IXYS IXDN604PI 4a peak source/sink drive current Datasheet

IXD_604
4-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
Features
Description
• 4A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Logic Input Withstands Negative Swing of up to 5V
• Outputs May be Connected in Parallel for Higher
Drive Current
• Matched Rise and Fall Times
• Low Propagation Delay Time
• Low, 10A Supply Current
• Low Output Impedance
The IXDD604/IXDF604/IXDI604/IXDN604 dual
high-speed gate drivers are especially well suited for
driving the latest IXYS MOSFETs and IGBTs. Each of
the two outputs can source and sink 4A of peak
current while producing voltage rise and fall times of
less than 10ns. The input of each driver is virtually
immune to latch up, and proprietary circuitry
eliminates cross conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_604 family
ideal for high-frequency and high-power applications.
Applications
•
•
•
•
•
•
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual inverting driver, and the IXDF604
has one inverting driver and one non-inverting driver.
The IXD_604 family is available in a standard 8-pin
DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an
exposed metal back (SI), and an 8-pin DFN (D2)
package.
Ordering Information
Part Number
IXDD604D2TR
IXDD604PI
IXDD604SI
IXDD604SITR
IXDD604SIA
IXDD604SIATR
IXDF604PI
IXDF604SI
IXDF604SITR
IXDF604SIA
IXDF604SIATR
IXDI604PI
IXDI604SI
IXDI604SITR
IXDI604SIA
IXDI604SIATR
IXDN604PI
IXDN604SI
IXDN604SITR
IXDN604SIA
IXDN604SIATR
DS-IXD_604-R07
Logic
Configuration
ENA
A
OUTA
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
ENB
INB
Package Type
Packing
Method
Quantity
8-Pin DFN
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
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1
INTEGRATED CIRCUITS DIVISION
IXD_604
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Electrical Characteristics: -40°C < TA < +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
4
5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6
6
6
6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
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10
10
10
10
11
R07
IXD_604
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IXDD604PI/SI/SIA
ENA
1
INA
2
GND
3
INB
4
A
B
IXDD604D2
8
ENB
ENA
1
7
OUTA
INA
2
6
VCC
INB
3
5
OUTB
ENB
4
IXDI604PI/SI/SIA
NC
1
INA
2
GND
3
INB
4
A
B
Pin Name
Description
8
OUTA
A
7
GND
INA
Channel A Logic Input
B
6
VCC
INB
Channel B Logic Input
5
OUTB
ENA
Channel A Enable Input Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
ENB
Channel B Enable Input Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC
Supply Voltage - Provides power to the device
GND
Ground - Common ground reference for the
device
IXDF604PI/SI/SIA
8
NC
NC
1
7
OUTA
INA
2
6
VCC
GND
3
5
OUTB
INB
4
A
B
8
NC
7
OUTA
6
VCC
5
OUTB
IXDN604PI/SI/SIA
NC
1
INA
2
GND
3
INB
4
A
B
8
NC
7
OUTA
6
VCC
5
OUTB
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VCC
-0.3
40
V
VINx , VENx
-5
VCC+0.3
V
IOUT
-
±4
A
Junction Temperature
TJ
-55
+150
°C
Storage Temperature
TSTG
-65
+150
°C
Supply Voltage
Input Voltage
Output Current
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Range
Units
VCC
4.5 to 35
V
Operating Temperature Range
TA
-40 to +125
°C
R07
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Supply Voltage
3
IXD_604
INTEGRATED CIRCUITS DIVISION
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Conditions
Symbol
Minimum
Input Voltage, High
Parameter
4.5V < VCC < 18V
VIH
3.0
-
-
Input Voltage, Low
4.5V < VCC < 18V
VIL
-
-
0.8
0V < VIN < VCC
IIN
±10
A
IXDD604 only
VENH
2/3VCC
-
High EN Input Voltage
-
Low EN Input Voltage
IXDD604 only
VENL
-
V
