Infineon MA001351310 Material content data sheet Datasheet

Material Content Data Sheet
Sales Product Name
BFP 520F H6327
MA#
MA001351310
Package
PG-TSFP-4-1
Issued
Weight*
Construction Element
Material Group
Substances
CAS#
if applicable
chip
non noble metal
noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
tin
gold
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
7440-31-5
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
60676-86-0
7440-31-5
7440-22-4
leadframe
wire
encapsulation
leadfinish
plating
*deviation
20. April 2015
Weight
[mg]
1.87 mg
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
0.001
0.03
269
0.002
0.10
1041
0.014
0.77
0.000
0.01
0.001
0.04
395
0.002
0.12
1184
0.734
39.30
39.47
393028
394686
0.007
0.35
0.35
3543
3543
0.010
0.52
0.208
11.14
0.750
40.15
51.81
401472
518028
0.050
2.65
2.65
26527
26527
0.090
4.82
4.82
48191
0.90
7715
2.
3.
5180
111376
Sum in total: 100.00
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Infineon Technologies AG
Address
81726 München
Internet
www.infineon.com
9025
79
Important Remarks:
1.
Sum
[ppm]
48191
1000000
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