TI LP3961EMP-3.3 Lp396x 800-ma fast ultra-low-dropout linear regulator Datasheet

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LP3961, LP3964
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LP396x 800-mA Fast Ultra-Low-Dropout Linear Regulators
1 Features
3 Description
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•
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The LP396x series of fast ultra-low-dropout linear
regulators operate from a 2.5-V to 7-V input supply. A
wide range of preset output voltage options are
available. These ultra-low dropout linear regulators
respond very fast to step changes in load which
makes them suitable for low-voltage microprocessor
applications. The LP3961 and LP3964 are developed
on a CMOS process which allows low quiescent
current operation independent of output load current,
as well as operation under extremely low dropout
conditions.
1
•
•
•
Input Supply Voltage: 2.5 V to 7 V
Ultra-Low Dropout Voltage
Low Ground Pin Current
Load Regulation of 0.02%
15-µA Quiescent Current in Shutdown Mode
Specified Output Current of 0.8-A DC
Output Voltage Accuracy ±1.5%
ERROR Flag Indicates Output Status (LP3961)
Sense Option Improves Better Load Regulation
(LP3964)
Extremely Low Output Capacitor Requirements
Overtemperature and Overcurrent Protection
−40°C to 125°C Junction Temperature Range
2 Applications
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•
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Microprocessor Power Supplies
GTL, GTL+, BTL, and SSTL Bus Terminators
Power Supplies for DSPs
SCSI Terminator
Post Regulators
High-Efficiency Linear Regulators
Battery Chargers
Other Battery-Powered Applications
Dropout Voltage: Ultra-low dropout voltage; typically
24 mV at 80-mA load current and 240 mV at 800-mA
load current.
Ground Pin Current: Typically 4 mA at 800-mA load
current.
ERROR Flag: ERROR flag goes low when the output
voltage drops 10% below nominal value (for LP3961).
SENSE: SENSE pin improves regulation at remote
loads (for LP3964).
Precision Output Voltage: Multiple output voltage
options are available ranging from 1.2 V to 5 V and
adjustable (LP3964), with a specified accuracy of
±1.5% at room temperature, and ±3% over all
conditions (varying line, load, and temperature).
Device Information(1)
PACKAGE
BODY SIZE (NOM)
LP3961
LP3964
PART NUMBER
SOT-223 (5)
6.50 mm × 3.56 mm
TO-263 (5)
10.16 mm × 8.42 mm
LP3964
TO-220 (5)
14.986 mm × 10.16 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
LP3964 Typical Application Circuits
LP3961 Typical Application Circuit
A.
*
SD and ERROR pins must be pulled high
through a 10-kΩ pullup resistor. Connect
the ERROR pin to ground if this function is
not used.
*
See note A on LP3961 Typical Application
Circuit.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP3961, LP3964
SNVS056J – MAY 2000 – REVISED JUNE 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configurations and Functions .......................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics .............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 13
8
Application and Implementation ........................ 14
8.1 Application Information .......................................... 14
8.2 Typical Applications ................................................ 14
9 Power Supply Recommendations...................... 19
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
10.3 Heatsinking TO-220 Packages ............................. 20
11 Device and Documentation Support ................. 21
11.1
11.2
11.3
11.4
11.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
21
21
21
21
21
12 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (December 2014) to Revision J
Page
•
Changed pin names to conform to TI nomenclature (VOUT to OUT, VIN to IN)....................................................................... 1
•
Changed "I" to "O" to correct I/O type for ERROR flag ......................................................................................................... 3
•
Deleted Lead temperature row - info in POA ........................................................................................................................ 4
•
Deleted heatsinking sections re TO-263 and SOT-223 packages; not consistent with updated thermal metrics .............. 20
Changes from Revision H (April 2013) to Revision I
•
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Revision G (April 2013) to Revision H
2
Page
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5 Pin Configurations and Functions
5-Pin NDC
SOT-223 Package
Top View
5-Pin NDH
TO-220 Package (LP3964)
Top View
5-Pin KTT
SFM/TO-263 Package
Top View
Pin Functions
PIN
NO.
