bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 www.ti.com SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 Overvoltage Protection for 2-Series to 5-Series Cell Li-Ion Batteries with Internal Delay Timer Check for Samples: bq771800, bq771801, bq771802, bq771803, bq771808, bq771809 FEATURES • 1 • • • • • • 2-, 3-, 4-, and 5-Series Cell Overvoltage Protection Internal Delay Timer Fixed OVP Threshold High-Accuracy Overvoltage Protection: ± 10 mV Low Power Consumption ICC ≈ 1 µA (VCELL(ALL) < VPROTECT) Low Leakage Current Per Cell Input < 100 nA Small Package Footprint – 8-pin QFN (3 mm × 4 mm) APPLICATIONS • Protection in Li-Ion Battery Packs in: – Power Tools – UPS Battery Backup – Light Electric Vehicles (eBike, eScooter, Pedal Assist Bicycles) DESCRIPTION The bq7718xy family of products is an overvoltage monitor and protector for Li-Ion battery pack systems. Each cell is monitored independently for an overvoltage condition. In the bq7718xy device, an internal delay timer is initiated upon detection of an overvoltage condition on any cell. Upon expiration of the delay timer, the output is triggered into its active state (either high or low depending on the configuration). For quicker production-line testing, the bq7718xy device provides a Customer Test Mode with greatly reduced delay time. VDD 1 8 OUT V5 2 7 VSS V4 3 6 V1 V3 4 5 V2 Figure 1. bq771800 Pinout 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA OVP (V) OV Hysteresis (V) Output Delay Output Drive Tape and Reel (Large) Tape and Reel (Small) bq771800 4.300 0.300 4s CMOS Active High bq771800DPJR bq771800DPJT bq771801 4.275 0.050 3s NCH Active Low, Open Drain bq771801DPJR bq771801DPJT bq771802 4.225 0.300 1s NCH Active Low, Open Drain bq771802DPJR bq771802DPJT bq771803 4.275 0.050 1s NCH Active Low, Open Drain bq771803DPJR bq771803DPJT bq771804 (1) 4.225 0.300 3s CMOS Active High bq771804DPJR bq771804DPJT bq771805 (1) 4.325 0.300 3s CMOS Active High bq771805DPJR bq771805DPJT bq771806 (1) 4.350 0.300 3s CMOS Active High bq771806DPJR bq771806DPJT bq771807 (1) 4.450 0.300 3s CMOS Active High bq771807DPJR bq771807DPJT 4.200 0.050 1s NCH Active Low bq771808DPJR bq771808DPJT bq771809DPJR bq771809DPJT Part Number –40°C to 110°C bq771808 Package Package Designator 8-Pin QFN DPJ bq771809 4.200 0.050 1s CMOS Active High bq771810 (1) 4.200 0.250 1s CMOS Active High bq771810DPJR bq771810DPJT bq771811 (1) 4.225 0.050 1s CMOS Active High bq771811DPJR bq771811DPJT bq771812 (1) 4.250 0.050 1s CMOS Active High bq771812DPJR bq771812DPJT bq771813 (1) 4.250 0.050 1s CMOS Active High bq771813DPJR bq771813DPJT bq771814 (1) 3.900 0.300 3s CMOS Active High bq771814DPJR bq771814DPJT (1) 4.225 0.050 1s NCH Active Low bq771815DPJR bq771815DPJT bq771816 (1) 4.250 0.050 1s NCH Active Low bq771816DPJR bq771816DPJT 1s NCH, Active Low, Open Drain bq7718xyDPJR bq7718xyDPJT bq771815 bq7718xy (2) (1) (2) 3.850–4.650 0–0.300 Product Preview only. Future option, contact TI. THERMAL INFORMATION THERMAL METRIC (1) bq7718xy 8 PINS θJA Junction-to-ambient thermal resistance 56.6 θJC(top) Junction-to-case(top) thermal resistance 56.4 θJB Junction-to-board thermal resistance 30.6 ψJT Junction-to-top characterization parameter 1.0 ψJB Junction-to-board characterization parameter 37.8 θJC(bottom) Junction-to-case(bottom) thermal resistance 11.3 (1) 2 UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 www.ti.com SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 PIN FUNCTIONS bq7718xy Pin Name Type I/O 1 VDD P Power supply Description 2 V5 I Sense input for positive voltage of the fifth cell from the bottom of the stack 3 V4 I Sense input for positive voltage of the fourth cell from the bottom of the stack 4 V3 I Sense input for positive voltage of the third cell from the bottom of the stack 5 V2 I Sense input for positive voltage of the second cell from the bottom of the stack 6 V1 I Sense input for positive voltage of the lowest cell in the stack 7 VSS P Electrically connected to IC ground and negative terminal of the lowest cell in the stack 8 OUT O Output drive for overvoltage fault signal PIN DETAILS In the bq7718xy device, each cell is monitored independently. Overvoltage is detected by comparing the actual cell