CYStech Electronics Corp. Spec. No. : C327SL Issued Date : 2003.05.21 Revised Date : Page No. : 1/3 SURFACE MOUNT DIODES MF400XSL Description The MF400XSL is designed for general purpose rectification application in hybrid thick-and thin-film circuits. Features • Low forward voltage drop and low leakage current • High current capability • High surge current capability • Plastic material used carries UL flammability classification 94V-0 utilizing flame retardant epoxy molding compound. • High reliability • Small surface mount package Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Type Number MF 4001 50 35 50 MF 4002 100 70 100 Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on Rated Load(JEDEC method) Maximum Instantaneous Forward Voltage @ 1.0A Maximum DC Reverse Current at Rated DC Blocking Voltage Typical Junction Capacitance (Note 1) Thermal Resistance, Junction to Ambient Operating Temperature Range Tj Storage Temperature Range Tstg Notes: 1. Measured at 1 MHz and applied reverse voltage of 4.0Volts MF400XSL MF 4003 200 140 200 MF 4004 400 280 400 1 MF 4005 600 420 600 MF 4006 800 560 800 MF 4007 1000 700 1000 Units V V V A 30 A 1 V 5 (@Ta=25°C) 50 (@Ta=125°C) 15 50 -65 to +175 -65 to +175 µA pF ℃/W °C °C CYStek Product Specification Spec. No. : C327SL Issued Date : 2003.05.21 Revised Date : Page No. : 2/3 CYStech Electronics Corp. Characteristic Curves Maximum Non-Repetitive Forward Surge Current Forward Current Derating Curve 35 Peak Forward Surge Current---IFSM(A) Average Forward Current---Io(A) 1.2 1 0.8 0.6 0.4 Single phase, half wave, 60Hz. Resistive or inductive load 0.2 30 Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method 25 20 15 10 5 0 0 0 20 40 60 1 80 100 120 140 160 180 200 100 Number of Cycles at 60Hz Ambient Temperature---TA(℃ ) Forward Current vs Forward Voltage Junction Capacitance vs Reverse Voltage 35 100 Tj=25℃, Pulse width=300μs 1% Duty cycle 10 Junction Capacitance---CJ(pF) Forward Current---IF(A) 10 1 0.1 0.01 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 Forward Voltage---VF(V) 30 25 20 15 10 5 0 0.01 0.1 1 10 100 Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage Reverse Leakage Current---IR(A) 100 10 Tj=100℃ 1 0.1 Tj=25℃ 0.01 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) MF400XSL CYStek Product Specification CYStech Electronics Corp. Spec. No. : C327SL Issued Date : 2003.05.21 Revised Date : Page No. : 3/3 Melf Dimension Cathode Mark A B D Melf plastic package CYStek package code:SL C *:Typical DIM A B Inches Min. Max. 0.095 0.105 0.018 0.024 Millimeters Min. Max. 2.40 2.70 0.46 0.60 DIM C D Inches Min. Max. 0.018 0.024 0.190 0.205 Millimeters Min. Max. 0.46 0.60 4.8 5.2 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MF400XSL CYStek Product Specification