LV8907UW Sensor-less Three-phase Brushless DC Motor Controller, with Gate Drivers, for Automotive www.onsemi.com Overview The LV8907 is a high performance, AEC−Q100 qualified, sensor−less three−phase BLDC motor controller with integrated gate drivers for driving external N−MOSFETs. An on−chip two−stage charge pump provides required gate voltage for a wide range of low RDS(ON) type external N−MOSFETs. The device offers a rich set of system protection and diagnostic functions such as over−current, over−voltage, short−circuit, under−voltage, over−temperature and many more. It supports open−loop as well as closed−loop speed control with user configurable startup, speed setting and proportional/integral (PI) control coefficients, making it suitable for a wide range of motor and load combinations. With a built−in linear regulator for powering external circuits, a watchdog timer, and a LIN (Local Interconnect Network) transceiver, the LV8907 offers a very small system solution. The LV8907 stores system parameters in embedded one−time programmable (OTP) non−volatile memory in addition to RAM system memory. An SPI interface is provided for parameter setting and monitoring the system status. With the operating junction temperature tolerance up to 175°C and electrically LIN compatible control signals (PWM and Enable), the LV8907 is an ideal solution for stand−alone BLDC motor control systems. SPQFP48 7x7 CASE 131AN MARKING DIAGRAM LV8907 YMALN Y M A LN Features • AEC−Q100 Qualified and PPAP Capable • Operating Junction Temperature Up to 175°C • Operating Voltage Range from 5.5 V to 20 V with Tolerance from • • • • • • • 4.5 V to 40 V Embedded Proprietary Sensor−less Trapezoidal and Pseudo−sinusoidal Commutation Supports Open−loop as well as Closed−loop Speed Control Integrated Gate Drivers for Driving Six N−MOSFETs Two−stage Charge Pump for Continuous 100% Duty Cycle Operation 5 V /3.3 V Regulator, LIN Transceiver and Watchdog Timer Applications Using an External Microcontroller. Configurable Speed Settings and PI Control Coefficients Various System Protection Features Including: ♦ Shoot through Protection Using Configurable Dead−time ♦ Drain−source Short Detection ♦ Cycle−by−cycle Current Limit and Over−current Shutdown ♦ Over−voltage and Under−voltage Shutdown ♦ Over−temperature Warning and Shutdown ♦ Input PWM Fault Detection © Semiconductor Components Industries, LLC, 2016 June, 2018 − Rev. 1 1 = Production Year = Production Month = Assembly Start Week = Lot Number ORDERING INFORMATION Device Package Shipping† LV8907UWR2G SQFP48K 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Typical Applications • Automotive Pumps (Fuel, Oil, and Hydraulic) • Fans (HVAC, Radiator, Battery Cooling, • LED Headlight Cooling) White Goods and Industrial BLDC Motor Control Publication Order Number: LV8907UW/D LV8907UW LV8907 BLOCK DIAGRAM CP1N CP1P CP2N CP2P VGL VS CHP VCC V3RI V3RO LIN_PWMIN LV8907 5V / 3.3V Regulator Internal Regulator LIN Transceiver / PWM Input TXD Charge Pump COM Back EMF Detection Watchdog Timer OTP OSC System Registers RXD UH CSB UOUT SCLK VH SI System MOSFET SO Control Pre−driver EN and Or Sensor−less PWMIN VOUT Commutation WH WOUT Gate Driver FG UL VL WAKE WL SUL DIAG VS CHP VGL Voltage Monitor TEST VS Thermal Shutdown Logic Protection Logic − + VDS Monitor SVL SWL + − + − RF 200 mV 100 mV RFSENS TH LGND AGND PGND Figure 1. LV8907 Block Diagram www.onsemi.com 2 LV8907UW APPLICATION BLOCK DIAGRAMS + PWMIN COM LIN_PWMIN TXD RXD UH UOUT VH CSB SCLK SI VOUT WH WOUT LV8907 SO EN PWMIN FG UL VL WL SUL DIAG SVL SWL RF PGND TH TEST AGND WAKE LGND Key VGL CP2P CP2N CP1P CHP VS VCC V3RI V3RO CP1N VBAT RFSENS V3RO Figure 2. Example of Standalone Configuration + CP2P CP2N VS CHP LIN_PWMIN V3RI V3RO CP1P LIN CP1N VBAT VGL COM VCC UH UOUT VH VOUT WH WOUT UL VL WL SUL SVL SWL TXD RXD CSB SCLK SI SO EN PWMIN FG DIAG LV8907 PGND TEST AGND WAKE LGND Key TH MCU RF RFSENS V3RO Figure 3. Example of LIN Based Control Configuration www.onsemi.com 3 LV8907UW SWL WL WOUT WH SVL VL VOUT VH SUL UL UOUT UH PIN ASSIGNMENTS 36 PGND 25 37 24 VGL COM NC LV8907 CHP CP1N CP1P CP2P RF NC RFSENS TH SQFP48K(7x7) 7mm x 7mm CP2N VS WAKE EN NC TEST NC LIN_PWMIN V3RO NC V3RI 48 13 1 LGND DIAG FG SO SI SCLK CSB NC AGND PWMIN TXD RXD VCC 12 Figure 4. LV8907 Pinout PIN DESCRIPTION Pin Name Pin No Description Page VCC 1 5 V or 3.3 V regulator output pin. (Selected by internal register setting) Power supply for microcontroller. Connect capacitor to AGND for stability 15 RXD 2 Open drain logic level output of LIN_PWMIN received data. Use pull-up to a voltage less than or equal to VS 17 TXD 3 Logic level input of transmit data for LIN_PWMIN 17 PWMIN 4 Digital level PWM input pin for direct drive or speed register selection details. Input polarity can be programmed for either active high or active low 16 AGND 5 Analog GND pin NC 6, 14, 16,18, 21, 23 No Connections CSB 7 Active low SPI interface chip selection pin 20 SCLK 8 SPI interface clock input pin 20 SI 9 Active high SPI interface serial data input pin 20 SO 10 Open drain SPI interface serial data output pin 20 FG 11 Open drain back−EMF transition output pin. The frequency division ratio is selectable via register settings 18 DIAG 12 Programmable open drain diagnostic output 17 LGND 13 LIN Block GND pin. Must be connected to AGND on the PCB LIN_PWMIN 15 LIN transceiver input/output. Register selectable as high voltage PWM input with a VVS/2 threshold TEST 17 Factory test pin. Connect to GND TH 19 Thermistor input pin for power stage temperature detection. If the input voltage is below the threshold voltage, an error is triggered. The error threshold is programmable. To disable tie to V3RO 18 RFSENS 20 Shunt resistance reference pin. Connect this pin to the GND side of the Shunt resistor with Kelvin leads 18 www.onsemi.com 4 17 LV8907UW PIN DESCRIPTION Pin Name Pin No Description RF 22 Output current detect pin. Connect this pin to higher terminal of the shunt resistor with Kelvin leads 18 COM 24 COM input pin. Connect this pin to the motor neutral point if available. This point may be derived from a resistive network with 1k resistors to the phases 13 SUL SVL SWL 33 29 25 Current return path for low−side gate drive. Short circuit shutoff level is measured between this pin and its corresponding phase pin 17 UL VL WL 34 30 26 Gate driver output pin for the low−side Nch Power FET. Use gate resistors for wave−shaping 17 UOUT VOUT WOUT 35 31 27 Current return path for high−side gate drive and reference for high−side short circuit shut−off 17 UH VH WH 36 32 28 Gate driver output pin for the high−side Nch Power FET. Use gate resistors for wave−shaping 17 PGND 37 GND pin for the charge pump VGL 38 Power supply pin for low−side gate drive. Connect decoupling capacitor between this pin and GND 15 CHP 39 Power supply pin for high−side gate drive. Connect decoupling capacitor between this pin and VS 15 CP1N 40 Charge transfer pin of the Charge pump (1N). Connect capacitor between CP1P and CP1N 15 CP1P 41 Charge transfer pin of the Charge pump (1P). Connect capacitor between CP1P and CP1N 15 CP2P 42 Charge transfer pin of the Charge pump (2P). Connect capacitor between CP2P and CP2N 15 CP2N 43 Charge transfer pin of the Charge pump (2N). Connect capacitor between CP2P and CP2N 15 VS 44 Power supply pin 14 WAKE 45 WAKE pin. “H” = Operating mode, “L” or “Open” = Sleep mode. In Sleep mode all gate drivers are high−impedance. To protect the power stage, pulldown resistors on the gate lines may be required 14 EN 46 Motor stage Enable pin. “H” = Normal enabled mode; “L” or “Open” = Standby mode. In Standby mode all gate drivers driven low. Motor freewheeling 14 V3RO 47 3V regulator output pin. Connect capacitor between this pin and AGND 15 V3RI 48 3V regulator input pin (internally connected to ccontrol, and logic circuits). Connect to V3RO pin 15 www.onsemi.com 5 Page LV8907UW PIN CIRCUIT VS VS VS V3RO V3RI VCC TH RFSENS PWMIN SCLK SI 100 k TEST EN TYPE2: V3RO, VCC TYPE1: V3RI, TH, RFSENS TYPE3: PWMIN, SCLK, SI, TEST, EN VS VS VS RXD DIAG WAKE 30 k SO FG V3RO TXD CSB 100 k TYPE4: RXD, SO, FG, DIAG TYPE5: TXD, CSB TYPE6: WAKE CHP VGL COM UH VH WH 60 60 k UL VL WL UOUT VOUT WOUT SUL SVL SWL TYPE7: UH , VH, WH , UOUT, VOUT, WOUT TYPE9: COM TYPE8: UL , VL, WL , SUL, SVL, SWL CHP VGL VS CP2P CP1P 30 k LIN_PWMIN VGL VS VS CP1N CP2N LGND PGND TYPE10: VGL, CP1P, CP1N, PGND PGND TYPE11: CHP, CP2P, CP2N, PGND Figure 5. Pin Circuit www.onsemi.com 6 TYPE12 : LIN_PWMIN, LGND 20 A LV8907UW 20 A 20 A VS RF VS RFSENS TYPE13: RF, RFSENS Figure 6. Pin Circuit (continued) www.onsemi.com 7 20 A LV8907UW ABSOLUTE MAXIMUM RATINGS Parameter Pins Ratings Unit Supply Voltage VS −0.3 to 40 V Charge Pump Voltage (High Side) CHP −0.3 to 40 V Charge Pump Voltage (Low Side) VGL −0.3 to 16 V Logic Power Supply VR3I, VR3O −0.3 to 3.6 V 5 V Regulator Voltage VCC −0.3 to 5.5 V Digital I/O Voltage1 WAKE,EN −0.3 to 40 V Digital I/O Voltage2 CSB, SCLK, SI, PWMIN, TXD, TEST −0.3 to 5.5 V Digital Output Voltage DIAG, FG, SO, RXD −0.3 to 40 V LIN Bus Voltage LIN_PWMIN Voltage differential between Pins are 60 V or less −40 to 40 V RF Input Voltage RF −3 to 3.6 V RFSENS Input Voltage RFSENS −0.3 to 1.0 V TH Input Voltage TH −0.3 to 3.6 V Voltage Tolerance UOUT, VOUT, WOUT, COM −3 to 40 V High−side Output UH, VH, WH −3 to 40 V Low−side Output UL, VL, WL −3 to 16 V Low−side Source Output Voltage SUL, SVL, SWL −3 to 3.6 V Voltage between HS Gate and Phase UH−UOUT,VH−VOUT,WH−WOUT −0.3 to 40 V Voltage between LS Gate and Source UL−SUL, VL−SVL, WL−SWL −0.3 to 16 V Output Current UH,VH,WH,UL,VL,WL pulsed (duty5%) 50 400 mA Open Drain Output Current DIAG, FG, SO, RXD 10 mA Thermal Resistance (RjA) With Board (Note 1) 47 _C/W ESD Human Body Model AEC Q100−002 2 kV ESD Charged Device Model AEC Q100−011 750 V Storage Temperature −55 to 150 _C Junction Temperature −40 to 150 _C 150 to 175 _C (Note 2) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. 76.2 × 114.3 × 1.6 mm, glass epoxy board. 