte
Register-Word
Memory-Byte
Memory-Word
IDIV e Integer divide (signed):
1111011w
mod 1 1 1 r/m
Register-Byte
Register-Word
Memory-Byte
Memory-Word
AAM e ASCII adjust for multiply
11010100
00001010
19
19
AAD e ASCII adjust for divide
11010101
00001010
15
15
CBW e Convert byte to word
10011000
2
2
CWD e Convert word to double word
10011001
4
4
2/15
2/15
LOGIC
Shift/Rotate Instructions:
Register/Memory by 1
1101000w
mod TTT r/m
Register/Memory by CL
1101001w
mod TTT r/m
Register/Memory by Count
1100000w
mod TTT r/m
5 a n/17 a n 5 a n/17 a n
count
5 a n/17 a n 5 a n/17 a n
TTT Instruction
000
ROL
001
ROR
010
RCL
011
RCR
1 0 0 SHL/SAL
101
SHR
111
SAR
AND e And:
Reg/memory and register to either
001000dw
mod reg r/m
Immediate to register/memory
1000000w
mod 1 0 0 r/m
data
Immediate to accumulator
0010010w
data
data if w e 1
data if w e 1
3/10
3/10*
4/16
4/16*
3/4
3/4*
3/10
3/10*
4/10
4/10*
3/4
3/4
3/10
3/10*
4/16
4/16*
3/4
3/4*
8/16-bit
TEST e And function to flags, no result:
Register/memory and register
1000010w
mod reg r/m
Immediate data and register/memory
1111011w
mod 0 0 0 r/m
data
Immediate data and accumulator
1010100w
data
data if w e 1
data if w e 1
8/16-bit
OR e Or:
Reg/memory and register to either
000010dw
mod reg r/m
Immediate to register/memory
1000000w
mod 0 0 1 r/m
data
Immediate to accumulator
0000110w
data
data if w e 1
data if w e 1
Shaded areas indicate instructions not available in 8086/8088 microsystems.
NOTE:
*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.
44
8/16-bit
80C186XL/80C188XL
INSTRUCTION SET SUMMARY (Continued)
Function
Format
80C186XL
Clock
Cycles
80C188XL
Clock
Cycles
3/10
3/10*
4/16
4/16*
3/4
3/4
3/10
3/10*
Comments
LOGIC (Continued)
XOR e Exclusive or:
Reg/memory and register to either
001100dw
mod reg r/m
Immediate to register/memory
1000000w
mod 1 1 0 r/m
data
Immediate to accumulator
0011010w
data
data if w e 1
NOT e Invert register/memory
1111011w
mod 0 1 0 r/m
data if w e 1
8/16-bit
STRING MANIPULATION
MOVS e Move byte/word
1010010w
14
14*
CMPS e Compare byte/word
1010011w
22
22*
SCAS e Scan byte/word
1010111w
15
15*
LODS e Load byte/wd to AL/AX
1010110w
12
12*
STOS e Store byte/wd from AL/AX
1010101w
10
10*
INS e Input byte/wd from DX port
0110110w
14
14
OUTS e Output byte/wd to DX port
0110111w
14
14
8 a 8n
8 a 8n*
Repeated by count in CX (REP/REPE/REPZ/REPNE/REPNZ)
MOVS e Move string
11110010
1010010w
CMPS e Compare string
1111001z
1010011w
5 a 22n
5 a 22n*
SCAS e Scan string
1111001z
1010111w
5 a 15n
5 a 15n*
LODS e Load string
11110010
1010110w
6 a 11n
6 a 11n*
STOS e Store string
11110010
1010101w
6 a 9n
6 a 9n*
INS e Input string
11110010
0110110w
8 a 8n
8 a 8n*
OUTS e Output string
11110010
0110111w
8 a 8n
8 a 8n*
CONTROL TRANSFER
CALL e Call:
Direct within segment
11101000
disp-low
Register/memory
indirect within segment
11111111
mod 0 1 0 r/m
Direct intersegment
10011010
disp-high
segment offset
15
19
13/19
17/27
23
31
38
54
14
14
segment selector
Indirect intersegment
11111111
mod 0 1 1 r/m
Short/long
11101011
disp-low
Direct within segment
11101001
disp-low
Register/memory
indirect within segment
11111111
mod 1 0 0 r/m
Direct intersegment
11101010
(mod
i
11)
JMP e Unconditional jump:
disp-high
segment offset
14
14
11/17
11/21
14
14
26
34
segment selector
Indirect intersegment
11111111
mod 1 0 1 r/m
(mod
i
11)
Shaded areas indicate instructions not available in 8086/8088 microsystems.
NOTE:
*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.
