Top View Features Directly mounts to target PCB (needs tooling holes) with hardware A Minimum real estate required 30.23mm [1.190"] Compression plate distributes forces evenly Clamshell lid Materials: A 13 25.48mm [1.003"] Side View (Section AA) 4 1 Clam Shell Lid: Black anodized Aluminum. Height = 16.5 mm. 2 Socket Base: Black anodized Aluminum. Height = 6 mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 8.5 mm. 4 Compression Screw: Clear anodized Aluminum. Height = 25 mm, Fluted Knob 5 Ball Guide: Kapton polyimide. 6 7 8 Backing Plate: Black anodized Aluminum. Thickness= 4mm 9 Insulation Plate: FR4/G10 1 34.5mm + IC thickness 3 2 11 10 Customer's BGA IC 11 Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 12 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 13 Latch: Black anodised Aluminum. 6 5 Customer's PCB 9 IC Guide: Torlon Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 5/8" long. 8 10 12 7 CG-BGA-5004 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 1.33:1 Rev: B Drawing: S. Natarajan Date: 04/02/2010 File: CG-BGA-5004 Dwg.mcd Modified: 09/17/14 All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Orientation Mark Recommended PCB Layout Top View *3.3625mm 0.65mm typ. *Note: BGA pattern is not symmetrical with respect to the mounting holes. 11x11 array 15.225mm±0.125mm Socket size 17.725mm sqr. Backing plate outline 2.8625mm 2.54mm 3.1125mm 30.25mm 6.50mm Ø 0.850mm±0.025mm (x2) Non plated Alignment Hole 5.08mm Ø 0.35mm PAD (x121) 1.250mm±0.125mm (x4) Ø 1.75mm±0.05mm (x4) Non plated Mounting Hole 6.50mm 1.250mm±0.125mm (x4) Socket Lid Size 12.725mm (x4) 25.48mm Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask CG-BGA-5004 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com All dimensions are in mm unless stated otherwise Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 4:1 Rev: B Drawing: S.Natarajan Date: 04/02/2010 File: CG-BGA-5004 Dwg.mcd Modified: 09/17/14 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. PAGE 2 of 4 Compatible BGA Spec. D Y X 0.65mm E Øb Ø0.15 X Y Ø0.08 Top View Bottom View A1 0.10 Z 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A Z 0.08 Z DIM MIN MAX 1.2 A A1 0.27 0.37 b 0.35 0.45 D 8.0 BSC E 8.0 BSC e 0.65 BSC Array: 11x11 Side View CG-BGA-5004 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 8:1 Rev: B Drawing: S.Natarajan Date: 04/02/2010 File: CG-BGA-5004 Dwg.mcd Modified: 09/17/14 PAGE 3 of 4 2.50mm Top View 2.50mm 1.27mm (x4) 12.725mm±0.025mm (x4) Top View 17.725mm(x4) 2.00mm 4.00mm Ø 1.61mm±0.05mm (x4) 4.00mm sqr. 1.59mm 7.94mm Side View Side View Insulation Plate 4.00mm Backing Plate Description: Backing Plate with Insulation Plate CG-BGA-5004 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev: B Drawing: S.Natarajan Date: 04/02/2010 File: CG-BGA-5004 Dwg.mcd Modified: 09/17/14 All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4