2. Operation outside the Operating Junction temperature is not guaranteed. Operation above 150_C should not be considered without a written agreement from ON Semiconductor Engineering staff. www.onsemi.com 8 LV8907UW ELECTRICAL CHARACTERISTICS Valid at a junction temperature range from −40°C to 150°C, for supply Voltage 6.0 V ≤ VS ≤ 20 V. Typical values at 25°C and VS = 12 V unless specified otherwise. (Note 4) Parameter Symbol Supply−voltage Range Condition VS Supply Current Into VS Operational Junction Temperature Min Typ Max Unit 6 12 20 V Device fully functional 5.5 20 V Full logic functionality, driver stage off 4.5 40 V Is1 V3RO = V3RI 15 25 mA Is2 Sleep Mode 40 80 mA 150 °C Topj −40 OUTPUT BLOCK (UH, VH, WH, UL, VL, WL) Low−side Output On−resistance 1 RON(L1) “L” level Io = 10 mA 6 15 Low−side Output On−resistance 2 RON(L2) “H” level Io = −10 mA 12 22 High−side Output On−resistance 1 RON(H1) “L” level Io = 10 mA 6 15 High−side Output On−resistance 2 RON(H2) “H” level Io = −10 mA 12 22 fPWMO PWMF = 0 Low frequency mode 19.5 20.5 kHz PWMDUTY PWMF = 0 Low frequency mode (Note 5) 0.2 % 3.465 V 50 mV 50 mV DRIVE OUTPUT BLOCK (PWM BLOCK) Drive Output PWM Frequency Output PWM Duty Cycle Resolution 18.5 3V CONSTANT VOLTAGE OUTPUT Output Voltage V3RO Voltage Regulation V3R1 Load Regulation V3REG2 Current Limit 3.135 3.3 VS = 6.0 to 20 V Io = 5 mA to 25 mA IV3RO Not for external loads > 5 mA 50 mA Output Voltage VC5RO VS = 6.0 to 20 V 5.25 V Voltage Regulation VC5R1 VS = 6.0 to 20 V 50 mV Load Regulation VC5R2 Io = 5 mA to 25 mA 50 mV Current Limit IVCC5V 50 Output Voltage VC3RO 3.135 Voltage Regulation VC3R1 Load Regulation VC3R2 Current Limit IVCC3V3 VCC 5 V CONSTANT VOLTAGE OUTPUT 4.75 5.00 mA VCC 3 V CONSTANT VOLTAGE OUTPUT 3.3 3.465 V VS = 6.0 to 20 V 50 mV Io = 5 mA to 25 mA 50 mV 50 mA LOW−SIDE GATE VOLTAGE OUTPUT (VGL PIN) Low−side Output Voltage1 VGLH1 6.0 < VS ≤ 8.0 V Io = −10 mA www.onsemi.com 9 8.0 12.0 14.0 V LV8907UW ELECTRICAL CHARACTERISTICS Valid at a junction temperature range from −40°C to 150°C, for supply Voltage 6.0 V ≤ VS ≤ 20 V. Typical values at 25°C and VS = 12 V unless specified otherwise. (Note 4) Parameter Symbol Condition Min Typ Max Unit 8.0 < VS ≤ 20 V Io = −10 mA 10.0 12.0 14.0 V SSCG = 0 49.6 52.1 54.6 kHz LOW−SIDE GATE VOLTAGE OUTPUT (VGL PIN) Low−side Output Voltage2 VGLH2 HIGH−SIDE OUTPUT VOLTAGE (CHP PIN) Internal Charge Pump Oscillator Frequency FCP Boost Voltage1 VGHH1 6.0 < VS ≤ 8.0 V Io = −10 mA VS +6.0 VS +12.0 VS +14.0 V Boost Voltage2 VGHH2 8.0 < VS ≤ 20 V Io = −10 mA VS +9.0 VS +12.0 VS +14.0 V 1000 Hz 220 ms 18.5 kHz PWMIN INPUT PIN IN LOW FREQUENCY MODE Input PWM Frequency Range PWM Signal Timeout fLPWM 5.3 TLPWMIN 210 PWMIN INPUT PIN IN HIGH FREQUENCY MODE fHPWM 0 High−level Input Voltage VIH1 0.8×V3RO Low−level Input Voltage VIL1 Input Hysteresis Voltage VIHYS1 0.1 RDVI1 15 Input PWM Frequency Range DIGITAL INPUT PIN (CSB, TXD) Pull−up Resistance. V 0.2×V3RO V 0.35 0.6×V3RO V 30 60 K DIGITAL INPUT PIN (SCLK, SI, PWMIN, TEST) High−level Input Voltage VIH2 Low−level Input Voltage VIL2 Input Hysteresis Voltage VIHYS2 0.1 RDVI2 50 VIH3 2.5 Pull−down Resistance 0.8×V3RO V 0.2×V3RO V 0.35 0.6×V3RO V 100 200 K WAKE INPUT PIN High−level Input Voltage Low−level Input Voltage Internal Pull−down Resistance V VIL3 RDVI3 50 High−level Input Voltage VIH4 0.8×V3RO Low−level Input Voltage VIL4 Input Hysteresis Voltage VIHYS4 0.1 RDVI4 50 100 0.6 V 200 K EN INPUT PIN Pull−down Resistance V 0.2×V3RO V 0.35 0.6×V3RO V 100 200 K 0.2 V 10 mA DIGITAL OUTPUT PIN (SO, FG, DIAG, RXD) Output Voltage Output Leakage Current VOL Io = 1 mA pull−up current ILOLK CURRENT LIMIT / OVER−CURRENT PROTECTION (RF, RFSENS) Current Limit Voltage VRF1 Voltage between RF and RFSENS 90 100 110 mV Over−current Detection Voltage Threshold VRF2 Voltage between RF and RFSENS 180 200 220 mV www.onsemi.com 10 LV8907UW ELECTRICAL CHARACTERISTICS Valid at a junction temperature range from −40°C to 150°C, for supply Voltage 6.0 V ≤ VS ≤ 20 V. Typical values at 25°C and VS = 12 V unless specified otherwise. (Note 4) Parameter Symbol Condition Min Typ Max Unit −10% 0.35 0.30 0.25 0.20 +10% V 0.025 0.05 0.075 V EXTERNAL THERMAL PROTECTION (TH) Threshold Voltage Falling Hysteresis Range VTH0 VTH1 VTH2 VTH3 THTH[1:0] = 00 THTH[1:0] = 01 THTH[1:0] = 10 THTH[1:0] = 11 VTHHYS THERMAL PROTECTION Thermal Warning Temperature TTW0 TTW1 Thermal Warning Temperature Hysteresis TTWHYS Thermal Shutdown Temperature TTSD0 TTSD1 Thermal Shutdown Temperature Hysteresis TTSDHYS Junction Temperature (Note 5) TSTS = 0 TSTS = 1 Junction Temperature (Note 5) Junction Temperature (Note 5) TSTS = 0 TSTS = 1 C 125 150 25 _C _C 150 175 Junction Temperature (Note 5) 25 _C VOLTAGE MONITORING (VS, CHP, VGL, VCC) VSLV 4.8 VSLVHYS 0.1 VSHV 20 VSHVHYS 0.5 CHP Under−voltage Detection CHPLV VS+4.5 CHP Under−voltage Detection Hysteresis CHPLVHYS 0.2 VGL under−voltage detection VGLLV 4.5 VGL Under−voltage Detection Hysteresis VGLLVHYS 0.2 VS under−voltage Detection VS under−voltage Detection Hysteresis VS Over−voltage Detection Over−voltage Detection Hysteresis VCC3.3 Under−voltage Detection VCLV3 VCC3.3 Under−voltage Detection hysteresis VCLVHYS3 VCC5.0 Under−voltage Detection VCLV5 VCC5.0 Under−voltage Detection Hysteresis VCLVHYS5 REGSEL = 0, VCEN = 1, VCLVPO = 0 2.3 REGSEL = 0, VCLVPO = 0 0.1 REGSEL = 1, VCEN = 1, VCLVPO = 0 3.8 REGSEL = 1, VCLVPO = 0 0.1 −1 0.25 1.0 0.4 0.4 0.25 0.25 5.1 V 0.4 V 24 V 1.5 V VS+5.5 V 0.7 V 5.5 V 0.7 V 2.7 V 0.4 V 4.2 V 0.4 V LIN_PWMIN PIN (LIN TRANSMITTER) LIN Output Current Bus in Dominant State Ibus_pas_dom Driver OFF Vbus = 0 V,VS = 7 V & 18 V LIN Output Current Bus in Recessive State Ibus_pas_rec Driver OFF Vbus = VS,VS = 7 V & 18 V Ibus_lim Driver ON Vbus = VS, VS = 7 V & 18 V 40 VS = 7 V & 18 V 20 Short Circuit Current Limitation Internal Pull−up Resistance Rslave www.onsemi.com 11 mA 30 20 uA 200 mA 47 kΩ LV8907UW ELECTRICAL CHARACTERISTICS Valid at a junction temperature range from −40°C to 150°C, for supply Voltage 6.0 V ≤ VS ≤ 20 V. Typical values at 25°C and VS = 12 V unless specified otherwise. (Note 4) Parameter Symbol Condition Min Typ Max Unit LIN_PWMIN PIN (LIN RECEIVER & PWMIN) High−level Input Voltage Vbusdom VS = 7 V & 18 V 0.6×VS VS V Low−level Input Voltage Vbusrec VS = 7 V & 18 V 0 0.4×VS V Input hysteresis voltage Vbushys VS = 7 V & 18 V 0.05×VS 0.2×VS V AC CHARACTERISTICS LIN_PWMIN PIN Duty Cycle 1 D1 Threcmax = 0.744VS Thdommax = 0.581VS VS = 7.0 V &18 V, tbit = 50 μs D1 = tBusrecmin / (2×tbit) 0.396 0.5 Duty Cycle 2 D2 Threcmin = 0.422VS Thdommin = 0.284VS VS = 7.6 V &18 V, tbit = 50 μs D1 = tBusrecmax / (2×tbit) 0.5 0.581 Duty Cycle 3 D3 Threcmax = 0.778VS Thdommax = 0.616VS VS = 7.0 V &18 V, tbit = 96 μs D1 = tBusrecmin / (2×bit) 0.417 0.5 Duty Cycle 4 D4 Threcmin = 0.389VS Thdommin = 0.251VS VS = 7.6 V &18 V, tbit = 96 μs D1 = tBusrecmax / (2×tbit) 0.5 0.59 Propagation Delay Bus Recessive to RXD = High Trx_pdr VS = 7 V & 18 V 6 μs Propagation Delay Bus Dominant to RXD = low Trx_pdf VS = 7 V & 18 V 6 μs Symmetry of Receiver Propagation Delay Trx_sym trx_pdr−Trxpdf 2 μs −2 Normal Slope Rise Time 12 T_rise_norm 12 VS = 12 V, LINSLP = 0 L1, L2 (Note 6) 22.5 μs Normal Slope Fall Time 12 T_fall_norm 12 VS=12V,LINSLP=0 L1, L2 (Note 6) 22.5 μs Symmetry of Normal Slope 12 T_sym_norm 12 VS=12V,LINSLP=0 L1, L2 (Note 6) 4 μs −4 Normal Slope Rise Time 3 T_rise_norm 3 VS = 12 V, LINSLP = 0, L3 (Note 6) 27 μs Normal Slope Fall Time 3 T_fall_norm 3 VS = 12 V, LINSLP = 0, L3 (Note 6) 27 μs Symmetry of Normal Slope 3 T_sym_norm 3 VS = 12 V, LINSLP = 0, L3 (Note 6) 5 μs Low Slope Rise Time T_rise_low VS = 12 V, LINSLP = 0, L3 (Note 6) 62 μs Low Slope Fall Time T_fall_low VS = 12 V, LINSLP = 0, L3 (Note 6) 62 μs −5 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Not tested in production. Guaranteed by design. 4. Load conditions Rbus/Cbus: L1 = 1 kΩ / 1 nF, L2 = 660 Ω / 6.8 nF, L3 = 500 Ω / 10 nF Typical Operating Conditions. www.onsemi.com 12 LV8907UW DETAILED FUNCTIONAL DESCRIPTON • LIN Transceiver • External Temperature Sensor The LV8907 integrates full sensor−less brushless DC motor commutation and Proportional/Integral (PI) speed control. A robust startup algorithm combined with OTP registers for important system parameters make this IC a solution of choice for many BLDC applications which need to turn a motor in one direction only such as pumps, fans, etc. No detailed BLDC commutation knowledge is necessary. Building a BLDC application with the LV8907 is even simpler than building a DC motor. Only a PWM pulse train is necessary to control the motor – either directly or via speed control. Switch−only applications are also possible. Speed and error information can be fed back to the control unit via FG and DIAG outputs. If more complex operation and flexibility are required the LV8907 can be combined with a small microcontroller. The LV8907 implements motor commutation and includes all necessary support circuitry for the microcontroller such as: • 5 V / 3.3 V Power supply • Integrated watchdog timer In case of system errors such as a missing control signal, or a watchdog error, the LV8907 includes auto−run settings. If one of those errors occur and connection to the microcontroller is lost, the motor can continue running at a pre−defined fixed duty cycle of 25%, 50%, 75% or 100%. Motor Commutation Motor position is detected using the BEMF of the un−driven phase of a rotating three−phase motor relative to its neutral point connected to COM. Once an adequate BEMF level has been detected voltages applied via PWM to the other two phases of the motor maintain rotation. The digital equivalent of the BEMF signal appears at FG. Two different PWM patterns can be selected via register MRCONF12 to match motors with trapezoidal or sinusoidal BEMF. Figure 7. Trapezoidal vs. Sinusoidal Drive @ 50% Duty Cycle (CH1 = U Phase Voltage, CH2 = V Phase Voltage, CH3 = W Phase Voltage, CH4 = U Phase Current) rotor magnetic field positioning and allows for higher motor speeds at the expense of efficiency. Advancing commutation can be done dynamically by a companion microcontroller. Figure 7 shows a comparison of a motor driven with normal trapezoidal commutation (left) vs. one driven with sinusoidal drive. With sinusoidal drive each phase is driven 150 electrical degrees with soft transitioning. This results in sinusoidal drive current with lower total harmonic distortion, reducing both torque ripple and noise. Trapezoidal drive results in a higher voltage across the motor phases and may be preferable for high torque and high speed operation. Motor Startup BEMF is used for rotor position sensing but for BEMF generation the motor has to be rotating. A stopped motor will initially be driven open−loop until BEMF can be detected. Open−loop operation is motor parameter dependent. The most critical parameters depend on load and motor inertia. They are initial commutation frequency and PWM duty cycle (which affects motor flux density). In the LV8907, the initial commutation frequency is programmed with register STOSC. Flux density is regulated by limiting startup current with a current ramp. During this ramp the current limit is increased in 16 steps from 0 to the maximum current defined by the external shunt. The ramp time from 105 ms to 6.72 s is defined in register SSTT. Maximum Motor Speed The maximum physical motor speed of the application is limited by the internal clock to approximately 48000 electrical RPM. If this is exceeded the LV8907 coasts the motor until BEMF detection and drive can resume. Commutation Angle Adjustment In trapezoidal commutation mode it is possible to advance the commutation