AMD AM27C256-120PI 256 kilobit (32,768 x 8-bit) cmos eprom Datasheet

FINAL
Advanced
Micro
Devices
Am27C256
256 Kilobit (32,768 x 8-Bit) CMOS EPROM
DISTINCTIVE CHARACTERISTICS
■ Fast access time
■ Latch-up protected to 100 mA from –1 V to
VCC + 1 V
— 55 ns
■ High noise immunity
■ Low power consumption
— 20 µA typical CMOS standby current
■ Versatile features for simple interfacing
— Both CMOS and TTL input/output
compatibility
■ JEDEC-approved pinout
■ Single +5 V power supply
■ ±10% power supply tolerance available
■ 100% Flashrite programming
— Two line control functions
■ Standard 28-pin DIP, PDIP, 32-pin TSOP and
PLCC packages
— Typical programming time of 4 seconds
GENERAL DESCRIPTION
The Am27C256 is a 256K-bit ultraviolet erasable programmable read-only memory. It is organized as 32K
words by 8 bits per word, operates from a single +5 V
supply, has a static standby mode, and features fast single address location programming. Products are available in windowed ceramic DIP packages as well as plastic one time programmable (OTP) PDIP, TSOP, and
PLCC packages.
Typically, any byte can be accessed in less than 55 ns,
allowing operation with high-performance microprocessors without any WAIT states. The Am27C256 offers
separate Output Enable (OE) and Chip Enable (CE)
controls, thus eliminating bus contention in a multiple
bus microprocessor system.
AMD’s CMOS process technology provides high speed,
low power, and high noise immunity. Typical power consumption is only 80 mW in active mode, and 100 µW in
standby mode.
All signals are TTL levels, including programming signals. Bit locations may be programmed singly, in blocks,
or at random. The Am27C256 supports AMD’s Flashrite
programming algorithm (100 µs pulses) resulting in typical programming time of 4 seconds.
BLOCK DIAGRAM
VCC
VSS
VPP
OE
CE
A0–A14
Address
Inputs
Data Outputs
DQ0–DQ7
Output Enable
Chip Enable
and
Prog Logic
Output
Buffers
Y
Decoder
Y
Gating
X
Decoder
262,144
Bit Cell
Matrix
08007H-1
2-32
Publication# 08007 Rev. H
Issue Date: May 1995
Amendment /0
AMD
PRODUCT SELECTOR GUIDE
Family Part No.
Am27C256
Ordering Part No:
VCC ± 5%
-255
VCC ± 10%
-55
-70
-90
-120
-150
-200
Max Access Time (ns)
55
70
90
120
150
200
250
CE (E) Access Time (ns)
55
70
90
120
150
200
250
OE (G) Access Time (ns)
35
40
40
50
50
50
50
CONNECTION DIAGRAMS
Top View
DIP
A14
A7
3
26
A13
A6
4
25
A5
5
VCC
A13
27
A14
2
VCC
A12
DU
28
VPP
1
A7
A12
VPP
PLCC
4 3 2 1 32 31 30
A6
5
29
A8
A8
A5
6
28
A9
24
A9
A4
7
27
A11
A4
6
23
A11
A3
8
26
NC
A3
7
22
OE (G)
A2
9
25
OE (G)
A2
8
21
A10
A1
10
24
A10
A1
9
20
CE (E)
A0
11
DQ7
12
23
22
CE (E)
NC
DQ0
13
21
DQ6
18
DQ6
DQ1
12
17
DQ5
DQ2
13
16
DQ4
VSS
14
15
DQ3
DQ7
14 15 16 17 18 19 20
DQ4
DQ5
11
DQ3
DQ0
DU
19
DQ1
10
DQ2
VSS
A0
08007H-3
08007H-2
Notes:
1. JEDEC nomenclature is in parentheses.
Am27C256
2-33
AMD
CONNECTION DIAGRAM
TSOP*
OE (G)
A11
A9
A8
A13
NC
A14
VCC
VPP
NC
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NC
A10
CE (E)
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
NC
A0
A1
A2
08007H-4
*Contact local AMD sales office for package availability
Standard Pinout
PIN DESIGNATIONS
A0–A14
=
Address Inputs
CE (E)
=
Chip Enable
DQ0–DQ7
=
Data Inputs/Outputs
OE (G)
=
Output Enable Input
VCC
=
VCC Supply Voltage
VPP
=
Program Voltage Input
VSS
=
Ground
DU
=
Don’t Use
LOGIC SYMBOL
15
A0–A14
8
DQ0–DQ7
CE (E)
OE (G)
08007H-5
2-34
Am27C256
AMD
ORDERING INFORMATION
UV EPROM Products
AMD Standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of:
AM27C256
-55
D
C
B
OPTIONAL PROCESSING
Blank = Standard Processing
B = Burn-in
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
E = Extended Commercial (–55°C to +125°C)
PACKAGE TYPE
D = 28-Pin Ceramic DIP (CDV028)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER
Am27C256
256 Kilobit (32,768 x 8-Bit) CMOS UV EPROM
Valid Combinations
AM27C256-55
AM27C256-70
AM27C256-90
AM27C256-120
AM27C256-150
AM27C256-200
AM27C256-255
Valid Combinations
Valid Combinations list configurations planned to be
supported in volume for this device. Consult the local AMD sales office to confirm availability of specific
valid combinations and to check on newly released
combinations.
DC, DCB, DI, DIB
DC, DCB, DI,
DIB, DE, DEB
DC, DCB, DI, DIB
Am27C256
2-35
AMD
ORDERING INFORMATION
OTP Products
AMD Standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of:
AM27C256
-55
P
C
OPTIONAL PROCESSING
Blank = Standard Processing
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to + 85°C)
PACKAGE TYPE
P = 28-Pin Plastic DIP (PD 028)
J = 32-Pin Rectangular Plastic Leaded Chip
Carrier (PL 032)
E = 32-Pin TSOP (TS 032)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER
Am27C256
256 Kilobit (32,768 x 8-Bit) CMOS OTP EPROM
Valid Combinations
JC, PC, EC
AM27C256-55
AM27C256-70
AM27C256-90
JC, PC, EC,
AM27C256-120
JI, PI, EI
AM27C256-150
AM27C256-200
AM27C256-255
2-36
Valid Combinations
Valid Combinations list configurations planned to be
supported in volume for this device. Consult the local AMD sales office to confirm availability of specific
valid combinations and to check on newly released
combinations.
Am27C256
AMD
FUNCTIONAL DESCRIPTION
Erasing the Am27C256
In order to clear all locations of their programmed contents, it is necessary to expose the Am27C256 to an
ultraviolet light source. A dosage of 15 W sec/cm2 is
required to completely erase an Am27C256. This dosage can be obtained by exposure to an ultraviolet amp—
wavelength of 2537 A° —with intensity of 12,000 µW/cm2
for 15 to 20 minutes. The Am27C256 should be directly
under and about one inch from the source and all filters
should be removed from the UV light source prior
to erasure.
It is important to note that the Am27C256 and similar
devices will erase with light sources having wavelengths
shorter than 4000 A° . Although erasure times will be
much longer than with UV sources at 2537 A° , exposure
to fluorescent light and sunlight will eventually erase the
Am27C256 and exposure to them should be prevented
to realize maximum system reliability. If used in such an
environment, the package window should be covered
by an opaque label or substance.
Programming the Am27C256
Upon delivery or after each erasure the Am27C256 has
all 262,144 bits in the “ONE” or HIGH state. “ZEROs”
are loaded into the Am27C256 through the procedure
of programming.
The programming mode is entered when 12.75 V
± 0.25 V is applied to the VPP pin, OE is at VIH, and CE is
at VIL.
For programming, the data to be programmed is applied
8 bits in parallel to the data output pins.
