Material Content Data Sheet Sales Product Name BSS816NW H6327 MA# MA001055680 Package PG-SOT323-3-2 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material non noble metal non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% tin gold silicon zinc tin chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-31-5 7440-57-5 7440-21-3 7440-66-6 7440-31-5 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 17. April 2015 Weight [mg] 6.20 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.002 0.03 334 0.008 0.13 1294 0.122 1.97 0.005 0.09 860 0.007 0.11 1075 0.008 0.13 2.644 42.68 43.01 426799 430024 0.026 0.42 0.42 4161 4161 0.030 0.49 0.650 10.49 2.343 37.82 48.80 378201 488001 0.133 2.14 2.14 21418 21418 0.217 3.50 3.50 35025 2.13 19743 2. 3. 4880 104920 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 21371 1290 Important Remarks: 1. Sum [ppm] 35025 1000000