angle by up to 28 electrical degrees as defined in register LASET. Early commutation adjusts the www.onsemi.com 13 LV8907UW at V3RO. Once the voltage on V3RO as sensed on V3RI has passed the power on reset (POR) threshold the system oscillator starts, and after 32 counts of the system clock (3.2s typical) releases the internal digital reset which simultaneously starts the external regulator VCC and the charge−pump, and loads the system register contents from OTP into the internal registers. During the entire wake−up sequence of 8 ms (typ.) DIAG is masked for charge−pump and VCC under−voltage. After wake−up is complete, the IC enters Standby mode and DIAG is activated to display internal errors. During Standby mode full SPI access is possible. A high on EN takes the LV8907 from Standby to Normal mode. Normal mode allows motor control and SPI access is limited. A low on EN disables the motor stage regardless of the PWM input and returns the part back to Standby mode. The IC is shut down by taking WAKE below 0.6 V (min.). WAKE has priority over the state of EN, if EN hold functionality is desired; it needs to be implemented with an external diode from EN to WAKE. Register SSTEN allows to disable the current ramp if necessary. Fixed motor speed will be applied until either a valid BEMF has been detected in all three phases or the startup timer expires. Motor Lock This timer begins after the end of the current ramp and can be programmed from 420 ms to 6.72 s in register CPTM. If the timer expires a locked rotor error is flagged. In automatic retry mode, the LV8907 will restart after standby mode for time of eight times of CPTM. Spin−up of Rotating Motors The LV8907 can perform free−wheeling detection before applying the open loop spin−up algorithm described above. If the motor is already turning in the right direction the IC will continue with closed loop commutation. If the motor is turning in the wrong direction, the IC will wait for the motor to stop and then perform open−loop startup. There are two scenarios where this behavior might not be desirable: 1. Fast Startup is required Free−wheeling detection takes up to one electrical revolution of the motor, which may be inacceptable for some applications. In this case free−wheeling detection can be disabled by setting FRREN. See section “Fast Startup” 2. Wind−milling backwards Should the motor be driven by some external force as it is freewheeling in the wrong direction the LV8907 will potentially wait forever. Should start−up under these conditions be required, free−wheeling detection must be disabled as well System States LV8907 has three operating modes. The operating modes are controlled by WAKE and EN. Sleep mode Sleep mode is a power saving mode. All circuits are powered down, charge pump is inactive and the SPI port is unusable. Activating WAKE allows the transition from the sleep mode to either Standby or Normal mode. Standby mode In Standby mode the OTP content has been transferred into the master−register. In this mode all outputs are turned off. Any internal writable register that is not locked can be configured by SPI interface. Chip Activation, Shutdown and System States After power up of VS and WAKE above 2.5 V the LV8907 wakes up. Standby mode is entered after VS has exceeded 5.5 V (min.). A high level on WAKE > 2.5 V (max.) activates the IC from sleep mode which enables the internal linear regulator Normal mode In normal mode, outputs can be controlled and all blocks are active. All registers can be read through the SPI interface. Mode WAKE EN Internal bias Logic VCC Charge pump Drivers Sleep L × Disable Reset Disable Disable High−Z Standby H L Enable Active Enable Enable Low Normal H H Enable Active Enable Enable Enable Supply Voltage Transients must be configured for 3.3 V if low transient operation is desired. If over−voltage protection is enabled in MRCONF10 an over−voltage error is indicated if the supply rises beyond 20 V(min). In both under− and over−voltage error modes, the power stage drivers UH, VH, WH and UL, VL, and WL go low, turning the external power stage high−impedance and letting the motor freewheel. The LV8907 will re−engage the motor after conditions have returned to normal. The LV8907 is well suited to operate during typical automotive transients. It is fully functional during start−stop transients, as it maintains all specified parameters for supply voltages from 6 V < VS < 20 V. If the supply voltage falls below 5 V, for example during cold−cranking, under−voltage error is flagged, but digital functionality is maintained until the internal regulator falls below its under−voltage lockout level of 2.2 V. The VCC regulator www.onsemi.com 14 LV8907UW System Power Supplies • • • drops below 4.2 V in 5 V operation, or 2.7 V in 3.3 V operation. The VCC regulator can be enabled or disabled with register VCEN. Three power supplies are integrated into the LV8907: An internal 3.3 V regulator provides power to the digital and interface section The VCC regulator can be configured to provide 5 V or 3.3 V to an external processor and other loads A dual stage charge−pump allows 100% duty cycle operation and maintains full enhancement to the power stage at low input voltages Charge Pump Circuit for CHP and VGL LV8907 has an integrated charge pump circuit for low−side and high−side pre−driver supply. Low side drive voltage at VGL is 12 V(typ.) and high side drive voltage at CHP is VS + 12 V(typ.). For functionality see Figure 8. Under−voltage protection for the low side drivers activates if VGL falls below 4.8 V in which case the output FET’s will be turned off and VGL under−voltage error is flagged in register MRDIAG. Over−voltage protection for the high side drivers activates if VS becomes greater than 20 V(min). In that event the driver stage is disabled, over−voltage error is flagged in register MRDIAG, and both VGL and CHP are discharged to prevent output circuit destruction. The charge pump circuit operates nominally at 52.1 KHz. A SSCG function is provided to add a spread−spectrum component for EMI reduction. Internal Regulator V3RO, V3RI The internal regulator is supplied from VS, provides 3.3 V at V3RO. V3RI is connected to the power supply inputs of the control and logic circuit blocks. V3RO and V3RI need to be connected externally and bypassed to the GND plane for stability. V3RO must not be used for external loads. VCC Regulator The VCC regulator may power external loads up to 50 mA(max). VCC becomes active during Standby mode and can be configured via register REGSEL to provide 5 V or 3.3 V. Under−voltage error is flagged if the output voltage CCP2 CCP1 CVGL Current limitation Voltage clamping CP1P CP1N VGL CCHP CP2P CP2N CHP VS Supply for LS Pre−Drivers Buf Supply for HS Pre−Drivers Buf Figure 8. Charge Pump Circuit CHP(V) VGL (V ) CHP 20 V 12 V VS VGL 12 V VS 8V VS (V) 4.8 V 6.0 8.0 V VS CP ON under voltage CHP=VS +VGL VS (V ) 4.8 V 6.0 V 21 V CP ON CHP=VS +VGL VS over voltage VS under voltage 8.0 V CP ON VGL = VS x 2 Figure 9. High Side and Low Side Gate Voltages www.onsemi.com 15 21 V CP ON VGL = 12V VS over voltage LV8907UW INPUT PWM and SPEED CONTROL The LV8907 provides three speed control methods through the input PWM signal: 1. Direct PWM pass−through 2. Indirect PWM translation 3. Closed loop speed control Input duty cycles lower than 15% are considered a motor−off command and will also reset the error registers. Input to output duty cycle translation is described by the following formula: 0 Direct PWM Pass-through The input PWM frequency and duty cycle are directly fed to the power stage. This allows a companion microprocessor direct control over duty cycle and output frequency up to 18.5 kHz. No input frequency detection takes place in this mode, so 100% and 0% duty cycle can be applied. NOTE: It is important not to exceed 18.5 kHz to maintain reliable back−EMF detection. d OUT + Indirect PWM Translation This is the preferred mode for stand−alone operation. In this mode the input PWM signal is compared against minimum and maximum PWM frequency thresholds to allow for more robust operation. Frequencies above 1 kHz are ignored and frequencies below 5.3 Hz(typ.) are considered as 0% or 100% duty cycle (no frequency). The duty cycle of the PWM input signal is measured with a resolution of 9 bits. There is an inherent delay to detect and utilize this duty cycle information, the motor will not start. The delay time is determined by . If faster start−up is necessary, see section “Fast Startup” below. If no frequency is detected after 210 ms (typ.) the PWMPO flag is set in system warning register MRDIAG1. Even without PWM input the LV8907 can run as described below in section “Fast Startup”. If a valid frequency was detected, the LV8907 evaluates the input duty cycle and translates it into an output duty cycle as shown in Figure 10. The output PWM frequency is fixed to 19.5 kHz (typ.). , (eq. 1) 85 t d IN t 100 100% upward downward FGT8 FGT7 FGT6 FGT5 FGT4 FGT3 FGT2 FGT1 FGT0 0% 0 3 12.5 25 37.5 50 62.5 75 87.5 97 100 INPUT PWM DUTY CYCLE [%] Figure 11. Target Speed Register Selection by Input PWM Duty Cycle A duty cycle of 50% with a variation band of 6.25% for example will select the motor speed value stored in the 4th speed register FGT4. This allows for non−linear speed curves. When using a companion microcontroller it is possible to write to the speed register in real time during operation to achieve finer RPM resolution. For more information see section “Target speed setting”. 100 OUTPUT DUTY CYCLE (%) 15 t d IN t 85 Closed Loop Speed Control For stand−alone operation, the LV8907 offers a PI controller for motor speed which is activated by clearing bit SCEN. Frequencies above 1 kHz are ignored and frequencies below 5.3 Hz(typ.) are considered as 0% or 100% duty cycle (no frequency). The output PWM frequency is fixed to 19.5 kHz (typ.). LV8907 provides nine target speed values which are stored in registers FGT0 to FGT8. In speed control mode the input PWM duty cycle is encoded as a selector for these registers as shown in Figure 11. A duty cycle hysteresis allows for stable register selection. When the register bit PWMF is set 1, this control method is selected. 80 60 The Control Algorithm The LV8907 controls the motor speed by comparing the selected target speed to the actual motor speed and incorporating a PI controller with configurable gains for the P and I components which are stored in register MRSPCT0 and MRSPCT1 respectively. 