TI DRV5023 Drv5023 digital-switch hall effect sensor Datasheet

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DRV5023
SLIS151C – MAY 2014 – REVISED MAY 2015
DRV5023 Digital-Switch Hall Effect Sensor
1 Features
2 Applications
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1
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Digital Unipolar-Switch Hall Sensor
Superior Temperature Stability
– Sensitivity ±10% Over Temperature
High Sensitivity Options:
– +6.9 / +3.2 mT (AJ)
– +14.5 / +6 mT (BI)
Supports a Wide Voltage Range
– 2.5 to 38 V
– No External Regulator Required
Wide Operating Temperature Range
– TA = –40 to 125°C (Q see Figure 22)
Open Drain Output (30-mA Sink)
Fast 35-µs Power-On Time
Small Package and Footprint
– Surface Mount 3-Pin SOT-23 (DBZ)
– 2.92 mm × 2.37 mm
– Through-Hole 3-Pin SIP (LPG)
– 4.00 mm × 3.15 mm
Protection Features
– Reverse Supply Protection (up to –22 V)
– Supports up to 40-V Load Dump
– Output Short-Circuit Protection
– Output Current Limitation
Docking Detection
Door Open and Close Detection
Proximity Sensing
Valve Positioning
Pulse Counting
3 Description
The DRV5023 device is a chopper-stabilized Hall
Effect Sensor that offers a magnetic sensing solution
with superior sensitivity stability over temperature and
integrated protection features.
When the applied magnetic flux density exceeds the
BOP threshold, the DRV5023 open drain output goes
low. The output stays low until the field decreases to
less than BRP, and then the output goes to high
impedance. The output current sink capability is 30
mA. A wide operating voltage range from 2.5 to 38 V
with reverse polarity protection up to –22 V makes
the device suitable for a wide range of industrial
applications.
Internal protection functions are provided for reverse
supply conditions, load dump, and output short circuit
or over current.
Device Information(1)
PART NUMBER
DRV5023
PACKAGE
BODY SIZE (NOM)
SOT-23 (3)
2.92 mm × 2.37 mm
SIP (3)
4.00 mm × 3.15 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Output State
SOT-23
SIP
OUT
BHYS
B (mT)
B RP
B OF
BOP
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV5023
SLIS151C – MAY 2014 – REVISED MAY 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Output State ...........................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
4
4
4
4
5
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Magnetic Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
8.1
8.2
8.3
8.4
9
Overview ................................................................... 8
Functional Block Diagram ......................................... 8
Feature Description................................................... 9
Device Functional Modes........................................ 14
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application .................................................. 15
10 Power Supply Recommendations ..................... 17
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
11.5
Device Support......................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
19
19
19
12 Mechanical, Packaging, and Orderable
Information ........................................................... 19
5 Revision History
Changes from Revision A (August 2014) to Revision B
Page
•
Updated High Sensitivity Options to +6.9 / +3.2 mT (AJ) and +14.5 / +6 mT (BI)................................................................. 1
•
Added typical rise and fall time and removed maximum value ............................................................................................. 5
•
Updated the device values and typical values in Magnetic Characteristics .......................................................................... 5
•
Updated all Typical Characteristics graphs ........................................................................................................................... 6
•
Updated Equation 4 ............................................................................................................................................................. 16
•
Updated Figure 22 ............................................................................................................................................................... 18
Changes from Original (May 2014) to Revision A
Page
•
Changed High Sensitivity Options: +6.9 / +2.3 mT (AJ) to +6.9 / +3.3 mT (AJ) .................................................................... 1
•
Changed the maximum TJ value from 175°C to 150°C ......................................................................................................... 4
•
Changed MIN value for IOCP from 20 to 15 ............................................................................................................................ 5
•
Changed Max value for IOCP from 40 to 45 ............................................................................................................................ 5
•
Updated Magnetic Characteristics table. ............................................................................................................................... 5
2
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6 Pin Configuration and Functions
For additional configuration information, see Device Markings and Mechanical, Packaging, and Orderable
Information.