NAME
I/O
LP3964
LP3961
SOT-223
TO-220
SFM/TO-263
DESCRIPTION
ERROR
4
—
—
O
ERROR flag
GND
5
5
3
—
Ground
IN
2
2
2
I
Input supply
OUT
3
3
4
O
Output voltage
SD
1
1
1
I
Shutdown
SENSE/AD
J
—
4
5
I
Remote sense pin or output adjust pin
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6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
MIN
MAX
UNIT
Power dissipation (3)
Internally Limited
Input Supply Voltage (Survival)
−0.3
7.5
V
Shutdown Input Voltage (Survival)
−0.3
VIN + 0.3
V
−0.3
7.5
V
Output Voltage (Survival)
(4) (5)
,
IOUT (Survival)
Short-Circuit Protected
Maximum Voltage for ERROR pin
VIN + 0.3
Maximum Voltage for SENSE pin
Storage temperature, Tstg
(1)
(2)
(3)
(4)
(5)
V
VOUT + 0.3
V
150
°C
–65
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications
and test conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some
performance characteristics may degrade when the device is not operated under the listed test conditions.
If Military- or Aerospace-specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
using: P(MAX) = (TJ(MAX) – TA) / RθJA.
If used in a dual-supply system where the regulator load is returned to a negative supply, the LP396X output must be diode-clamped to
ground.
The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get
forward biased if the voltage at the OUT pin is forced to be higher than the voltage at the IN pin. This diode can typically withstand 200
mA of DC current and 1 A of peak current.
6.2 ESD Ratings
V(ESD)
(1)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
Electrostatic discharge
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process..
6.3 Recommended Operating Conditions
MIN
MAX
2.5
7
V
−0.3
VIN + 0.3
V
0.8
A
125
°C
Input supply voltage (operating) (1)
Shutdown input voltage (operating)
Maximum operating current (DC)
−40
Operating junction temperature
(1)
UNIT
The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5 V, whichever is greater.
6.4 Thermal Information
LP3961, LP3964
THERMAL METRIC (1)
NDC
KTT
LP3964
NDH
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
65.2
40.3
32.1
RθJC(top)
Junction-to-case (top) thermal resistance
47.2
43.4
43.8
RθJB
Junction-to-board thermal resistance
9.9
23.1
18.7
ψJT
Junction-to-top characterization parameter
3.4
11.5
8.8
ψJB
Junction-to-board characterization parameter
9.7
22.1
18.0
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
1.0
1.3
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
Unless otherwise specified: TJ = 25°C, VIN = VO(NOM) + 1 V, IL = 10 mA, COUT = 33 µF, VSD = VIN – 0.3 V.
MIN (1)
TYP (2)
MAX (1)
10 mA ≤ IL ≤ 800 mA,
VOUT + 1 ≤ VIN ≤ 7 V
–1.5%
0%
1.5%
10 mA ≤ IL ≤ 800 mA,
VOUT + 1 ≤ VIN ≤ 7 V,
–40°C ≤ TJ ≤ 125°C
–3%
PARAMETER
VO
Output voltage tolerance
VADJ
ΔVOL
ΔVO /
ΔIOUT
TEST CONDITIONS
(3)
Adjust pin voltage (ADJ version)
Output voltage line regulation (3)
Output voltage load regulation (3)
VIN – VOUT Dropout voltage (4)
10 mA ≤ IL ≤ 800 mA,
VOUT + 1.5 V ≤ VIN ≤ 7 V
1.198
10 mA ≤ IL ≤ 800 mA,
VOUT + 1.5 V ≤ VIN ≤ 7 V,
–40°C ≤ TJ ≤ 125°C
1.180
3%
1.216
V
VOUT + 1 V < VIN < 7 V
0.02%
VOUT + 1 V < VIN < 7 V,
–40°C ≤ TJ ≤ 125°C
0.06%
10 mA < IL < 800 mA
0.02%
10 mA < IL < 800 mA,
–40°C ≤ TJ ≤ 125°C
0.08%
IL = 80 mA
24
30
35
IL = 800 mA
240
IL = 800 mA, –40°C ≤ TJ ≤ 125°C
Ground pin current in normal
operation mode
1.234
1.253
IL = 80 mA, –40°C ≤ TJ ≤ 125°C
IGND
UNIT
300
mV
350
IL = 80 mA
3
IL = 80 mA, –40°C ≤ TJ ≤ 125°C
9
10
IL = 800 mA
4
IL = 800 mA, –40°C ≤ TJ ≤ 125°C
14
mA
15
IGND
Ground pin current in shutdown
mode (5)
VSD ≤ 0.2 V
IO(PK)
Peak output current
See (6)
1.2
See (6), –40°C ≤ TJ ≤ 125°C
1.1
15
VSD ≤ 0.2 V, –40°C ≤ TJ ≤ 125°C
25
µA
75
1.5
A
2.8
A
165
°C
10
°C
SHORT-CIRCUIT PROTECTION
ISC
Short-circuit current
OVERTEMPERATURE PROTECTION
Tsh(t)
Shutdown threshold
Tsh(h)
Thermal shutdown hysteresis
SHUTDOWN INPUT
Output = High
VSDT
Shutdown threshold
Output = High, –40°C ≤ TJ ≤
125°C
Output = Low
Output = Low, –40°C ≤ TJ ≤ 125°C
(1)
(2)
(3)
(4)
(5)
(6)
VIN
VIN – 0.3
V
0
0.2
Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using
Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely parametric norm.
Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the input line voltage.
Output voltage load regulation is defined as the change in output voltage from the nominal value due to change in load current. The line
and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the
output voltage tolerance specification.
Dropout voltage is defined as the minimum input-to-output differential voltage at which the output drops 2% below the nominal value.
Dropout voltage specification applies only to output voltages of 2.5 V and above. For output voltages below 2.5 V, the drop-out voltage
is nothing but the input-to-output differential voltage because the minimum input voltage is 2.5 V.
This specification has been tested for –40°C ≤ TJ ≤ 85°C because the temperature rise of the device is negligible under shutdown
conditions.
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
using: P(MAX) = (TJ(MAX) – TA) / RθJA.
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Electrical Characteristics (continued)
Unless otherwise specified: TJ = 25°C, VIN = VO(NOM) + 1 V, IL = 10 mA, COUT = 33 µF, VSD = VIN – 0.3 V.
PARAMETER
TEST CONDITIONS
MIN (1)
TYP (2)
MAX (1)
UNIT
TdOFF
Turnoff delay
IL = 800 mA
20
TdON
Turnon delay
IL = 800 mA
25
µs
µs
ISD
SD input current
VSD = VIN
1
nA
ERROR FLAG COMPARATOR
VT
Threshold
See (7)
See (7), –40°C ≤ TJ ≤ 125°C
VTH
Threshold hysteresis
See (7)
See (7), –40°C ≤ TJ ≤ 125°C
VEF(Sat)
ERROR flag saturation
10%
5%
16%
5%
2%
Isink = 100 µA
8%
0.02
Isink = 100 µA
V
0.1
Td
Flag reset delay
1
µs
Ilk
ERROR flag pin leakage current
1
nA
Imax
ERROR flag pin sink current
1
mA
VERROR = 0.5 V (overtemperature)
AC PARAMETERS
PSRR
Ripple rejection
ρn(l/f)
Output noise density
en
Output noise voltage (rms)
(7)
6
VIN = VOUT + 1.5 V,
COUT = 100 µF,
VOUT = 3.3 V
60
VIN = VOUT + 0.3 V,
COUT = 100 µF,
VOUT = 3.3 V
40
f = 120 Hz
0.8
BW = 10 Hz to 100 kHz
150
BW = 300 Hz to 300 kHz
100
dB
µV
µVRMS
ERROR flag threshold and hysteresis are specified as percentage of regulated output voltage.
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6.6 Typical Characteristics
Unless otherwise specified, VIN = VO(NOM) + 1 V, VOUT = 2.5 V, COUT = 33 µF, IOUT = 10 mA, CIN = 68 µF, VSDT = VIN, and
TA = 25°C.
Figure 1. Drop-Out Voltage vs Temperature for Different
Load Currents
Figure 2. Drop-Out Voltage vs Temperature for Different
Output Voltages (IOUT = 800 mA)
Figure 3. Ground Pin Current vs Input Voltage (VSD = VIN)
Figure 4. Ground Pin Current vs Input Voltage (VSD = 100
mV)
Figure 5. Ground Current vs Temperature (VSD = VIN)
Figure 6. Ground Current vs Temperature (VSD = 0 V)
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Typical Characteristics (continued)
Unless otherwise specified, VIN = VO(NOM) + 1 V, VOUT = 2.5 V, COUT = 33 µF, IOUT = 10 mA, CIN = 68 µF, VSDT = VIN, and
TA = 25°C.
8
Figure 7. Ground Pin Current vs Shutdown Pin Voltage
Figure 8. Input Voltage vs Output Voltage
Figure 9. Output Noise Density, VOUT = 2.5 V
Figure 10. Output Noise Density, VOUT = 5 V
Figure 11. Load Transient Response
Figure 12. Ripple Rejection vs Frequency
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Typical Characteristics (continued)
Unless otherwise specified, VIN = VO(NOM) + 1 V, VOUT = 2.5 V, COUT = 33 µF, IOUT = 10 mA, CIN = 68 µF, VSDT = VIN, and
TA = 25°C.