Output Voltage, High
-
VOH
VCC-0.025
1/3VCC
-
-
Output Voltage, Low
-
VOL
-
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-10mA
ROH
-
1.3
2.5
Output Resistance, Low State
ROL
-
1.1
2
IDC
-
-
±1
Rise Time
VCC=18V, IOUT=10mA
Limited by package power
dissipation
VCC=18V, CLOAD=1000pF
tr
-
9
16
Fall Time
VCC=18V, CLOAD=1000pF
tf
-
8
14
On-Time Propagation Delay
VCC=18V, CLOAD=1000pF
tondly
-
29
50
Off-Time Propagation Delay
VCC=18V, CLOAD=1000pF
toffdly
-
35
50
Enable to Output-High Delay Time
IXDD604 only, VCC=18V
tENOH
-
35
55
Disable to High Impedance State Delay Time
IXDD604 only, VCC=18V
tDOLD
-
40
55
VCC=18V, VIN=3.5V
VCC=18V, VIN=0V
VCC=18V, VIN=VCC
REN
-
200
1
<1
<1
3
10
10
Input Current
Output Current, Continuous
Enable Pull-Up Resistor
Power Supply Current
ICC
Typical
Maximum
Units
V
V

A
ns
k
mA
A
1.6 Electrical Characteristics: -40°C < TA < +125°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Parameter
Conditions
Symbol
Minimum
Maximum
Input Voltage, High
4.5V < VCC < 18V
VIH
3.3
-
Input Voltage, Low
4.5V < VCC < 18V
VIL
-
0.65
0V < VIN < VCC
IIN
-
VOH
-10
VCC-0.025
10
Output Voltage, High
Output Voltage, Low
-
VOL
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-10mA
ROH
-
3
Output Resistance, Low State
ROL
-
2.5
IDC
-
±1
Rise Time
VCC=18V, IOUT=10mA
Limited by package power
dissipation
VCC=18V, CLOAD=1000pF
tr
-
16
Fall Time
VCC=18V, CLOAD=1000pF
tf
-
14
On-Time Propagation Delay
VCC=18V, CLOAD=1000pF
tondly
-
65
Off-Time Propagation Delay
VCC=18V, CLOAD=1000pF
toffdly
-
65
Enable to Output-High Delay Time
IXDD604 only, VCC=18V
tENOH
-
65
Disable to High Impedance State Delay Time
IXDD604 only, VCC=18V
VCC=18V, VIN=3.5V
VCC=18V, VIN=0V
VCC=18V, VIN=VCC
tDOLD
-
65
3.5
150
150
Input Current
Output Current, Continuous
Power Supply Current
4
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ICC
-
Units
V
A
V

A
ns
mA
A
R07
IXD_604
INTEGRATED CIRCUITS DIVISION
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
D2 (8-Pin DFN)
Units
35
PI (8-Pin DIP)
125
JA
Thermal Resistance, Junction-to-Ambient
SI (8-Pin Power SOIC)
°C/W
85
SIA (8-Pin SOIC)
120
SI (8-Pin Power SOIC)
JC
Thermal Resistance, Junction-to-Case
10
°C/W
2 IXD_604 Performance
2.1 Timing Diagrams
VIH
INx
VIH
INx
VIL
VIL
tondly
toffdly
tondly
toffdly
90%
OUTx
90%
OUTx
10%
10%
tf
tr
tf
tr
2.2 Characteristics Test Diagram
+
0.1μF
10μF
INA
VCC
-
VCC
INB
OUTA
OUTB
CLOAD
VCC
VIN
ENA
ENB
GND
R07
Tektronix
Current Probe
6302
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CLOAD
Tektronix
Current Probe
6302
5
IXD_604
INTEGRATED CIRCUITS DIVISION
3 Block Diagrams & Truth Tables
3.1 IXDD604
3.3 IXDF604
IXDD604
IXDF604
VCC
VCC
200kΩ
OUTA
INA
VCC
ENA
INA
GND
OUTA
VCC
VCC
200kΩ
OUTB
INB
VCC
ENB
INB
OUTB
GND
INA
OUTA
0
1
1
0
INX
ENX
OUTX
INB
0
1 or open
OUTB
0
0
1
1 or open
0
1
1
0
0
1
Z
1
0
Z
3.4 IXDN604
3.2 IXDI604
IXDI604
IXDN604
VCC
OUTA
INA
VCC
OUTA
INA
GND
GND
VCC
OUTB
INB
6
VCC
OUTB
INB
INX
OUTX
INX
OUTX
0
1
0
0
1
0
1
1
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R07
IXD_604
INTEGRATED CIRCUITS DIVISION
4 Typical Performance Characteristics
A&B Rise Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
120
A&B Rise and Fall Times
vs. Temperature
(Input=0-5V, VCC=18V, CL=1nF)
A&B Fall Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
120
10
80
CL=10nF
CL=1nF
CL=470pF
60
40
80
40
20
0
0
15
20
25
30
Supply Voltage (V)
120
40
0
5
10
15
20
25
30
Supply Voltage (V)
A&B Rise Time vs. Load Capacitance
at Various VCC Levels
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
100
Rise Time (ns)
35
80
60
120
4000
6000
8000
Load Capacitance (pF)
140
120
100
toffdly
tondly
20
5
30
60
0
10000
2000
4000
6000
8000
