TI1 LM2594N-5.0/NOPB Simple switcher power converter 150-khz 0.5-a step-down voltage regulator Datasheet

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LM2594, LM2594HV
SNVS118D – DECEMBER 1999 – REVISED MAY 2016
LM2594, LM2594HV SIMPLE SWITCHER® Power Converter 150-kHz 0.5-A Step-Down
Voltage Regulator
1 Features
3 Description
•
•
The LM2594xx series of regulators are monolithic
integrated circuits that provide all the active functions
for a step-down (buck) switching regulator, capable of
driving a 0.5-A load with excellent line and load
regulation. These devices are available in fixed output
voltages of 3.3 V, 5 V, 12 V, and an adjustable output
version, and are packaged in a 8-pin PDIP and a 8pin surface-mount SOIC package.
1
•
•
•
•
•
•
•
•
•
•
3.3-V, 5-V, 12-V, and Adjustable Output Versions
Adjustable Version Output Voltage Range: 1.2 V
to 37 V (57 V for the HV Version), ±4% Maximum
Over Line and Load Conditions
Available in 8-Pin Surface-Mount SOIC and 8-Pin
PDIP Packages
Ensured 0.5-A Output Current
Input Voltage Range up to 60 V
Requires Only 4 External Components
150-kHz Fixed-Frequency Internal Oscillator
TTL Shutdown Capability
Low Power Standby Mode, IQ Typically 85 μA
High Efficiency
Uses Readily-Available Standard Inductors
Thermal Shutdown and Current-Limit Protection
2 Applications
•
•
•
•
Simple High-Efficiency Step-Down (Buck)
Regulator
Efficient Preregulator for Linear Regulators
On-Card Switching Regulators
Positive-to-Negative Convertor
Requiring a minimum number of external
components, these regulators are simple to use and
feature internal frequency compensation, a fixedfrequency oscillator, and improved line and load
regulation specifications.
The LM2594xx series operates at a switching
frequency of 150-kHz, thus allowing smaller-sized
filter components than what would be needed with
lower-frequency switching regulators. Because of its
high efficiency, the copper traces on the printedcircuit board are normally the only heat sinking
needed.
Device Information(1)
PART NUMBER
LM2597, LM2597HV
PACKAGE
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
PDIP (8)
9.81 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
Fixed Output Voltage Versions
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2594, LM2594HV
SNVS118D – DECEMBER 1999 – REVISED MAY 2016
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
4
4
4
4
5
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics – 3.3 V ..............................
Electrical Characteristics – 5 V .................................
Electrical Characteristics – 12 V ...............................
Electrical Characteristics – Adjustable......................
Electrical Characteristics – All Output Voltage
Versions .....................................................................
7.10 Typical Characteristics ............................................
8
6
7
Detailed Description ............................................ 10
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
10
10
10
14
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Applications ................................................ 22
10 Power Supply Recommendations ..................... 29
11 Layout................................................................... 30
11.1 Layout Guidelines ................................................. 30
11.2 Layout Example .................................................... 30
11.3 Thermal Considerations ........................................ 31
12 Device and Documentation Support ................. 33
12.1
12.2
12.3
12.4
12.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
33
33
33
33
33
13 Mechanical, Packaging, and Orderable
Information ........................................................... 33
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2013) to Revision D
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
•
Removed all references to design software Switchers Made Simple ................................................................................... 1
Changes from Revision B (April 2013) to Revision C
•
2
Page
Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 31
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5 Description (continued)
A standard series of inductors (both through-hole and surface-mount types) are available from several different
manufacturers optimized for use with the LM2594xx series. This feature greatly simplifies the design of switchmode power supplies.
Other features include an ensured ±4% tolerance on output voltage under all conditions of input voltage and
output load conditions, and ±15% on the oscillator frequency. External shutdown is included, featuring typically
85-μA standby current. Self-protection features include a two stage frequency reducing current limit for the output
switch and an overtemperature shutdown for complete protection under fault conditions.
The LM2594HV is for applications requiring an input voltage up to 60 V.
6 Pin Configuration and Functions
D or P Package
8-Pin SOIC or PDIP
Top View
NC
1
8
Output
NC
2
7
NC
3
6
+VIN
Ground
Feedback
4
5
ON/OFF
Not to scale
*No internal connection, but must be soldered to PCB for best heat transfer.
‡Patent Number 5,382,918.
Pin Functions (1)
PIN
NO.
NAME
1, 2, 3
4
I/O
DESCRIPTION
NC
—
No connection
Feedback
I
Senses the regulated output voltage to complete the feedback loop.
Allows the switching regulator circuit to be shut down using logic level signals, thus dropping
the total input supply current to approximately 80 μA. Pulling this pin below a threshold
voltage of approximately 1.3 V turns the regulator on, and pulling this pin above 1.3 V (up to
a maximum of 25 V) shuts the regulator down. If this shutdown feature is not needed, the
ON/OFF pin can be wired to the ground pin or it can be left open, in either case the regulator
is in the ON condition.
5
ON/OFF
I
6
Ground
—
7
+VIN
I
This is the positive input supply for the IC switching regulator. A suitable input bypass
capacitor must be present at this pin to minimize voltage transients and to supply the
switching currents needed by the regulator.
8
Output
O
Internal switch. The voltage at this pin switches between (+VIN − VSAT) and approximately
−0.5 V, with a duty cycle of VOUT/VIN. To minimize coupling to sensitive circuitry, the PCB
copper area connected to this pin must be kept to a minimum.
(1)
Circuit ground.
I = INPUT, O = OUTPUT
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7 Specifications
7.1 Absolute Maximum Ratings (1) (2)
MIN
Supply voltage
45
LM2594HV
60
ON/OFF pin input voltage
−0.3
Feedback pin voltage
−0.3
Output voltage to ground (steady state)
Power dissipation
D8 package
V
25
V
25
V
−1
V
Vapor phase (60 s)
215
Infrared (15 s)
220
P package (soldering, 10 s)
°C
260
Maximum junction temperature
−65
Storage temperature, Tstg
(2)
UNIT
Internally limited
Lead temperature
(1)
MAX
LM2594
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
7.2 ESD Ratings
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
The human-body model is a 100-pF capacitor discharged through a 1.5k resistor into each pin.
7.3 Recommended Operating Conditions
Supply voltage
MIN
MAX
LM2594
4.5
40
LM2594HV
4.5
60
V
−40
125
°C
Temperature
UNIT
V
7.4 Thermal Information
LM2594, LM2594HV
THERMAL METRIC
RθJA
(1)
(2)
(3)
4
(1)
Junction-to-ambient thermal resistance (2) (3)
D (SOIC)
P (PDIP)
8 PINS
8 PINS
150
95
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
The package thermal impedance is calculated in accordance to JESD 51-7.
Thermal resistances were simulated on a 4 -layer, JEDEC board.
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7.5 Electrical Characteristics – 3.3 V
Specifications are for TJ = 25°C, VINmax= 40 V for the LM2594 and 60 V for the LM2594HV (unless otherwise noted).
PARAMETER
SYSTEM PARAMETERS
(3)
Output voltage
4.75 V ≤ VIN ≤ VINmax,
0.1 A ≤ ILOAD ≤ 0.5 A
η
Efficiency
VIN = 12 V, ILOAD = 0.5 A
(3)
TYP (1)
MAX (2)
TJ = 25°C
3.432
3.3
3.168
Over full operating temperature
range
3.465
UNIT
(see Figure 35 for test circuit)
VOUT
(1)
(2)
MIN
TEST CONDITIONS
3.135
V
80%
Typical numbers are at 25°C and represent the most likely norm.
All limits ensured at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits at
temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator system performance. When the LM2594xx is used as shown in the Figure 35 test circuit, system performance is as
shown in the system parameters.
7.6 Electrical Characteristics – 5 V
Specifications are for TJ = 25°C (unless otherwise noted).
PARAMETER
SYSTEM PARAMETERS
TEST CONDITIONS
(3)
TJ = 25°C
Output voltage
7 V ≤ VIN ≤ VINmax,
0.1 A ≤ ILOAD ≤ 0.5 A
η
Efficiency
VIN = 12 V, ILOAD = 0.5 A
(3)
TYP (1)
4.8
5
MAX (2)
UNIT
(see Figure 35 for test circuit)
VOUT
(1)
(2)
MIN
Over full operating temperature range
4.75
5.2
5.25
V
82%
Typical numbers are at 25°C and represent the most likely norm.
All limits ensured at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits at
temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator system performance. When the LM2594xx is used as shown in the Figure 35 test circuit, system performance is as
shown in the system parameters.
7.7 Electrical Characteristics – 12 V
Specifications are for TJ = 25°C (unless otherwise noted).