40 20 0 10 (d * 15), 7 IN 100 0 t d IN t 15 , 0 20 40 60 80 100 INPUT PWM DUTY CYCLE [%] Figure 10. Duty Cycle Translation www.onsemi.com 16 LV8907UW Decreasing motor speed too fast results in energy recuperation back into the system. To limit over−voltage during energy recuperation, the variable DWNSET allows either 1. to distribute the recuperation energy over a longer period of time or 2. to prevent energy recuperation entirely Ramping of Speed Control Values While tight control is required for optimal speed tracking, it may be undesirable during large input changes as it may lead to sudden supply loading, increasing noise and motor wear. To limit the slope of the control signal, register STEPSEL imposes a ramp on an input step to slew the speed response of the motor. direct PWM LIN_PWMIN PWM command LIN Transceiver duty cycle LINIO 0 PWMIN 1 0 PWMON period 1 1 polarity Duty Cycle Encoder T=1/F Ramp Imposer PI speed controller PWMF SCEN PWMFL, FLSEL[1:0] PWMZP, ZPSEL[1:0] PDTC PDTSEL[1:0] FGTG0[6:0] ∙∙∙ FGTG8[6:0] speed STEPSEL[2:0] PX[2:0], PG[2:0] DWNSET[1:0] IX[2:0], IG[2:0] Abnormal duty cycle detected or Initial duty cycle for ‘fast start-up’ sequence WDTEN WDTP WDT[5:0] WDTSEL[1:0] 19.5kHz PWM Generator Fixed Duty Cycle Generator 0%, 25%, 50%, 75% or 100% watchdog Figure 12. PWM Command Flow and Related Registers Fault Output DIAG Fast Startup It may be desirable to have the motor start immediately after EN goes high and not wait for PWM input duty cycle evaluation. Two register settings enable motor operation during this evaluation time: bit PDTC determines if the motor should be running during this time at all, and PDTSEL selects a motor duty cycle of 25, 50, 75 or 100%. This is used as the initial value of the duty cycle command for the closed loop speed control mode. To guarantee smooth transition from fast startup to PWM operation it is important to apply a comparable external PWM duty cycle at startup. Also make sure that free−run detection is disabled (FRREN = 1) to improve start−up speed. A low on open drain output DIAG indicates a system fault and a shutdown of the driver stage. Per default all system faults self−recover when the fault condition is removed. For some potentially destructive faults such as over−current, FET−short circuit and locked rotor conditions, it is possible to latch the fault condition. For more information on system diagnostics see section “System Errors and Warnings”. LIN Transceiver LIN_PWMIN can be used as a local interconnect network (LIN) 2.2 A compatible LIN transceiver by setting the LINIO bit and connecting an external microcontroller to RXD and TXD. The microcontroller must handle the LIN communication and control the LV8907 through EN, PWMIN and the SPI interface. The LIN transceiver can be switched to low slope mode to reduce electromagnetic emissions by setting LINSLP = 1. For more information on the automotive LIN bus protocol consult publicly available documentation. Abnormal Duty Cycle Operation (100% or 0%) For normal duty cycle controlled operation the PWM signal is expected to have a frequency between 5.3 Hz and 1kHz. If no frequency is detected, the LV8907 will flag PWMPO error and enter 0% or 100% duty cycle mode depending on the level of the PWM signal (all low or all high). Operation during this mode can be selected to be either no motor operation, or motor operation at a fixed motor duty cycle of 25, 50, 75 or 100% as defined by the variables PWMFL and FLSEL or PWMZP and ZPSEL. These PWM values do not enter into the speed control loop. Gate Drive Circuit The gate drive circuit of the LV8907 includes 3 half−bridge drivers which control external N−Channel FETs for the motor phases U, V and W. The high side drivers UH, VH, WH switch their gate connection either to CHP or the respective phase connection UOUT, VOUT and WOUT. The low−side drivers are switched from VGL to the corresponding source connection SUL, SVL, SWL. Both high and low side switches are not current controlled. Slope control has to be implemented with external components. Speed Feedback FG The motor speed is shown at open drain output FG where the transitions are direct representations of the BEMF signal transitions on the motor. The relationship between motor rotation and FG pulses is defined in register FGOF. www.onsemi.com 17 LV8907UW Current shoot−through protection of the bridge−drivers is implemented by a dead−time counter that delays the turning− on of the complementary switch. The dead−time can be programmed from 100ns < tFDTI < 3.2 s into 5 bit parameter FDTI. To protect against external shorts the drain−source voltage of the active external Power FETs is monitored as well. 4 bit register FSCDL selects a short−circuit shutoff voltage 100 mV < VFSCLD < 1.6 V. To suppress false triggering during the rising edge of FET activation, a four bit masking time can be programmed in FSCDT. Cycle−by−cycle Current Limit If the voltage between RF and RFSENS exceeds VRF1 = 100 mV(typ.), the active bridge is turned off until the next PWM period. To suppress switching transients a current limit blanking time 0.1 s < tCLMASK < 1.6 s can be programmed into register CLMASK. During soft−start this current limit is ramped from 0 to 100 mV in 16 steps during a programmable time 105ms < tSSTT < 6.72 s as defined in register SSTT. Over−current Shutoff If the bit OCPEN is set and the voltage between RF and RFSENS exceeds VRF2 = 200 mV(typ.), the LV8907 goes into over−current shutoff and all gate drivers are driving low turning the power FETs high−impedance. To suppress switching transients an over−current shutoff blanking time 0.2 s < tOCMASK < 3.2 s can be programmed into register OCMASK. Current Limit and Over−current Shutoff An integrated current sense amplifier implements current limiting and over−current shutoff by measuring the motor phase current across a single shunt between RF and RFSENS. Figure 13 shows a summary of the current limit and the over−current shutoff, and the descriptions for each function are in the following sections. Current Purpose Flag Sense point Threshold Turn−off Recovery Cycle−by−cycle Limiter None Sense Resistor VRF 100 mV PWM FET Next PWM cycle Protector OCPO Sense Resistor VRF 200 mV All FET 52.4 ms later FSPO FET VDS configurable FSPO FET VDS configurable All FET 52.4 ms later Short to VS Short to GND Protector The short protection can be (3) latched by register setting.. OCPLT: for OCPO FET VDS is determined by FSPLT: for FSPO the register FSCDL[3:0]. 0.1 to 1.6[V] step 0.1 (2) (1) (2) (2) Figure 13. Current Limit vs. Over−current Shutoff Temperature Sensing External Over−temperature Shutoff An analog comparator triggers external over−temperature error if the voltage at pin TH falls below the two bit programmable level 0.2 V < VTHTH < 0.35 V as defined by register THTH. For external temperature measurement connect a resistor between V3RO and TH and an NTC between TH and AGND. The programmed threshold voltage at VTHTH should be reached at the intended thermal shutdown temperature of the external component to be protected. During the over−temperature condition, the gate drivers are disabled and a flag, THPO in MRDIAG0 is set. The LV8907 measures internal die temperature and implements internal thermal warning and shutoff. It is also possible to protect external devices by monitoring the voltage at pin TH. Internal and external over−temperature can shut down the driver section. Internal Over−temperature Measurement A thermal warning is issued if the internal temperature of the device reaches approximately 25°C below the over−temperature shutoff level. The shutoff level is selected by bit TSTS as 150°C or 175°C(min). www.onsemi.com 18 LV8907UW V3RI System Errors and Warnings All system errors and most warnings cause a transition on DIAG. The polarity of this transition can be selected in bit DIAGSEL. The ability of stand−alone applications without microcontroller to react to errors and warnings is limited. For this case various auto−retry strategies are implemented. If a companion microcontroller exists, more complex error handling is possible and DIAG should be connected to an interrupt input of the microcontroller. Errors that may cause serious damage such as short−circuit, over−current and locked rotor can be latched by enabling the corresponding latch bit in MRCONF10. In this case the LV8907 will keep the output stage disabled until the latch is cleared by one of the following actions: • Power on reset • EN low • Low frequency PWM less than 15% duty cycle • SPI write of FFh to MRRST TH Figure 14. Example Circuit for External Temperature Sensing Watchdog Operation The LV8907 includes a watchdog timer to monitor a companion microcontroller and disable the motor if the microcontroller stops working properly. Bit WDTEN enables and disables the watchdog timer. Access to this bit can be blocked – see section “OTP Registers” for details. The enabled watchdog will issue an error whenever the watchdog time 1.64 ms < tWDT < 104.96 ms expires. A write of 00h to register MRRST resets the watchdog timer. A watchdog timeout can result in either a motor stop, or motor operation at four predefined duty cycles (25%, 50%, 75%, 100%) as defined by WDTP and WDTSEL. The duty cycle is directly applied to the power stage, not through the speed selection registers. The microprocessor is not re−set. If bit DLTO is set ONLY latched errors will cause a transition of DIAG. To detect the other less serious errors and warnings, the diagnostic registers MRDIAG0/MRDIAG1 have to be read regularly via SPI access. Table 1. ERROR REGISTER: MRDIAG0[7:0] Bit Error Description Mascable Latchable Self Recovery when Latch Function Turned Off 0 OCPO Over−current Error × × 1 VSLVPO VS Under−voltage 2 VSOVPO VS Over−voltage 3 CHPLVPO CHP Under−voltage Motor is re−started when voltage recovers 4 VGLLVPO VGL Under−voltage Motor is re−started when voltage recovers 5 FSPO FET Short Circuit × 6 THPO TH Over−temperature × 7 CPO Locked Rotor × After 52.4 ms (typ.) the motor will re−start Motor is re−started when voltage recovers Motor is re−started when voltage recovers × × After 52.4 ms (typ.) the motor will re−start Motor is re−started when temperature recovers × Wait 8 tCPTM periods (see “Motor Lock”) 5. See register MRCONF10 for error activation and masking and MRCONF11 for latching options. www.onsemi.com 19 LV8907UW Table 2. WARNING REGISTER: MRDIAG1[7:0] Bit Warning Description DIAG Blankable 0 THWPO Junction Temp. Warning × × Effect 1 THSPO Junction Over−temperature × 2 WDTPO Watchdog Timeout × 3 STUPO Startup Operation The motor is running open loop 4 SPCO Loss of speed lock Target speed and actual speed are more than 6.25% different 5 Internal Use 6 VCLVPO VCC under−voltage × 7 PWMPO PWM Input Fault × The IC has exceeded the warning temperature but stays in Normal operation The IC has exceeded the shutoff temperature. Drivers are shut down during over−temperature Driver stage is shut off or continues with pre−selected duty cycle (25, 50, 75, 100%) × Driver stage off × No PWM signal detected. Driver stage is shut off or continues with pre−selected duty cycle (25, 50, 75, 100%) 6. An “×” in column “DIAG Blank” means that it is possible to prevent a warning from triggering DIAG see register MRCONF10 for details. SPI Interface In the LV8907 the SPI interface is used to perform general communications for status reporting, control and programming. There are two items to be especially careful of with the general communication scheme: 1. Communications must be full duplex and simultaneous. It is not allowed to send one transaction and then read data on a second transaction as the status register information will be updated on the first transaction and then be out of date for the second. Some systems break transactions into separate read and write operations which is not acceptable with the LV8907 2. It is important the system master uses the clock and data polarities and phases as shown above. Both the clock and data on some systems can be inverted for various reasons but must arrive at the LV8907 per the above drawing. Common errors include SCLK inversion such that the leading edge arrives as a downward transition rather than a rising edge, or having the data to clock phase incorrect. Data phase must be such that the data only changes during a clock falling edge and is completely stable during a clock rising edge. This means a good margin of one half of a bit time exists to eliminate transmission delay hazards Figure 15. SPI Format SPI communications with the LV8907 follows established industry standard practices including the use of WEN and start and stop bits as shown above. Data is transferred MSB first and both clock and data are transferred as ‘true’ data with the higher level indicating a logical 1 or true state. If WEN is LOW, the register data is transferred from LV8907 to the microcontroller. If WEN is HIGH, the register data is transferred from the microcontroller to the LV8907 register. The first byte returned on all transactions is always the status register, GSDAT, and contains information such as the busy flag during programming operations. www.onsemi.com 20 LV8907UW GSDAT[7:0] Bit7 6 5 4 3 2 ORBEN STUPO SACF DIAGS LATCH OBSY 0 × 0 × 0 1 Bit0 SMOD[1:0] 0 0 0 Sleep mode (MRACK[7:0] = FFh) 0 0 Device start up time 1 0 Standby mode 1 1 Normal mode (MRACK [7:0] = 55h) × × Normal Operation 1 OTP busy with read/write access 1 Latched shutdown condition 1 Failure Condition 0 Last SPI access OK 1 Last SPI access failed* 1 Startup mode 1 OTP integrity test mode • Write access to any of the main registers after setting The following SPI failures are detectable and reported collectively in GSDAT as general SPI failures: • Any access to an address which are outside the defined address space • The number of SCLK transitions is not 16 within one word transfer • Any access to MRCONF, MRACS, ORCONF, ORACS while OBSY = 1 (during write operations) • Write access to MRODL register while OBSY = 1 (during write operations) MSAENB = 1 (Implies MRxxxx registers are locked) • Write access to any of the OTP registers after • • OSAENB = 1 (Implies ORxxxx registers are locked) Write access attempt to a read only or locked register SI signal changed at positive edge of SCLK (Incorrect data/sclk phase setup) SPI Timing 90% CSB 90% 10 % 10 % 1/ Tfck Tcss Tckn 90% SCLK SI Tsis Tsih 90% 90% 10 % 10% Tcssod Tcssoo Tckp Tcsh 90% 10 % 10% 10% SO 90% Tcksod 90 % 90% 10% 10% Figure 16. SPI Timing Chart www.onsemi.com 21 10% Tcssoz Tcsp LV8907UW SPI TIMING TJ = −40 to 150°C, VS = 4.5 to 20 V. Pull−up resistance of SO pin = 2.4 k, Output load of SO pin = 30 pF. Symbol Comment Min Typ Max Unit 500 kHz Tfck SCLK clock frequency Tckp SCLK high pulse width 950 ns Tckn SCLK low pulse width 950 ns Tcss CSB setup time 950 ns Tcsh CSB hold time 950 ns Tcsp CSB high pulse width 1900 ns Tsis SI setup time 450 ns Tsih SI hold time 450 ns Tcssod CSB fall edge to SO delay time 950 ns Tcksod SCLK fall edge to SO delay time 950 ns Tcssoo CSB fall edge to SO data out time Tcssoz CSB rise edge to SO Hi−Z out time 0 ns 950 www.onsemi.com 22 ns LV8907UW REGISTER DESCRIPTION SPI Register Map The SPI interface allows read access to the entire address space. The MASTER registers can only be written in Standby mode and then only if the write lock bit MSAENB has never been set high. SPI REGISTER MAP Addr Register Description Write Enable Standby Mode Normal Mode IC SETUP REGISTER 00h MRCONF0 Main function Free−run Detection ON/OFF setup MSAENB Read / Write Read 01h MRCONF1 PWM Input Specification MSAENB Read / Write Read 02h MRCONF2 Soft−start EN setup / FG output setup / Dead time setup MSAENB Read / Write Read 03h MRCONF3 PWM undetected operation mode setup Soft−start setting MSAENB Read / Write Read 04h MRCONF4 Activation frequency setup MSAENB Read / Write Read 05h MRCONF5 Current limit detection timing setup / Over-current detection setup MSAENB Read / Write Read 06H MRCONF5 For Internal Use Only MSAENB Read / Write Read 07h MRCONF7 Sync rectification setup Protection setup FET short Protection MSAENB Read / Write Read 08h MRCONF8 SSCG Protection setup Locking Protection Overheat protection MSAENB Read / Write Read 09h MRCONF9 WDT setup MSAENB Read / Write Read 0Ah MRCONF10 Error / warning masks and DIAG output setup MSAENB Read / Write Read 0Bh MRCONF11 Speed FB operation setup at deceleration WDT protection operation setup Latch setup MSAENB Read / Write Read 0Ch MRCONF12 Lead angle setup Silent drive setup STEP at the time of changing Speed FB target revolution Always OK Read / Write Read / Write SPEED CONTROL SETUP 10h MRSPCT0 Proportional Gain Setup Always OK Read / Write Read / Write 11h MRSPCT1 Integral Gain Setup Always OK Read / Write Read / Write 12h MRSPCT2 3.125% Input PWM Always OK Read / Write Read / Write 13h MRSPCT3 12.5% Input PWM Always OK Read / Write Read / Write 14h MRSPCT4 25% Input PWM Always OK Read / Write Read / Write 15h MRSPCT5 37.5% Input PWM Always OK Read / Write Read / Write 16h MRSPCT6 50% Input PWM Always OK Read / Write Read / Write 17h MRSPCT7 62.5% Input PWM Always OK Read / Write Read / Write 18h MRSPCT8 75% Input PWM Always OK Read / Write Read / Write 19h MRSPCT9 87.5% Input PWM Always OK Read / Write Read / Write 1Ah MRSPCT10 96.875% Input PWM Always OK Read / Write Read / Write Read Read SYSTEM DIAGNOSTICS AND TEST 20h MRACS Lock Bits for OTP and Main Register write www.onsemi.com 23 LV8907UW SPI REGISTER MAP Addr Register Description Write Enable Standby Mode Normal Mode − Read Read SYSTEM DIAGNOSTICS AND TEST 30h MRACK SPI Operation Diagnostics 31h MRODL OTP data READ Always OK Read / Write Read 32h MRRST For WDT/Protection Reset Always OK Read / Write Read / Write 33h MRORB For OTP Zapping check Always OK Read / Write Read 34h MRDIAG0 Protection status check − Read Read 35h MRDIAG1 Protection status check − Read Read 38h TEST1 Production test register 1 … 3C TEST5 Production test register 5 OTP MEMORY SECTION 40h ORCONF0 Default states of MRCONF0 – MRCONF12 … 4Ch ORCONF12 transferred upon startup 50h ORSPCT0 Default states of MRSPCT0 – MRSPCT10 5Ah ORSPCT10 transferred upon startup 60h ORACS Default states of MRACS … MOTOR CONFIGURATION REGISTER OVERVIEW ADDR[6:0] Register Name D7 D6 D5 D4 D3 D2 D1 D0 00h MRCONF0 FRMD FRREN SCEN PWMF REGSEL VCEN LINSLP LINIO 01h MRCONF1 PWMFL PWMZP PDTC PWMON 02h MRCONF2 03h MRCONF3 04h MRCONF4 05h MRCONF5 06h MRCONF6 07h MRCONF7 SYNCEN 08h MRCONF8 SSCG FLSEL[1:0] SSTEN ZPSEL[1:0] FGOF[1:0] FDTI[4:0] PDTSEL[1:0] SSTT[5:0] STOSC[7:0] CLMASK[3:0] OCMASK[3:0] Internal Use Only PPDOSEL 09h MRCONF9 WDTEN WDTP 0Ah MRCONF10 VCLVPEN CPEN 0Bh MRCONF11 0Ch MRCONF12 FSCDT[1:0] FSCDL[3:0] CPTM[3:0] THTH[1:0] TSTS WDT[5:0] THWEN DWNSET[1:0] THPEN WDTSEL[1:0] STEPSEL[2:0] FSPEN OVPEN OCPEN DIAGSEL CPLT FSPLT OCPLT DLTO SLMD LASET[3:0] MRCONF0 Address = 00h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 FRMD FRREN SCEN PWMF REGSEL VCEN LINSLP LINIO www.onsemi.com 24 LV8907UW FRMD: Forward / Reverse Selection The physical motor rotation direction depends on the wiring of the three phases. FRMD = 1 reverses the motor direction. FRREN: Free−run Detection Enable Decides if the LV8907 does a BEMF detection before attempting to start the motor open−loop excitation and commutation. FRREN = 0 Motor will start with a BEMF detection. FRREN = 1 Motor will start open loop with startup parameters. SCEN PWMF Speed Control Input PWM Frequency Range [Hz] 0 0 closed loop 5.3 to 1000 19.5 [kHz] 1 0 indirect translated 5.3 to 1000 19.5 [kHz] 0 1 direct pass-through up to 18500 same as input 1 1 direct pass-through up to 18500 same as input Output PWM Frequency REGSEL: VCC Voltage Selection (5 V / 3.3 V) REGSEL = 0 VCC output set to 3.3 V. REGSEL = 1 VCC output set to 5 V. SCEN: Speed Feedback Control Enable This bit selects the LV8907 internal speed feedback control or PWM pass−through. Speed feedback control is active when SCEN = 0. RPM is selected from input duty cycle as shown in Figure 11. SCEN = 1: The closed loop speed control is inactivated. VCEN: VCC Regulator Enable VCEN = 0 VCC is off. VCEN = 1 VCC is active. LINSLP: LIN Slope Mode Setup To improve EMI performance the LIN switching slope can be reduced. LINSLP = 0 Normal LIN rise−time. LINSLP = 1 Rise time increased by 1/3. PWMF: PWM input frequency selection Decides the PWM input frequency range and PWM translation configuration. PWMF = 0: Indirect PWM translation or closed loop speed control. Valid PWM input frequency from 5.3 Hz to 1 kHz. PWMF = 1: Direct PWM pass−through. Valid PWM input frequency up to 18.5 kHz. In this mode the PWM frequency is directly fed to the power stage. Internal closed loop speed control cannot be used. The following table shows the configuration summary based on the combination of SCEN and PWMF. LINIO: External Input System Selection LV8907 has an embedded LIN physical layer which can also be used as a PWM input channel. LINIO = 0 LIN_PWMIN is in PWM input mode. LINIO = 1 The LIN transceiver is active and the PWM signal is taken from PWMIN. MRCONF1 Address = 01h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 FRMD FRREN SCEN PWMF REGSEL VCEN LINSLP LINIO PWMFL PWMZP PDTC PWMON FLSEL[1,0] ZPSEL[1,0] duty cycle programmed into ZPSEL as shown in the following table. FLSEL: 100% PWM Input Duty Cycle Motor Operation If 100% PWM input duty cycle was detected (no PWM frequency) and PWMFL is set, the motor is driven with the duty cycle programmed into FLSEL as shown in the following table. FLSEL[1] FLSEL[0] Motor Duty Cycle[%] 0 0 25 0 1 50 1 0 75 1 1 100 ZPSEL[1] ZPSEL[0] Motor Duty Cycle[%] 0 0 25 0 1 50 1 0 75 1 1 100 PWMFL: Operation Mode Selection at PWM Input Duty Cycle = 100% If 100% PWM input duty cycle was detected the motor will be PWMFL = 0: turned off. PWMFL = 1: driven with the duty cycle defined by FLSEL. ZPSEL: 0% PWM Input Duty Cycle Motor Operation If 0% PWM input duty cycle is detected (no PWM frequency) and PWMZP is set, the