Load Capacitance (pF)
100 120 140
50
40
toffdly
30
tondly
Min VIH
2.3
2.1
Max VIL
1.9
4
6
8
Input Voltage (V)
10
100 120 140
toffdly
40
35
tondly
30
25
-40 -20
12
2.8
2.6
2.4
2.2
VIH
2.0
1.8
VIL
0
5
10
15
20
25
Supply Voltage (V)
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30
35
0
20 40 60 80
Temperature (ºC)
100 120 140
Enable Threshold vs. Supply Voltage
Input Threshold vs. Supply Voltage
3.2
1.4
20 40 60 80
Temperature (ºC)
45
20
2
1.6
1.7
10000
Propagation Delay vs. Temperature
Enable Threshold (V)
2.5
0
20 40 60 80
Temperature (ºC)
50
3.0
2.7
-40 -20
0
40
60
35
Input Threshold (V)
Input Threshold Voltage (V)
10
15
20
25
Supply Voltage (V)
Input Threshold Voltage
vs. Temperature
(VCC=18V, CL=1nF)
2.9
R07
-40 -20
20
0
5
4
40
Propagation Delay vs. Input Voltage
(VCC=15V, CL=1nF)
70
Propagation Delay (ns)
Propagation Delay (ns)
2000
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CL=1nF, f=1kHz)
40
6
0
0
60
tf
7
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
80
0
80
tr
8
20
20
160
9
A&B Fall Time vs. Load Capacitance
at Various VCC Levels
100
40
35
Propagation Delay (ns)
10
Fall Time (ns)
5
CL=10nF
CL=1nF
CL=470pF
60
20
0
Rise & Fall Times (ns)
100
Fall Time (ns)
Rise Time (ns)
100
22
20
18
16
14
12
10
8
6
4
2
0
VENH
VENL
0
5
10
15
20
25
Supply Voltage (V)
30
35
7
IXD_604
INTEGRATED CIRCUITS DIVISION
100
400
10
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=18V)
250
f=1MHz
f=500kHz
f=100kHz
f=50kHz
200
f=2MHz
350
300
400
150
100
250
200
150
100
50
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
250
200
150
100
50
Supply Current vs. Frequency
Both Outputs Active
(VCC=12V)
100
10
1
0.1
10
100
1000
Frequency (kHz)
CL=10nF
CL=1nF
CL=470pF
100
10
1
10000
1
Supply Current vs. Frequency
Both Outputs Active
(VCC=8V)
1000
CL=10nF
CL=1nF
CL=470pF
10000
0.1
1
10000
100
10
1
0.1
10
100
1000
Frequency (kHz)
10000
Quiescent Supply Current
vs. Temperature
(VCC=18V)
3.0
CL=10nF
CL=1nF
CL=470pF
Supply Current (mA)
1000
Load Capacitance (pF)
Supply Current (mA)
Supply Current (mA)
10
1000
Load Capacitance (pF)
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
1000
CL=10nF
CL=1nF
CL=470pF
100
0
100
10000
1
0
100
1000
1000
Load Capacitance (pF)
Supply Current vs. Frequency
Both Outputs Active
(VCC=35V)
1000
Supply Current (mA)
300
Supply Current (mA)
10000
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
350
0
100
Supply Current (mA)
1000
Load Capacitance (pF)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
300
50
1
100
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
350
Supply Current (mA)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Supply Current (mA)
Supply Current (mA)
1000
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
VIN=3.5V
VIN=5V
VIN=10V
2.5
2.0
1.5
1.0
0.5
VIN=0V & 18V
0.01
1000
Dynamic Supply Current
vs. Temperature
(VCC=18V, VIN=5V, f=1khz, CL=1nF)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
10
100
1000
Frequency (kHz)
0
20 40 60 80
Temperature (ºC)
100 120 140
-40 -20
10000
Output Source Current
vs. Supply Voltage
(CL=10nF)
-10
-8
-6
-4
-2
0
20 40 60 80
Temperature (ºC)
100 120 140
Output Sink Current
vs. Supply Voltage
(CL=10nF)
10
8
6
4
2
0
0
-40 -20
8
1
Output Source Current (A)
Supply Current (mA)
10
100
Frequency (kHz)
Output Sink Current (A)
1
1.4
0.0
0.01
0
5
10
15
20
25
Supply Voltage (V)
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30
35
0
5
10
15
20
25
Supply Voltage (V)
30
35
R07
IXD_604
INTEGRATED CIRCUITS DIVISION
Output Source Current
vs. Temperature
(VCC=18V, CL=10nF)
6.0
Output Sink Current (A)
Output Source Current (A)
6
5
4
3
2
0
20 40 60 80
Temperature (ºC)
100 120 140
4.0
3.0
-40 -20
