HI-8200, HI-8201, HI-8202 Quad 10 Ohm +/-12V outside-the-rails Analog Switch with Open Circuit when Power Off December 2012 GENERAL DESCRIPTION The HI-8200 is a quad analog CMOS switch fabricated with Silicon-on-Insulator (SOI) technology for latch-up free operation and maximum switch isolation. High voltage gate drive is entirely created on-chip enabling +/-12V switching range from a single 3.3V or 5V supply. These switches are ideally suited for applications demanding low switch leakage when the power pins are 0V. At 25°C and with VDD from 3.0V to 5.5V, the switch resistance (RON) is typically 8W. RON is independent of VDD. In a switching range of -5V to +5V, the maximum deviation of RON from flat is less than 5%. These switches conduct equally well in either direction. Power down and Off state leakages are less than 10nA maximum. Charge injection is less than 10pC. Switching times are typically 180ns to the On state and 60ns to the Off state. The onboard charge pump allows an On/Off cycle time of 5KHz for all four switches simultaneously before the switching range becomes restricted. FEATURES ·CMOS analog switches with up to +/-12V switching range from a single 3.3V or 5V supply · Low RON: 10W max at 25°C · Robust CMOS Silicon-on-Insulator (SOI) technology · Switch nodes are open-circuit when chip is powered down · SOI switch isolation with 1nA typical Off leakage · ESD protection > 4KV HBM · Fast switching time with break-before-make · Low power · Extended Temperature Range (-55°C to +125°C) PIN CONFIGURATIONS (Top Views) IN1 1 20 IN2 S1A 2 19 S2A -3 18 - S1B 4 17 S2B V- 5 15 VLOGIC S4B 7 14 S3B -8 13 - S4A 9 12 S3A IN4 10 11 IN3 14 IN2 13 S2A HI-8200PSx 20-Pin TSSOP package 16 S1A Industry-standard plastic package options include 20-pin TSSOP, 16-pin DIP and 16-pin QFN. Ceramic packaging is available on request. All three products are offered in both industrial (-40°C to +85°C) and extended (-55°C to +125°C) temperature range options. 16 V+ GND 6 15 IN1 The HI-8200 provides four each normally open switches when the switch control inputs are low. The HI-8201 provides four each normally closed switches when the switch control inputs are low. The HI-8202 provides a combination of two normally closed and two normally open switches. S1B 1 12 S2B V- 2 11 V+ GND 3 APPLICATIONS 10 VLOGIC S4B 4 IN3 7 S3B S3A 8 · Avionics IN4 6 S4A 5 9 · Data bus isolation · Sample-and-Hold circuits · Test Equipment HI-8200PCx 16-pin 5mm x 5mm Chip-scale package (see page 6 for additional package configurations) · Communications Systems PRODUCT OPTIONS PART TYPE IN1 HI-8200 0 1 HI-8201 0 1 HI-8202 0 1 (DS8200 Rev. B) HOLT INTEGRATED CIRCUITS www.holtic.com Switch 1 Open Closed Closed Open Open Closed IN2 0 1 0 1 0 1 Switch 2 Open Closed Closed Open Closed Open IN3 0 1 0 1 0 1 Switch 3 Open Closed Closed Open Closed Open IN4 0 1 0 1 0 1 Switch 4 Open Closed Closed Open Open Closed 12/12 HI-8200, HI-8201, HI-8202 PIN DESCRIPTIONS SIGNAL FUNCTION IN1 S1A S1B VGND S4B S4A IN4 IN3 S3A S3B VLOGIC V+ S2B S2A IN2 Logic Input Switch Node Switch Node CAP Supply Switch Node Switch Node Logic Input Logic Input Switch Node Switch Node Supply CAP + Switch Node Switch Node Logic input DESCRIPTION HI-8200 and HI-8202 are normally Open when input Low Switch 1 Node Switch 1 Node Bulk storage capacitor. Add 0.1uF ceramic capacitor to GND. (20V or higher). Reference Ground Switch 4 Node Switch 4 Node HI-8200 and HI-8202 are normally Open when input Low HI-8201 and HI-8202 are normally Closed when input Low Switch 3 Node Switch 3 Node 3.3V or 5.0V Logic supply Bulk storage capacitor. Add 0.1uF ceramic capacitor to GND. (20V or higher). Switch 2 Node Switch 2 Node HI-8201 and HI-8202 are normally Closed when input Low NOTE: V+ and V- pins are only to be used for connection of bulk storage capacitors and MUST NOT be loaded. 