PARAMETER
SYSTEM PARAMETERS
TEST CONDITIONS
(3)
Output voltage
15 V ≤ VIN ≤ VINmax,
0.1 A ≤ ILOAD ≤ 0.5 A
η
Efficiency
VIN = 25 V, ILOAD = 0.5 A
(3)
TYP (1)
MAX (2)
11.52
12
12.48
UNIT
(see Figure 35 for test circuit)
VOUT
(1)
(2)
MIN
TJ = 25°C
Over full operating temperature range
11.4
12.6
V
88%
Typical numbers are at 25°C and represent the most likely norm.
All limits ensured at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits at
temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator system performance. When the LM2594/LM2594HV is used as shown in the Figure 35 test circuit, system
performance is as shown in the system parameters.
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7.8 Electrical Characteristics – Adjustable
Specifications are for TJ = 25°C (unless otherwise noted).
PARAMETER
SYSTEM PARAMETERS
TEST CONDITIONS
(3)
Feedback voltage
4.5 V ≤ VIN ≤ VINmax,
0.1 A ≤ ILOAD ≤ 0.5 A,
VOUT programmed for 3 V,
Circuit of Figure 35
η
Efficiency
VIN = 12 V, ILOAD = 0.5 A
(3)
TYP (1)
MAX (2)
1.193
1.23
1.267
UNIT
(see Figure 35 for test circuit)
VFB
(1)
(2)
MIN
TJ = 25°C
Over full operating temperature range
1.18
1.28
V
80%
Typical numbers are at 25°C and represent the most likely norm.
All limits ensured at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits at
temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect
switching regulator system performance. When the LM2594/LM2594HV is used as shown in the Figure 35 test circuit, system
performance is as shown in the system parameters.
7.9 Electrical Characteristics – All Output Voltage Versions
Specifications are for TJ = 25°C, VIN = 12 V for the 3.3-V, 5-V, and adjustable version, and VIN = 24 V for the 12-V version,
ILOAD = 100 mA (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX (2)
UNIT
DEVICE PARAMETERS
Ib
Feedback bias current
Adjustable version only, VFB =
1.3 V
fO
Oscillator frequency
See (3)
VSAT
Saturation voltage
IOUT = 0.5 A (4) (5)
Max duty cycle (ON)
See (5)
Min duty cycle (OFF)
See (6)
DC
ICL
Current limit
Peak current (4) (5)
IL
Output leakage current
Output = 0 V (4) (6) (7)
Output = −1 V
IQ
Quiescent current
See (6)
TJ = 25°C
10
Over full operating temperature range
TJ = 25°C
127
Over full operating temperature range
110
TJ = 25°C
Standby quiescent
current
150
173
173
0.9
Over full operating temperature range
1.1
1.2
nA
kHz
V
100%
0%
TJ = 25°C
0.65
over full operating temperature range
0.58
ON/OFF pin = 5 V (OFF) (7)
ISTBY
50
100
LM2594
1.3
1.4
A
50
μA
2
15
mA
5
10
mA
85
μA
TJ = 25°C
200
Over full operating temperature range
250
TJ = 25°C
LM2594HV
0.8
140
Over full operating temperature range
250
300
μA
μA
ON/OFF CONTROL (see Figure 35 for test circuit)
ON/OFF pin logic input
VIH
VIL
IH
IL
(1)
(2)
(3)
(4)
(5)
(6)
(7)
6
Threshold voltage
ON/OFF pin input
current
1.3
Low (regulator ON), over full operating temperature range
High (regulator OFF), over full operating temperature range
V
0.6
V
5
15
μA
0.02
5
μA
2
VLOGIC = 2.5 V (regulator OFF)
VLOGIC = 0.5 V (regulator ON)
V
Typical numbers are at 25°C and represent the most likely norm.
All limits ensured at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits at
temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
The switching frequency is reduced when the second stage current limit is activated. The amount of reduction is determined by the
severity of current overload.
No diode, inductor or capacitor connected to output pin.
Feedback pin removed from output and connected to 0 V to force the output transistor switch ON.
Feedback pin removed from output and connected to 12 V for the 3.3-V, 5-V, and the adjustable version, and 15 V for the 12-V version,
to force the output transistor switch OFF.
VIN = 40 V for the LM2594 and 60 V for the LM2594HV.
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7.10 Typical Characteristics
Figure 1. Normalized Output Voltage
Figure 2. Line Regulation
Figure 3. Efficiency
Figure 4. Switch Saturation Voltage
Figure 5. Switch Current Limit
Figure 6. Dropout Voltage
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Typical Characteristics (continued)
8
Figure 7. Quiescent Current
Figure 8. Standby Quiescent Current
Figure 9. Minimum Operating Supply Voltage
Figure 10. ON/OFF Threshold Voltage
Figure 11. ON /OFF Pin Current (Sinking)
Figure 12. Switching Frequency
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Typical Characteristics (continued)
Figure 13. Feedback Pin Bias Current
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8 Detailed Description
8.1 Overview
The LM2594 SIMPLE SWITCHER® regulator is an easy-to-use, nonsynchronous step-down DC-DC converter
with a wide input voltage range from 45 V to up to 60 V for a HV version. The regulator is capable of delivering
up to 0.5-A DC load current with excellent line and load regulation. These devices are available in fixed output
voltages of 3.3-V, 5-V, 12-V, and an adjustable output version. The family requires few external components, and
the pin arrangement was designed for simple, optimum PCB layout.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Delayed Start-Up
The circuit in Figure 14 uses the ON/OFF pin to provide a time delay between the time the input voltage is
applied and the time the output voltage comes up (only the circuitry pertaining to the delayed start-up is shown).
As the input voltage rises, the charging of capacitor C1 pulls the ON/OFF pin high, keeping the regulator off.
Once the input voltage reaches its final value and the capacitor stops charging, the resistor R2 pulls the ON/OFF
pin low, thus allowing the circuit to start switching. Resistor R1 is included to limit the maximum voltage applied to
the ON/OFF pin (maximum of 25 V), reduces power supply noise sensitivity, and also limits the capacitor, C1,
discharge current. When high input ripple voltage exists, avoid long delay time, because this ripple can be
coupled into the ON/OFF pin and cause problems.
This delayed start-up feature is useful in situations where the input power source is limited in the amount of
current it can deliver. It allows the input voltage to rise to a higher voltage before the regulator starts operating.
Buck regulators require less input current at higher input voltages.
10
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Feature Description (continued)
Figure 14. Delayed Start-Up
8.3.2 Undervoltage Lockout
Some applications require the regulator to remain off until the input voltage reaches a predetermined voltage.
Figure 15 shows an undervoltage lockout feature applied to a buck regulator, while Figure 16 and Figure 17
apply the same feature to an inverting circuit. The circuit in Figure 16 features a constant threshold voltage for
turnon and turnoff (Zener voltage plus approximately 1 V). If hysteresis is needed, the circuit in Figure 17 has a
turnon voltage which is different than the turnoff voltage. The amount of hysteresis is approximately equal to the
value of the output voltage. If Zener voltages greater than 25 V are used, an additional 47-kΩ resistor is needed
from the ON/OFF pin to the ground pin to stay within the 25 V maximum limit of the ON/OFF pin.
Figure 15. Undervoltage Lockout
for Buck Regulator
8.3.3 Inverting Regulator
The circuit in Figure 18 converts a positive input voltage to a negative output voltage with a common ground. The
circuit operates by bootstrapping the regulators ground pin to the negative output voltage, then grounding the
feedback pin, the regulator senses the inverted output voltage and regulates it.
This circuit has an ON/OFF threshold of approximately 13 V.
Figure 16. Undervoltage Lockout for Inverting Regulator
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Feature Description (continued)
This circuit has hysteresis
Regulator starts switching at VIN = 13 V
Regulator stops switching at VIN = 8 V
Figure 17. Undervoltage Lockout With Hysteresis for Inverting Regulator
CIN — 68-μF, 25-V Tant. Sprague 595D
120-μF, 35-V Elec. Panasonic HFQ
COUT — 22-μF, 20-V Tant. Sprague 595D
39-μF, 16-V Elec. Panasonic HFQ
Figure 18. Inverting −5-V Regulator With Delayed Start-Up
This example uses the LM2594-5 to generate a −5-V output, but other output voltages are possible by selecting
other output voltage versions, including the adjustable version. Because this regulator topology can produce an
output voltage that is either greater than or less than the input voltage, the maximum output current greatly
depends on both the input and output voltage. Figure 19 provides a guide as to the amount of output load current
possible for the different input and output voltage conditions.
