CALMIRCO CM1203-01CS 1, 2 and 3-channel esd arrays in csp Datasheet

CM1203
1, 2 and 3-Channel ESD Arrays in CSP
Features
Product Description
•
The CM1203 comprises a family of 1, 2, and 3-channel
ESD protection arrays, which integrate two, three and
four identical avalanche-style diodes. It is intended that
one of these diodes is connected to GND and the other
diodes provide ESD protection for up to 3 lines
depending upon the configuration utilized. The backto-back diode connections provide ESD protection for
nodes that have AC signals up to 5.9V peak. These
devices provide a very high level of protection for sensitive electronic components that may be subjected to
electrostatic discharge (ESD).
The diodes are
designed and characterized to safely dissipate ESD
strikes of ±15kV, well beyond the maximum requirements of the IEC 61000-4-2 international standard.
Using the MIL-STD-883 (Method 3015) specification
for Human Body Model (HBM) ESD, these devices protect against contact discharges of greater than ±30kV.
The diodes also provide some EMI filtering, when used
in combination with a PCB trace or series resistor.
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•
•
•
•
•
•
Functionally and pin compatible with CMD’s
CSPESD301/302/303 family of devices
OptiGuard™ coated for improved reliability at
assembly
1, 2 or 3 channels of ESD protection
±15kV ESD protection (IEC 61000-4-2, contact
discharge)
±30kV ESD protection (HBM)
Supports both AC and DC signal applications
Low leakage current (<100nA)
Chip Scale Package features extremely low lead
inductance for optimum ESD and filter performance
4 bump, 1.06 x 0.93mm footprint Chip Scale Package (CSP)
Lead-free version available
Applications
•
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These devices are particularly well-suited for portable
electronics (e.g. cellular telephones, PDAs, notebook
computers) because of their small package format and
easy-to-use pin assignments.
I/O port protection
EMI filtering for data ports
Cellphones, notebook computers, PDAs
Wireless Handsets
MP3 Players
Digital Still Cameras
Handheld PCs
The CM1203 incorporates OptiGuard™ coating which
results in improved reliability at assembly. The CM1203
is available in a space-saving, low-profile, chip-scale
package with optional lead-free finishing.
Electrical Schematics
A2
B1
CM1203-01
A2
B1
B2
A1
CM1203-02
A2
B1
B2
CM1203-03
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
CM1203
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
(see note 2)
A1
A
A2
A1
B2
B1
Orientation
Marking
n*
B
* See ordering information for
appropriate part marking.
CM1203
4-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
3) All 4 bumps are always present. Unused bumps are electrically unconnected.
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
4
CSP
CM1203-01CS
P
CM1203-01CP
P
4
CSP
CM1203-02CS
Q
CM1203-02CP
Q
4
CSP
CM1203-03CS
R
CM1203-03CP
R
Part Marking
Ordering Part
Number1
Part Marking
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CM1203
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-65 to +150
°C
200
mW
RATING
UNITS
-40 to +85
°C
DC Package Power Rating
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
PARAMETER
CONDITIONS
MIN
VSO
Diode Stand-off Voltage
IDIODE = ±10µA
±5.9
ILEAK
Diode Leakage Current
VIN=3.3V
VSIG
Small Signal Clamp Voltage
Positive Clamp
Negative Clamp
IDIODE = 10mA
IDIODE = -10mA
VESD
VCL
RD
C
6.0
-9.2
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Notes 2, 3 and 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Between adjacent bumps
Between diagonal bumps
Notes 2, 3 and 4
Dynamic Resistance
Between adjacent bumps
Between diagonal bumps
Notes 2, 3 and 4
Capacitance
At 0VDC, 1MHz, 30mVAC
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to
another diode, one at a time.
Note 3: Unused pins are left open.
Note 4: These parameters are guaranteed by design and characterization.
TYP
MAX
UNITS
V
7.6
-7.6
100
nA
9.2
-6.0
V
V
±30
kV
±15
kV
19.5
19.9
V
V
0.85
1.10
Ω
Ω
27
pF
I
IESD
slope = 1/R
D
10mA
10µA
ILEAK
3.3V
VSO
VSIG
VCL
V
Figure 1. Parameter Legend
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
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CM1203
Performance Information
Figure 2. Typical EMI Filter Performance (0VDC, 50 Ohm Environment)
Figure 3. Typical Capacitance vs. Input Voltage (normalized to 0VDC)
© 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CM1203
Performance Information (cont’d)
I (µA)
8
6
4
2
-8
-6
-4
-2
2
4
6
8
V (V)
-2
-4
-6
-8
Figure 4. Low Current I-V Curve
High Current I-V Characteristic - Pads A1 to A2
2.0
1.5
Current [A]
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-12 -11 -10 -9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10 11 12
Voltage [V]
Figure 5. High Current I-V Curve
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
CM1203
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CM1203
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CM1203 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are shown below. For
complete information on CSP packaging, see the California Micro Devices CSP Package Information document.
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
PACKAGE DIMENSIONS
Custom CSP
Bumps
A
4
Millimeters
Min
Nom
1
Inches
Max
Min
Nom
0.881 0.925 0.971 0.0347 0.0365 0.0382
A2
1.015 1.060 1.105 0.0400 0.0417 0.0435
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.163 0.213 0.263 0.0064 0.0084 0.0104
C2
0.230 0.280 0.330 0.0091 0.0110 0.0130
D1
0.600 0.670 0.739 0.0236 0.0264 0.0291
D2
0.394 0.445 0.495 0.0155 0.0175 0.0195
SIDE
VIEW
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Max
A1
# per tape and
reel
2
C2
Dim
B
A2
Package
B2
B1
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1203 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1203
1.06 X 0.93 X 0.670
1.14 X 1.00 X 0.70
8mm
178mm (7")
3500
4mm
4mm
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 9. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
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