AMMP-6130 30 GHz Power Amplifier with Frequency Multiplier (x2) in SMT Package Data Sheet Description Features Avago Technologies AMMP-6130 is a high gain, narrowband doubler and output power amplifier designed for DBS applications and other commercial communication systems. The MMIC takes an input 15 GHz signal and passes it through a harmonic frequency multiplier (x2) and then three stages of power amplification. Integrated matching structures filter and match input/output to 50 Ω. It has integrated input and output DC blocking capacitors and bias structures to all stages. The MMIC is fabricated using PHEMT technology. The backside of this package part is both RF and DC ground. This helps simply the assembly process and reduces assembly related performance variations and costs. The surface mount package allows elimination of “chip & wire” assembly for lower cost. This MMIC is a cost effective alternative to hybrid (discrete-FET) amplifiers that require complex tuning and assembly process. • • • • • Surface Mount Package, 5.0 x 5.0 x 1.25 mm Integrated DC Block and Choke 50 Ω Input and Output Match Single Positive Supply Pin No Negative Gate Bias Specifications (Vd=4.5V, Idd=200mA) • • • • • Frequency Range 15GHz in, 30GHz out Output Power: 21 dBm Harmonic Suppression: 60dBc Single Positive Supply DC Requirements: 4.5V, 200mA Applications NC Vdd NC • Microwave Radio systems • Satellite VSAT, DBS Up/Down Link • Broadband Wireless Access) 1 2 3 Functional Block Diagram Package Diagram 1 RF IN 8 4 7 6 5 NC NC NC 2 3 RF OUT 8 X2 4 7 6 5 Pin 1 2 3 4 5 6 7 8 Function Vd RF Out RF In PACKAGE BASE GND Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model = 80V ESD Human Body Model = 250V Refer to Avago Application Note A004R: Electrostatic Discharge, Damage and Control. Note: MSL Rating = Level 2A Electrical Specifications 1. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C. 2. Pre-assembly into package performance verified 100% on-wafer per AMMC-6220 published specifications. 3. This final package part performance is verified by a functional test correlated to actual performance at one or more frequencies. 4. Specifications are derived from measurements in a 50 Ω test environment. Aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (Гopt) matching. 5. All tested parameters guaranteed with measurement accuracy +/-1dB/dBm/dBc Table 1. RF Electrical Characteristics Parameter Min Typ. Max Unit Conversion Gain, Gain 14 16 18.5 dB Operational Frequency, Freq 30 Output Power, Pout 18.5 Comment GHz 21 21.5 dBm Fundamental Suppression, FS 60 dBc 3rd Harmonic Suppression, 3H Sup 50 dBc Tested at 29.25 and 30 GHz Table 2. Recommended Operating Range 1. Ambient operational temperature TA = 25°C unless otherwise noted. 2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temperature (Tb) = 25°C calculated from measured data. Description Min. Drain Supply Current, Id Drain Supply Voltage, Vd 3.5 Typical Max. Unit Comments 200 250 mA Vd = 4.5 V, Under any RF power drive and temperature 4.5 5 V Table 3. Thermal Properties Parameter Test Conditions Value Thermal Resistance, qjc Channel-to-backside Thermal Resistance Tchannel(Tc)=34°C Thermal Resistance at backside temperature Tb=25°C qjc = 27 °C/W Absolute Minimum and Maximum Ratings Table 4. Minimum and Maximum Ratings Description Pin Drain to Ground Supply Voltage Min. Max. Unit Vdd 5 V Drain Current Idd 300 mA RF CW Input Power Pin 15 dBm +150 °C +150 °C +260 °C Channel Temperature Storage Temperature Maximum Assembly Temperature -65 Comments CW 20 second maximum Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. 2 AMMP-6130 Typical Performance (TA = 25°C, Vdd=4.5V, Idd=200 mA, Zin = Zout = 50Ω, Pin=3dBm unless otherwise stated) 20 65 18 16 60 45 40 C.G. 2H-1H 6 4 35 14.5 15 15.5 Input Frequency [GHz] 16 29 22 20 2H [dBm] 20 18 4V 3.5V 5V 4.5V 30 30.5 29 31 29.5 24 0 20 -5 16 -10 12 8 14GHz 16GHz 15GHz 4 -6 -4 -2 0 2 4 22 2H [dBm] 20 18 -40C 25C 85C 12 29.5 30 30.5 Frequency [GHz] Figure 7. Output Power vs. Output Freq @ Temp = 25C, -40C & 85C 3 -15 -20 -25 18 23 Frequency [GHz] Figure 6. Input and Output Return Loss vs. Freq 24 29 S11[dB] S22[dB] 13 Figure 5. Output Power vs. Input Power vs. Input Freq 14 31 -30 6 Pin [dBm] 16 30 30.5 Frequency [GHz] Figure 4. Fundamental, 2H & 3H Output Power vs. Output Freq Return Loss [dB] 2H [dBm] Figure 3. Output Power vs. Output Frequency @ 4 bias levels -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 2H 1H 3H Frequency [GHz] 0 31 10 0 29.5 30.5 15 5 12 29 30 Figure 2. Output Power vs. Output Frequency vs. Input Power 25 14 29.5 Output Frequency [GHz] 24 16 3dBm 5dBm 4dBm 14 25 Figure 1. Conversion Gain & Fundamental Sup vs. Input Freq 2H [dBm] 18 16 30 14 20 31 28 33 1H [dBm], 3H [dBm] 8 2H [dBm] 50 12 10 2H-1H [dBm] C.G.[dB] 22 55 14 2 24 Biasing and Operation The AMMP-6130 frequency doubler has been designed with a fully integrated self bias network; thus, requiring only a single 4.5v bias input with a typical current draw of 200mA. The one-stage frequency doubler relies on the non-linear behavior of the FET to produce the doubled signal at the output. A high-pass filter at the input shorts any reflected 2nd harmonic signal to ground. The input also consists of matching components tuned to 15GHz. An additional LC-filter is included at the input for stability. The doubler is operated at pinch-off to create a halfwave conduction angle ideal for generation of the 2nd harmonic. The AMMP-6130 is also designed for stability over temperature. Figure 8. Evaluation / Test Board (Available to qualified customer requests) C C3 Port Vd1 MLIN TL10 Port Vd2 MLIN TL11 MLIN TL12 MLOC TL8 C C2 Port Input_15G MLIN TL3 MLIN TL4 MLIN HP_FET TL7 HPFET1 MLIN TL2 C C9 C C10 R R1 Figure 9. Simplified Doubler-Amplifier Schematic 4 C MLIN C4 TL20 MLOC TL9 MLIN MLINTL14 TL17 R R2 C HP_FET C5 HPFET2 MLIN TL21 MLIN TL15 MLIN TL18 C C C11 C12 R R5 R R3 C HP_FET C6 HPFET3 MLIN TL13 MLIN TL22 MLIN TL16 MLIN TL19 C C C C R C15C13 C14 C16R6 R R4 C HP_FET C7 HPFET4 Port Output_30G Typical Scattering Parameters Please refer to <http://www.avagotech.com> for typical scattering parameters data. Package Dimension, PCB Layout and Tape and Reel information Please refer to Avago Technologies Application Note 5520, AMxP-xxxx production Assembly Process (Land Pattern A). AMMP-6130 Part Number Ordering Information Part Number Devices Per Container Container AMMP-6130-BLKG 10 Antistatic bag AMMP-6130-TR1G 100 “7”” Reel” AMMP-6130-TR2G 500 “7”” Reel” For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0287EN AV02-0514EN - July 9, 2013