The maximum voltage appearing across the regulator is the absolute sum of the input and output voltage, and
this must be limited to a maximum of 40 V. For example, when converting 20 V to −12 V, the regulator would see
32 V between the input pin and ground pin. The LM2594 has a maximum input voltage specification of 40 V (60
V for the LM2594HV).
Additional diodes are required in this regulator configuration. Diode D1 is used to isolate input voltage ripple or
noise from coupling through the CIN capacitor to the output, under light or no load conditions. Also, this diode
isolation changes the topology to closely resemble a buck configuration thus providing good closed loop stability.
TI recommends a Schottky diode for low input voltages (because of its lower voltage drop), but for higher input
voltages, a fast recovery diode could be used.
Without diode D3, when the input voltage is first applied, the charging current of CIN can pull the output positive
by several volts for a short period of time. Adding D3 prevents the output from going positive by more than a
diode voltage.
12
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Feature Description (continued)
Figure 19. Inverting Regulator Typical Load Current
Because of differences in the operation of the inverting regulator, the standard design procedure is not used to
select the inductor value. In the majority of designs, a 100-μH, 1-A inductor is the best choice. Capacitor
selection can also be narrowed down to just a few values. Using the values shown in Figure 18 provides good
results in the majority of inverting designs.
This type of inverting regulator can require relatively large amounts of input current when starting up, even with
light loads. Input currents as high as the LM2594 current limit (approximately 0.8 A) are needed for at least 2 ms
or more, until the output reaches its nominal output voltage. The actual time depends on the output voltage and
the size of the output capacitor. Input power sources that are current limited or sources that can not deliver these
currents without getting loaded down, may not work correctly. Because of the relatively high start-up currents
required by the inverting topology, the delayed start-up feature (C1, R1 and R2) shown in Figure 18 is
recommended. By delaying the regulator start-up, the input capacitor is allowed to charge up to a higher voltage
before the switcher begins operating. A portion of the high input current needed for start-up is now supplied by
the input capacitor (CIN). For severe start-up conditions, the input capacitor can be made much larger than
normal.
8.3.4 Inverting Regulator Shutdown Methods
To use the ON/OFF pin in a standard buck configuration is simple; pull it below 1.3 V (at 25°C, referenced to
ground) to turn regulator ON and pull it above 1.3 V to shut the regulator OFF. With the inverting configuration,
some level shifting is required, because the ground pin of the regulator is no longer at ground, but is now setting
at the negative output voltage level. Two different shutdown methods for inverting regulators are shown in
Figure 20 and Figure 21.
Figure 20. Inverting Regulator Ground Referenced Shutdown
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Feature Description (continued)
Figure 21. Inverting Regulator Ground Referenced Shutdown Using Opto Device
8.4 Device Functional Modes
8.4.1 Discontinuous Mode Operation
The selection guide chooses inductor values suitable for continuous mode operation, but for low current
applications and high input voltages, a discontinuous mode design may be a better choice. Discontinuous mode
would use an inductor that is physically smaller, and would need only one half to one third of the inductance
value needed for a continuous mode design. The peak switch and inductor currents are higher in a discontinuous
design, but at these low load currents (200 mA and below), the maximum switch current is still less than the
switch current limit.
Discontinuous operation can have voltage waveforms that are considerably different than a continuous design.
The output pin (switch) waveform can have some damped sinusoidal ringing present (see Figure 33). This
ringing is normal for discontinuous operation, and is not caused by feedback loop instabilities. In discontinuous
operation, there is a period of time where neither the switch nor the diode are conducting, and the inductor
current has dropped to zero. During this time, a small amount of energy can circulate between the inductor and
the switch or diode parasitic capacitance causing this characteristic ringing. Normally this ringing is not a
problem, unless the amplitude becomes great enough to exceed the input voltage, and even then, there is very
little energy present to cause damage.
Different inductor types and core materials produce different amounts of this characteristic ringing. Ferrite core
inductors have very little core loss and therefore produce the most ringing. The higher core loss of powdered iron
inductors produce less ringing. If desired, a series RC could be placed in parallel with the inductor to dampen the
ringing.
Figure 22. Post Ripple Filter Waveform
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Input Capacitor (CIN)
A low ESR aluminum or tantalum bypass capacitor is required between the input pin and ground pin. The
capacitor must be located near the regulator using short leads. This capacitor prevents large voltage transients
from appearing at the input, and provides the instantaneous current needed each time the switch turns on.
The important parameters for the input capacitor are the voltage rating and the RMS current rating. Because of
the relatively high RMS currents flowing in the input capacitor of the buck regulator, this capacitor must be
chosen for its RMS current rating rather than its capacitance or voltage ratings, although the capacitance value
and voltage rating are directly related to the RMS current rating.
The RMS current rating of a capacitor could be viewed as a power rating of the capacitor. The RMS current
flowing through the capacitors internal ESR produces power which causes the internal temperature of the
capacitor to rise. The RMS current rating of a capacitor is determined by the amount of current required to raise
the internal temperature approximately 10°C above an ambient temperature of 105°C. The ability of the capacitor
to dissipate this heat to the surrounding air determines the amount of current the capacitor can safely sustain.
Capacitors that are physically large and have a large surface area typically has a higher RMS current ratings. For
a given capacitor value, a higher voltage electrolytic capacitor is physically larger than a lower voltage capacitor,
and thus be able to dissipate more heat to the surrounding air, and therefore has a higher RMS current rating.
The consequences of operating an electrolytic capacitor above the RMS current rating is a shortened operating
life. The higher temperature speeds up the evaporation of the electrolyte of the capacitor, resulting in eventual
failure.
Selecting an input capacitor requires consulting the manufacturers data sheet for maximum allowable RMS ripple
current. For a maximum ambient temperature of 40°C, a general guideline would be to select a capacitor with a
ripple current rating of approximately 50% of the DC load current. For ambient temperatures up to 70°C, a
current rating of 75% of the DC load current would be a good choice for a conservative design. The capacitor
voltage rating must be at least 1.25 times greater than the maximum input voltage, and often a much higher
voltage capacitor is needed to satisfy the RMS current requirements.
Figure 23 shows the relationship between an electrolytic capacitor value, its voltage rating, and the RMS current
it is rated for. These curves were obtained from the Nichicon PL series of low-ESR, high-reliability electrolytic
capacitors designed for switching regulator applications. Other capacitor manufacturers offer similar types of
capacitors, but always check the capacitor data sheet.
Standard electrolytic capacitors typically have much higher ESR numbers, lower RMS current ratings and
typically have a shorter operating lifetime.
Because of their small size and excellent performance, surface-mount solid tantalum capacitors are often used
for input bypassing, but several precautions must be observed. A small percentage of solid tantalum capacitors
can short if the inrush current rating is exceeded. This can happen at turnon when the input voltage is suddenly
applied, and of course, higher input voltages produce higher inrush currents. Several capacitor manufacturers do
a 100% surge current testing on their products to minimize this potential problem. If high turnon currents are
expected, it may be necessary to limit this current by adding either some resistance or inductance before the
tantalum capacitor, or select a higher voltage capacitor. As with aluminum electrolytic capacitors, the RMS ripple
current rating must be sized to the load current.
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Application Information (continued)
Figure 23. RMS Current Ratings for Low-ESR Electrolytic Capacitors (Typical)
9.1.2 Output Capacitor (COUT)
An output capacitor is required to filter the output and provide regulator loop stability. Low impedance or low ESR
Electrolytic or solid tantalum capacitors designed for switching regulator applications must be used. When
selecting an output capacitor, the important capacitor parameters are; the 100-kHz Equivalent Series Resistance
(ESR), the RMS ripple current rating, voltage rating, and capacitance value. For the output capacitor, the ESR
value is the most important parameter.
The output capacitor requires an ESR value that has an upper and lower limit. For low output ripple voltage, a
low ESR value is needed. This value is determined by the maximum allowable output ripple voltage, typically 1%
to 2% of the output voltage. But if the ESR of the selected capacitor is extremely low, there is a possibility of an
unstable feedback loop, resulting in an oscillation at the output. Using the capacitors listed in the tables, or
similar types, provides design solutions under all conditions.
If very low output ripple voltage (less than 15 mV) is required, see Output Voltage Ripple and Transients for a
post-ripple filter.
An aluminum electrolytic capacitor's ESR value is related to the capacitance value and its voltage rating. In most
cases, Higher voltage electrolytic capacitors have lower ESR values (see Figure 24). Often, capacitors with much
higher voltage ratings may be needed to provide the low ESR values required for low output ripple voltage.
The output capacitor for many different switcher designs often can be satisfied with only three or four different
capacitor values and several different voltage ratings. See Figure 30 and Table 7 for typical capacitor values,
voltage ratings, and manufacturers capacitor types.