35W 30W 25W T = -55C T = +125C 20W T = +25C 15W 10W 5W -18V -12V -6V 0V VSWITCH 6V 12V 18V Typical RON as a function of VSWITCH and Temperature (10mA switch current, VSUPPLY = +3.3V) HOLT INTEGRATED CIRCUITS 2 HI-8200, HI-8201, HI-8202 ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND = 0V) Supply Voltage, VLOGIC .........................................................................7.0V Continuous Power Dissipation (TA=70°C): SO Package (derate 6.7mW/°C above 70°C)...................696mW Switch Current (either direction, DC): .................................................20mA Plastic DIP (derate 10.53 mw/°C above 70°C) .................842mW Peak Switch Current (1 ms pulse, 10% duty cycle max.)..................100mA Thin QFN (derate 21.3mW/°C above 70°C) ...................1702mW Digital Input Voltage (IN1-4):.....................................-0.3V to VLOGIC + 0.3V Operating Temperature Range: (Industrial)..........................-40°C to +85°C Storage Temperature Range: (Hi-Temp) ........................-55°C to +125°C Soldering Temperature: Maximum Junction Temperature ........................................................175°C ......................................-65°C to +150°C (Ceramic)......................60 sec. at +300°C (Plastic - leads).............10 sec. at +280°C (Plastic - body) .....................+260°C Max. NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS VLOGIC = 3.3V or 5.0V, GND = 0V. Operating temperature range (unless otherwise noted). PARAMETER SYMBOL CONDITIONS FIGURE MIN TYP MAX UNIT RON 12V > Vs > -12V 1 6 8 10 W |ISWLEAK| 12V > Vs > -12V 2 1 10 nA SWITCH PARAMETERS Switch Resistance, 25°C, 10mA Leakage - (open circuit and power down) LOGIC INPUTS Input High Voltage VIH Input Low Voltage VIL Input Current IIH 75% V 25% V 0.5 µA µA µA 5.5 V inputs static VLogic = 3.3V Vlogic = 5.0V 1.0 2.5 mA mA any load 5 Khz 180 250 ns 80 150 80K Ohm pulldown VLogic = 3.3V Vlogic = 5.0V 45 65 IIL SUPPLY VLogic Operating Range VDD VLogic Operating Current IDD 3.0 DYNAMIC PARAMETERS Max Vin On/Off cycling fcycle Turn On Time TON Turn Off time 3 TOFF 3 Break-Before-Make Time TD 4 Charge Injection Q VS=0V, RS=0W, 25°C Off Isolation RR Crosstalk ns 80 ns 5 -20 pC f = 1 MHz, 25°C 6 65 dB CR f = 1 MHz, 25°C 7 90 dB Capacitance COFF CON Switch Off, 25°C Switch On, 25°C 8 9 15 60 pF pF Charge Pump Power On Tvon V+ and V- = +/-14.5V VLogic = 5.0V 10 HOLT INTEGRATED CIRCUITS 3 40 10 ms HI-8200, HI-8201, HI-8202 TEST CIRCUITS IDS V1 SA VS + - RON = V1/IDS + - VS Figure 1 - On Resistance +3.3V 0.1µF 0.1µF (20V) V+ SA VD + - Figure 2 - Off Leakage VIN (HI-8201) VLOGIC ID(OFF) SB A IS(OFF) SA A SB 50% 50% 50% 50% VIN (HI-8200) SB VOUT IN VS GND + - V- 35pF 90% 300W 50% VOUT 0.1µF (20V) t ON t OFF Figure 3. Switching Times 0.1µF +3.3V 0.1µF (20V) 3.3V VLOGIC VIN V+ 50% 50% 0V VS1 VS2 S1A S1B S2A S2B IN VOUT1 VOUT2 35pF GND V- 35pF 90% 50% VOUT1 300W 300W 90% VOUT2 50% 0.1µF (20V) tD Figure 4. Break-Before-Make