The Flashrite algorithm reduces programming time by
using 100 µs programming pulses and by giving each
address only as many pulses as is necessary in order to
reliably program the data. After each pulse is applied to
a given address, the data in that address is verified. If
the data does not verify, additional pulses are given until
it verifies or the maximum is reached. This process is repeated while sequencing through each address of the
Am27C256. This part of the algorithm is done at
VCC = 6.25 V to assure that each EPROM bit is programmed to a sufficiently high threshold voltage. After
the final address is completed, the entire EPROM memory is verified at VCC = VPP = 5.25 V.
Please refer to Section 6 for programming flow chart
and characteristics.
Program Inhibit
Programming of multiple Am27C256 in parallel with different data is also easily accomplished. Except for CE,
all like inputs of the parallel Am27C256 may be common. A TTL low-level program pulse applied to an
Am27C256 CE input with VPP = 12.75 V ± 0.25 V, and
OE High will program that Am27C256. A high-level CE
input inhibits the other Am27C256 devices from
being programmed.
Program Verify
A verify should be performed on the programmed bits to
determine that they were correctly programmed. The
verify should be performed with OE at VIL, CE at VIH, and
VPP between 12.5 V to 13.0 V.
Auto Select Mode
The auto select mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and type. This mode is intended for use by programming
equipment for the purpose of automatically matching
the device to be programmed with its corresponding
programming algorithm. This mode is functional in the
25°C ± 5°C ambient temperature range that is required
when programming the Am27C256.
To activate this mode, the programming equipment
must force 12.0 V ± 0.5 V on address like A9 of the
Am27C256. Two identifier bytes may then be sequenced from the device outputs by toggling address
line A0 from VIL to VIH. All other address lines must be
held at VIL during auto select mode.
Byte 0 (A0 = VIL) represents the manufacturer code, and
byte 1 (A0 = VIH), the device code. For the Am27C256,
these two identifier bytes are given in the Mode Select
Table. All identifiers for manufacturer and device codes
will possess odd parity, with the MSB (DQ7) defined as
the parity bit.
Read Mode
The Am27C256 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that addresses are stable, address access time
(tACC) is equal to the delay from CE to output (tCE). Data
is available at the outputs tOE after the falling edge of
OE, assuming that CE has been LOW and addresses
have been stable for at least tACC–tOE.
Standby Mode
The Am27C256 has a CMOS standby mode which reduces the maximum VCC current to 100 µA. It is placed in
CMOS-standby when CE is at VCC ± 0.3 V. The
Am27C256 also has a TTL-standby mode which reduces the maximum VCC current to 1.0 mA. It is placed in
TTL-standby when CE is at VIH. When in standby mode,
the outputs are in a high-impedance state, independent
of the OE input.
Am27C256
2-37
AMD
Output OR-Tieing
System Applications
To accommodate multiple memory connections, a twoline control function is provided to allow for:
During the switch between active and standby conditions, transient current peaks are produced on the rising
and falling edges of Chip Enable. The magnitude of
these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a
0.1-µF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and VSS to minimize transient effects. In addition, to
overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7-µF bulk electrolytic capacitor should be used
between VCC and VSS for each eight devices. The location of the capacitor should be close to where the power
supply is connected to the array.
■ Low memory power dissipation
■ Assurance that output bus contention will not occur
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
low-power standby mode and that the output pins are
only active when data is desired from a particular
memory device.
MODE SELECT TABLE
Pins
CE
OE
A0
A9
VPP
Outputs
VIL
VIL
X
X
X
DOUT
Output Disable
X
VIH
X
X
X
High-Z
Standby (TTL)
VIH
X
X
X
X
High-Z
VCC + 0.3 V
X
X
X
X
High-Z
Program
VIL
VIH
X
X
VPP
DIN
Program Verify
VIH
VIL
X
X
VPP
DOUT
Program Inhibit
VIH
VIH
X
X
VPP
High-Z
Manufacturer
Code
VIL
VIL
VIL
VH
X
01H
Device Code
VIL
VIL
VIH
VH
X
10H
Mode
Read
Standby (CMOS)
Auto Select
(Note 3)
Notes:
1. VH = 12.0 V + 0.5 V
2. X = Either VIH or VIL
3. A1–A8 = A10–A14 = VIL
4. See DC Programming Characteristics for VPP voltage during programming.
2-38
Am27C256
AMD
ABSOLUTE MAXIMUM RATINGS
OPERATING RANGES
Storage Temperature
OTP Products . . . . . . . . . . . . . . . –65°C to +125°C
All Other Products . . . . . . . . . . . . –65°C to +150°C
Commercial (C) Devices
Ambient Temperature (TA) . . . . . . . 0°C to +70°C
Ambient Temperature
with Power Applied . . . . . . . . . . . . . –55°C to +125°C
Voltage with Respect To VSS
All pins except A9,VPP,VCC
(Note 1) . . . . . . . . . . . . . . . –0.6 V to VCC + 0.5 V
Industrial (I) Devices
Ambient Temperature (TA) . . . . . –40°C to +85°C
Extended Commercial (E) Devices
Ambient Temperature (TA) . . . . –55°C to +125°C
Supply Read Voltages
VCC for Am27C256-XX5 . . . . . +4.75 V to +5.25 V
A9 and VPP (Note 2) . . . . . . . . . . –0.6 V to +13.5 V
VCC for Am27C256-XX0 . . . . . +4.50 V to +5.50 V
VCC . . . . . . . . . . . . . . . . . . . . . . . –0.6 V to +7.0 V
Operating ranges define those limits between which the functionality of the device is guaranteed.
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During
transitions, the inputs may overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on input andI/O
pins is VCC + 0.5 V which may overshoot to VCC + 2.0 V for
periods up to 20 ns.
2. For A9 and VPP the minimum DC input is –0.5 V. During
transitions, A9 and VPP may overshoot VSS to –2.0 V for
periods of up to 20 ns. A9 and VPP must not exceed 13.5 V
for any period of time.
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these
or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure of
the device to absolute maximum rating conditions for extended periods may affect device reliability.
Am27C256
2-39
AMD
DC CHARACTERISTICS over operating range unless otherwise specified.
(Notes 1, 2 and 4)
Parameter
Symbol
Parameter Description
Test Conditions
Min
VOH
Output HIGH Voltage
IOH = –400 µA
2.4
VOL
Output LOW Voltage
IOL = 2.1 mA
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
ILI
Input Load Current
VIN = 0 V to +VCC
ILO
Output Leakage Current
VOUT = 0 V to +VCC
Max
Unit
V
0.45
V
2.0
VCC + 0.5
V
–0.5
+0.8
V
1.0
µA
C/I Devices
1.0
µA
E Devices
5.0
ICC1
VCC Active Current
(Note 3)
CE = VIL, f = 10 MHz,
IOUT = 0 mA
25
mA
ICC2
VCC TTL Standby Current
CE = VIH
1.0
mA
ICC3
VCC CMOS Standby Current
CE = VCC ± 0.3 V
100
µA
IPP1
VPP Current During Read
CE = OE = VIL, VPP = VCC
100
µA
Notes:
1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.
2. Caution: The Am27C256 must not be removed from (or inserted into) a socket when VCC or VPP is applied.
3. ICC1 is tested with OE = VIH to simulate open outputs.
30
30
25
25
Supply Current
in mA
Supply Current
in mA
4. Minimum DC Input Voltage is –0.5 V. During transitions, the inputs may overshoot to –2.0 V for periods less than 20 ns.
Maximum DC Voltage on output pins is VCC + 0.5 V, which may overshoot to VCC + 2.0 V for periods less than 20 ns.
20
15
10
1
2
3
4
5
6
7
8
9
10
15
10
–75 –50 –25 0
25
50
75 100 125 150
Temperature in °C
Frequency in MHz
Figure 1. Typical Supply Current
vs. Frequency
VCC = 5.5 V, T = 25°C
Figure 2. Typical Supply Current
vs. Temperature
VCC = 5.5 V, f = 10 MHz
08007H-6
2-40
20
Am27C256
08007H-7
AMD
CAPACITANCE
Parameter
Symbol
Parameter
Description
CDV028
Test
Conditions
PL 032
PD 028
TS 032
Typ
Max
Typ
Max
Typ
Max
Typ
Max
Unit
CIN
Input Capacitance
VIN = 0
8
12
8
12
6
10
10
12
pF
COUT
Output Capacitance
VOUT = 0
8
12
8
12
8
10
12
14
pF
Notes:
1. This parameter is only sampled and not 100% tested.
2. TA = +25°C, f = 1 MHz.
SWITCHING CHARACTERISTICS over operating range unless otherwise specified
(Notes 1, 3 and 4)
Parameter
Symbols
JEDEC
Standard
tAVQV
tACC
Am27C256
Parameter
Description
Test
Conditions
-55
-70
-90
-120
-150
-200
-255
Unit
Address to
Output Delay
CE = OE =
VIL
Min
Max
–
55
–
70
–
90
–
120
–
150
–
200
–
250
ns
tELQV
tCE
Chip Enable to
Output Delay
OE = VIL
Min
Max
–
55
–
70
–
90
–
120
–
150
–
200
–
250
ns
tGLQV
tOE
Output Enable to
Output Delay
CE = VIL
Min
Max
–
35
–
40
–
40
–
50
–
50
–
50
–
50
ns
Chip Enable HIGH or
Output Enable HIGH,
whichever comes
first, to Output Float
Min
Max
–
25
–
25
–
25
–
30
–
30
–
30
–
30
ns
Output Hold from
Addresses, CE,
or OE, whichever
occurred first
Min
Max
0
–
0
–
0
–
0
–
0
–
0
–
0
–
ns
tEHQZ,
tGHQZ
tDF
(Note 2)
tAXQX
tOH
Notes:
1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.
2. This parameter is only sampled and not 100% tested.
3. Caution: The Am27C256 must not be removed from (or inserted into) a socket or board when VPP or VCC is applied.
4. For the -55 and -70:
Output Load: 1 TTL gate and CL = 30 pF
Input Rise and Fall Times: 20 ns
Input Pulse Levels: 0 V to 3 V
Timing Measurement Reference Level: 1.5 V for inputs and outputs
For all other versions:
Output Load: 1 TTL gate and CL = 100 pF
Input Rise and Fall Times: 20 ns
Input Pulse Levels: 0.45 V to 2.4 V
Timing Measurement Reference Level: 0.8 V and 2 V inputs and outputs
Am27C256
2-41
AMD
SWITCHING TEST CIRCUIT
2.7 kΩ
Device
Under
Test
+5.0 V
CL
Diodes = IN3064
or Equivalent
6.2 kΩ
CL = 100 pF including jig capacitance (30 pF for -55, -70)
08007H-8
SWITCHING TEST WAVEFORM
2.4 V
2.0 V
0.8 V
Test Points
2.0 V
0.8 V
0.45 V
3V
1.5 V
Test Points
1.5 V
0V
Input
Output
Input
Output
08007H-9
AC Testing: Inputs are driven at 3.0 V for a logic “1”
and 0 V for a logic “0”. Input pulse rise and
fall times are ≤ 20 ns for -55 and -70.
AC Testing: Inputs are driven at 2.4 V for a logic “1”
and 0.45 V for a logic “0”. Input pulse
rise and fall times are ≤ 20 ns.
2-42
Am27C256
AMD
KEY TO SWITCHING TEST WAVEFORMS
WAVEFORM
INPUTS
OUTPUTS
Must Be
Steady
Will Be
Steady
May
Change
from H to L
Will Be
Changing
from H to L
May
Change
from L to H
Will Be
Changing
from L to H
Don’t Care,
Any Change
Permitted
Changing
State
Unknown
Does Not
Apply
Center
Line is High
Impedence
“Off” State
KS000010
SWITCHING WAVEFORMS
2.4
Addresses
0.45
2.0
0.8
2.0
0.8
Addresses Valid
CE
tCE
OE
Output
High Z
tOE
tACC
(Note 1)
tOH
tDF
(Note 2)
High Z
Valid Output
Notes:
08007H-10
1. OE may be delayed up to tACC–tOE after the falling edge of the addresses without impact on tACC.
2. tDF is specified from OE or CE, whichever occurs first.
Am27C256
2-43
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