3-Pin SOT-23
DBZ Package
Top View
3-Pin SIP
LPG Package
Top View
OUT
2
3
GND
1
1
2
3
VCC
VCC
OUT
GND
Pin Functions
PIN
NAME
TYPE
DESCRIPTION
DBZ
LPG
GND
3
2
GND
OUT
2
3
Output
Hall sensor open-drain output. The open drain requires a resistor pullup.
VCC
1
1
Power
2.5 to 38 V power supply. Bypass this terminal to the GND terminal with a 0.01-μF
(minimum) ceramic capacitor rated for VCC.
Ground pin
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Power supply voltage
MIN
MAX
UNIT
–22 (2)
40
V
Voltage ramp rate (VCC), VCC < 5 V
Unlimited
Voltage ramp rate (VCC), VCC > 5 V
0
2
V/µs
Output pin voltage
OUT
–0.5
40
Output pin reverse current during reverse supply
condition
OUT
0
100
Operating junction temperature
TJ
–40
Tstg
Storage temperature
–65
(1)
(2)
(3)
150
V
mA
(3)
150
°C
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Ensured by design. Only tested to –20 V.
Tested in production to TA = 125°C.
7.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2500
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX
UNIT
VCC
Power supply voltage
2.5
38
VO
Output pin voltage (OUT)
0
38
V
ISINK
Output pin current sink (OUT) (1)
0
30
mA
TA
Operating ambient temperature
–40
125
°C
(1)
V
Power dissipation and thermal limits must be observed.
7.4 Thermal Information
DRV5023
THERMAL METRIC (1)
SOT-23 (DBZ)
SIP (LPG)
3 PINS
3 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
333.2
180
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
99.9
98.6
°C/W
RθJB
Junction-to-board thermal resistance
66.9
154.9
°C/W
ψJT
Junction-to-top characterization parameter
4.9
40
°C/W
ψJB
Junction-to-board characterization parameter
65.2
154.9
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLIES (VCC)
VCC
VCC operating voltage
ICC
Operating supply current
ton
Power-on time
2.5
VCC = 2.5 to 38 V, TA = 25°C
38
V
2.7
VCC = 2.5 to 38 V, TA = 125°C
3
3.5
35
50
mA
µs
OPEN DRAIN OUTPUT (OUT)
rDS(on)
FET on-resistance
Ilkg(off)
Off-state leakage current
VCC = 3.3 V, IO = 10 mA, TA = 25°C
22
VCC = 3.3 V, IO = 10 mA, TA = 125°C
36
Ω
50
Output Hi-Z
1
µA
45
mA
PROTECTION CIRCUITS
VCCR
Reverse supply voltage
IOCP
Overcurrent protection level
–22
OUT shorted VCC
15
V
30
7.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
13
25
UNIT
OPEN DRAIN OUTPUT (OUT)
td
Output delay time
B = BRP – 10 mT to BOP + 10 mT in 1 µs
tr
Output rise time (10% to 90%)
R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V
200
µs
ns
tf
Output fall time (90% to 10%)
R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V
31
ns
7.7 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
ƒBW
Bandwidth
TEST CONDITIONS
(2)
MIN
TYP
MAX
UNIT (1)
20
kHz
DRV5023AJ: +6.9 / +3.2 mT
BOP
Operate point (see Figure 12)
3
6.9
12
mT
BRP
Release point (see Figure 12)
1
3.2
5
mT
Bhys
Hysteresis; Bhys= (BOP – BRP)
BO
Magnetic offset, BO = (BOP + BRP) / 2
TA = –40°C to 125°C
3.7
mT
5
mT
DRV5023BI: +14.5 / +6 mT
BOP
Operate point (see Figure 12)
6
14.5
24
mT
BRP
Release point (see Figure 12)
3
6
9
mT
(3)
Bhys
Hysteresis; Bhys = (BOP – BRP)
BO
Magnetic offset, BO = (BOP + BRP) / 2
(1)
(2)
(3)
TA = –40°C to 125°C
8.5
mT
10.3
mT
1 mT = 10 Gauss
Bandwidth describes the fastest changing magnetic field that can be detected and translated to the output.
|BOP| is always greater than |BRP|.
