CM1203 1, 2 and 3-Channel ESD Arrays in CSP Features Product Description • The CM1203 comprises a family of 1, 2, and 3-channel ESD protection arrays, which integrate two, three and four identical avalanche-style diodes. It is intended that one of these diodes is connected to GND and the other diodes provide ESD protection for up to 3 lines depending upon the configuration utilized. The backto-back diode connections provide ESD protection for nodes that have AC signals up to 5.9V peak. These devices provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The diodes are designed and characterized to safely dissipate ESD strikes of ±15kV, well beyond the maximum requirements of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices protect against contact discharges of greater than ±30kV. The diodes also provide some EMI filtering, when used in combination with a PCB trace or series resistor. • • • • • • • • • Functionally and pin compatible with CMD’s CSPESD301/302/303 family of devices OptiGuard™ coated for improved reliability at assembly 1, 2 or 3 channels of ESD protection ±15kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) Supports both AC and DC signal applications Low leakage current (<100nA) Chip Scale Package features extremely low lead inductance for optimum ESD and filter performance 4 bump, 1.06 x 0.93mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • • These devices are particularly well-suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of their small package format and easy-to-use pin assignments. I/O port protection EMI filtering for data ports Cellphones, notebook computers, PDAs Wireless Handsets MP3 Players Digital Still Cameras Handheld PCs The CM1203 incorporates OptiGuard™ coating which results in improved reliability at assembly. The CM1203 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing. Electrical Schematics A2 B1 CM1203-01 A2 B1 B2 A1 CM1203-02 A2 B1 B2 CM1203-03 © 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 CM1203 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking 1 2 (see note 2) A1 A A2 A1 B2 B1 Orientation Marking n* B * See ordering information for appropriate part marking. CM1203 4-Bump CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. 3) All 4 bumps are always present. Unused bumps are electrically unconnected. Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 4 CSP CM1203-01CS P CM1203-01CP P 4 CSP CM1203-02CS Q CM1203-02CP Q 4 CSP CM1203-03CS R CM1203-03CP R Part Marking Ordering Part Number1 Part Marking Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/28/04 CM1203 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C 200 mW RATING UNITS -40 to +85 °C DC Package Power Rating STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN VSO Diode Stand-off Voltage IDIODE = ±10µA ±5.9 ILEAK Diode Leakage Current VIN=3.3V VSIG Small Signal Clamp Voltage Positive Clamp Negative Clamp IDIODE = 10mA IDIODE = -10mA VESD VCL RD C 6.0 -9.2 In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2, 3 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Between adjacent bumps Between diagonal bumps Notes 2, 3 and 4 Dynamic Resistance Between adjacent bumps Between diagonal bumps Notes 2, 3 and 4 Capacitance At 0VDC, 1MHz, 30mVAC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to another diode, one at a time. Note 3: Unused pins are left open. Note 4: These parameters are guaranteed by design and characterization. TYP MAX UNITS V 7.6 -7.6 100 nA 9.2 -6.0 V V ±30 kV ±15 kV 19.5 19.9 V V 0.85 1.10 Ω Ω 27 pF I IESD slope = 1/R D 10mA 10µA ILEAK 3.3V VSO VSIG VCL V Figure 1. Parameter Legend © 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 CM1203 Performance Information Figure 2. Typical EMI Filter Performance (0VDC, 50 Ohm Environment) Figure 3. Typical Capacitance vs. Input Voltage (normalized to 0VDC) © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/28/04 CM1203 Performance Information (cont’d) I (µA) 8 6 4 2 -8 -6 -4 -2 2 4 6 8 V (V) -2 -4 -6 -8 Figure 4. Low Current I-V Curve High Current I-V Characteristic - Pads A1 to A2 2.0 1.5 Current [A] 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 Voltage [V] Figure 5. High Current I-V Curve © 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 CM1203 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 6. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/28/04 CM1203 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CM1203 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are shown below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS Custom CSP Bumps A 4 Millimeters Min Nom 1 Inches Max Min Nom 0.881 0.925 0.971 0.0347 0.0365 0.0382 A2 1.015 1.060 1.105 0.0400 0.0417 0.0435 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.163 0.213 0.263 0.0064 0.0084 0.0104 C2 0.230 0.280 0.330 0.0091 0.0110 0.0130 D1 0.600 0.670 0.739 0.0236 0.0264 0.0291 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 SIDE VIEW D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Max A1 # per tape and reel 2 C2 Dim B A2 Package B2 B1 DIMENSIONS IN MILLIMETERS Package Dimensions for CM1203 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1203 1.06 X 0.93 X 0.670 1.14 X 1.00 X 0.70 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 9. Tape and Reel Mechanical Data © 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7