voltage to a protection voltage reference, VOV. If any cell voltage exceeds the programmed OV value, a timer circuit is activated. When the timer expires, the OUT terminal goes from inactive to active state. Cell Voltage (V) (V5–V4, V4–V3, V3–V2, V2–V1, V1–VSS) For NCH Open Drain Active Low configurations, the OUT pin pulls down to VSS when active (OV present) and is high impedance when inactive (no OV). VOV VOV –VHYS tDELAY OUT (V) Figure 2. Timing for Overvoltage Sensing Sense Positive Input for Vx This is an input to sense each single battery cell voltage. A series resistor and a capacitor across the cell for each input is required for noise filtering and stable voltage monitoring. Output Drive, OUT This terminal serves as the fault signal output, and may be ordered in either active HIGH or LOW options. Supply Input, VDD This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current, and a capacitor is connected to ground for noise filtering. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 3 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 www.ti.com FUNCTIONAL BLOCK DIAGRAM RVD PACK+ C VD VDD RIN V5 CIN RIN V4 V3 CIN RIN V2 Sensing Circuit CIN RIN REG INT_EN VOV Delay Timer OUT CIN RIN V1 OSC CIN VSS PACK – ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted) (1) PARAMETER CONDITION VALUE/UNIT VDD–VSS –0.3 to 30 V V5–VSS or V4–VSS or V3–VSS or V2–VSS or V1–VSS –0.3 to 30 V Supply voltage range Input voltage range Output voltage range OUT–VSS –0.3 to 30 V Continuous total power dissipation, PTOT See package dissipation rating. Functional temperature –40 to 110°C Storage temperature range, TSTG –65 to 150°C Lead temperature (soldering, 10 s), TSOLDER (1) 300°C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted) PARAMETER Supply voltage, VDD (1) Input voltage range V5–V4 or V4–V3 or V3–V2 or V2–V1 or V1–VSS Operating ambient temperature range, TA (1) 4 MIN MAX UNIT 3 NOM 25 V 0 5 V –40 110 °C See APPLICATION SCHEMATIC. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 www.ti.com SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 DC CHARACTERISTICS Typical values stated where TA = 25°C and VDD = 18 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD = 3 V to 25 V (unless otherwise noted). SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT Voltage Protection Threshold VCx bq771800 4.300 V bq771801 4.275 V bq771803 4.275 V bq771802 4.225 V (1) 4.225 V bq771805 (1) 4.325 V bq771806 (1) 4.350 V (1) bq771804 bq771807 VOV V(PROTECT) Overvoltage Detection 4.450 V bq771808 4.200 V bq771809 4.200 V (1) 4.200 V bq771811 (1) 4.225 V bq771812 (1) 4.250 V bq771813 (1) 4.250 V (1) 3.900 V bq771815 (1) 4.225 V bq771816 (1) 4.250 V bq771810 bq771814 bq771800 250 300 400 bq771801 0 50 100 V bq771802 250 300 400 mV bq771803 0 50 100 V bq771804 (1) 250 300 400 mV bq771805 (1) 250 300 400 mV bq771806 (1) 250 300 400 mV (1) bq771807 VHYS OV Detection Hysteresis 250 300 400 mV bq771808 0 50 100 V bq771809 0 50 100 V bq771810 VOADRIFT OV Detection Accuracy OV Detection Accuracy Across Temperature (1) 200 250 250 mV bq771811 (1) 0 50 100 V bq771812 (1) 0 50 100 V bq771813 VOA mV (1) 0 50 100 V bq771814 (1) 250 300 400 mV bq771815 (1) 0 50 100 V bq771816 (1) 0 50 100 V TA = 25°C –10 10 mV TA = –40°C –40 44 mV TA = 0°C –20 20 mV TA = 60°C –24 24 mV TA = 110°C –54 54 mV 2 µA 0.1 µA Supply and Leakage Current (1) ICC Supply Current (V5–V4) = (V4–V3) = (V3–V2) = (V2–V1) = (V1–VSS) = 4.0 V (See Figure 13.) IIN Input Current at Vx Pins (V5–V4) = (V4–V3) = (V3–V2) = (V2–V1) = (V1–VSS) = 4.0 V (See Figure 13.) 1 –0.1 Product Preview only. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 5 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 www.ti.com DC CHARACTERISTICS (continued) Typical values stated where TA = 25°C and VDD = 18 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD = 3 V to 25 V (unless otherwise noted). SYMBOL PARAMETER CONDITION MIN (V5–V4), (V4–V3), (V3–V2), (V2–V1), or (V1–VSS) > VOV, VDD = 18 V, IOH = 100 µA 6 TYP MAX UNIT Output Drive OUT, CMOS Active HIGH Versions Only VOUT1 Output Drive Voltage, Active High If three of four cells are short circuited and only one cell remains powered and > VOV, VDD = Vx (cell voltage), IOH = 100 µA VDD – 0.3 (V5–V4), (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 18 V, IOL = 100 µA measured into pin IOUTH1 OUT Source Current (during OV) (V5–V4), (V4–V3), (V3–V2), (V2–V1), or (V1–VSS) > VOV, VDD = 18 V. OUT = 0 V. Measured out of OUT pin IOUTL1 OUT Sink Current (no OV) (V5–V4), (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 18 V, OUT = VDD. Measured into OUT pin V 250 0.5 V 400 mV 4.5 mA 14 mA 400 mV 14 mA 100 nA Output Drive OUT, NCH Open Drain Active LOW Versions Only VOUT2 (V5–V4), (V4–V3), (V3–V2), (V2–V1), or Output Drive Voltage, Active Low (V1–VSS) > VOV, VDD = 18 V, IOL = 100 µA measured into OUT pin IOUTH2 OUT Sink Current (during OV) (V5–V4), (V4–V3), (V3–V2), (V2–V1), or (V1–VSS) > VOV, VDD = 18 V. OUT = VDD. Measured into OUT pin IOUTL2 OUT Source Current (no OV) (V5–V4), (V4–V3), (V3–V2), (V2–V1), and (V1–VSS) < VOV, VDD = 18 V. OUT = VDD. Measured out of OUT pin 250 0.5 Delay Timer tDELAY XCTMDELAY 6 OV Delay Time Fault Detection Delay Time during Customer Test Mode Submit Documentation Feedback bq771800 3.2 4 4.8 s bq771801 2.4 3 3.6 s bq771802, bq771803 0.8 1 1.2 s Preview option only. Contact TI. 4.4 5.5 6.6 s See CUSTOMER TEST MODE. 15 ms Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 www.ti.com SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 TYPICAL CHARACTERISTICS 4.40 0.316 Mean Min Max 4.39 4.38 0.315 4.36 VHYS (V) VOUT (V) 4.37 4.35 4.34 4.33 0.314 0.313 4.32 4.31 4.30 −50 −25 0 25 50 Temperature (°C) 75 100 125 0.312 −50 −25 0 G001 Figure 3. Overvoltage Threshold (OVT) vs. Temperature 25 50 Temperature (°C) 75 100 125 G002 Figure 4. Hysteresis VHYS vs. Temperature 1.6 1.8 1.5 1.6 1.4 1.4 1.2 ICELL (µA) IDD (µA) 1.3 1.1 1.0 1.2 1.0 0.9 0.8 0.8 0.7 0.6 −50 −25 0 25 50 Temperature (°C) 75 100 125 0.6 −50 Figure 5. IDD Current Consumption vs. Temperature at VDD = 16 V 0 25 50 Temperature (°C) 75 100 125 G004 Figure 6. ICELL vs. Temperature at VCELL= 9.2 V −3.68 8 −3.70 7 −3.72 6 −3.74 −3.76 VOUT (V) IOUT (mA) −25 G003 −3.78 −3.80 −3.82 5 4 3 2 −3.84 1 −3.86 −3.88 −50 −25 0 25 50 Temperature (°C) 75 100 Figure 7. Output Current IOUT vs. Temperature Copyright © 2012–2013, Texas Instruments Incorporated 125 G005 0 0 5 10 15 VDD (V) 20 25 30 G006 Figure 8. VOUT vs. VDD Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 7 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 www.ti.com APPLICATION INFORMATION CVD VDD OUT V5 VSS V4 V1 V3 V2 RVD Cell5 Cell4 RIN RIN CIN CIN RIN Cell3 CIN RIN Cell2 Cell1 RIN CIN CIN Figure 9. Application Configuration NOTE In the case of an Open Drain Active Low configuration, an external pull-up resistor is required on the OUT terminal. Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 9 shows each external component. Table 1. Parameters PARAMETER EXTERNAL COMPONENT MIN NOM MAX Voltage monitor filter resistance RIN 900 1000 1100 Ω Voltage monitor filter capacitance CIN 0.01 0.1 µF Supply voltage filter resistance RVD 100 Supply voltage filter capacitance CVD 1K 0.1 CD external delay capacitance 0.1 OUT Open drain version pull-up resistance to PACK+ 100 UNIT Ω µF 1 µF kΩ NOTE The device is calibrated using an RIN value = 1 kΩ. Using a value other than this recommended value changes the accuracy of the cell voltage measurements and VOV trigger level. 8 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 www.ti.com SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 APPLICATION SCHEMATIC C VD C VD OUT VDD Cell4 R IN R IN Cell2 R IN Cell1 OUT V5 VSS V5 VSS V4 V1 V4 V1 V3 V2 V3 V2 C IN RIN R IN Cell3 VDD R VD RVD C IN Cell3 C IN Cell2 C IN Cell1 CIN RIN RIN Figure 10. 4-Series Cell Configuration CIN CIN Figure 11. 3-Series Cell Configuration with Fixed Delay C VD VDD OUT V5 VSS V4 V1 V5 V2 R VD R IN Cell2 R IN Cell1 CIN CIN Figure 12. 2-Series Cell Configuration with Internal Fixed Delay NOTE In these application examples, an external pull-up resistor is required on the OUT terminal to configure for an Open Drain Active Low operation. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 9 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 www.ti.com CUSTOMER TEST MODE Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V5 (see Figure 13). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal operation. To exit Customer Test Mode, remove the VDD to V5 voltage differential of 10 V so that the decrease in this value automatically causes an exit. CAUTION Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltages for the individual cell voltages (V5–V4), (V4–V3), (V4–V3), (V3–V2), (V2–V1), and (V1–VSS). Stressing the pins beyond the rated limits may cause permanent damage to the device. Figure 13 shows the timing for the Customer Test Mode. Cell Voltage (V) (V5–V4, V4–V3, V3–V2, V2–V1, V1–VSS) 10 V VOV VOV – VHYS OUT (V) > 10 ms Figure 13. Timing for Customer Test Mode 10 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 www.ti.com SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 Figure 14 shows the measurement for current consumption for the product for both VDD and Vx. VDD OUT V5 VSS I IN V4 V1 I IN V3 V2 ICC I IN Cell5 Cell4 Cell3 I IN Cell2 IIN Cell1 Figure 14. Configuration for IC Current Consumption Test Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 11 bq771800, bq771801, bq771802 bq771803, bq771808, bq771809 SLUSAX1B – DECEMBER 2012 – REVISED OCTOBER 2013 www.ti.com REVISION HISTORY Changes from Original (December 2012) to Revision A • Page Added bq771808 device to Production Data ........................................................................................................................ 2 Changes from Revision A (September 2013) to Revision B • 12 Page Added bq771809 device to Production Data ........................................................................................................................ 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771808 bq771809 PACKAGE OPTION ADDENDUM www.ti.com 23-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ771800DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771800 BQ771800DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771800 BQ771801DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771801 BQ771801DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771801 BQ771802DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771802 BQ771802DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771802 BQ771803DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771803 BQ771803DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771803 BQ771808DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771808 BQ771808DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771808 BQ771809DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771809 BQ771809DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771809 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Oct-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing BQ771800DPJR WSON DPJ 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771800DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771801DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771801DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771802DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771802DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771803DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771803DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771808DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771808DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771809DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771809DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ771800DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771800DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771801DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771801DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771802DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771802DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771803DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771803DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771808DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771808DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771809DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771809DPJT WSON DPJ 8 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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