Figure 13. δVOUT vs Temperature
Figure 14. Noise Density VIN = 3.5 V, VOUT = 2.5 V, IL = 10 mA
Figure 15. Line Transient Response
Figure 16. Line Transient Response
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7 Detailed Description
7.1 Overview
The LP3961/LP3964 are a series of ultra-low dropout linear regulators. Fixed output products have output
voltage options from 1.2 V to 5 V, adjustable output voltage is only available for LP3964. These regulators can
provide maximum 800-mA load current. The device can operate under extremely low dropout conditions.
The LP3961 has an ERROR flag pin, this pin will go low when the output voltage drops 10% below nominal
value. The LP3964 (fixed output products) provides a SENSE pin. The SENSE pin can improve regulation at
remote loads. The LP3961, LP3964 also provide short-circuit protection and reverse current path. The devices
can be operated with shutdown (SD) pin control.
7.2 Functional Block Diagram
Figure 17. LP3961 Block Diagram
Figure 18. LP3964 Block Diagram
10
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Functional Block Diagram (continued)
Figure 19. LP3964 Adjustable Version Block Diagram
7.3 Feature Description
7.3.1 Short-Circuit Protection
The LP3961 and LP3964 are short-circuit protected and in the event of a peak overcurrent condition, the shortcircuit control loop will rapidly drive the output PMOS pass element off. Once the power pass element shuts
down, the control loop will rapidly cycle the output on and off until the average power dissipation causes the
thermal shutdown circuit to respond to servo the on/off cycling to a lower frequency. Please refer to the section
on thermal information for power dissipation calculations.
7.3.2 ERROR Flag Operation
The LP3961 produces a logic low signal at the ERROR flag pin when the output drops out of regulation due to
low input voltage, current limiting, or thermal limiting. This flag has a built-in hysteresis. The timing diagram in
Figure 20 shows the relationship between the ERROR pin and the output voltage. In this example, the input
voltage is changed to demonstrate the functionality of the ERROR flag.
The internal ERROR flag comparator has an open drain output stage. Hence, the ERROR pin should be pulled
high through a pull-up resistor. Although the ERROR pin can sink current of 1 mA, this current is an energy drain
from the input supply. Hence, the value of the pull-up resistor should be in the range of 100 kΩ to 1 MΩ. The
ERROR pin must be connected to ground if this function is not used. It should also be noted that when the SD
pin is pulled low, the ERROR pin is forced to be invalid for reasons of saving power in shutdown mode.
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Feature Description (continued)
Figure 20. ERROR Flag Operation
7.3.3 SENSE Pin
In applications where the regulator output is not very close to the load, LP3964 can provide better remote load
regulation using the SENSE pin. Figure 21 depicts the advantage of the SENSE option. LP3961 regulates the
voltage at the OUT pin. Hence, the voltage at the remote load will be the regulator output voltage minus the drop
across the trace resistance. For example, in the case of a 3.3-V output, if the trace resistance is 100 mΩ, the
voltage at the remote load will be 3.22 V with 800 mA of load current, ILOAD. The LP3964 regulates the voltage at
the SENSE pin. Connecting the SENSE pin to the remote load will provide regulation at the remote load, as
shown in Figure 21. If the sense option pin is not required, the SENSE pin must be connected to the OUT pin.
Figure 21. Improving Remote Load Regulation Using LP3964
12
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Feature Description (continued)
7.3.4 Dropout Voltage
The dropout voltage of a regulator is defined as the minimum input-to-output differential required to stay within
2% of the output voltage. The LP3961 and LP3964 use an internal MOSFET with an Rds(on) of 240 mΩ
(typically). For CMOS LDOs, the dropout voltage is the product of the load current and the Rds(on) of the internal
MOSFET.
7.3.5 Reverse Current Path
The internal MOSFET in LP3961 and LP3964 has an inherent parasitic diode. During normal operation, the input
voltage is higher than the output voltage and the parasitic diode is reverse biased. However, if the output is
pulled above the input in an application, then current flows from the output to the input as the parasitic diode gets
forward biased. The output can be pulled above the input as long as the current in the parasitic diode is limited to
200-mA continuous and 1-A peak.