45
80C186XL/80C188XL
INSTRUCTION SET SUMMARY (Continued)
Function
Format
80C186XL
Clock
Cycles
80C188XL
Clock
Cycles
16
20
Comments
CONTROL TRANSFER (Continued)
RET e Return from CALL:
Within segment
11000011
Within seg adding immed to SP
11000010
Intersegment
11001011
Intersegment adding immediate to SP
11001010
data-low
25
33
JE/JZ e Jump on equal/zero
01110100
disp
4/13
4/13
JL/JNGE e Jump on less/not greater or equal
01111100
disp
4/13
4/13
JLE/JNG e Jump on less or equal/not greater
01111110
disp
4/13
4/13
JB/JNAE e Jump on below/not above or equal
01110010
disp
4/13
4/13
JBE/JNA e Jump on below or equal/not above
01110110
disp
4/13
4/13
JP/JPE e Jump on parity/parity even
01111010
disp
4/13
4/13
JO e Jump on overflow
01110 000
disp
4/13
4/13
JS e Jump on sign
01111000
disp
4/13
4/13
JNE/JNZ e Jump on not equal/not zero
01110101
disp
4/13
4/13
JNL/JGE e Jump on not less/greater or equal
01111101
disp
4/13
4/13
JNLE/JG e Jump on not less or equal/greater
01111111
disp
4/13
4/13
JNB/JAE e Jump on not below/above or equal
01110011
disp
4/13
4/13
JNBE/JA e Jump on not below or equal/above
01110111
disp
4/13
4/13
JNP/JPO e Jump on not par/par odd
01111011
disp
4/13
4/13
JNO e Jump on not overflow
01110001
disp
4/13
4/13
JNS e Jump on not sign
01111001
disp
4/13
4/13
data-low
data-high
data-high
18
22
22
30
JCXZ e Jump on CX zero
11100011
disp
5/15
5/15
LOOP e Loop CX times
11100010
disp
6/16
6/16
LOOPZ/LOOPE e Loop while zero/equal
11100001
disp
6/16
6/16
LOOPNZ/LOOPNE e Loop while not zero/equal
11100000
disp
6/16
6/16
ENTER e Enter Procedure
11001000
data-low
15
25
22 a 16(n b 1)
19
29
26 a 20(n b 1)
8
8
data-high
Le0
Le1
Ll1
LEAVE e Leave Procedure
11001001
JMP not
taken/JMP
taken
LOOP not
taken/LOOP
taken
L
INT e Interrupt:
Type specified
11001101
47
47
Type 3
11001100
type
45
45
if INT. taken/
INTO e Interrupt on overflow
11001110
48/4
48/4
if INT. not
taken
IRET e Interrupt return
11001111
BOUND e Detect value out of range
01100010
mod reg r/m
28
28
33–35
33–35
Shaded areas indicate instructions not available in 8086/8088 microsystems.
NOTE:
*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.
46
80C186XL/80C188XL
INSTRUCTION SET SUMMARY (Continued)
Function
Format
80C186XL
Clock
Cycles
80C188XL
Clock
Cycles
Comments
PROCESSOR CONTROL
CLC e Clear carry
11111000
2
2
CMC e Complement carry
11110101
2
2
STC e Set carry
11111001
2
2
CLD e Clear direction
11111100
2
2
STD e Set direction
11111101
2
2
CLI e Clear interrupt
11111010
2
2
STI e Set interrupt
11111011
2
2
HLT e Halt
11110100
2
2
WAIT e Wait
10011011
6
6
LOCK e Bus lock prefix
11110000
2
2
10010000
3
3
NOP e No Operation
if TEST e 0
(TTT LLL are opcode to processor extension)
Shaded areas indicate instructions not available in 8086/8088 microsystems.
NOTE:
*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.
The Effective Address (EA) of the memory operand
is computed according to the mod and r/m fields:
if mod e 11 then r/m is treated as a REG field
if mod e 00 then DISP e 0*, disp-low and disphigh are absent
if mod e 01 then DISP e disp-low sign-extended to 16-bits, disp-high is absent
if mod e 10 then DISP e disp-high: disp-low
e 000 then EA e (BX) a (SI) a DISP
if r/m
e 001 then EA e (BX) a (DI) a DISP
if r/m
e 010 then EA e (BP) a (SI) a DISP
if r/m
e 011 then EA e (BP) a (DI) a DISP
if r/m
e 100 then EA e (SI) a DISP
if r/m
e 101 then EA e (DI) a DISP
if r/m
e 110 then EA e (BP) a DISP*
if r/m
e 111 then EA e (BX) a DISP
if r/m
DISP follows 2nd byte of instruction (before data if
required)
*except if mod e 00 and r/m e 110 then EA e
disp-high: disp-low.
EA calculation time is 4 clock cycles for all modes,
and is included in the execution times given whenever appropriate.
Segment Override Prefix
0
0
1
reg
1
1
reg is assigned according to the following:
reg
00
01
10
11
Segment
Register
ES
CS
SS
DS
REG is assigned according to the following table:
16-Bit (w e 1)
8-Bit (w e 0)
000 AX
000 AL
001 CX
001 CL
010 DX
010 DL
011 BX
011 BL
100 SP
100 AH
101 BP
101 CH
110 SI
110 DH
111 DI
111 BH
The physical addresses of all operands addressed
by the BP register are computed using the SS segment register. The physical addresses of the destination operands of the string primitive operations
(those addressed by the DI register) are computed
using the ES segment, which may not be overridden.
0
47
80C186XL/80C188XL
REVISION HISTORY
This data sheet
# 272031-002
# 270975-002
# 272309-001
# 272310-001
replaces the following data sheets:
80C186XL
80C188XL
SB80C186XL
SB80C188XL
ERRATA
An A or B step 80C186XL/80C188XL has the following errata. The A or B step 80C186XL/80C188XL
can be identified by the presence of an ‘‘A’’ or ‘‘B’’
alpha character, respectively, next to the FPO number. The FPO number location is shown in Figure 4.
48
1. An internal condition with the interrupt controller
can cause no acknowledge cycle on the INTA1
line in response to INT1. This errata only occurs
when Interrupt 1 is configured in cascade mode
and a higher priority interrupt exists. This errata
will not occur consistently, it is dependent on interrupt timing.
The C step 80C186XL/80C188XL has no known errata. The C step can be identified by the presence of
a ‘‘C’’ or ‘‘D’’ alpha character next to the FPO number. The FPO number location is shown in Figure 4.
PRODUCT IDENTIFICATION
Intel 80C186XL devices are marked with a 9-character alphanumeric Intel FPO number underneath the
product number. This data sheet (272431-001) is
valid for devices with an ‘‘A’’, ‘‘B’’, ‘‘C’’, or ‘‘D’’ as
the ninth character in the FPO number, as illustrated
in Figure 4.