STMicroelectronics BTA16-XXXXXRG 16a triac Datasheet

BTA16, BTB16 and T16 Series
®
16A TRIACS
SNUBBERLESS™, LOGIC LEVEL & STANDARD
Table 1: Main Features
A2
Symbol
Value
Unit
IT(RMS)
16
A
VDRM/VRRM
600, 700 and 800
V
IGT (Q1)
10 to 50
mA
G
A1
A2
A1 A2
G
DESCRIPTION
Available either in through-hole or surface-mount
packages, the BTA16, BTB16 and T16 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase
control operation in light dimmers, motor speed
controllers, ...
The snubberless versions (BTA/BTB...W and T16
series) are specially recommended for use on inductive loads, thanks to their high commutation
performances. By using an internal ceramic pad,
the BTA series provides voltage insulated tab (rated at 2500VRMS) complying with UL standards
(File ref.: E81734).
February 2006
D2PAK
(T16-G)
A2
A1
A2
G
TO-220AB Insulated
(BTA16)
Table 2: Order Codes
Part Number
BTA16-xxxxxRG
BTB16-xxxxxRG
T16xx-xxxG
REV. 7
A1
A2
G
TO-220AB
(BTB16)
Marking
See page table 8 on
page 8
1/9
BTA16, BTB16 and T16 Series
Table 3: Absolute Maximum Ratings
Symbol
IT(RMS)
ITSM
I²t
dI/dt
Parameter
RMS on-state current (full sine
wave)
D2PAK /
TO-220AB
Tc = 100°C
TO-220AB Ins.
Tc = 15°C
Non repetitive surge peak on-state F = 50 Hz
current (full cycle, Tj initial = 25°C) F = 60 Hz
I²t Value for fusing
tp = 10 ms
Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns
F = 120 Hz
VDSM/VRSM Non repetitive surge peak off-state tp = 10 ms
voltage
IGM
PG(AV)
Tstg
Tj
Peak gate current
tp = 20 µs
Average gate power dissipation
Value
Unit
16
A
t = 20 ms
160
t = 16.7 ms
168
A
144
A ²s
Tj = 125°C
50
A/µs
Tj = 25°C
VDSM/VRSM
+ 100
V
Tj = 125°C
4
A
Tj = 125°C
1
W
- 40 to + 150
- 40 to + 125
°C
Storage junction temperature range
Operating junction temperature range
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
SNUBBERLESS and Logic Level (3 quadrants)
■
Symbol
IGT (1)
VGT
Test Conditions
VD = 12 V RL = 33 Ω
VGD
VD = VDRM RL = 3.3 kΩ
Tj = 125°C
IH (2)
IT = 500 mA
IL
IG = 1.2 IGT
dV/dt (2)
BTA16 / BTB16
T1635
SW
CW
BW
35
10
35
50
MAX.
I - II - III
MAX.
1.3
V
I - II - III
MIN.
0.2
V
MAX.
I - III
II
MAX.
35
15
35
50
50
25
50
70
60
30
60
80
500
40
500
1000
Tj = 125°C MIN.
(dV/dt)c = 0.1 V/µs
Tj = 125°C
-
8.5
-
-
Tj = 125°C MIN.
-
3.0
-
-
8.5
-
8.5
14
Without snubber
Unit
I - II - III
VD = 67 %VDRM gate open
(dI/dt)c (2) (dV/dt)c = 10 V/µs
2/9
T16
Quadrant
Tj = 125°C
mA
mA
mA
V/µs
A/ms
BTA16, BTB16 and T16 Series
■
Standard (4 quadrants)
Symbol
IGT (1)
Quadrant
RL = 33 Ω
I - II - III
IV
MAX.
ALL
MAX.
1.3
V
ALL
MIN.
0.2
V
VD = 12 V
VGT
VGD
VD = VDRM RL = 3.3 kΩ Tj = 125°C
IH (2)
IT = 500 mA
IL
IG = 1.2 IGT
dV/dt (2)
BTA16 / BTB16
Test Conditions
MAX.