7.4 Device Functional Modes
7.4.1 Operation With VOUT(TARGET) + 0.35 V ≤ VIN ≤ 7 V
For the fixed output voltage products, the devices operate if the input voltage is equal to or exceeds
VOUT(TARGET) + 0.35 V. At input voltages below the minimum VIN requirement, the devices do not operate
correctly and output voltage may not reach target value.
7.4.2 Operation With Shutdown (SD) Pin Control
A CMOS logic low level signal at the shutdown (SD) pin will turn off the regulator. The SD pin must be actively
terminated through a 10-kΩ pullup resistor for a proper operation. This pin must be tied to the IN pin if not used .
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LP3961, LP3964 products can provide 800-mA output current with 2.5-V to 7-V input voltage. An input
capacitor of at least 68-uF is required. A minimum 33-uF output capacitor is required for loop stability. Pin SD
must be tied to input if not used. For LP3961, the ERROR pin should be pulled high through a pull up resistor; if
this function is not used, ERROR pin must be connected to ground . For LP3964, if the sense option is not
required, the SENSE pin must be connected to the OUT pin.
8.2 Typical Applications
Figure 22. LP3961 Typical Application Circuit
Figure 23. LP3964 Typical Application Circuits
14
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Typical Applications (continued)
8.2.1 Design Requirements
DESIGN PARAMETERS
VALUE
Input voltage
5.3 V, ±10%
Output voltage
3.3 V, ±3%
Output current
800 mA (maximum)
Input capacitor
68 uF (minimum)
Output capacitor
33 uF (minimum)
ERROR pullup resistor (LP3964 only)
10 kΩ
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
Like any low-dropout regulator, external capacitors are required to assure stability. these capacitors must be
correctly selected for proper performance.
8.2.2.1.1 Input Capacitor
The LP3961 or LP3964 requires a low source impedance to maintain regulator stability because the internal bias
circuitry is connected directly to the IN pin. The input capacitor must be located less than 1 cm from the LP3961
or LP3964 device and connected directly to the IN and GND pins using traces which have no other currents
flowing through them (see the Layout Guidelines section).
The minimum allowable input capacitance for a given application depends on the type of the capacitor and
equivalent series resistance (ESR). A lower ESR capacitor allows the use of less capacitance, while higher ESR
types (like aluminum electrolytics) require more capacitance.
The lowest value of input capacitance that can be used for stable full-load operation is 68 µF (assuming it is a
ceramic or low-ESR Tantalum with ESR less than 100 mΩ).
To determine the minimum input capacitance amount and ESR value, an approximation is used:
CIN ESR (mΩ) / CIN (µF) ≤ 1.5
(1)
This shows that input capacitors with higher ESR values can be used if sufficient total capacitance is provided.
Capacitor types (aluminum, ceramic, and tantalum) can be mixed in parallel, but the total equivalent input
capacitance/ESR must be defined as above to assure stable operation.
IMPORTANT: The input capacitor must maintain its ESR and capacitance in the stable range over the entire
temperature range of the application to assure stability (see the Capacitor Characteristics section).
8.2.2.1.2 Output Capacitor
An output capacitor is also required for loop stability. It must be located less than 1 cm from the LP3961 or
LP3964 device and connected directly to the OUT and GND pins using traces which have no other currents
flowing through them (see the Layout Guidelines section).
The minimum value of the output capacitance that can be used for stable full-load operation is 33 µF, but it may
be increased without limit. The ESR of the output capacitor is critical because it forms a zero to provide phase
lead which is required for loop stability. The ESR must fall within the specified range:
0.2 Ω ≤ COUT ESR ≤ 5 Ω
(2)
The lower limit of 200 mΩ means that ceramic capacitors are not suitable for use as LP3961 or LP3964 output
capacitors (but can be used on the input). Some ceramic capacitance can be used on the output if the total
equivalent ESR is in the stable range: when using a 100-µF Tantalum as the output capacitor, approximately 3
µF of ceramic capacitance can be applied before stability becomes marginal.
IMPORTANT: The output capacitor must meet the requirements for minimum amount of capacitance and also
have an appropriate ESR value over the full temperature range of the application to assure stability (see the
Capacitor Characteristics section).
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8.2.2.2 Selecting a Capacitor
It is important to note that capacitance tolerance and variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required amount of capacitance is provided over the full
operating temperature range. In general, a good Tantalum capacitor will show very little capacitance variation
with temperature, but a ceramic may not be as good (depending on dielectric type). Aluminum electrolytics also
typically have large temperature variation of capacitance value.