motor is driven with the www.onsemi.com 25 LV8907UW PDTC = 0: turned off. PDTC = 1: driven with the duty cycle defined by PDTSEL (MRCONF3[7,6]) PWMZP: Operation Mode Selection at PWM Input Duty Cycle = 0% If 0% PWM input duty cycle is detected the motor will be. PWMZP = 0: turned off. PWMZP = 1: driven with the duty cycle defined by ZPSEL. PWMON: PWM input signal level Decides whether the PWM input signal is active low, or active high. PWMON = 0: PWM input signal is active high. PWMON = 1: PWM input signal is active low. PDTC: Fast Startup Operation Mode During the first 200 ms after EN high, while the PWM signal is still being measured, the motor can be either MRCONF2 Address = 02h Bit 7 6 SSTEN 5 4 Standby Mode: Read/Write Normal Mode: Read Only 3 2 FGOF[1,0] 1 Bit 0 FDTI[4:0] Note that soft−start typically begins after duty cycle detection. If no duty cycle operation is selected (PDTC = 1) Soft−start will begin after reset. SSTEN: Soft−start Function Enable Soft−start (current ramp) allows slow startup of motors with higher inertia. The soft−start algorithm ramps the current limit from 0 to max current in 16 steps during soft−start time tSST which is programmed in register MRCONF3. SSTEN =0 Soft−start is OFF. SSTEN = 1 Soft−start is active. FGOF: FG Signal Output Frequency Selection The FG signal is a representation of a successfully detected back−EMF transition which occurs three times during every electrical revolution. It is possible to divide that frequency as described in the following table. FGOF[1] FGOF[0] FG output mode 0 0 One transition per back−EMF detection 0 1 One pulse per electrical revolution 1 0 One transition every two BEMF det 1 1 One pulse every two elec. Revolutions temporarily on at the same time causing large current spikes. Register FDTI defines a dead time during which both drivers will be kept off during these transitions. FDTI: Dead Time Setting During phase switching between supply and GND it is possible for both low− and high−side drivers to be FDTI[4] FDTI[3] FDTI[2] FDTI[1] FDTI[0] Dead time[ms] 0 0 0 0 0 3.2 0 0 0 0 1 3.1 3.2 - FDTI/10 FDTI 1 1 1 1 0 0.2 1 1 1 1 1 0.1 MRCONF3 Address = 03h Bit 7 6 5 4 Standby Mode: Read/Write Normal Mode: Read Only 3 PDTSEL[1,0] 2 SSTT[5:0] www.onsemi.com 26 1 Bit 0 LV8907UW as soon as EN is high. This feature is bridging the initial 200 ms of operation until a valid PWM duty cycle can be decoded. PDTSEL: Fast Start−up Motor Operation If bit PDTC is set the motor is driven with the duty cycle programmed into PDTSEL as shown in the following table, PDTSEL[1] PDTSEL[0] Motor Duty Cycle[%] 0 0 25 0 1 50 1 0 75 1 1 100 increases the value from 6.25 mV to 100 mV to switch over the current limit value. The soft start can be set from 0.1 s < tSSTT < 6.72 s as shown in the table below: SSTT: Soft−start Time Setting Soft−start allows startup of motors with higher inertia by ramping the current. The soft−start algorithm divides the current limit voltage 100 mV (Typ.) into 16 sections and SSTT[5] SSTT[4] SSTT[3] SSTT[2] SSTT[1] SSTT[0] Soft−start time[s] 0 0 0 0 0 0 0.105 0 0 0 0 0 1 0.21 SSTT 0.105 × (1 + SSTT) 1 1 1 1 1 0 6.615 1 1 1 1 1 1 6.72 MRCONF4 Address = 04h Bit 7 6 5 4 3 2 Standby Mode: Read/Write Normal Mode: Read Only 1 Bit 0 STOSC[7:0] 0 0 0 0 Startup commutation period [ms] 0 0 0 0 0.82 STOSC 1 1 1 1 0.82 × (1 + STOSC) 1 1 1 1 209.92 commutate to the next energization pattern with the frequency programmed into STOSC. Open−loop startup continues for the time programmed into CPTM (MRCONF8[6:3]) If no BEMF is detected during that time a locked rotor error is indicated. This register defines the rotation frequency fSTOSC at which the motor should be turned during open−loop startup. If a BEMF signal can be detected the IC will commutate to the next energization pattern by using the zero−crossing as its reference. If no BEMF can be detected the IC will MRCONF5 Address = 05h Bit 7 6 5 4 Standby Mode: Read/Write Normal Mode: Read Only 3 CLMASK[4:0] 2 1 OCMASK[4:0] www.onsemi.com 27 Bit 0 LV8907UW CLMASK: Current Limit Mask Time Setting In order to prevent noise and glitches from causing false current limiting, a mask time can be programmed. CLMASK[3] CLMASK [2] CLMASK [1] CLMASK [0] Mask Time[us] 0 0 0 0 0.1 0 0 0 1 0.2 CLMASK 0.1 + CLMASK/10 1 1 1 0 1.5 1 1 1 1 1.6 OCMASK: Over−current Detection Mask Time Setting The time to detect over−current can be programmed with OCMASK. OCMASK[3] OCMASK [2] OCMASK [1] OCMASK [0] Mask Time[us] 0 0 0 0 0.2 0 0 0 1 0.4 1 1 1 0 3.0 1 1 1 1 3.2 OCMASK 0.2 × (1 + OCMASK) MRCONF6 Address = 06h Bit 7 6 5 4 Standby Mode: Read/Write Normal Mode: Read Only 3 2 SROFFT[3−0] 1 Bit 0 1 Bit 0 CRMASK[3−0] 7. Internal use only. MRCONF7 Address = 07h Bit 7 6 SYNCEN PPDOSEL 5 4 Standby Mode: Read/Write Normal Mode: Read Only 3 FSCDT[1:0] 2 FSCDL[3:0] PPDOSEL: DIAG Output Selection at PWM Input Abnormality D6 of the main register MRCONF7 can be used to reflect abnormal detection result to DIAG pin at the time of PWM input abnormal detection (0% or 100% detection). PPDOSEL = 0 PWM abnormal input detection result is reflected to DIAG pin when PPDOSEL = 1 and it is not reflected to DIAG pin when. SYNCEN: Synchronous Rectification Enable Defines synchronous rectification mode for the output stage. In synchronous rectification the high and low side switches are always switched in complementary mode = if one switch is on, the other one is off. In a−synchronous rectification both complementary switches may be off and the motor current is circling through the body diodes. SYNCEN = 0 Synchronous rectification is ON. SYNCEN = 1 Synchronous rectification is OFF. www.onsemi.com 28 LV8907UW D4 of MRCONF7. Please refer to the table below for settable time: FSCDT: FET Short Protection Detection Time Setting By monitoring FET Vds, the time from FET’s ON signal output until detecting Shorted status can be set with D5 and FSCDT[1] FSCDT [0] Detection Time[us] 0 0 3.2 0 1 6.4 1 0 9.6 1 1 12.8 FSCDL: FET Short Protection Detection Voltage Setting Vds voltage to detect FET Short status can be set with D3~D0 of MRCONF7. Please refer to the table below for available voltages: FSCDL [3] FSCDL[2] FSCDL [1] FSCDL [0] Vth[V] 0 0 0 0 0.1 0 0 0 1 0.2 FSCDL 0.1 + FSCDL/10 1 1 1 0 1.5 1 1 1 1 1.6 MRCONF8 Address = 08h Bit 7 6 5 SSCG 4 Standby Mode: Read/Write Normal Mode: Read Only 3 2 CPTM[3−0] 1 THTH[1,0] Bit 0 TSTS locked rotor is detected by counting the time the IC is in Start−up mode (without back−EMF detection) If no back−EMF is detected for the time programmed into CPTM register the motor is turned off and a locked rotor is flagged. In Auto recovery mode the motor will remain off for eight times the Open Loop Startup Timeout before another startup is attempted. SSCG: Charge Pump Spread Spectrum The Charge pump may have radiation noise issues due to switching at 52.1 kHz(typ.). By activating SSCG it is possible to disperse frequency components of the charge pump switching frequency. The frequency will vary 20%. SSCG = 0: Spread spectrum OFF. SSCG = 1: Spread spectrum ON. CPTM: Open Loop Startup Timeout A locked rotor protection circuit is embedded in order to protect IC and Motor during locked rotor conditions. A CPTM [3] CPTM [2] CPTM [1] CPTM [0] Detection/Restart time[s] 0 0 0 0 0.42 / 3.36 0 0 0 1 0.84 / 6.72 CPTM 0.42 × (1+CPTM) / 3.36 × (1+CPTM) 1 1 1 0 6.3 / 50.4 1 1 1 1 6.72 / 53.76 www.onsemi.com 29 LV8907UW level (shown in the table), the external over−temperature protection is activated, the output gate driver stage is turned off and the THPO error flag is set. THTH: Threshold for External Thermometer Input LV8907 has an embedded comparator to monitor the external power FET’s temperature using an external thermistor. If the voltage at TH drops below the threshold THTH[1] THTH [0] VTH[V] 0 0 0.35 0 1 0.30 1 0 0.25 1 1 0.20 TSTS = 0: Over−temperature warning 125℃(typ.), shutdown at 150℃(typ.). TSTS = 1: Over−temperature warning 150℃(typ.), shutdown at 175℃(typ.). TSTS: Junction Temperature Warning and Shutoff Levels The LV8907 monitors its own junction temperature to protect against over−temperature damage. Two different warning and shut−off levels can be selected: occurs at occurs at MRCONF9 Address = 09h Bit 7 6 WDTEN WDTP 5 4 Standby Mode: Read/Write Normal Mode: Read Only 3 2 1 Bit 0 WDT[5:0] WDTP = 0 Motor off. WDTP = 1 Motor is driven with the PWM duty cycle as defined by WDTSEL (MRCONF11[5,4]). WDTEN: Watchdog Enable This bit can enable or disable the watchdog. For increased system robustness it is possible to permanently lock access to this bit. See OTP section for more details. WDTEN = 1 Watchdog is active. WDTEN = 0 Watchdog is disabled. WDT: Watchdog Timer Setting The end time of the watchdog timer is defined by register WDT. WDTP: Operation Against Watchdog Timeout Operation mode against watchdog time can be selected. WDT [5] WDT [4] WDT [3] WDT [2] WDT [1] WDT [0] Detection Time[ms] 0 0 0 0 0 0 1.64 0 0 0 0 0 1 3.28 1 1 1 1 1 0 103.32 1 1 1 1 1 1 104.96 WDT 1.64 × (1 + WDT) MRCONF10 Address = 0Ah Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 VCLVPEN CPEN THWEN THPEN FSPEN OVPEN OCPEN DIAGSEL www.onsemi.com 30 LV8907UW • FSPEN = 0: FET short protection enabled • OVPEN = 0: Over−voltage protection enabled • OCPEN = 0: Over−current protection enabled xEN: Error and Warning Mask The higher seven bit in this register allows enabling and disabling of various errors and warnings. A one in the register masks the error, a zero activates the protection. The following errors and warnings can be masked: • VCLVPEN = 0: VCC Under−voltage protection enabled • CPEN = 0: Motor block protection enabled • THWEN = 0: Thermal warning output enabled • THPEN = 0: Thermal protection enabled DIAGSEL: Diagnosis Output Polarity Selection This bit selects the polarity of the DIAG signal DIAGSEL = 0 The DIAG pin is active low. DIAGSEL = 1 The DIAG pin is active high and draws pull−down current when off. MRCONF11 Address = 0Bh Bit 7 6 5 DWNSET[1,0] 4 WDTSEL[1,0] DWNSET: Mode Setting at the Time of Speed Feedback Deceleration During speed control mode, motor deceleration can lead to energy recuperation and temporary voltage spikes. DWNSET allows for various degrees of energy recuperation: • Normal Mode Results in a tightest control and maximum energy recuperation. The application circuit has to be able to absorb the energy generated • Sync OFF Mode The motor is essentially not driven until it has reached the target speed. This does not feed any energy back into the supply, but may take a long time if motor inertia is high and losses are low • Slow Response Mode This mode is essentially imposing a slow deceleration ramp on the control speed. The energy recuperated is similar to Normal Mode but spread over a longer period of time reducing the voltage overshoot DWNSET[1] DWNSET [0] Mode 0 0 Normal Mode 