Electrolytic capacitors are not recommended for temperatures below −25°C. The ESR rises dramatically at cold
temperatures and typically rises three times at −25°C and as much as ten times at −40°C (see Figure 25).
Solid tantalum capacitors have a much better ESR specifications for cold temperatures and are recommended
for temperatures below −25°C.
Figure 24. Capacitor ESR vs Capacitor Voltage Rating (Typical Low-ESR Electrolytic Capacitor)
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Application Information (continued)
Table 1. Output Capacitor and Feedforward Capacitor Selection Table
THROUGH-HOLE OUTPUT CAPACITOR
OUTPUT
VOLTAGE
(V)
PANASONIC HFQ
SERIES (µF/V)
NICHICON PL
SERIES (µF/V)
1.2
220/25
4
180/25
6
9
SURFACE-MOUNT OUTPUT CAPACITOR
FEEDFORWARD
CAPACITOR
AVX TPS SERIES
(µF/V)
SPRAGUE 595D
SERIES (µF/V)
FEEDFORWARD
CAPACITOR
220/25
0
220/10
220/10
0
180/25
4.7 nF
100/10
120/10
4.7 nF
82/25
82/25
4.7 nF
100/10
120/10
4.7 nF
82/25
82/25
3.3 nF
100/16
100/16
3.3 nF
12
82/25
82/25
2.2 nF
100/16
100/16
2.2 nF
15
82/25
82/25
1.5 nF
68/20
100/20
1.5 nF
24
82/50
120/50
1 nF
10/35
15/35
220 pF
28
82/50
120/50
820 pF
10/35
15/35
220 pF
9.1.3 Catch Diode
Buck regulators require a diode to provide a return path for the inductor current when the switch turns off. This
must be a fast diode and must be located close to the LM2594 using short leads and short printed-circuit traces.
Because of their very fast switching speed and low forward voltage drop, Schottky diodes provide the best
performance, especially in low output voltage applications (5 V and lower). Ultra-fast recovery, or high-efficiency
rectifiers are also a good choice, but some types with an abrupt turnoff characteristic may cause instability or
EMI problems. Ultra-fast recovery diodes typically have reverse recovery times of 50 ns or less. Rectifiers such
as the 1N4001 series are much too slow and must not be used.
Figure 25. Capacitor ESR Change vs Temperature
Table 2. Diode Selection Table
1-A DIODES
VR
SURFACE MOUNT
SCHOTTKY
ULTRA FAST RECOVERY
THROUGH HOLE
SCHOTTKY
ULTRA FAST RECOVERY
1N5817
20 V
SR102
MBRS130
All of these diodes are rated to
at least 60 V.
30 V
1N5818
All of these diodes are rated to
at least 60 V.
SR103
11DQ03
40 V
50 V
or
more
MBRS140
MURS120
1N5819
MUR120
10BQ040
10BF10
SR104
HER101
10MQ040
11DQ04
11DF1
MBRS160
SR105
10BQ050
MBR150
10MQ060
11DQ05
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Table 2. Diode Selection Table (continued)
1-A DIODES
VR
SURFACE MOUNT
SCHOTTKY
ULTRA FAST RECOVERY
THROUGH HOLE
SCHOTTKY
MBRS1100
MBR160
10MQ090
SB160
SGL41-60
11DQ10
ULTRA FAST RECOVERY
SS16
9.1.4 Inductor Selection
All switching regulators have two basic modes of operation: continuous and discontinuous. The difference
between the two types relates to the inductor current, whether it is flowing continuously, or if it drops to zero for a
period of time in the normal switching cycle. Each mode has distinctively different operating characteristics,
which can affect the regulators performance and requirements. Most switcher designs operates in the
discontinuous mode when the load current is low.
The LM2594 (or any of the SIMPLE SWITCHER family) can be used for both continuous or discontinuous modes
of operation.
In many cases the preferred mode of operation is the continuous mode. This mode offers greater output power,
lower peak switch, inductor, and diode currents, and can have lower output ripple voltage. However, the
continuous mode requires larger inductor values to keep the inductor current flowing continuously, especially at
low output load currents and high input voltages.
To simplify the inductor selection process, an inductor selection guide (nomograph) was designed (see Figure 27
through Figure 30). This guide assumes that the regulator is operating in the continuous mode, and selects an
inductor that allows a peak-to-peak inductor ripple current to be a certain percentage of the maximum design
load current. This peak-to-peak inductor ripple current percentage is not fixed, but is allowed to change as
different design load currents are selected. (See Figure 26.)
Figure 26. (ΔIIND) Peak-to-Peak Inductor Ripple Current
(as a Percentage of the Load Current) vs Load Current
By allowing the percentage of inductor ripple current to increase for low load currents, the inductor value and size
can be kept relatively low.
When operating in the continuous mode, the inductor current waveform ranges from a triangular to a sawtooth
type of waveform (depending on the input voltage), with the average value of this current waveform equal to the
DC output load current.
Inductors are available in different styles such as pot core, toroid, E-core, bobbin core, and so forth, as well as
different core materials, such as ferrites and powdered iron. The least expensive, the bobbin, rod or stick core,
consists of wire wrapped on a ferrite bobbin. This type of construction makes for a inexpensive inductor;
however, because the magnetic flux is not completely contained within the core, it generates more ElectroMagnetic Interference (EMl). This magnetic flux can induce voltages into nearby printed-circuit traces, thus
causing problems with both the switching regulator operation and nearby sensitive circuitry, and can give
incorrect scope readings because of induced voltages in the scope probe (see Open Core Inductors).
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The inductors listed in the selection chart include ferrite E-core construction for Schott ferrite bobbin core for
Renco and Coilcraft, and powdered iron toroid for Pulse Engineering.
Exceeding the maximum current rating of the inductor may cause the inductor to overheat because of the copper
wire losses, or the core may saturate. If the inductor begins to saturate, the inductance decreases rapidly and the
inductor begins to look mainly resistive (the DC resistance of the winding). This can cause the switch current to
rise very rapidly and force the switch into a cycle-by-cycle current limit, thus reducing the DC output load current.
This can also result in overheating of the inductor and the LM2594. Different inductor types have different
saturation characteristics, and this must be kept in mind when selecting an inductor.
The inductor manufacturers data sheets include current and energy limits to avoid inductor saturation.
For continuous mode operation, see the inductor selection graphs in Figure 27 through Figure 30.
Figure 27. LM2594xx 3.3-V
Figure 28. LM2594xx 5-V
Figure 29. LM2594xx 12-V
Figure 30. LM2594xx Adjustable Voltage
Table 3. Inductor Manufacturers Part Numbers
INDUCTANCE
(μH)
CURRENT
(A)
L1
220
L2
150
L3
SCHOTTKY
RENCO
PULSE ENGINEERING
COILCRAFT
THROUGH
HOLE
SURFACE
MOUNT
THROUGH
HOLE
SURFACE
MOUNT
THROUGH
HOLE
SURFACE
MOUNT
SURFACE
MOUNT
0.18
67143910
67144280
RL-5470-3
RL1500-220
PE-53801
PE-53801-S
DO1608-224
0.21
67143920
67144290
RL-5470-4
RL1500-150
PE-53802
PE-53802-S
DO1608-154
100
0.26
67143930
67144300
RL-5470-5
RL1500-100
PE-53803
PE-53803-S
DO1608-104
L4
68
0.32
67143940
67144310
RL-1284-68
RL1500-68
PE-53804
PE-53804-S
DO1608-68
L5
47
0.37
67148310
67148420
RL-1284-47
RL1500-47
PE-53805
PE-53805-S
DO1608-473
L6
33
0.44
67148320
67148430
RL-1284-33
RL1500-33
PE-53806
PE-53806-S
DO1608-333
L7
22
0.60
67148330
67148440
RL-1284-22
RL1500-22
PE-53807
PE-53807-S
DO1608-223
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Table 3. Inductor Manufacturers Part Numbers (continued)
INDUCTANCE
(μH)
CURRENT
(A)
L8
330
L9
220
L10
SCHOTTKY
RENCO
PULSE ENGINEERING
COILCRAFT
THROUGH
HOLE
SURFACE
MOUNT
THROUGH
HOLE
SURFACE
MOUNT
THROUGH
HOLE
SURFACE
MOUNT
SURFACE
MOUNT
0.26
67143950
67144320
RL-5470-2
RL1500-330
PE-53808
PE-53808-S
DO3308-334
0.32
67143960
67144330
RL-5470-3
RL1500-220
PE-53809
PE-53809-S
DO3308-224
150
0.39
67143970
67144340
RL-5470-4
RL1500-150
PE-53810
PE-53810-S
DO3308-154
L11
100
0.48
67143980
67144350
RL-5470-5
RL1500-100
PE-53811
PE-53811-S
DO3308-104
L12
68
0.58
67143990
67144360
RL-5470-6
RL1500-68
PE-53812
PE-53812-S
DO1608-683
L13
47
0.70
67144000
67144380
RL-5470-7
RL1500-47
PE-53813
PE-53813-S
DO3308-473
L14
33
0.83
67148340
67148450
RL-1284-33
RL1500-33
PE-53814
PE-53814-S
DO1608-333
L15
22
0.99
67148350
67148460
RL-1284-22
RL1500-22
PE-53815
PE-53815-S
DO1608-223
L16
15
1.24
67148360
67148470
RL-1284-15
RL1500-15
PE-53816
PE-53816-S
DO1608-153
L17
330
0.42
67144030
67144410
RL-5471-1
RL1500-330
PE-53817
PE-53817-S
DO3316-334
L18
220
0.55
67144040
67144420
RL-5471-2
RL1500-220
PE-53818
PE-53818-S
DO3316-224
L19
150
0.66
67144050
67144430
RL-5471-3
RL1500-150
PE-53819
PE-53819-S
DO3316-154
L20
100
0.82
67144060
67144440
RL-5471-4
RL1500-100
PE-53820
PE-53820-S
DO3316-104
L21
68
0.99
67144070
67144450
RL-5471-5
RL1500-68
PE-53821
PE-53821-S
DDO3316-683
L26
330
0.80
67144100
67144480
RL-5471-1
—
PE-53826
PE-53826-S
—
L27
220
1.00
67144110
67144490
RL-5471-2
—
PE-53827
PE-53827-S
—
9.1.5 Output Voltage Ripple and Transients
The output voltage of a switching power supply operating in the continuous mode contains a sawtooth ripple
voltage at the switcher frequency, and may also contain short voltage spikes at the peaks of the sawtooth
waveform.
