Material Content Data Sheet Sales Product Name BFP 520F H6327 MA# MA001351310 Package PG-TSFP-4-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal < 10% tin gold silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver 7440-31-5 7440-57-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 20. April 2015 Weight [mg] 1.87 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.001 0.03 269 0.002 0.10 1041 0.014 0.77 0.000 0.01 0.001 0.04 395 0.002 0.12 1184 0.734 39.30 39.47 393028 394686 0.007 0.35 0.35 3543 3543 0.010 0.52 0.208 11.14 0.750 40.15 51.81 401472 518028 0.050 2.65 2.65 26527 26527 0.090 4.82 4.82 48191 0.90 7715 2. 3. 5180 111376 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 9025 79 Important Remarks: 1. Sum [ppm] 48191 1000000