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7.8 Typical Characteristics
3.5
TA ±ƒ&
TA = 25°C
TA = 75°C
TA = 125°C
Supply Current (mA)
Supply Current (mA)
3.5
3
2.5
2
0
10
20
Supply Voltage (V)
30
VCC = 2.5 V
VCC = 3.3 V
VCC = 13.2 V
VCC = 38 V
3
2.5
2
-50
40
-25
0
25
50
75
Ambient Temperature (°C)
D009
Figure 1. ICC vs VCC
Magnetic Field Operate Point BOP (mT)
Magnetic Field Operate Point BOP (mT)
D010
16
14
12
DRV5023AJ
DRV5023BI
10
8
6
4
0
10
20
Supply Voltage (V)
30
14
12
DRV5023AJ
DRV5023BI
10
8
6
4
-50
40
-25
0
25
50
75
Ambient Temperature (°C)
D001
TA = 25°C
100
125
D002
VCC = 3.3 V
Figure 3. BOP vs VCC
Figure 4. BOP vs Temperature
6.5
7
Magnetic Field Operate Point BRP (mT)
Magnetic Field Release Point BRP (mT)
125
Figure 2. ICC vs Temperature
16
6
5.5
5
4.5
DRV5023BI
DRV5023AJ
4
3.5
3
2.5
2
0
10
20
Supply Voltage (V)
TA = 25°C
30
40
6
5
DRV5023AJ
DRV5023BI
4
3
2
-50
-25
0
25
50
75
Ambient Temperature (°C)
D003
100
125
D004
VCC = 3.3 V
Figure 5. BRP vs VCC
6
100
Figure 6. BRP vs Temperature
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Typical Characteristics (continued)
9
10
DRV5023AJ
DRV5023BI
8
8
6
Hysteresis (mT)
Hysteresis (mT)
7
DRV5023AJ
DRV5023BI
5
4
6
4
3
2
0
10
20
Supply Voltage (V)
30
2
-50
40
TA = 25°C
10
10
9
9
8
DRV5023AJ
DRV5023BI
7
8
125
D008
6
5
5
4
12
16
20
24
28
Supply Voltage (V)
TA = 25°C
32
36
40
DRV5023AJ
DRV5023BI
7
6
8
100
Figure 8. Hysteresis vs Temperature
11
Offset (mT)
Offset (mT)
Figure 7. Hysteresis vs VCC
4
0
25
50
75
Ambient Temperature (°C)
VCC = 3.3 V
11
0
-25
D007
4
-50
-25
0
25
50
75
Ambient Temperature (°C)
D005
100
125
D006
VCC = 3.3 V
Figure 9. Offset vs VCC
Figure 10. Offset vs Temperature
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8 Detailed Description
8.1 Overview
The DRV5023 device is a chopper-stabilized Hall sensor with an digital latched output for magnetic sensing
applications. The DRV5023 device can be powered with a supply voltage between 2.5 and 38 V, and will survive
–22 V reverse-battery conditions. The DRV5023 device does not operate when –22 to 2.4 V is applied to the VCC
pin (with respect to GND pin). In addition, the device can withstand supply voltages up to 40 V for transient
durations.
The field polarity is defined as follows: a south pole near the marked side of the package is a positive magnetic
field. A north pole near the marked side of the package is a negative magnetic field.
The output state is dependent on the magnetic field perpendicular to the package. A strong south pole near the
marked side of the package causes the output to pull low (operate point, BOP), and a weak south pole causes
the output to release (release point, BRP). Hysteresis is included in between the operate point and the release
point therefore magnetic-field noise does not accidentally trip the output.