I - III - IV
II
VD = 67 %VDRM gate open
(dV/dt)c (2) (dI/dt)c = 7 A/ms
MAX.
C
B
25
50
50
100
25
50
40
60
80
120
Unit
mA
mA
mA
Tj = 125°C
MIN.
200
400
V/µs
Tj = 125°C
MIN.
5
10
V/µs
Table 5: Static Characteristics
Symbol
Test Conditions
VT (2)
ITM = 22.5 A
Vto (2)
tp = 380 µs
Value
Unit
Tj = 25°C
MAX.
1.55
V
Threshold voltage
Tj = 125°C
MAX.
0.85
V
Rd (2)
Dynamic resistance
Tj = 125°C
MAX.
25
mΩ
IDRM
IRRM
VDRM = VRRM
5
µA
2
mA
Tj = 25°C
Tj = 125°C
MAX.
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1.
Table 6: Thermal resistance
Symbol
Parameter
Rth(j-c)
Junction to case (AC)
Rth(j-a)
Junction to ambient
S = 1 cm²
Value
D2PAK / TO-220AB
1.2
TO-220AB Insulated
2.1
D2PAK
45
TO-220AB / TO-220AB Insulated
60
Unit
°C/W
°C/W
S = Copper surface under tab.
3/9
BTA16, BTB16 and T16 Series
Figure 1: Maximum power dissipation versus
RMS on-state current (full cycle)
Figure 2: RMS on-state current versus case
temperature (full cycle)
P(W)
IT(RMS)(A)
20
18
18
16
16
BTB / T16
14
BTA
14
12
12
10
10
8
8
6
6
4
4
2
2
IT(RMS)(A)
TC(°C)
0
0
0
2
4
6
8
10
12
14
0
16
Figure 3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm) (full cycle)
25
50
75
100
125
Figure 4: Relative variation of thermal
impedance versus pulse duration
IT(RMS)(A)
K=[Zth/Rth]
4.0
1E+0
2
D PAK
(S=1cm2)
3.5
Zth(j-c)
3.0
Zth(j-a)
2.5
2.0
1E-1
1.5
1.0
0.5
TC(°C)
0.0
0
25
50
tp(s)
1E-2
75
100
1E-3
125
Figure 5: On-state characteristics (maximum
values)
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Figure 6: Surge peak on-state current versus
number of cycles
ITM(A)
ITSM(A)
200
180
Tj max.
Vto = 0.85V
Rd = 25 mΩ
100
160
140
t=20ms
120
Tj = Tj max.
One cycle
Non repetitive
Tj initial=25°C
100
Tj = 25°C.
80
10
Repetitive
TC=85°C
60
40
20
VTM(V)
0.5
4/9
1.0
1.5
2.0
2.5
3.0
Number of cycles
0
1
3.5
4.0
4.5
5.0
1
10
100
1000
BTA16, BTB16 and T16 Series
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width tp < 10 ms
and corresponding value of I2t
Figure 8: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
ITSM(A), I2t (A2s)
2.5
3000
Tj initial=25°C
dI/dt limitation:
50A/µs
2.0
IGT
1000
1.5
ITSM
IH & IL
1.0
I2t
0.5
Tj(°C)
tp(ms)
0.0
100
0.01
0.10
1.00
-40
10.00
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Snubberless & Logic level
types)
-20
0
20
40
60
80
100
120
140
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Standard types)
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
6
2.0
1.8
SW
1.6
5
C
B
4
1.4
1.2
3
T1635/CW/BW
1.0
2
0.8
1
0.6
Tj(°C)
(dV/dt)c (V/µs)
0.4
0
0.1
1.0
10.0
100.0
0
25
50
75
100
125
Figure 11: D2PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm)
Rth(j-a)(°C/W)
80
70
60
50
D2PAK
40
30
20
10
S(cm²)
0
0
4
8
12
16
20
24
28
32
36
40
5/9
BTA16, BTB16 and T16 Series
Figure 12: Ordering Information Scheme (BTA16 and BTB16 series)
