Panasonic MA2SV04 Silicon epitaxial planar type for vco Datasheet

This product complies with the RoHS Directive (EU 2002/95/EC).
Variable Capacitance Diodes
MA2SV04
Silicon epitaxial planar type
Unit: mm
For VCO
0.13+0.05
–0.02
0.27+0.05
–0.02
VR
Junction temperature
Tj
Storage temperature
Tstg
0.7±0.1
Unit
6
V
150
°C
−55 to +150
°C
0.15 max.
Reverse voltage
Rating
0 to 0.01
Symbol
0.15 min.
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5˚
■ Absolute Maximum Ratings Ta = 25°C
Parameter
1
0.8±0.1
0.15 min.
• Good linearity and large capacitance-ratio in CD − VR relation
• Small series resistance rD
• SS-Mini type package, allowing downsizing of equipment and
automatic insertion through the taping package
5˚
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1.3±0.1
■ Features
1.7±0.1
2
1: Anode
2: Cathode
SSMini2 F2 Package
EIAJ: SC-79
Marking Symbol: 5
■ Electrical Characteristics Ta = 25°C ± 3°C
Symbol
ue
Parameter
IR
ce
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isc
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tin
Reverse current
Diode capacitance
Series resistance *
Conditions
Min
VR = 5 V
CD(1V)
VR = 1 V, f = 1 MHz
10.0
CD(3V)
VR = 3 V, f = 1 MHz
5.8
rD
VR = 3 V, f = 470 MHz
Typ
Max
Unit
10
nA
11.1
pF
6.4
0.35
Ω
Ma
int
en
an
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 470 MHz.
3. *: Measuring instrument; YHP MODEL 4191A RF IMPEDANCE ANALYZER
Publication date: March 2004
SKD00016CED
1
2
80
0
10 −2
Ta = 60°C
0
102
0
0.2
0.4
40
0.6
80
60
40
0.8
1.0
Ambient temperature Ta (°C)
120
1.2
Forward voltage VF (V)
VR = 5 V
IR  T a
10
1
10 −1
160
Diode capacitance CD (pF)
−40°C
1
Reverse voltage VR (V)
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Forward current IF (mA)
120
10
CD (Ta)
CD (Ta = 25°C)
100
ue
ce
/D
isc
on
tin
an
en
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Ma
Reverse current IR (nA)
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MA2SV04
This product complies with the RoHS Directive (EU 2002/95/EC).
IF  V F
102
CD  VR
f = 1 MHz
Ta = 25°C
20
0
8
16
24
SKD00016CED
32
40
1.04
CD  Ta
25°C
0.98
f = 1 MHz
1.03
VR = 1 V
1.02
3V
1.01
1.00
0.99
0
Ambient temperature Ta (°C)
20
40
60
80
100
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semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
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company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
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systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
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thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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