An external pullup resistor is required on the OUT pin. The OUT pin can be pulled up to VCC, or to a different
voltage supply. This allows for easier interfacing with controller circuits.
8.2 Functional Block Diagram
2.5 to 38 V
C1
VCC
Regulated Supply
Bias
R1
Temperature
Compensation
OUT
C2
OCP
Offset Cancel
Hall Element
(Optional)
+
Gate
Drive
±
Reference
GND
8
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8.3 Feature Description
8.3.1 Field Direction Definition
A positive magnetic field is defined as a south pole near the marked side of the package as shown in Figure 11.
SOT-23 (DBZ)
SIP (LPG)
B > 0 mT
B < 0 mT
B > 0 mT
B < 0 mT
N
S
N
S
S
N
S
N
1
2
3
1
2
3
(Bottom view)
N = North pole, S = South pole
Figure 11. Field Direction Definition
8.3.2 Device Output
If the device is powered on with a magnetic field strength between BRP and BOP, then the device output is
indeterminate and can either be Hi-Z or Low. If the field strength is greater than BOP, then the output is pulled
low. If the field strength is less than BRP, then the output is released.
OUT
BHYS
B (mT)
B RP
B OF
BOP
Figure 12. Output State
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Feature Description (continued)
8.3.3 Power-On Time
After applying VCC to the DRV5023 device, ton must elapse before the OUT pin is valid. During the power-up
sequence, the output is Hi-Z. A pulse as shown in Figure 13 and Figure 14 occurs at the end of ton. This pulse
can allow the host processor to determine when the DRV5023 output is valid after startup. In Case 1 (Figure 13)
and Case 2 (Figure 14), the output is defined assuming a constant magnetic field B > BOP and B < BRP.
VCC
t (s)
B (mT)
BOP
BRP
t (s)
OUT
Valid Output
t (s)
ton
Figure 13. Case 1: Power On When B > BOP
VCC
t (s)
B (mT)
BOP
BRP
t (s)
OUT
Valid Output
t (s)
ton
Figure 14. Case 2: Power On When B < BRP
10
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Feature Description (continued)
If the device is powered on with the magnetic field strength BRP < B < BOP, then the device output is
indeterminate and can either be Hi-Z or pulled low. During the power-up sequence, the output is held Hi-Z until
ton has elapsed. At the end of ton, a pulse is given on the OUT pin to indicate that ton has elapsed. After ton, if the
magnetic field changes such that BOP < B, the output is released. Case 3 (Figure 15) and Case 4 (Figure 16)
show examples of this behavior.
VCC
t (s)
B (mT)
BOP
BRP
t (s)
OUT
Valid Output
t (s)
ton
td
Figure 15. Case 3: Power On When BRP < B < BOP, Followed by B > BOP
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Feature Description (continued)
VCC
t (s)
B (mT)
BOP
BRP
t (s)
OUT
Valid Output
t (s)
ton
td
Figure 16. Case 4: Power On When BRP < B < BOP, Followed by B < BRP
12
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Feature Description (continued)
8.3.4 Output Stage
The DRV5023 output stage uses an open-drain NMOS, and it is rated to sink up to 30 mA of current. For proper
operation, calculate the value of the pullup resistor R1 using Equation 1.
Vref max
V min
d R1 d ref
30 mA
100 µA
(1)
The size of R1 is a tradeoff between the OUT rise time and the current when OUT is pulled low. A lower current
is generally better, however faster transitions and bandwidth require a smaller resistor for faster switching.
In addition, ensure that the value of R1 > 500 Ω to ensure the output driver can pull the OUT pin close to GND.
NOTE
Vref is not restricted to VCC. The allowable voltage range of this pin is specified in the
Absolute Maximum Ratings.
Vref
R1
OUT
ISINK
OCP
C2
Gate
Drive
GND
Figure 17.