High State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
4.0
3.5
3.0
3.0
2.5
2.0
1.5
1.0
0
20 40 60 80
Temperature (ºC)
100 120 140
Low State Output Resistance
vs. Supply Voltage
(IOUT= +10mA)
4.0
3.5
Resistance (Ω)
Resistance (Ω)
5.0
2.0
-40 -20
2.5
2.0
1.5
1.0
0.5
0.5
0.0
0.0
0
R07
Output Sink Current
vs. Temperature
(VCC=18V, CL=10nF)
5
10
15
20
25
Supply Voltage (V)
30
35
0
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5
10
15
20
25
Supply Voltage (V)
30
35
9
IXD_604
INTEGRATED CIRCUITS DIVISION
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IXD_604 All Versions
MSL 1
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
10
Device
Maximum Temperature x Time
Maximum Reflow Cycles
IXD_604SI / IXD_604SIA / IXD_604D2
IXD_604PI
260°C for 30 seconds
250°C for 30 seconds
3
-
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R07
IXD_604
INTEGRATED CIRCUITS DIVISION
5.4 Mechanical Dimensions
5.4.1 SIA (8-Pin SOIC)
1.270 REF
(0.050)
Pin 8
PCB Land Pattern
0.60
(0.024)
0.762 ± 0.254
(0.030 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
1.55
(0.061)
5.40
(0.213)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.346 ± 0.076
(0.053 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.27
(0.050)
0.559 ± 0.254
(0.022 ± 0.010)
Dimensions
mm
(inches)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
5.40
2.75
(0.209) (0.108)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.27
(0.050)
1.270 REF
(0.050)
4.928 ± 0.254
(0.194 ± 0.010)
0.60
(0.024)
Recommended PCB Land Pattern
1.346 ± 0.076
(0.053 ± 0.003)
2.540 ± 0.254
(0.100 ± 0.010)
7º
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
3.556 ± 0.254
(0.140 ±0.010)
Dimensions
mm
(inches)
Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for
carrying current.
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11
IXD_604
INTEGRATED CIRCUITS DIVISION
5.4.3 Tape & Reel Information for SI and SIA Packages
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=12.00
(0.472)
B0=5.30
(0.209)
A0=6.50
(0.256)
K0= 2.10
(0.083)
P=8.00
(0.315)
Dimensions
mm
(inches)
User Direction of Feed
Embossed Carrier
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
5.4.4 PI (8-Pin DIP)
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
12
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
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R07
IXD_604
INTEGRATED CIRCUITS DIVISION
5.4.5 D2 (8-Pin DFN)
5.00 BSC
(0.197 BSC)
0.80 / 1.00
(0.031 / 0.039)
0.20 REF
(0.008 REF)
Pin 1
4.00 BSC
(0.157 BSC)
0.35 x 45º
(0.014 x 45º)
0.95
(0.037)
4.50
(0.177)
3.10
(0.122)
0.45
(0.018)
0.10
(0.004)
2.60
(0.102)
1.20
(0.047)
0.74 / 0.83
(0.029 / 0.033)
Recommended PCB Land Pattern
3.03 / 3.10
(0.119 / 0.122)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.30 / 0.45
(0.012 / 0.018)
0.95 BSC
(0.037 BSC)
Pin 1
Pin 8
2.53 / 2.60
(0.100 / 0.102)
0.35 / 0.45 x 45º
(0.014 / 0.018 x 45º)
NOTE:
The exposed metal pad on the back of the D2 package should
be connected to GND. Pad is not suitable for carrying current.
5.4.6 Tape & Reel Information for D2 Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
∅1.55 ± 0.05
4.00 ± 0.10 See Note #2
2.00 ± 0.05
R0.75 TYP
1.75 ± 0.10
(0.05)
5º MAX
5.50 ± 0.05
(0.05)
B0=5.40 ± 0.10
12.00 ± 0.30
Embossed Carrier
K0=1.90 ± 0.10
8.00 ± 0.10
5º MAX
A0=4.25 ± 0.10
Embossment
0.30 ± 0.05
∅1.50 (MIN)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. ± 0.2mm
3. ( ) Reference dimensions only.
4. Unless otherwise specified, all dimensions in millimeters.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_604-R07
©Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
9/25/2014
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13