Equally important to consider is a capacitor's ESR change with temperature: this is not an issue with ceramics,
as their ESR is extremely low. However, it is very important in Tantalum and aluminum electrolytic capacitors.
Both show increasing ESR at colder temperatures, but the increase in aluminum electrolytic capacitors is so
severe they may not be feasible for some applications (see the Capacitor Characteristics section).
8.2.2.3 Capacitor Characteristics
8.2.2.3.1 Ceramic
For values of capacitance in the 10- to 100-µF range, ceramics are usually larger and more costly than
Tantalums but give superior AC performance for bypassing high-frequency noise because of very low ESR
(typically less than 10 mΩ). However, some dielectric types do not have good capacitance characteristics as a
function of voltage and temperature.
Z5U and Y5V dielectric ceramics have capacitance that drops severely with applied voltage. A typical Z5U or
Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. The Z5U and Y5V
also exhibit a severe temperature effect, losing more than 50% of nominal capacitance at high and low limits of
the temperature range.
X7R and X5R dielectric ceramic capacitors are strongly recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over full operating ratings of temperature and voltage. Of
course, they are typically larger and more costly than Z5U/Y5U types for a given voltage and capacitance.
8.2.2.3.2 Tantalum
Solid Tantalum capacitors are recommended for use on the output because their typical ESR is very close to the
ideal value required for loop compensation. They also work well as input capacitors if selected to meet the ESR
requirements previously listed.
Tantalums also have good temperature stability: a good quality Tantalum will typically show a capacitance value
that varies less than 10 to 15% across the full temperature range of 125°C to −40°C. ESR will vary only about 2X
going from the high to low temperature limits.
The increasing ESR at lower temperatures can cause oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the stability range at room temperature).
8.2.2.3.3 Aluminum
This capacitor type offers the most capacitance for the money. The disadvantages are that they are larger in
physical size, not widely available in surface mount, and have poor AC performance (especially at higher
frequencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is higher than either Tantalum or ceramic, and it also
varies greatly with temperature. A typical aluminum electrolytic can exhibit an ESR increase of as much as 50X
when going from 25°C down to −40°C.
It should also be noted that many aluminum electrolytics only specify impedance at a frequency of 120 Hz, which
indicates they have poor high-frequency performance. Only aluminum electrolytics that have an impedance
specified at a higher frequency (from 20 kHz to 100 kHz) should be used for the LP396X. Derating must be
applied to the manufacturer's ESR specification, because it is typically only valid at room temperature.
Any applications using aluminum electrolytics should be thoroughly tested at the lowest ambient operating
temperature where ESR is maximum.
16
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LP3961, LP3964
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8.2.2.4 RFI and EMI Susceptibility
Radio frequency interference (RFI) and electromagnetic interference (EMI) can degrade the performance of any
integrated circuit because of the small dimensions of the geometries inside the device. In applications where
circuit sources are present which generate signals with significant high-frequency energy content (> 1 MHz), care
must be taken to ensure that this does not affect the IC regulator.
If RFI and EMI noise is present on the input side of the LP396x regulator (such as applications where the input
source comes from the output of a switching regulator), good ceramic bypass capacitors must be used at the
input pin of the LP396x.
If a load is connected to the LP396x output which switches at high speed (such as a clock), the high-frequency
current pulses required by the load must be supplied by the capacitors on the LP396x output. Because the
bandwidth of the regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above
that frequency. The means the effective output impedance of the LP396x at frequencies above 100 kHz is
determined only by the output capacitors.
In applications where the load is switching at high speed, the output of the LP396x may need RF isolation from
the load. It is recommended that some inductance be placed between the LP396x output capacitor and the load,
and good RF bypass capacitors be placed directly across the load.
PCB layout is also critical in high-noise environments, because RFI and EMI is easily radiated directly into PC
traces. Noisy circuitry should be isolated from clean circuits where possible, and grounded through a separate
path. At MHz frequencies, ground planes begin to look inductive and RFI/EMI can cause ground bounce across
the ground plane.
In multilayer PCB applications, care should be taken in layout so that noisy power and ground planes do not
radiate directly into adjacent layers which carry analog power and ground.
8.2.2.5 Output Adjustment
An adjustable output device has output voltage range of 1.216 V to 5.1 V. To obtain a desired output voltage, the
following equation can be used with R1 always a 10-kΩ resistor.