Select a value for C2 based on the system bandwidth specifications as shown in Equation 2.
1
u ¦BW +] 2S u R1 u C2
(2)
Most applications do no require this C2 filtering capacitor.
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Feature Description (continued)
8.3.5 Protection Circuits
The DRV5023 device is fully protected against overcurrent and reverse-supply conditions.
8.3.5.1 Overcurrent Protection (OCP)
An analog current-limit circuit limits the current through the FET. The driver current is clamped to IOCP. During
this clamping, the rDS(on) of the output FET is increased from the nominal value.
8.3.5.2 Load Dump Protection
The DRV5023 device operates at DC VCC conditions up to 38 V nominally, and can additionally withstand VCC =
40 V. No current-limiting series resistor is required for this protection.
8.3.5.3 Reverse Supply Protection
The DRV5023 device is protected in the event that the VCC pin and the GND pin are reversed (up to –22 V).
NOTE
In a reverse supply condition, the OUT pin reverse-current must not exceed the ratings
specified in the Absolute Maximum Ratings.
Table 1.
FAULT
CONDITION
DEVICE
DESCRIPTION
RECOVERY
FET overload (OCP)
ISINK ≥ IOCP
Operating
Output current is clamped to IOCP
IO < IOCP
Load dump
38 V < VCC < 40 V
Operating
Device will operate for a transient duration
VCC ≤ 38 V
Reverse supply
–22 V < VCC < 0 V
Disabled
Device will survive this condition
VCC ≥ 2.5 V
8.4 Device Functional Modes
The DRV5023 device is active only when VCC is between 2.5 and 38 V.
When a reverse supply condition exists, the device is inactive.
14
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DRV5023 device is used in magnetic-field sensing applications.
9.2 Typical Application
C2
680 pF
(Optional)
2
OUT
R1
10 kŸ
3
1
VCC
VCC
C1
0.01 µF
(minimum)
Figure 18. Typical Application Circuit
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
DESIGN PARAMETER
REFERENCE
EXAMPLE VALUE
Supply voltage
VCC
3.2 to 3.4 V
System bandwidth
ƒBW
10 kHz
9.2.2 Detailed Design Procedure
Table 3. External Components
COMPONENT
PIN 1
PIN 2
RECOMMENDED
C1
VCC
GND
A 0.01-µF (minimum) ceramic capacitor rated for VCC
C2
OUT
GND
Optional: Place a ceramic capacitor to GND
R1
(1)
OUT
REF
(1)
Requires a resistor pullup
REF is not a pin on the DRV5023 device, but a REF supply-voltage pullup is required for the OUT pin; the OUT pin may be pulled up to
VCC.
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9.2.2.1 Configuration Example
In a 3.3-V system, 3.2 V ≤ Vref ≤ 3.4 V. Use Equation 3 to calculate the allowable range for R1.
Vref max
V min
d R1 d ref
30 mA
100 µA
(3)
For this design example, use Equation 4 to calculate the allowable range of R1.
3.4 V
3.2 V
d R1 d
30 mA
100 µA
(4)
Therefore:
113 Ω ≤ R1 ≤ 32 kΩ
(5)
After finding the allowable range of R1 (Equation 5), select a value between 500 Ω and 32 kΩ for R1.
Assuming a system bandwidth of 10 kHz, use Equation 6 to calculate the value of C2.
1
u ¦BW +] 2S u R1 u C2
(6)
For this design example, use Equation 7 to calculate the value of C2.
1
2 u 10 kHz 2S u R1 u C2
(7)
An R1 value of 10 kΩ and a C2 value less than 820 pF satisfy the requirement for a 10-kHz system bandwidth.
A selection of R1 = 10 kΩ and C2 = 680 pF would cause a low-pass filter with a corner frequency of 23.4 kHz.