Time Delay (HI-8202) HOLT INTEGRATED CIRCUITS 4 tD HI-8200, HI-8201, HI-8202 +3.3V VLOGIC RS 0.1µF (20V) V+ SA SB VOUT VIN IN VS GND + - CL 10nF V- DVOUT VOUT 0.1µF (20V) QINJ = CL x DVOUT Figure 5. Charge Injection 0.1µF 0.1µF +3.3V +3.3V 0.1µF (20V) 0.1µF (20V) V+ VLOGIC VLOGIC SA1 V+ SA SB SB1 50W IN1 VOUT VS IN IN2 GND 50W V- VS SB2 VOUT 0.1µF (20V) 50W SA2 GND NC V- 0.1µF (20V) Figure 6 - Off Isolation Figure 7 - Channel-to-Channel Crosstalk 0.1µF +3.3V VLOGIC 0.1µF (20V) V+ SA Capacitance Meter f=1MHz 0.1µF VLOGIC SB SA Capacitance Meter f=1MHz IN GND +3.3V V- 0.1µF (20V) V+ SB IN GND V- 0.1µF (20V) 0.1µF (20V) Figure 8 - Off Capacitance Figure 9 - On Capacitance HOLT INTEGRATED CIRCUITS 5 VS HI-8200, HI-8201, HI-8202 15V +3.3V 0.1µF (20V) 10V VLOGIC V+ 5V T=0 0V -5V GND +3.3V +- V- -10V -15V 0.1µF (20V) T=0 2ms Figure 10. Charge Pump Power On Additional package configurations IN1 1 16 IN2 S1A 2 15 S2A S1B 3 14 S2B V- 4 13 V+ GND 5 12 VLOGIC S4B 6 11 S3B S4A 7 10 S3A IN4 8 9 IN3 HI-8200PDx 16-Pin DIP package HOLT INTEGRATED CIRCUITS 6 4ms 6ms Time 8ms 10ms HI-8200, HI-8201, HI-8202 ORDERING INFORMATION HI - 820x xx x x PART NUMBER Blank F PART NUMBER LEAD FINISH Tin / Lead (Sn / Pb) Solder Pb-free, RoHS compliant TEMPERATURE RANGE FLOW BURN IN I -40°C TO +85°C I NO T -55°C TO +125°C T NO M -55°C TO +125°C M YES PART NUMBER PACKAGE DESCRIPTION PC 16 PIN PLASTIC 5 x 5 mm CHIP SCALE (16PCS1) (No M-flow, Pb-free only) PS 20 PIN PLASTIC TSSOP (20HS) PD 16 PIN PLASTIC DIP (16P) PART NUMBER FUNCTION 8200 QUAD SWITCH, NORMALLY OPEN 8201 QUAD SWITCH, NORMALLY CLOSED 8202 QUAD SWITCH, TWO NORMALLY OPEN, TWO NORMALLY CLOSED HOLT INTEGRATED CIRCUITS 7 HI-8200, HI-8201, HI-8202 REVISION HISTORY P/N Rev DS8200 New A B Date 10/18/12 10/22/12 12/18/12 Description of Change Initial Release Remove 1MOhm resistor to GND from test circuits. Correct typo in Pin Descriptions Clarify that V+/V- pins must not be loaded. Used only for connection of bulk storage caps. HOLT INTEGRATED CIRCUITS 8 HI-8200 PACKAGE DIMENSIONS inches (millimeters) 20-PIN PLASTIC TSSOP Package Type: 20HS .2555 ± .0035 (6.500 ± .100) .252 ± .006 (6.400 ± .150) .006 ± .002 (.145 ± .055) .173 ± .004 (4.400 ± .100) Pin 1 See Detail A .0095 ± .0025 (.245 ± .055) .036 ± .005 (.925 ± .125) .026 BSC (.650) 0° to 8° .018 - .029 (.450 - .750) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) .004 ± .002 (.100 ± .050) Detail A millimeters 16-PIN PLASTIC CHIP-SCALE PACKAGE Package Type: 16PCS1 Electrically isolated metal heat sink on bottom of package 3.38 ± 0.05 (0.133 ± 0.002) 3.38 ± 0.05 (0.133 ± 0.002) Top View 5.00 ± 0.05 (0.197 ± 0.002) Connect to any ground or power plane for optimum thermal dissipation Bottom View 5.00 ± 0.05 (0.197 ± 0.002) .50 ± 0.05 (0.020 ± 0.002) 0.20 (0.008) min. 0.75 ± 0.05 (0.03 ± 0.002) 0.203 (0.008) 0.025 ± 0.025 (0.001 ± 0.001) 0.80 (0.031) BSC REF. 0.30 ± 0.05 (0.012 ± 0.002) HOLT INTEGRATED CIRCUITS 9 BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HI-8200 PACKAGE DIMENSIONS 16-PIN PLASTIC DIP Package Type: 16P 0.745 (18.923) 0.810 (20.574) 0.240 (6.096) 0.260 (6.604) 0.290 (7.366) 0.310 (7.874) 0.015 (0.381) 0.035 (0.889) 0.125 (3.175) 0.150 (3.810) 0.120 (3.048) 0.150 (3.810) 0.015 (0.381) 0.023 (0.584) 0.100 (2.54) BSC. 0.045 (1.143) 0.065 (1.651) HOLT INTEGRATED CIRCUITS 10 0.008 (0.203) 0.015 (0.381) 0.300 (7.620) 0.370 (9.398) inches (millimeters)