(3)
For output stability, CF must be between 68 pF and 100 pF.
8.2.2.6 Turnon Characteristics for Output Voltages Programmed to 2.0 V or Below
As VIN increases during start-up, the regulator output will track the input until VIN reaches the minimum operating
voltage (typically about 2.2 V). For output voltages programmed to 2 V or below, the regulator output may
momentarily exceed its programmed output voltage during start up. Outputs programmed to voltages above 2 V
are not affected by this behavior.
8.2.2.7 Output Noise
Noise is specified in two ways:
• Spot noise or output noise density is the RMS sum of all noise sources, measured at the regulator output, at
a specific frequency (measured with a 1-Hz bandwidth). This type of noise is usually plotted on a curve as a
function of frequency.
• Total output noise or broadband noise is the RMS sum of spot noise over a specified bandwidth, usually
several decades of frequencies.
Attention should be paid to the units of measurement. Spot noise is measured in units µV/√Hz or nV/√Hz and
total output noise is measured in µV(rms).
The primary source of noise in low-dropout regulators is the internal reference. In CMOS regulators, noise has a
low-frequency component and a high-frequency component, which depend strongly on the silicon area and
quiescent current. Noise can be reduced in two ways: by increasing the transistor area or by increasing the
current drawn by the internal reference. Increasing the area will decrease the chance of fitting the die into a
smaller package. Increasing the current drawn by the internal reference increases the total supply current
(ground pin current). Using an optimized trade-off of ground pin current and die size, LP396x achieves low noise
performance and low quiescent current operation.
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The total output noise specification for LP396x is presented in the Electrical Characteristics table. The output
noise density at different frequencies is represented by a curve under typical performance characteristics.
8.2.2.8 Shutdown Operation
A CMOS logic level signal at the shutdown (SD) pin will turnoff the regulator. Pin SD must be actively terminated
through a 10-kΩ pullup resistor for a proper operation. If this pin is driven from a source that actively pulls high
and low (such as a CMOS rail-to-rail comparator), the pull-up resistor is not required. This pin must be tied to the
IN pin if not used.
8.2.2.9 Maximum Output Current Capability
LP3961 and LP3964 can deliver a continuous current of 800 mA over the full operating temperature range. A
heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. Under all possible conditions, the junction temperature must be within the range specified under
operating conditions. The total power dissipation of the device is given by:
PD = (VIN − VOUT) × IOUT + VIN × IGND
(4)
where IGND is the operating ground current of the device (specified under the Electrical Characteristics table).
The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the
application, and the maximum allowable junction temperature (TJmax):
TRmax = TJmax− TAmax
(5)
The maximum allowable value for junction to ambient Thermal Resistance, RθJA, can be calculated using the
formula:
RθJA = TRmax / PD
(6)
LP3961 and LP3964 are available in TO-220, SFM/TO-263, and SOT-223 packages. The thermal resistance
depends on amount of copper area or heat sink, and on air flow.
8.2.3 Application Curves
Figure 24. Line Transient Response (IOUT = 800 mA)
18
Figure 25. Line Transient Response (IOUT = 800 mA)
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9 Power Supply Recommendations
The LP396x devices are designed to operate from an input voltage supply range between 2.5 V and 7 V. The
input voltage range provides adequate headroom in order for the device to have a regulated output. This input
supply must be well regulated. An input capacitor of at least 68 μF is required.
10 Layout
10.1 Layout Guidelines
Good PC layout practices must be used or instability can be induced because of ground loops and voltage drops.
The input and output capacitors must be directly connected to the IN, OUT, and GND pins of the LP396x using
traces which do not have other currents flowing in them (Kelvin connect).
The best way to do this is to lay out CIN and COUT near the device with short traces to the IN, OUT, and GND
pins. The regulator ground pin should be connected to the external circuit ground so that the regulator and its
capacitors have a single-point ground.
It should be noted that stability problems have been seen in applications where vias to an internal ground plane
were used at the ground points of the LP396x IC and the input and output capacitors. This was caused by
varying ground potentials at these nodes resulting from current flowing through the ground plane. Using a singlepoint ground technique for the regulator and its capacitors fixed the problem.
Because high current flows through the traces going into the IN pin and coming from the OUT pin, Kelvin connect
the capacitor leads to these pins so there is no voltage drop in series with the input and output capacitors.
