MBRS230L, NRVBS230L Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package This device employs the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Features • • • • • • www.onsemi.com SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 30 VOLTS Compact Package with J−Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over−Voltage Protection Low Forward Voltage Drop NRVBS Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant SMB CASE 403A MARKING DIAGRAM ALYW 2BL3G G Mechanical Characteristics • • • • • • • Case: Molded Epoxy Epoxy Meets UL 94, V−0 @ 0.125 in. Weight: 95 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Maximum Temperature of 260°C/10 Seconds for Soldering Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix to Part Number Cathode Polarity Band A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† MBRS230LT3G SMB (Pb−Free) 2500 / Tape & Reel NRVBS230LT3G SMB (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 4 1 Publication Order Number: MBRS230LT3/D MBRS230L, NRVBS230L MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 30 V Average Rectified Forward Current (At Rated VR, TC = 110°C) IO 2.0 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 105°C) IFRM 4.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) IFSM 40 A Tstg, TC −55 to +175 °C TJ −55 to +125 °C dv/dt 10,000 V/ms Storage/Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25°C) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Value RqJL 18.6 RqJA 135 Unit °C/W Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2) VF (IF = 2.0 A) (IF = 4.0 A) see Figure 2 Maximum Instantaneous Reverse Current (Note 2) IR (VR = 30 V) (VR = 15 V) see Figure 4 TJ = 25°C TJ = 125°C 0.50 0.60 0.45 0.63 TJ = 25°C TJ = 125°C 1 0.31 75 35 V mA IF, INSTANTANEOUS FORWARD CURRENT (AMPS) iF, INSTANTANEOUS FORWARD CURRENT (AMPS) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Minimum pad size (0.108″ X 0.085″) for each lead on FR4 board. 2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%. 10 1 TJ = 125°C 0.1 100°C 25°C −55°C 0.01 0 0.1 0.2 0.3 0.4 0.6 0.5 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 10 TJ = 125°C 1 100°C 25°C 0.1 0 Figure 1. Typical Forward Voltage 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 2. Maximum Forward Voltage www.onsemi.com 2 0.8 100E−3 TJ = 125°C 10E−3 TJ = 100°C 1E−3 100E−6 1E−6 0 10 5 15 20 25 30 FREQ = 20 kHz Ipk/Io = p 1.5 Ipk/Io = 5.0 1.0 Ipk/Io = 10 Ipk/Io = 20 0 20 0 60 40 120 100 80 140 TC, CASE TEMPERATURE (°C) 20 15 25 30 1.8 dc 1.6 1.4 Ipk/Io = p 1.2 SQUARE WAVE Ipk/Io = 5.0 Ipk/Io = 10 1.0 Ipk/Io = 20 0.8 0.6 0.4 0.2 TJ = 125°C 0 0 Figure 5. Current Derating Per Leg r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 10 5 Figure 4. Maximum Reverse Current SQUARE WAVE 0 10E−6 Figure 3. Typical Reverse Current 3.0 0.5 TJ = 25°C VR, REVERSE VOLTAGE (VOLTS) dc 2.0 1E−3 VR, REVERSE VOLTAGE (VOLTS) 3.5 2.5 TJ = 100°C 100E−6 TJ = 25°C 10E−6 TJ = 125°C 10E−3 PFO, AVERAGE POWER DISSIPATION (WATTS) IR, REVERSE CURRENT (AMPS) 100E−3 IO, AVERAGE FORWARD CURRENT (AMPS) IR, MAXIMUM REVERSE CURRENT (AMPS) MBRS230L, NRVBS230L 0.5 1.0 1.5 2.0 2.5 3.0 3.5 IO, AVERAGE FORWARD CURRENT (AMPS) Figure 6. Forward Power Dissipation Per Leg 1 RqJ Lead = 18.6 0.1 RqJ Ambient = 150 0.01 0.001 0.0001 0.0001 0.001 0.01 0.1 1.0 t, TIME (s) Figure 7. Thermal Response www.onsemi.com 3 10 100 1000 MBRS230L, NRVBS230L PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE J HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.95 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.30 2.47 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.077 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.091 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.097 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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