The output ripple voltage is a function of the inductor sawtooth ripple current and the ESR of the output
capacitor. A typical output ripple voltage can range from approximately 0.5% to 3% of the output voltage. To
obtain low ripple voltage, the ESR of the output capacitor must be low; however, caution must be exercised when
using extremely low ESR capacitors because they can affect the loop stability, resulting in oscillation problems. If
very low output ripple voltage is needed (less than 15 mV), TI recommends a post ripple filter (see Figure 35).
The inductance required is typically between 1 μH and 5 μH, with low DC resistance, to maintain good load
regulation. A low ESR output filter capacitor is also required to assure good dynamic load response and ripple
reduction. The ESR of this capacitor may be as low as desired, because it is out of the regulator feedback loop.
Figure 22 shows a typical output ripple voltage, with and without a post ripple filter.
When observing output ripple with a scope, it is essential that a short, low inductance scope probe ground
connection be used. Most scope probe manufacturers provide a special probe terminator which is soldered onto
the regulator board, preferably at the output capacitor. This provides a very short scope ground, thus eliminating
the problems associated with the 3 inch ground lead normally provided with the probe, and provides a much
cleaner and more accurate picture of the ripple voltage waveform.
The voltage spikes are caused by the fast switching action of the output switch and the diode, the parasitic
inductance of the output filter capacitor, and its associated wiring. To minimize these voltage spikes, the output
capacitor must be designed for switching regulator applications, and the lead lengths must be kept very short.
Wiring inductance, stray capacitance, as well as the scope probe used to evaluate these transients, all contribute
to the amplitude of these spikes.
When a switching regulator is operating in the continuous mode, the inductor current waveform ranges from a
triangular to a sawtooth type of waveform (depending on the input voltage). For a given input and output voltage,
the peak-to-peak amplitude of this inductor current waveform remains constant. As the load current increases or
decreases, the entire sawtooth current waveform also rises and falls. The average value (or the center) of this
current waveform is equal to the DC load current.
If the load current drops to a low enough level, the bottom of the sawtooth current waveform reaches zero, and
the switcher smoothly changes from a continuous to a discontinuous mode of operation. Most switcher designs
(regardless how large the inductor value is) is forced to run discontinuous if the output is lightly loaded. This is a
perfectly acceptable mode of operation.
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Figure 31. Peak-to-Peak Inductor
Ripple Current vs Load Current
In a switching regulator design, knowing the value of the peak-to-peak inductor ripple current (ΔIIND) can be
useful for determining a number of other circuit parameters. Parameters such as, peak inductor or peak switch
current, minimum load current before the circuit becomes discontinuous, output ripple voltage and output
capacitor ESR can all be calculated from the peak-to-peak ΔIIND. When the inductor nomographs shown in
Figure 27 through Figure 30 are used to select an inductor value, the peak-to-peak inductor ripple current can
immediately be determined. Figure 31 shows the range of (ΔIIND) that can be expected for different load currents.
Figure 31 also shows how the peak-to-peak inductor ripple current (ΔIIND) changes as the designer goes from the
lower border to the upper border (for a given load current) within an inductance region. The upper border
represents a higher input voltage, while the lower border represents a lower input voltage (see Inductor
Selection).
These curves are only correct for continuous mode operation, and only if the inductor selection guides are used
to select the inductor value
Consider the following example:
VOUT = 5 V, maximum load current of 300 mA
VIN = 15 V, nominal, varying between 11 V and 20 V.
The selection guide in Figure 28 shows that the vertical line for a 0.3-A load current and the horizontal line for the
15-V input voltage intersect approximately midway between the upper and lower borders of the 150-μH
inductance region. A 150-μH inductor allows a peak-to-peak inductor current (ΔIIND) to flow a percentage of the
maximum load current. Referring to Figure 31, follow the 0.3-A line approximately midway into the inductance
region, and read the peak-to-peak inductor ripple current (ΔIIND) on the left hand axis (approximately 150 mAp-p).
As the input voltage increases to 20 V, it approaches the upper border of the inductance region, and the inductor
ripple current increases. Figure 31 shows that for a load current of 0.3 A, the peak-to-peak inductor ripple current
(ΔIIND) is 150 mA with 15V in, and can range from 175 mA at the upper border (20 V in) to 120 mA at the lower
border (11 V in).
Once the ΔIIND value is known, the following formulas can be used to calculate additional information about the
switching regulator circuit.
1. Peak Inductor or peak switch current
2. Minimum load current before the circuit becomes discontinuous
3. Output Ripple Voltage
–
= (ΔIIND) × (ESR of COUT)
–
= 0.150 A × 0.240 Ω = 36 mVp-p
– or
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4. ESR of COUT
9.1.6 Open Core Inductors
Another possible source of increased output ripple voltage or unstable operation is from an open core inductor.
Ferrite bobbin or stick inductors have magnetic lines of flux flowing through the air from one end of the bobbin to
the other end. These magnetic lines of flux induces a voltage into any wire or PCB copper trace that comes
within the inductor's magnetic field. The strength of the magnetic field, the orientation and location of the PC
copper trace to the magnetic field, and the distance between the copper trace and the inductor, determine the
amount of voltage generated in the copper trace. Another way of looking at this inductive coupling is to consider
the PCB copper trace as one turn of a transformer (secondary) with the inductor winding as the primary. Many
millivolts can be generated in a copper trace located near an open core inductor which can cause stability
problems or high output ripple voltage problems.
If unstable operation is seen, and an open core inductor is used, it is possible that the location of the inductor
with respect to other PC traces may be the problem. To determine if this is the problem, temporarily raise the
inductor away from the board by several inches and then check circuit operation. If the circuit now operates
correctly, then the magnetic flux from the open core inductor is causing the problem. Substituting a closed core
inductor such as a torroid or E-core corrects the problem, or re-arranging the PC layout may be necessary.
Magnetic flux cutting the IC device ground trace, feedback trace, or the positive or negative traces of the output
capacitor must be minimized.
Sometimes, locating a trace directly beneath a bobbin inductor provides good results, provided it is exactly in the
center of the inductor (because the induced voltages cancel themselves out), but if it is off center one direction or
the other, then problems could arise. If flux problems are present, even the direction of the inductor winding can
make a difference in some circuits.
This discussion on open core inductors is not to frighten the user, but to alert the user on what kind of problems
to watch out for when using them. Open core bobbin or stick inductors are an inexpensive, simple way of making
a compact efficient inductor, and they are used by the millions in many different applications.
9.2 Typical Applications
9.2.1 Series Buck Regulator (Fixed Output)
Select components with higher voltage ratings for designs using the LM2594HV with an input voltage between 40
V and 60 V.
