MC10H101 Quad OR/NOR Gate Description The MC10H101 is a quad 2−input OR/NOR gate with one input from each gate common to pin 12. This MECL 10H™ part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in propagation delay, and no increases in power−supply current. http://onsemi.com MARKING DIAGRAMS* Features • Propagation Delay, 1.0 ns Typical • Power Dissipation 25 mW/Gate (same as MECL 10K) • Improved Noise Margin 150 mV (Over Operating Voltage and 16 MC10H101L AWLYYWW Temperature Range) CDIP−16 L SUFFIX CASE 620 • Voltage Compensated • MECL 10K Compatible • Pb−Free Packages are Available* 1 16 MC10H101P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 1 10H101 ALYWG SOEIAJ−16 CASE 966 1 20 10H101G AWLYYWW 20 1 PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Publication Order Number: MC10H101/D MC10H101 4 VCC1 1 16 VCC2 5 Aout 2 15 Dout 3 Bout 3 14 Cout 6 Ain 4 13 Din 14 Aout 5 12 Common Input Bout 6 11 Cout Bin 7 10 Cin VEE 8 9 Dout 2 7 10 11 13 15 12 9 VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 Pin assignment is for Dual−in−Line Package. Figure 1. Logic Diagram Figure 2. Pin Assignment Table 1. MAXIMUM RATINGS Symbol Characteristic Rating Unit VEE Power Supply (VCC = 0) −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range −55 to +150 −55 to +165 °C °C Continuous Surge Plastic Ceramic Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit − 29 − 26 − 29 mA − − 425 850 − − 265 535 − − 265 535 mA 0.5 − 0.5 − 0.3 − mA −0.735 Vdc IE Power Supply Current IinH Input Current High IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc (Pin 12 only) 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. http://onsemi.com 2 MC10H101 Table 3. AC PARAMETERS 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max 0.5 0.5 1.6 1.45 0.5 0.5 1.6 1.5 0.5 0.5 1.7 1.6 Unit tpd Propagation Delay tr Rise Time 0.5 2.1 0.5 2.2 0.5 2.3 ns tf Fall Time 0.5 2.1 0.5 2.2 0.5 2.3 ns Pin 12 Only Exclude Pin 12 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. ORDERING INFORMATION Package Shipping † MC10H101M SOEIAJ−16 50 Unit / Rail MC10H101MG SOEIAJ−16 (Pb−Free) 50 Unit / Rail MC10H101MEL SOEIAJ−16 2000 / Tape & Reel MC10H101MELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel MC10H101FN PLLC−20 46 Units / Rail MC10H101FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H101FNR2 PLLC−20 500 / Tape & Reel MC10H101FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H101L CDIP−16 25 Unit / Rail MC10H101P PDIP−16 25 Unit / Rail MC10H101PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H101 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H101 PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c 0.10 (0.004) M 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. −B− C −T− L K N SEATING PLANE M E J G D INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620−10 ISSUE T −A− F MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 0.25 (0.010) 16 PL 0.25 (0.010) 16 PL M T A S http://onsemi.com 5 M T B S DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 MC10H101 PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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