0 1 Sync OFF Mode 1 0 Slow Response Mode (PROT/32) 1 1 Normal Mode Standby Mode: Read/Write Normal Mode: Read Only 3 2 1 Bit 0 CPLT FSPLT OCPLT DLTO WDTSEL: Operation mode selection after a Watchdog timeout Bit WDTP (MRCONF9[6]) defines if a Watchdog timeout causes Halt mode (0% drive) or Drive mode. When Drive mode is selected the motor duty cycle is defined by WDTSEL as shown in the table below. WDTSEL[1] WDTSEL[0] Duty[%] 0 0 25 0 1 50 1 0 75 1 1 100 xPLT: Protection Latch Selection The faults of the motor block, FET Short and over−current can cause intolerable large−current. To prevent repeated current flow during re−try attempts, it is possible to latch these errors. The LV8907 will remain disabled until the latch is cleared by the register MRRST. CPLT = 0 Auto recover after a motor block. CPLT = 1 Latch the IC off after a motor block. FSPLT = 0 Auto recover after a FET short. FSPLT = 1 Latch the IC off after a FET short. OCPLT = 0 Auto recover after over−current. OCPLT = 1 Latch the IC off after over−current. www.onsemi.com 31 LV8907UW warning. DLTO = 1: Trigger DIAG only for latched errors as defined by xPLT above. DLTO: Diagnostic Output Mode Selection Selects which errors/warnings will actually trigger a DIAG transition. DLTO = 0: Trigger DIAG for any non−masked error or MRCONF12 Address = 0Ch Bit 7 6 5 Standby Mode: Read/Write Normal Mode: Read Only 4 STEPSEL[2−0] 3 2 SLMD 1 Bit 0 LASET[3−0] 8. This register is writeable in Normal mode. NOTE: Note: During closed loop speed control optimization and/or evaluation, it might be useful to turn off this ramp imposing (STEPSEL[2:0]= 0b000). STEPSEL: Ramp Imposed on Speed Control Changes In speed control mode, large steps in motor target speed can cause excessive current spikes, noise and wear on the mechanical components. The LV8907 allows to impose a limit on the difference between target speed and actual speed such that every electrical revolution only a fraction of the previous rotational (PROT) speed is allowed to change. This limit is defined by STEPSEL in register MRCONF12[7−5]. Figure 17 shows the RPM ramping response to an input step for six different ramp settings for instance. Target Speed Transistion by Setting of the Register STEPSEL Example Case of 1000rpm to 5000rpm Vice Versa PROT PROT/2 PROT/4 PROT/8 PROT/16 PROT/32 Target Speed (rpm) 6000 5000 4000 3000 2000 1000 0 0 20 40 60 80 100 120 140 the Number of Electrical Cycle (FG counts) Figure 17. Speed Control Input Ramp of Different STEPSEL Settings STEPSEL[2] STEPSEL[1] STEPSEL[0] Step Mode 0 0 0 PROT (Current electrical speed at FG) 0 0 1 PROT/2 0 1 0 PROT/4 0 1 1 PROT/8 1 0 0 PROT/16 1 0 1 PROT/32 1 1 0 PROT 1 1 1 PROT www.onsemi.com 32 LV8907UW LASET: Lead Angle Setting In trapezoidal drive mode it is possible to advance the commutation point towards zero−crossing of the back−EMF signal. This helps to achieve back−EMF field−weakening for higher rotational speeds and to compensate for delays in high speed operation. SLMD: Sinusoidal vs. Trapezoidal Drive Mode Selection This bit selects whether the motor phases are driven with a trapezoidal or pseudo−sinusoidal signal. SLMD = 0 Trapezoidal drive with 120 degrees energization. SLMD = 1 Sinusoidal drive with 150 degrees energization. LASET [3] LASET [2] LASET [1] LASET [0] Lead Angle[deg] 0 0 0 0 0 0 0 0 1 1.875 LASET LASET × 1.875 1 1 1 0 26.25 1 1 1 1 28.125 SPEED CONTROL REGISTER OVERVIEW ADDR[6:0] Register Name D7 10h MRSPCT0 − PX[2:0] − PG[2:0] 11h MRSPCT1 − IX[2:0] − IG[2:0] 12h MRSPCT2 − FGT0[6:0] 13h MRSPCT3 − FGT1[6:0] 14h MRSPCT4 − FGT2[6:0] 15h MRSPCT5 − FGT3[6:0] 16h MRSPCT6 − FGT4[6:0] 17h MRSPCT7 − FGT5[6:0] 18h MRSPCT8 − FGT6[6:0] 19h MRSPCT9 − FGT7[6:0] 1Ah MRSPCT10 − FGT8[6:0] D6 D5 D4 Speed Control Loop Gain Setting 128 VS D2 D1 D0 Proportional Gain can be set with PX and PG of MRSPCT0 where the total gain is the product of both components PG and PX. Integral Gain can be set with IX, and IG of MRSPCT1 respectively. These P and I parameters can be changed while a motor is running (i.e. EN = HIGH). MRSPCT0 must be written, followed by writing MRSPCT1 through SPI. To update the P and I parameters of the control logic block simultaneously, MRSPCT0 code is suspended until MRSPCT1 is written. The calculation operates every FG cycle. The period is measured by 104 kHz clock. Closed loop motor rotation speed controller (PI) is provided. The block diagram is shown in Figure 18. Where, TAG: target speed (period) PROT: previous speed feedback (period) Int: previous sum K: scaling factor K+ D3 512 www.onsemi.com 33 LV8907UW Pg TAG - Px Drive Voltage K + Ig Ix Int PROT Figure 18. PI Speed Controller Block Diagram PX, IX [2] PX, IX [1] PX, IX [0] Gain PG, IG [2] PG, IG [1] PG, IG [0] Gain 0 0 0 1 0 0 0 1 0 0 1 2 0 0 1 7/8 0 1 0 4 0 1 0 6/8 0 1 1 8 0 1 1 5/8 1 0 0 16 1 0 0 4/8 1 0 1 32 1 0 1 3/8 1 1 0 64 1 1 0 2/8 1 1 1 0 1 1 1 1/8 The proportional gain is a product of PX and PG, and the integrator gain is a product of IX and IG. Px Ix Pg Ig Value Factor Setting Factor Setting 0.125 x1 0 x1/8 7 0.250 x1 0 x2/8 6 0.250 x2 1 x1/8 7 0.375 x1 0 x3/8 5 0.500 x1 0 x4/8 4 0.500 x2 1 x2/8 6 0.500 x4 2 x1/8 7 0.625 x1 0 x5/8 3 0.750 x1 0 x6/8 2 0.750 x2 1 x3/8 5 0.875 x1 0 x7/8 1 1.000 x1 0 x1 0 1.000 x2 1 x4/8 4 1.000 x4 2 x2/8 6 1.000 x8 3 x1/8 7 1.250 x2 1 x5/8 3 1.500 x2 1 x6/8 2 1.500 x4 2 x3/8 5 1.750 x2 1 x7/8 1 2.000 x16 4 x1/8 7 2.000 x2 1 x1 0 2.000 x4 2 x4/8 4 www.onsemi.com 34 LV8907UW Px Ix Pg Ig Value Factor Setting Factor Setting 2.000 x8 3 x2/8 6 2.500 x4 2 x5/8 3 3.000 x4 2 x6/8 2 3.000 x8 3 x3/8 5 3.500 x4 2 x7/8 1 4.000 x16 4 x2/8 6 4.000 x32 5 x1/8 7 4.000 x4 2 x1 0 4.000 x8 3 x4/8 4 5.000 x8 3 x5/8 3 6.000 x16 4 x3/8 5 6.000 x8 3 x6/8 2 7.000 x8 3 x7/8 1 8.000 x16 4 x4/8 4 8.000 x32 5 x2/8 6 8.000 x64 6 x1/8 7 8.000 x8 3 x1 0 10.000 x16 4 x5/8 3 12.000 x16 4 x6/8 2 12.000 x32 5 x3/8 5 14.000 x16 4 x7/8 1 16.000 x16 4 x1 0 16.000 x32 5 x4/8 4 16.000 x64 6 x2/8 6 20.000 x32 5 x5/8 3 24.000 x32 5 x6/8 2 24.000 x64 6 x3/8 5 28.000 x32 5 x7/8 1 32.000 x32 5 x1 0 32.000 x64 6 x4/8 4 40.000 x64 6 x5/8 3 48.000 x64 6 x6/8 2 56.000 x64 6 x7/8 1 64.000 x64 6 x1 0 Thus, there are some duplication with responding to the combination of X and G. SPI Speed Control For SPI speed control the companion microprocessor should apply a fixed duty cycle PWM signal to the LV8907 PWMIN pin. An input duty cycle of 12.5% would then select speed register MRSPCT3 as shown in the table below. By writing RPM values to register MRSPCT3 via SPI, the speed can be controlled directly. Target Speed Setting There are two ways of setting a target speed with speed control active (SCEN = 0): 1. By using a companion microprocessor to write the speed value directly into the Speed Control Register via SPI 2. By applying a low frequency PWM input which selects a target speed from the Speed Control Register www.onsemi.com 35 LV8907UW PWM Speed Control PWM input frequency must be in Low frequency mode (PWMF = 0). In this mode the PWM input duty cycle is measured and used to select a target speed from the Speed Control Registers MRSPCT2..10. Note that 0% and 100% input duty cycle will be flagged as a “PWM Input Fault”. Preset Target Speed RPM in Electrical Cycle Register FGTx[6:0] Speed Index Code 400 4 (0x04) …one step 200… …one step 1… 13,200 68 (0x44) …one step 400… …one step 1… 17,600 79 (0x4F) …one step 800… …one step 1… 24,000 87 (0x57) …one step 2,000… …one step 1… 40,000 95 (0x5F) Input Duty Cycle(%) (Center Value of the Range) Register 0 0% Duty Operation* (3.125) MRSPCT2 12.5 MRSPCT3 25 MRSPCT4 37.5 MRSPCT5 50 MRSPCT6 62.5 MRSPCT7 75 MRSPCT8 87.5 MRSPCT9 (96.875) MRSPCT10 100 100% Duty Operation* FGT: Target Speed Setting Target Speed [Electrical RPM] 45000 *See Abnormal Duty Cycle Operation (100% or 0%) There is a hysteresis of 6.25% duty cycle around each typical value resulting in the duty cycle thresholds depicted in Figure 11. The motor speed is defined as ERPM (Electrical Revolutions Per Minute). To calculate the physical rotational speed RPM of the motor divide ERPM by the number of pole pairs of the motor. Each of the nine registers (FGT0[6:0] to FGT8[6:0]) selected by the input PWM above has 7 bits to program ERPM in a piecewise exponential function. 40000 35000 30000 25000 20000 15000 10000 5000 0 0 16 32 48 64 80 96 112 128 Register Code [count] Figure 19. Speed Register Contents vs. Electrical RPM MRACS Address = 20h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 OSAENB MSAENB This read−only register controls SPI access to the Master Registers and OTP Registers. Its contents are transferred from OTP Register ORACS at device startup. www.onsemi.com 36 LV8907UW OSANEB: OTP Register Access Enable Controls write access to the OTP registers. OSAENB = 0: Write access permitted. OSAENB = 1: Write access denied. MSANEB: Master Register Access Enable Controls write access to the Master registers. OSAENB = 0: Write access permitted. OSAENB = 1: Write access denied. MRACK Address = 30h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 0 1 0 1 0 1 0 1 This read only register is used to check IC and SPI interface. 55h is read from this register in standby and normal mode, FFh during sleep mode. MRODL Address = 31h Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 Standby Mode: Read/Write Normal Mode: Read Only MRODL[7:0] 0 0 0 0 0 OTP download A write access of 00h to this register initiates a copy operation of OTP data to the Master Register. This register is blocked if OBSY is high. MRRST Address = 32h Bit 7 6 5 4 0 0 0 0 1 1 1 1 3 Standby Mode: Read/Write Normal Mode: Read Only 2 1 Bit 0 0 0 0 0 Reset Watchdog Timer 1 1 1 1 Reset Error Latch MRRST[7:0] • Writing FFh will reset the protection latch This register is used to reset the watch dog timer or the error latch. • Writing 00h to this register will reset the watch dog timer MRORB Address = 33h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 ORBEN ORBLV This register modifies the OTP readout threshold. After programming the OTP registers should be verified by reading them with the readout thresholds set low and high to detect false zeros and ones. See “OTP Programming”. ORBEN: Selects the Margin Read Mode ORBEN = 0: Normal mode. ORBEN = 1: Margin read mode. www.onsemi.com 37 LV8907UW ORBLV: Selects the OTP Readout Threshol. ORBLV = 0: Low level margin check ORBLV = 1: High level margin check MRDIAG0 Address = 34h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 CPO THPO FSPO VGLLVPO CHPLVPO VSOVPO VSLVPO OCPO Registers MRDIAG0 and MRDIAG1 indicate the system errors and/or warnings. VGLLVPO: VGL Low Voltage Protection Output The voltage at VGL has dropped below 5.5 V(max). The drivers are disabled to protect against low gate enhancement. CPO: Locked Rotor Protection Output No back EMF was detected during the entire open−loop startup time