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CIN — 68-μF, 35-V, Aluminum Electrolytic Nichicon “PL Series”
COUT — 120-μF, 25-V Aluminum Electrolytic, Nichicon “PL Series”
D1 — 1-A, 40-V Schottky Rectifier, 1N5819
L1 — 100-μH, L20
Figure 32. Fixed Output Voltage Versions
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Typical Applications (continued)
9.2.1.1 Design Requirements
Table 4 lists the design parameters of this example.
Table 4. Design Parameters
PARAMETER
EXAMPLE VALUE
Regulated output voltage (3.3-V, 5-V or 12-V), VOUT
5V
Maximum DC input voltage, VIN(max)
12 V
Maximum load current, ILOAD(max)
0.4 A
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Inductor Selection (L1)
1. Select the correct inductor value selection guide from Figure 27, Figure 28, or Figure 29 (output voltages of
3.3 V, 5 V, or 12 V respectively). For all other voltages, see Detailed Design Procedure for the adjustable
version.
Use the inductor selection guide for the 5-V version shown in Figure 28.
2. From the inductor value selection guide, identify the inductance region intersected by the maximum input
voltage line and the maximum load current line. Each region is identified by an inductance value and an
inductor code (LXX).
From the inductor value selection guide shown in Figure 28, the inductance region intersected by the 12-V
horizontal line and the 0.4-A vertical line is 100 μH, and the inductor code is L20.
3. Select an appropriate inductor from the four manufacturer's part numbers listed in Table 3.
The inductance value required is 100 μH. See row L20 of Table 3 and choose an inductor part number from
any of the four manufacturers shown. (In most instance, both through-hole and surface-mount inductors are
available.)
9.2.1.2.2 Output Capacitor Selection (COUT)
1. In the majority of applications, low ESR (Equivalent Series Resistance) electrolytic capacitors between 82 μF
and 220 μF and low-ESR, solid tantalum capacitors between 15 μF and 100 μF provide the best results. This
capacitor must be located close to the IC using short capacitor leads and short copper traces. Do not use
capacitors larger than 220 μF. For additional information, see Output Capacitor (COUT).
2. To simplify the capacitor selection procedure, see Figure 30 for quick design component selection. This table
contains different input voltages, output voltages, and load currents, and lists various inductors and output
capacitors that provides the best design solutions.
From Figure 30, locate the 5-V output voltage section. In the load current column, choose the load current
line that is closest to the current required for the application; for this example, use the 0.5-A line. In the
maximum input voltage column, select the line that covers the input voltage required for the application; in
this example, use the 15-V line. The rest of this line shows the recommended inductors and capacitors that
provides the best overall performance.
The capacitor list contains both through hole electrolytic and surface mount tantalum capacitors from four
different capacitor manufacturers. TI recommends using both the manufacturers and the manufacturer's
series that are listed in Table 5.
In this example aluminum electrolytic capacitors from several different manufacturers are available with the
range of ESR numbers needed:
120-μF, 2-5V Panasonic HFQ Series
120-μF, 2-5V Nichicon PL Series
3. The capacitor voltage rating for electrolytic capacitors must be at least 1.5 times greater than the output
voltage, and often require much higher voltage ratings to satisfy the low ESR requirements for low output
ripple voltage.
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For a 5-V output, a capacitor voltage rating at least 7.5 V or more is required. But, in this example, even a
low ESR, switching grade, 120-μF, 10-V aluminum electrolytic capacitor would exhibit approximately 400 mΩ
of ESR (see Figure 24 for the ESR vs voltage rating). This amount of ESR would result in relatively high
output ripple voltage. To reduce the ripple to 1% of the output voltage, or less, a capacitor with a higher
voltage rating (lower ESR) must be selected. A 16-V or 25-V capacitor reduces the ripple voltage by
approximately half.
9.2.1.2.3 Catch Diode Selection (D1)
1. The catch diode current rating must be at least 1.3 times greater than the maximum load current. Also, if the
power supply design must withstand a continuous output short, the diode must have a current rating equal to
the maximum current limit of the LM2594. The most stressful condition for this diode is an overload or
shorted output condition.
See Table 2. In this example, a 1-A, 20-V, 1N5817 Schottky diode provides the best performance, and will
not be overstressed even for a shorted output.
2. The reverse voltage rating of the diode must be at least 1.25 times the maximum input voltage.
3. This diode must be fast (short reverse recovery time) and must be located close to the LM2594 using short
leads and short printed circuit traces. Because of their fast switching speed and low forward voltage drop,
Schottky diodes provide the best performance and efficiency, and must be the first choice, especially in low
output voltage applications. Ultra-fast recovery, or high-efficiency rectifiers also provide good results. Ultrafast recovery diodes typically have reverse recovery times of 50 ns or less. Rectifiers such as the 1N4001
must not be used because they are too slow.
9.2.1.2.4 Input Capacitor (CIN)
A low ESR aluminum or tantalum bypass capacitor is needed between the input pin and ground to prevent large
voltage transients from appearing at the input. In addition, the RMS current rating of the input capacitor must be
selected to be at least ½ the DC load current. The capacitor manufacturers data sheet must be checked to
assure that this current rating is not exceeded. Figure 23 shows typical RMS current ratings for several different
aluminum electrolytic capacitor values.
This capacitor must be located close to the IC using short leads and the voltage rating must be approximately 1.5
times the maximum input voltage.
If solid tantalum input capacitors are used, TI recommends that they be surge current tested by the
manufacturer.
Use caution when using ceramic capacitors for input bypassing, because it may cause severe ringing at the VIN
pin.
The important parameters for the Input capacitor are the input voltage rating and the RMS current rating. With a
nominal input voltage of 12 V, an aluminum electrolytic capacitor with a voltage rating greater than 18 V
(1.5 × VIN) is necessary. The next higher capacitor voltage rating is 25 V.
The RMS current rating requirement for the input capacitor in a buck regulator is approximately ½ the DC load
current. In this example, with a 400-mA load, a capacitor with a RMS current rating of at least 200 mA is needed.
Figure 23 can be used to select an appropriate input capacitor. From the curves, locate the 25-V line and note
which capacitor values have RMS current ratings greater than 200 mA. Either a 47-μF or 68-μF, 25-V capacitor
could be used.
For a through hole design, a 68-μF, 25-V electrolytic capacitor (Panasonic HFQ series or Nichicon PL series or
equivalent) would be adequate. Other types or other manufacturers' capacitors can be used provided the RMS
ripple current ratings are adequate.
For surface-mount designs, solid tantalum capacitors are recommended. The TPS series available from AVX,
and the 593D series from Sprague are both surge current tested.
For additional information, see Input Capacitor (CIN).
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Table 5. LM2594xx Fixed Voltage Quick Design Component Selection Table
CONDITIONS
OUTPUT
LOAD
VOLTAGE CURRENT
(V)
(A)
0.5
3.3
0.2
0.5
5
0.2
0.5
12
0.2
OUTPUT CAPACITOR
INDUCTOR
THROUGH HOLE
SURFACE MOUNT
MAX INPUT
VOLTAGE
(V)
INDUCTANCE
(μH)
INDUCTOR
(#)
PANASONIC
HFQ SERIES
(μF/V)
NICHICON
PL SERIES
(μF/V)
AVX TPS
SERIES
(μF/V)
SPRAGUE
595D SERIES
(μF/V)
5
33
L14
220/16
220/16
100/16
100/6.3
7
47
L13
120/25
120/25
100/16
100/6.3
10
68
L21
120/25
120/25
100/16
100/6.3
40
100
L20
120/35
120/35
100/16
100/6.3
6
68
L4
120/25
120/25
100/16
100/6.3
10
150
L10
120/16
120/16
100/16
100/6.3
40
220
L9
120/16
120/16
100/16
100/6.3
8
47
L13
180/16
180/16
100/16
33/25
10
68
L21
180/16
180/16
100/16
33/25
15
100
L20
120/25
120/25
100/16
33/25
40
150
L19
120/25
120/25
100/16
33/25
9
150
L10
82/16
82/16
100/16
33/25
20
220
L9
120/16
120/16
100/16
33/25
40
330
L8
120/16
120/16
100/16
33/25
15
68
L21
82/25
82/25
100/16
15/25
18
150
L19
82/25
82/25
100/16
15/25
30
220
L27
82/25
82/25
100/16
15/25
40
330
L26
82/25
82/25
100/16
15/25
15
100
L11
82/25
82/25
100/16
15/25
20
220
L9
82/25
82/25
100/16
15/25
40
330
L17
82/25
82/25
100/16
15/25
9.2.1.3 Application Curves
Discontinuous mode switching waveforms
VIN = 20 V, VOUT = 5 V, ILOAD = 200 mA
L = 33 μH, COUT = 220 μF, COUT ESR = 60 mΩ
A: Output pin voltage, 10 V/div.
B: Inductor current, 0.2 A/div.