BT A 16 - 600 BW RG
Triac series
Insulation
A = insulated
B = non insulated
Current
16 = 16A
Voltage
600 = 600V
700 = 700V
800 = 800V
Sensitivity and type
B = 50mA Standard
C = 25mA Standard
SW = 10mA Logic Level
BW = 50mA Snubberless
CW = 35mA Snubberless
Packing mode
RG = Tube
Figure 13: Ordering Information Scheme (T16 series)
T 16 35 - 600 G (-TR)
Triac series
Current
16 = 16A
Sensitivity
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
G = D2PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Table 7: Product Selector
Part Numbers
Voltage (xxx)
Sensitivity
Type
Package
X
50 mA
Standard
TO-220AB
X
X
50 mA
Snubberless
TO-220AB
X
X
X
25 mA
Standard
TO-220AB
BTA/BTB16-xxxCW
X
X
X
35 mA
Snubberless
TO-220AB
BTA/BTB16-xxxSW
X
X
X
10 mA
Logic level
TO-220AB
T1635-xxxG
X
X
35 mA
Snubberless
D2PAK
600 V
700 V
800 V
BTA/BTB16-xxxB
X
X
BTA/BTB16-xxxBW
X
BTA/BTB16-xxxC
BTB: non insulated TO-220AB package
6/9
BTA16, BTB16 and T16 Series
Figure 14: D2PAK Package Mechanical Data
DIMENSIONS
REF.
E
C2
L2
D
L
L3
A1
B2
R
C
Millimeters
Min.
A
B
G
A2
2mm min.
FLAT ZONE
V2
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.30
4.60 0.169
0.181
A1
2.49
2.69 0.098
0.106
A2
0.03
0.23 0.001
0.009
B
0.70
0.93 0.027
0.037
B2
1.25
C
0.45
0.60 0.017
C2
1.21
1.36 0.047
0.054
D
8.95
9.35 0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28 0.192
0.208
1.40
0.048 0.055
0.024
L
15.00
15.85 0.590
0.624
L2
1.27
1.40 0.050
0.055
L3
1.40
1.75 0.055
0.069
R
V2
0.40
0°
0.016
8°
0°
8°
Figure 15: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
7/9
BTA16, BTB16 and T16 Series
Figure 16: TO-220AB Package Mechanical Data
REF.
C
B
ØI
b2
L
F
A
I4
l3
c2
a1
l2
a2
M
c1
b1
e
A
a1
a2
B
b1
b2
C
c1
c2
e
F
ØI
I4
L
l2
l3
M
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ.
15.20
15.90 0.598
3.75
0.147
13.00
14.00 0.511
10.00
10.40 0.393
0.61
0.88 0.024
1.23
1.32 0.048
4.40
4.60 0.173
0.49
0.70 0.019
2.40
2.72 0.094
2.40
2.70 0.094
6.20
6.60 0.244
3.75
3.85 0.147
15.80 16.40 16.80 0.622 0.646
2.65
2.95 0.104
1.14
1.70 0.044
1.14
1.70 0.044
2.60
0.102
Max.
0.625
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
0.661
0.116
0.066
0.066
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
BTA/BTB16-xxxyzRG
BTA/BTB16xxxyz
TO-220AB
2.3 g
50
Tube
T1635-xxxG
T1635xxxG
Tube
T1635xxxG
1.5 g
50
T1635-xxxG-TR
D2PAK
1000
Tape & reel
Note: xxx = voltage, yy = sensitivity, z = type
Table 9: Revision History
8/9
Date
Revision
Oct-2002
6A
13-Feb-2006
7
Description of Changes
Last update.
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
BTA16, BTB16 and T16 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
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9/9
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