as programmed in CPTM. Either the rotor is blocked, or startup parameters are not correct. The drivers are disabled. CHPLVPO: CHP Low Voltage Protection Output The voltage between VS and VCP has dropped below 5.5 V(max). The drivers are disabled to protect against low gate enhancement. THPO: Thermal Protection Output The external temperature sensor input TH threshold was triggered. If the voltage at pin TH is lower than programmed in THTH the drivers will shut down. Tie TH to V3RO to disable this function. VSOVPO: VS Over−voltage Protection Output The voltage at VS has exceeded 20 V(min). The driver stage and the charge pump are disabled to protect against over−voltage at the charge−pump. VSLVPO: VS Low Voltage Protection Output The voltage at VS has fallen below 5.1 V(max). The driver stage is disabled to protect against internal threshold issues. FSPO: FET Short Protection Output The drain−source voltage threshold across one of the external power FETs has been exceeded during operation. The threshold voltage is programmed in register FSCDL. Errors are suppressed for a blanking time as programmed in register FSCDT. For the high−side FETs this voltage is measured between pin VS and the corresponding phase connection UOUT, VOUT, WOUT. For the low−side FETs it is measured between the phase connection and the pins SUL, SVL and SWL. Make sure to minimize potential voltage drops in the sense paths. VOCPO: Over−current Protection Output The voltage between current sense pins RFSENS and RF has exceeded 200 mV for longer than the over−current limit mask time programmed in OCMASK in register MRCONF5. The driver stage is disabled to protect against damage. MRDIAG1 Address = 35h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 PWMPO VCLVPO − SPCO STUPO WDTPO THSPO THWPO Registers MRDIAG0 and MRDIAG1 indicate the system errors and/or warnings. turn off, or operate at a predefined duty cycle (emergency mode). PWMPO:PWM Input Abnormal Protection Output The PWM input does not oscillate with the appropriate frequency or is steady high (100%) or low (0%). Depending on the settings in register MRCONF1 the driver stage will VCLVPO:VCC Reduced Voltage Protection Output VCC under−voltage error. Depending on the setting of MRCONF0 on page MRCONF0 VCC is either 5 V(typ.) or 3.3 V(typ.). Under−voltage is flagged if VCC falls below 4.2 V(max.) or 2.7 V(max.) respectively. www.onsemi.com 38 LV8907UW THWPO: Junction Temperature Thermal Warning Output The IC temperature has exceeded the warning level. The over−temperature warning level is defined by MRCONF8 to be either 125°C(min.) or 150°C(min.). SPCO: Speed Error Out of the Range SPCO = 0, when the absolute value of the speed error is equal to or less than target × 1/16. SPCO = 1, when the absolute value of the speed error is greater than target × 1/16. STUPO: Start−up status output This flag indicates open−loop startup operation. No back EMF has been detected, yet. OTP Registers The OTP Registers contain the default values of the system registers. These registers are always readable via SPI in either Standby or Normal modes. During device startup these default values are copied from the OTP bank (SPI addresses 40h to 60h) to the Master register bank (SPI addresses 00h to 20h). The OTP registers should only be programmed once during IC initialization, during normal operation only the Master Registers are accessed and modified. It is possible to block programming of the OTP section by setting the OSAENB bit in the ORACS Register of the OTP. For detailed information on the content of the OTP see the corresponding Master Register descriptions in the previous section. Master registers from 30h to 35h shown below are autonomous and have no equivalent position in the OTP as they report various internal data and status information. WDTPO: Watch Dog Timer Protection Output The watchdog has timed out. This flag will be high if the watchdog was not re−set during the time defined by MRCONF9. If the watchdog is enabled the driver stage will either be off or run in emergency mode with the settings defined by MRCONF11. Flag WDTPO is high even if the watchdog is disabled. THSPO: Junction Temperature Thermal Protection Output The IC temperature is too high and the drivers are shut off. The over−temperature shutoff level is defined by MRCONF8 to be either 150°C(min.) or 175°C(min.). ADDR[6:0] Bank OTP Register Function Master Register ADDR[6:0] 40h 0d[0] ORCONF0 …corresponds to… MRCONF0 00h 41h 0d[1] ORCONF1 MRCONF1 01h 42h 0d[2] ORCONF2 MRCONF2 02h 43h 0d[3] ORCONF3 MRCONF3 03h 44h 0d[4] ORCONF4 MRCONF4 04h 45h 1d[0] ORCONF5 MRCONF5 05h 47h 1d[2] ORCONF7 MRCONF7 07h 48h 1d[3] ORCONF8 MRCONF8 08h 49h 1d[4] ORCONF9 MRCONF9 09h 4Ah 2d[0] ORCONF10 MRCONF10 0Ah 4Bh 2d[1] ORCONF11 MRCONF11 0Bh 4Ch 2d[2] ORCONF12 MRCONF12 0Ch 50h 2d[3] ORSPCT0 MRSPCT0 10h 51h 2d[4] ORSPCT1 MRSPCT1 11h 52h 3d[0] ORSPCT2 MRSPCT2 12h 53h 3d[1] ORSPCT3 MRSPCT3 13h 54h 3d[2] ORSPCT4 MRSPCT4 14h 55h 3d[3] ORSPCT5 MRSPCT5 15h 56h 3d[4] ORSPCT6 MRSPCT6 16h 57h 4d[0] ORSPCT7 MRSPCT7 17h 58h 4d[1] ORSPCT8 MRSPCT8 18h 59h 4d[2] ORSPCT9 MRSPCT9 19h 5Ah 4d[3] ORSPCT10 MRSPCT10 1Ah 60h 4d[4] ORACS WRITE protection MRACS 20h − − − SPI Status Register MRACK 30h www.onsemi.com 39 LV8907UW ADDR[6:0] Bank OTP Register Function Master Register ADDR[6:0] − − − Initiates OTP download MRODL 31h − − − Watchdog Reset MRRST 32h − − − Margin read checks MRORB 33h − − − Diagnostic Flags MRDIAG0 34h − − − Diagnostic Flags MRDIAG1 35h transition). This operation takes up to 110 s. A high OBSY flag in the first returned byte during a SPI transaction indicates this. OTP Data Download The OTP register data is typically transferred into the main registers at device startup (From sleep to standby Figure 20. OTP Data Download Timing at Startup An OTP download can also actively be initiated by writing 00h to register MRODL. This command requires monitoring the OBSY flag. Don’t perform specific register access (MRCONF, MRSPCT, ORCONF, ORSPCT, ORACS) until the OBSY flag is cleared. Figure 21. OTP Data Download Timing after an MRODL Command www.onsemi.com 40 LV8907UW OTP Programming Overall Figure 20 shows overall of the OTP memory write and verify flow. It consists of preparation, write and three times of data integrity verification. START Set LV8907 standby Apply VS > 14 V Write Data Set mode to L side read check Verify Set mode to H side read check Verify Set mode to Normal Verify END Figure 22. OTP Memory Write and Verify Flow SPI write transactions. When the last address register in each bank is received, the busy−flag OBSY will be set and those five bytes will be programmed permanently into the corresponding OTP bank. The OBSY flag will be reset at the end of the write cycle. OBSY is in GSDAT register. To get GSDAT, SPI accesses to the register MRACK is recommended. MRACK doesn’t interfere with the programming operation. MRCONF, MRSPCT, ORCONF, ORSPCT, ORACS registers cannot be accessed during an OTP write cycle. OTP Programming The OTP registers can be programmed in Standby mode only while the write lock bit OSAENB is set 0. And, the supply voltage at pin VS must be more than 14 V. The actual write operation to the OTP memory will be done, when the state change from 0 to 1 is commanded. Once the bit state is changed to 1, it cannot be change back to 0. The number of writing is limited to one per bit. The OTP memory consists of five memory banks. The bank contains five register bytes. The bank is filled by five Figure 23. OTP Programming Timing The programming takes 25 ms maximum. To simplify operation, a waiting for 25 ms plus margin can be applicable instead of a polling of the flag OBSY. (Figure 24) www.onsemi.com 41 LV8907UW START WRITE DATA Write data to address 40 h, 41 h, 42 h, 43 h, 44 h Wait for 25 ms or more Write data to address 45 h, 46 h, 47 h, 48 h, 49 h Wait for 25 ms or more Write data to address 4Ah, 4Bh, 4Ch , 50 h, 51 h Wait for 25 ms or more Write data to address 52 h, 53 h, 54 h, 55 h, 56 h Wait for 25 ms or more Write data to address 57 h, 58 h, 59 h, 5Ah , 60 h Wait for 25 ms or more END Figure 24. OTP Memory Write Operation 6. Verify that the main register contents are consistent with the programmed OTP data 7. Return OTP threshold to normal by setting ORBEN = 0 and ORBLV = 0 8. Execute OTP download command 9. Verify that the main register contents are consistent with the programmed OTP data OTP Data Integrity Verification In order to verify that the OTP programming operation was successful. It is strongly recommended to do an OTP margin check: To do this, the OTP registers are downloaded into the main register bank with minimum and maximum readout thresholds. This OTP download is forced by writing 00h to register MRODL. The readout threshold is set in register MRORB. OTP Margin read check sequence after programmed: 1. Set OTP readout threshold “low” by setting ORBEN = 1 and ORBLV = 0 in register MRORB 2. Execute OTP download command by writing 00h to MRODL 3. Verify that the main register contents are consistent with the programmed OTP data 4. Set OTP readout threshold “high” by setting ORBEN = 1 and ORBLV = 1 in register MRORB 5. Execute OTP download command by writing 00h to MRODL Locking OTP Register Contents MSAENB bit and OSAENB bit of ORACS register are used in order to prevent write−access of main− and OTP registers respectively. CAUTION: Inadvertent writing of these bits will permanently lock the corresponding register blocks from any further write access. Should only be set at end of development cycles. www.onsemi.com 42 LV8907UW ORACS Address = 60h Standby Mode: Read/Write Normal Mode: Read Only Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 OSAENB MSAENB This register is used in order to permanently prevent write access to the OTP and/or main registers. This register data is transferred into MRACS register. OSAENB: Controls write access to the OTP registers. OSAENB = 0: Write access permitted. OSAENB = 1: Write access denied. MSAENB: This bit is used in order to prevent write access to the main registers. MSAENB = 0: Write access permitted. MSAENB = 1: Write access denied. The exposed pad should be either left floating electrically or connected ground. www.onsemi.com 43 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SPQFP48 7x7 / SQFP48K CASE 131AN ISSUE A DOCUMENT NUMBER: STATUS: NEW STANDARD: 98AON78439F ON SEMICONDUCTOR STANDARD http://onsemi.com SPQFP48 7X7 / SQFP48K 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 DATE 08 NOV 2013 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON78439F PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA. 24 SEP 2013 A CHANGED DESCRIPTION FROM SPQFP48 TO SQFP48. REQ. BY I. CAMBALIZA. 08 NOV 2013 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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