C: Output ripple voltage, 20 mV/div.
Figure 33. Horizontal Time Base: 2 μs/div
Load transient response for discontinuous mode
VIN = 20 V, VOUT = 5 V, ILOAD = 100 mA to 200 mA
L = 33 μH, COUT = 220 μF, COUT ESR = 60 mΩ
A: Output voltage, 50 mV/div. (AC)
B: 100-mA to 200-mA load pulse
Figure 34. Horizontal Time Base: 200 μs/div
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9.2.2 Series Buck Regulator (Adjustable Output)
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CIN — 68-μF, 35-V, Aluminum Electrolytic Nichicon “PL Series”
COUT — 120-μF, 25-V Aluminum Electrolytic, Nichicon “PL Series”
D1 — 1-A, 40-V Schottky Rectifier, 1N5819
L1 — 100-μH, L20
R1 — 1 kΩ, 1%
CFF — See Feedforward Capacitor (CFF)
Figure 35. Adjustable Output Voltage Version
9.2.2.1 Design Requirements
Table 6 lists the design parameters of this example.
Table 6. Design Parameter
PARAMETER
EXAMPLE VALUE
Regulated output voltage, VOUT
20 V
Maximum input voltage, VIN(max)
28 V
Maximum load current, ILOAD(max)
0.5 A
Switching frequency, F
Fixed at a nominal 150 kHz
9.2.2.2 Detailed Design Procedure
9.2.2.2.1 Programming Output Voltage
Selecting R1 and R2, as shown in Figure 35.
Use Equation 1 to select the appropriate resistor values.
(1)
Select R1 to be 1 kΩ, 1%. Solve for R2 using Equation 2.
(2)
Select a value for R1 between 240 Ω and 1.5 kΩ using Equation 3. The lower resistor values minimize noise
pickup in the sensitive feedback pin. (For the lowest temperature coefficient and the best stability with time, use
1% metal film resistors.)
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(3)
R2 = 1k (16.26 − 1) = 15.26k, closest 1% value is 15.4 kΩ.
R2 = 15.4 kΩ.
9.2.2.2.2 Inductor Selection (L1)
1. Calculate the inductor Volt microsecond constant E • T (V • μs) with Equation 4.
where
•
•
VSAT = internal switch saturation voltage = 0.9 V
VD = diode forward voltage drop = 0.5 V
(4)
2. Calculate the inductor Volt • microsecond constant (E • T) with Equation 5.
(5)
3. Use the E • T value from the previous formula and match it with the E • T number on the vertical axis of the
Inductor Value Selection Guide shown in Figure 30.
E • T = 35.2 (V • μs)
(6)
4. On the horizontal axis, select the maximum load current: ILOAD(max) = 0.5 A
5. Identify the inductance region intersected by the E • T value and the maximum load current value. Each
region is identified by an inductance value and an inductor code (LXX).
From the inductor value selection guide shown in Figure 30, the inductance region intersected by the 35 (V •
μs) horizontal line and the 0.5-A vertical line is 150 μH, and the inductor code is L19.
6. Select an appropriate inductor from the four manufacturer's part numbers listed in Table 3.
From Table 3, locate line L19, and select an inductor part number from the list of manufacturers' part
numbers.
9.2.2.2.3 Output Capacitor Selection (COUT)
1. In the majority of applications, low ESR electrolytic or solid tantalum capacitors between 82 μF and 220 μF
provide the best results. This capacitor must be located close to the IC using short capacitor leads and short
copper traces. Do not use capacitors larger than 220 μF. For additional information, see Output Capacitor
(COUT).
2. To simplify the capacitor selection procedure, see Table 7 for a quick design guide. This table contains
different output voltages, and lists various output capacitors that provides the best design solutions.
From Table 7, locate the output voltage column. From that column, locate the output voltage closest to the
output voltage in your application. In this example, select the 24-V line. Under Output Capacitor (COUT),
select a capacitor from the list of through hole electrolytic or surface mount tantalum types from four different
capacitor manufacturers. TI recommends that both the manufacturers and the manufacturers series that are
listed in Table 7.
In this example, through hole aluminum electrolytic capacitors from several different manufacturers are
available.
82-µF, 50-V Panasonic HFQ Series
120-µF, 50-V Nichicon PL Series
3. The capacitor voltage rating must be at least 1.5 times greater than the output voltage, and often much
higher voltage ratings are needed to satisfy the low ESR requirements needed for low output ripple voltage.
For a 20-V output, a capacitor rating of at least 30-V or more is required. In this example, either a 35-V or
50-V capacitor would work. A 50-V rating was chosen because it has a lower ESR which provides a lower
output ripple voltage.
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Other manufacturers or other types of capacitors may also be used, provided the capacitor specifications
(especially the 100 kHz ESR) closely match the types listed in Table 7. Refer to the capacitor manufacturers
data sheet for this information.
9.2.2.2.4 Feedforward Capacitor (CFF)
For output voltages greater than approximately 10 V, an additional capacitor is required. The compensation
capacitor is typically between 50 pF and 10 nF, and is wired in parallel with the output voltage setting resistor,
R2. It provides additional stability for high output voltages, low input or output voltages, and very low ESR output
capacitors, such as solid tantalum capacitors calculated with Equation 7.
(7)
This capacitor type can be ceramic, plastic, silver mica, and so forth (because of the unstable characteristics of
ceramic capacitors made with Z5U material, they are not recommended).
Table 7 contains feedforward capacitor values for various output voltages. In this example, a 1-nF capacitor is
needed.
9.2.2.2.5 Catch Diode Selection (D1)
1. The catch diode current rating must be at least 1.3 times greater than the maximum load current. Also, if the
power supply design must withstand a continuous output short, the diode must have a current rating equal to
the maximum current limit of the LM2594. The most stressful condition for this diode is an overload or
shorted output condition.
See Table 2. Schottky diodes provide the best performance, and in this example a 1-A, 40-V, 1N5819
Schottky diode is a good choice. The 1-A diode rating is more than adequate and will not be overstressed
even for a shorted output.
2. The reverse voltage rating of the diode must be at least 1.25 times the maximum input voltage.
3. This diode must be fast (short reverse recovery time) and must be placed close to the LM2594 using short
leads and short printed circuit traces. Because of their fast switching speed and low forward voltage drop,
Schottky diodes provide the best performance and efficiency, and must be the first choice, especially in low
output voltage applications. Ultra-fast recovery or high-efficiency rectifiers are also good choices, but some
types with an abrupt turnoff characteristic may cause instability or EMl problems. Ultra-fast recovery diodes
typically have reverse recovery times of 50 ns or less. Rectifiers such as the 1N4001 series must not be
used because they are too slow.
9.2.2.2.6 Input Capacitor (CIN)
A low ESR aluminum or tantalum bypass capacitor is required between the input pin and ground to prevent large
voltage transients from appearing at the input. In addition, the RMS current rating of the input capacitor must be
selected to be at least ½ the DC load current. The capacitor manufacturers data sheet must be checked to
assure that this current rating is not exceeded. Figure 23 shows typical RMS current ratings for several different
aluminum electrolytic capacitor values.
This capacitor must be located close to the IC using short leads and the voltage rating must be approximately 1.5
times the maximum input voltage.
If solid tantalum input capacitors are used, TI recommends that they be surge current tested by the
manufacturer.
Use caution when using ceramic capacitors for input bypassing, because it may cause severe ringing at the VIN
pin.
The important parameters for the Input capacitor are the input voltage rating and the RMS current rating. With a
nominal input voltage of 28 V, an aluminum electrolytic aluminum electrolytic capacitor with a voltage rating
greater than 42 V (1.5 × VIN) is required. Because the next higher capacitor voltage rating is 50 V, a 50-V
capacitor must be used. The capacitor voltage rating of (1.5 × VIN) is a conservative guideline, and can be
modified somewhat if desired.
The RMS current rating requirement for the input capacitor of a buck regulator is approximately ½ the DC load
current. In this example, with a 400 mA load, a capacitor with a RMS current rating of at least 200 mA is needed.
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Figure 23 shows curves that can be used to select an appropriate input capacitor. From the curves, locate the
50-V line and note which capacitor values have RMS current ratings greater than 200 mA. A 47-μF, 50-V low
ESR electrolytic capacitor is needed.
For a through-hole design, a 47-μF, 50-V electrolytic capacitor (Panasonic HFQ series or Nichicon PL series or
equivalent) would be adequate. Other types or other manufacturers' capacitors can be used provided the RMS
ripple current ratings are adequate.
For surface mount designs, solid tantalum capacitors are recommended. The TPS series available from AVX,
and the 593D series from Sprague are both surge current tested.
For additional information, see Input Capacitor (CIN).