16
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9.2.3 Application Curves
OUT
OUT
R1 = 10-kΩ pullup
R1 = 10-kΩ pullup
No C2
C2 = 680 pF
Figure 20. 10-kHz Switching Magnetic Field
Figure 19. 10-kHz Switching Magnetic Field
0
-2
Magnitude (dB)
-4
-6
-8
-10
-12
-14
100
1000
10000
Frequency (Hz)
R1 = 10-kΩ pullup
100000
D011
C2 = 680 pF
Figure 21. Low-Pass Filtering
10 Power Supply Recommendations
The DRV5023 device is designed to operate from an input voltage supply (VM) range between 2.5 and 38 V. A
0.01-µF (minimum) ceramic capacitor rated for VCC must be placed as close to the DRV5023 device as possible.
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DRV5023
SLIS151C – MAY 2014 – REVISED MAY 2015
www.ti.com
11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
Figure 22 shows a legend for reading the complete device name for and DRV5023 device.
DRV5023
(AJ)
(Q)
(DBZ)
(R)
()
AEC-Q100
Q1: Automotive qualification
Prefix
DRV5023: Digital switch hall sensor
Blank: Non-auto
BOP/BRP
AJ: +6.9/+3.2 mT
BI: +14.5/+6 mT
Tape and Reel
R: 3000 pcs/reel
T: 250 pcs/reel
M: 1000 pcs/bag (bulk)
Blank: 3000 pcs/box (ammo)
Package
DBZ: 3-pin SOT (SMT)
LPG: 3-pin SIP (through-hole)
Temperature Range
Q: ±40 to 125°C
E: ±40 to 150°C
Figure 22. Device Nomenclature
11.1.2 Device Markings
Marked Side
3
Marked Side Front
1
1
2
3
2
Marked Side
1
2
3
(Bottom view)
Figure 23. SOT-23 (DBZ) Package
Figure 24. SIP (LPG) Package
indicates the Hall effect sensor (not to scale). The Hall element is located in the center of the package with a
tolerance of ±100 µm. The height of the Hall element from the bottom of the package is 0.7 mm ±50 µm in the DBZ
package and 0.987 mm ±50 µm in the LPG package.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
18
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DRV5023
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SLIS151C – MAY 2014 – REVISED MAY 2015
Community Resources (continued)
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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19
PACKAGE OPTION ADDENDUM
www.ti.com
5-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DRV5023AJQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
+PLAJ
DRV5023AJQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
+PLAJ
DRV5023AJQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+PLAJ
DRV5023AJQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+PLAJ
DRV5023BIQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
+PLBI
DRV5023BIQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
+PLBI
DRV5023BIQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+PLBI
DRV5023BIQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+PLBI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
5-May-2015
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DRV5023 :
• Automotive: DRV5023-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-May-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
DRV5023AJQDBZR
SOT-23
DBZ
3
3000
180.0
8.4
DRV5023AJQDBZT
SOT-23
DBZ
3
250
180.0
DRV5023BIQDBZR
SOT-23
DBZ
3
3000
180.0
DRV5023BIQDBZT
SOT-23
DBZ
3
250
180.0
3.15
2.77
1.22
4.0
8.0
Q3
8.4
3.15
2.77
1.22
4.0
8.0
Q3
8.4
3.15
2.77
1.22
4.0
8.0
Q3
8.4
3.15
2.77
1.22
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
6-May-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV5023AJQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5023AJQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
DRV5023BIQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5023BIQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
Pack Materials-Page 2
PACKAGE OUTLINE
LPG0003A
TO-92 - 5.05 mm max height
SCALE 1.300
TO-92
4.1
3.9
3.25
3.05
3X
0.55
0.40
5.05
MAX
3X (0.8)
3X
15.5
15.1
3X
0.48
0.35
3X
2X 1.27 0.05
0.51
0.36
2.64
2.44
2.68
2.28
1.62
1.42
2X (45° )
0.86
0.66
4221343/A 02/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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