PROTEC LC0406FC24C 200w low capacitance flip chip tvs array Datasheet

05158
LC0406FC3.3C - LC0406FC36C
Only One Name Means ProTek’Tion™
200w low capacitance flip chip tvs array
Description
The LC0406FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In addition, the LC0406FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
Features
applications
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Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
Protection for 3 to 5 Lines
Bidirectional and Monolithic Structure
Low Clamping Voltage
Low Capacitance
RoHS Compliant
REACH Compliant
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
Mechanical characteristics
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Standard EIA Chip Size: 0406
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
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05158
LC0406FC3.3C - LC0406FC36C
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typical device characteristics
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
VALUE
UNITS
PPP
200
Watts
TA
-55 to 150
°C
TSTG
-55 to 150
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
@ I P = 1A
VC
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(Note 2)
@VWM
ID
µA
TYPICAL
CAPACITANCE
V WM
VOLTS
@ 1mA
V(BR)
VOLTS
LC0406FC3.3C
3.3
LC0406FC05C
5.9
4.0
7.0
6.0
11.0
12.5V @ 16A
75*
70
13.0 @ 15A
10**
35
LC0406FC08C
8.0
8.5
13.2
18.0V @ 11A
1
32
LC0406FC12C
12.0
13.3
19.8
26.9V @ 7.4A
1
30
LC0406FC15C
LC0406FC24C
15.0
16.7
25.4
34.5V @ 5.8A
1
25
24.0
26.7
37.2
50.6V @ 4A
1
20
LC0406FC36C
36.0
40.0
70.0
80.0V @ 2.5A
1
18
@ 8/20µs
VC @ I PP
@0V, 1MHz
C
pF
notes
1. All devices are bidirectional. Electrical characteristics apply in both directions.
2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V.
05158.R7 2/11
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05158
LC0406FC3.3C - LC0406FC36C
Only One Name Means ProTek’Tion™
typical device characteristics
figure 1
peak pulse power vs pulse time
PPP - Peak Pulse Power - Watts
10,000
1,000
200W, 8/20µs Waveform
100
10
0.1
10
100
td - Pulse Duration - µs
Peak Value IPP
80
100
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
e-t
60
40
10,000
figure 3
power derating curve
Peak Pulse Power
8/20µs
80
% Of Rated Power
tf
100
td = t/(IPP/2)
60
40
20
20
0
1,000
figure 2
pulse wave form
120
IPP - Peak Pulse Current - % of IPP
1
0
05158.R7 2/11
5
10
15
t - Time - µs
20
25
0
30
Page 3
Average Power
0
25
50
75 100 125
TA - Ambient Temperature - °C
150
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05158
LC0406FC3.3C - LC0406FC36C
Only One Name Means ProTek’Tion™
typical device characteristics
figure 4
overshoot & clamping voltage for LC0406fc05c
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape)
figure 5
typical clamping voltage vs peak pulse current LC0406fc05c
VC - Clamping Voltage - Volts
12
8
4
0
0
05158.R7 2/11
5
10
IPP - Peak Pulse Current - Amps
Page 4
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20
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05158
LC0406FC3.3C - LC0406FC36C
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SOLDER REFLOW INFORMATION
printed circuit board recommendations
parameter
value
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
Requirements
recommended non-solder mask
defined pad illustration
Temperature:
TP for Lead-Free (Sn/Ag/Cu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
TP
Solder Melt
(Maximum Temp)
Temperature - °C
Ramp-Up
Ramp-Down
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
05158.R7 2/11
Ramp-Up
15 seconds
(Minimize)
Page 5
Solder-Time
15-20 seconds
Ramp-Down
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05158
LC0406FC3.3C - LC0406FC36C
Only One Name Means ProTek’Tion™
0406 package information
outline dimensions
dim
millimeters
min
max
inches
min
max
A
0.56
0.022
B
0.86
0.034
C
0.98
E
F
0.038
1.53
0.058
0.127
0.003
0.15 SQ
1.47
G
H
1.02
0.006 SQ
0.15
0.076
I
0.040
0.060
0.006
0.406
0.005
0.016
Notes
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
TOP
A
B C
SIDE
G
E
F
H
I
END
05158.R7 2/11
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05158
LC0406FC3.3C - LC0406FC36C
Only One Name Means ProTek’Tion™
0406 package information
Option 1 - layout dimensions
millimeters
inches
nominal
nominal
A
0.51
0.020
C
0.30
0.012
D
0.46
0.018
E
0.20
0.008
F
0.15 SQ
0.006 SQ
G
0.71
0.028
H
0.99
0.039
I
0.51
0.020
dim
C
D
A
DIE
SOLDER
BUMPS
E
H G
I
Notes
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
3. Preferred: Usign 0.1mm (0.004”) stencil.
F
SOLDER PADS
SOLDER PRINT
0.010” - 0.012” DIA.
COPPER CONTACTS
0.009”[0.23] DIA.
Option 2 - layout dimensions
millimeters
inches
nominal
nominal
A
0.51
0.020
F
0.15 SQ
0.006 SQ
G
0.71
0.028
H
0.99
0.039
I
0.51
0.020
dim
SOLDER MASK
A
DIE
SOLDER
BUMP
H G
Notes
I
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
3. Preferred: Usign 0.1mm (0.004”) stencil.
F
SOLDER PRINT
0.014”[0.36] DIA.
05158.R7 2/11
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SOLDER MASK
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05158
LC0406FC3.3C - LC0406FC36C
Only One Name Means ProTek’Tion™
TAPE AND REEL information
D
t
P2
Top Cover
Tape
10 Pitches Cumulative
Tolerance on tape ± 0.2
E
P0
A0
F
K0
W
B0
P
User Direction of Feed
specifications
Reel Dia.
Tape
Width
178(7”)
8
A0
B0
K0
D
E
F
P0
P2
P
tmax
0.80 ± 0.10 1.20 ± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.12 2.00 ± 0.05 2.00 ± 0.10
Notes
1.
2.
3.
4.
5.
6.
W
0.25
tape & reel orientation
Dimensions in millimeters.
Top view of tape. Solder bumps are face down in tape package.
Orientation: preferred stencil - 0.1mm (0.004”).
Surface mount product is taped and reeled in accordance with EIA 481.
8mm plastic tape: 7” Reels - 5,000.
Marking on reel: part number, date code and lot number.
Triple Die - 0406
Package outline, pad layout and tape specifications per document number 06023.R4 9/09.
ORDERING INFORMATION
base PART NUMBER
(xx = voltage)
LEADFREE SUFFIX
TAPE SUFFIX
QTY/REEL
REEL SIZE
TUBE qty
LC0406FCxxC
-LF
-T75-1
5,000
7”
n/a
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05158
LC0406FC3.3C - LC0406FC36C
Only One Name Means ProTek’Tion™
company information
COMPANY PROFILE
ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for
the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide
application specific protection solutions for all electronic equipment/systems.
ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products.
CONTACT US
Corporate Headquarters
2929 South Fair Lane
Tempe, Arizona 85282
USA
By Telephone
General: 602-431-8101
Sales: 602-414-5109
Customer Service: 602-414-5114
By Fax
General: 602-431-2288
By E-mail:
Sales: [email protected]
Customer Service: [email protected]
Technical Support: [email protected]
Web
www.protekdevices.com
www.protekanalog.com
COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice.
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of
its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special,
consequential or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory.
PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”.
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