Table 7. Output Capacitor and Feedforward Capacitor Selection Table
OUTPUT
VOLTAGE
(V)
THROUGH-HOLE OUTPUT CAPACITOR
PANASONIC HFQ
SERIES (μF/V)
NICHICON PL SERIES
(μF/V)
1.2
220/25
4
180/25
6
9
SURFACE-MOUNT OUTPUT CAPACITOR
FEEDFORWARD
CAPACITOR
AVX TPS
SERIES (μF/V)
SPRAGUE 595D
SERIES (μF/V)
FEEDFORWARD
CAPACITOR
220/25
0
220/10
220/10
0
180/25
4.7 nF
100/10
120/10
4.7 nF
82/25
82/25
4.7 nF
100/10
120/10
4.7 nF
82/25
82/25
3.3 nF
100/16
100/16
3.3 nF
12
82/25
82/25
2.2 nF
100/16
100/16
2.2 nF
15
82/25
82/25
1.5 nF
68/20
100/20
1.5 nF
24
82/50
120/50
1 nF
10/35
15/35
220 pF
28
82/50
120/50
820 pF
10/35
15/35
220 pF
9.2.2.3 Application Curves
Continuous mode switching waveforms
VIN = 20 V, VOUT = 5 V, ILOAD = 400 mA
L = 100 μH, COUT = 120 μF, COUT ESR = 140 mΩ
A: Output pin voltage, 10 V/div.
B: Inductor current, 0.2 A/div.
C: Output ripple voltage, 20 mV/div.
Figure 36. Horizontal Time Base: 2 μs/div
Load transient response for continuous mode
VIN = 20 V, VOUT = 5 V, ILOAD = 200 mA to 500 mA
L = 100 μH, COUT = 120 μF, COUT ESR = 140 mΩ
A: Output voltage, 50 mV/div. (AC)
B: 200-mA to 500-mA load pulse
Figure 37. Horizontal Time Base: 50 μs/div
10 Power Supply Recommendations
The LM2594 is designed to operate from an input voltage supply up to 45 V and 60 V (HV version). This input
supply must be well regulated and able to withstand maximum input current and maintain a stable voltage.
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11 Layout
11.1 Layout Guidelines
As in any switching regulator, layout is very important. Rapidly switching currents associated with wiring
inductance can generate voltage transients which can cause problems. For minimal inductance and ground
loops, the wires indicated by heavy lines must be wide printed circuit traces and must be kept as short as
possible. For best results, external components must be placed as close to the switcher lC as possible using
ground plane construction or single point grounding.
If open core inductors are used, special care must be taken as to the location and positioning of this type of
inductor. Allowing the inductor flux to intersect sensitive feedback, lC groundpath and COUT wiring can cause
problems.
When using the adjustable version, take special care regarding as to the location of the feedback resistors and
the associated wiring. Physically place both resistors near the IC, and route the wiring away from the inductor,
especially an open core type of inductor.
11.2 Layout Example
CIN = 10-μF, 35-V, Solid Tantalum AVX, TPS series
COUT = 00-μF, 10-V Solid Tantalum AVX, TPS series
D1 = 1-A, 40-V Schottky Rectifier, surface mount
L1 = 100-μH, L20, Coilcraft DO33
Figure 38. Typical Surface-Mount PCB Layout, Fixed Output (2X Size)
CIN = 10-μF, 35-V, Solid Tantalum AVX, TPS series
COUT = 100-μF, 10-V Solid Tantalum AVX, TPS series
D1 = 1-A, 40-V Schottky Rectifier, surface mount
L1 = 100-μH, L20, Coilcraft DO33
R1 = 1 kΩ, 1%
R2 = Use formula in Design Procedure
CFF = See Table 7
Figure 39. Typical Surface-Mount PCB Layout, Adjustable Output (2X Size)
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11.3 Thermal Considerations
The LM2594xx is available in two packages: an 8-pin through-hole PDIP and an 8-pin surface-mount SOIC. Both
packages are molded plastic with a copper lead frame. When the package is soldered to the printed-circuit board
(PCB), the copper and the board are the heat sink for the LM2594 and the other heat producing components.
For best thermal performance, wide copper traces must be used and all ground and unused pins must be
soldered to generous amounts of PCB copper, such as a ground plane (one exception to this is the output
(switch pin, which must not have large areas of copper). Large areas of copper provide the best transfer of heat
(lower thermal resistance) to the surrounding air, and even double-sided or multilayer boards provide a better
heat path to the surrounding air. Unless power levels are small, sockets are not recommended because of the
added thermal resistance it adds and the resultant higher junction temperatures.
Package thermal resistance and junction temperature rise numbers are all approximate, and there are many
factors that affects the junction temperature. Some of these factors include board size, shape, thickness,
position, location, and even board temperature. Other factors are trace width, printed-circuit copper area, copper
thickness, single- or double-sided multilayer board, and the amount of solder on the board. The effectiveness of
the PCB to dissipate heat also depends on the size, quantity, and spacing of other components on the board.
Furthermore, some of these components such as the catch diode adds heat to the PCB and the heat can vary as
the input voltage changes. For the inductor, depending on the physical size, type of core material, and the DC
resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board.
Circuit Data for Temperature Rise Curve (8-Pin PDIP)
Capacitors
Through hole electrolytic
Inductor
Through hole, Schott, 100 μH
Diode
Through hole, 1-A, 40-V, Schottky
PCB
4 square inches single sided 2 oz. copper (0.0028″)
Figure 40. Junction Temperature Rise, 8-Pin PDIP
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Thermal Considerations (continued)
Circuit Data for Temperature Rise Curve
(Surface Mount)
Capacitors
Surface mount tantalum, molded D size
Inductor
Surface mount, Coilcraft DO33, 100 μH
Diode
Surface mount, 1-A, 40-V, Schottky
PCB
4 square inches single sided 2 oz. copper (0.0028″)
Figure 41. Junction Temperature Rise, 8-Pin SOIC
Figure 40 and Figure 41 show the LM2594 junction temperature rise above ambient temperature with a 500-mA
load for various input and output voltages. This data was taken with the circuit operating as a buck switcher with
all components mounted on a PCB to simulate the junction temperature under actual operating conditions. This
curve is typical, and can be used for a quick check on the maximum junction temperature for various conditions,
but keep in mind that there are many factors that can affect the junction temperature.
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12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 8. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM2594
Click here
Click here
Click here
Click here
Click here
LM2594HV
Click here
Click here
Click here
Click here
Click here
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
SIMPLE SWITCHER is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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4-Feb-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2594HVM-12
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2594H
M-12
LM2594HVM-12/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-12
LM2594HVM-3.3
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2594H
M-3.3
LM2594HVM-3.3/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-3.3
LM2594HVM-5.0
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2594H
M-5.0
LM2594HVM-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-5.0
LM2594HVM-ADJ
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2594H
M-ADJ
LM2594HVM-ADJ/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-ADJ
LM2594HVMX-12/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-12
LM2594HVMX-3.3
NRND
SOIC
D
8
TBD
Call TI
Call TI
-40 to 125
2594H
M-3.3
LM2594HVMX-3.3/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-3.3
LM2594HVMX-5.0
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 125
2594H
M-5.0
LM2594HVMX-5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-5.0
LM2594HVMX-ADJ/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594H
M-ADJ
LM2594HVN-12/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594HV
N-12 P+
LM2594HVN-3.3/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594HV
N-3.3 P+
LM2594HVN-5.0/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594HV
N-5.0 P+
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2016
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2594HVN-ADJ/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594HV
N-ADJ P+
LM2594M-12/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-12
LM2594M-3.3
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2594
M-3.3
LM2594M-3.3/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-3.3
LM2594M-5.0
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2594
M-5.0
LM2594M-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-5.0
LM2594M-ADJ/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-ADJ
LM2594MX-12/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-12
LM2594MX-3.3/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-3.3
LM2594MX-5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-5.0
LM2594MX-ADJ/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2594
M-ADJ
LM2594N-12/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594N
-12 P+
LM2594N-3.3/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594N
-3.3 P+
LM2594N-5.0/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594N
-5.0 P+
LM2594N-ADJ/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2594N
-ADJ P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2016
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2594HVMX-12/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594HVMX-3.3/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594HVMX-5.0
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594HVMX-5.0/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594HVMX-ADJ/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594MX-12/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594MX-3.3/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594MX-5.0/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2594MX-ADJ/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2594HVMX-12/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2594HVMX-3.3/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2594HVMX-5.0
SOIC
D
8
2500
367.0
367.0
35.0
LM2594HVMX-5.0/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2594HVMX-ADJ/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2594MX-12/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2594MX-3.3/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2594MX-5.0/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2594MX-ADJ/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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