10.2 Layout Example
SD
ERROR
Pullup
Resistor
Pullup
Resistor
OUT
IN
Input
Capacitor
Output
Capacitor
Ground
Figure 26. LP3961 TO-263 Package Typical Layout
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Layout Example (continued)
SD
SENSE
Pull-up
Resistor
IN
OUT
Input
Capacitor
Output
Capacitor
Ground
Figure 27. LP3964 TO-263 Package Typical Layout
10.3 Heatsinking TO-220 Packages
The thermal resistance of a TO-220 package can be reduced by attaching it to a heatsink or a copper plane on a
PC board.
The heatsink to be used in the application should have a heatsink-to-ambient thermal resistance,
RθHA ≤ RθJA − RθCH − RθJC
(7)
In this equation, RθCH is the thermal resistance from the junction to the surface of the heatsink and RθJC is the
thermal resistance from the junction to the surface of the case.
20
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SNVS056J – MAY 2000 – REVISED JUNE 2015
11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LP3961
Click here
Click here
Click here
Click here
Click here
LP3964
Click here
Click here
Click here
Click here
Click here
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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21
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
LP3961EMP-1.8/NOPB
Package Type Package Pins Package
Drawing
Qty
ACTIVE
SOT-223
NDC
5
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBAB
(4/5)
LP3961EMP-2.5
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBBB
LP3961EMP-2.5/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBBB
LP3961EMP-3.3
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LAZB
LP3961EMP-3.3/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LAZB
LP3961EMP-5.0
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBSB
LP3961EMP-5.0/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBSB
LP3961EMPX-1.8/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBAB
LP3961EMPX-2.5/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBBB
LP3961EMPX-3.3
NRND
SOT-223
NDC
5
2000
TBD
Call TI
Call TI
-40 to 125
LAZB
LP3961ES-1.8
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3961ES
-1.8
LP3961ES-1.8/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3961ES
-1.8
LP3961ES-2.5
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3961ES
-2.5
LP3961ES-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3961ES
-2.5
LP3961ES-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3961ES
-3.3
LP3961ESX-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3961ES
-2.5
LP3961ESX-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3961ES
-3.3
LP3964EMP-1.8/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBFB
LP3964EMP-2.5
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBHB
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
8-Oct-2015
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP3964EMP-2.5/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBHB
LP3964EMP-3.3/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBJB
LP3964EMP-ADJ
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LBPB
LP3964EMP-ADJ/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBPB
LP3964EMPX-2.5/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBHB
LP3964EMPX-ADJ/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LBPB
LP3964ES-1.8
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3964ES
-1.8
LP3964ES-1.8/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3964ES
-1.8
LP3964ES-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3964ES
-2.5
LP3964ES-3.3
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3964ES
-3.3
LP3964ES-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3964ES
-3.3
LP3964ES-ADJ
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LP3964ES
-ADJ
LP3964ES-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3964ES
-ADJ
LP3964ESX-2.5/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3964ES
-2.5
LP3964ESX-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3964ES
-3.3
LP3964ESX-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LP3964ES
-ADJ
LP3964ET-ADJ/NOPB
ACTIVE
TO-220
NDH
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LP3964ET
-ADJ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LP3961EMP-1.8/NOPB
SOT-223
NDC
5
1000
330.0
16.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMP-2.5
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMP-2.5/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMP-3.3
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMP-3.3/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMP-5.0
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMP-5.0/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMPX-1.8/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMPX-2.5/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961EMPX-3.3
SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3961ESX-2.5/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3961ESX-3.3/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3964EMP-1.8/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3964EMP-2.5
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3964EMP-2.5/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3964EMP-3.3/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3964EMP-ADJ
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP3964EMP-ADJ/NOPB SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3964EMPX-2.5/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3964EMPX-ADJ/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP3964ESX-2.5/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3964ESX-3.3/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LP3964ESX-ADJ/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3961EMP-1.8/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3961EMP-2.5
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3961EMP-2.5/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3961EMP-3.3
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3961EMP-3.3/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3961EMP-5.0
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3961EMP-5.0/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3961EMPX-1.8/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP3961EMPX-2.5/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3961EMPX-3.3
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP3961ESX-2.5/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3961ESX-3.3/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3964EMP-1.8/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3964EMP-2.5
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3964EMP-2.5/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3964EMP-3.3/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3964EMP-ADJ
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3964EMP-ADJ/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP3964EMPX-2.5/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP3964EMPX-ADJ/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP3964ESX-2.5/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3964ESX-3.3/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LP3964ESX-ADJ/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
Pack Materials-Page 3
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
NDC0005A
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
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