BAR66... Silicon PIN Diode Array • Surge protection device • Designed for surge overvoltage clamping in antiparallel connection • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAR66 ! , , Type BAR66 Package SOT23 Configuration series LS(nH) 1.8 Marking PMs Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 150 V Forward current IF 200 mA Total power dissipation Ptot 250 mW ESD contact discharge2) VESD 25 kV Peak pulse current (tp = 8 / 20 µs)3) I pp 12 A Junction temperature Tj 150 °C Operating temperature range T op -55 ... 125 Storage temperature T stg -55 ... 150 Ts ≤ 25 °C Thermal Resistance Parameter Symbol Value Unit Junction - soldering point 4), BAR 66 RthJS ≤ 290 K/W 1Pb-containing package may be available upon special request according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected ESD 2V 3I pp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected calculation of RthJA please refer to Application Note Thermal Resistance 4For 1 2007-04-19 BAR66... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. 150 - - V IR - - 20 nA VF - 0.95 1.2 V VESD = ± 15 kV (contact) 1) - tbd - IPP = 12 A, tp = 8/20 µs2) - 7 - DC Characteristics Breakdown voltage V(BR) I(BR) = 5 µA Reverse current VR = 100 V Forward voltage IF = 50 mA Clamping voltage VCL AC Characteristics Diode capacitance pF CT VR = 35 V, f = 1 MHz - 0.4 0.6 VR = 0 V, f = 100 MHz - 0.35 0.9 gP - 220 - µS rf - 1.5 1.8 Ω τ rr - 0.7 - µs Zero bias conductance VR = 0 V, f = 1 GHz Forward resistance I F = 5 mA, f = 100 MHz Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω 1V ESD according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected pp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected 2I 2 2007-04-19 BAR66... Diode capacitance CT = ƒ (VR) f = Parameter Forward resistance rf = ƒ (I F) f = 100MHz 10 3 0.8 Ohm pF 10 2 0.5 rf CT 0.6 0.3 10 1 1MHz 0.4 100MHz 10 0 0.2 0.1 0 0 5 10 15 20 25 V 10 -1 -2 10 35 10 -1 10 0 10 VR 1 mA 10 2 IF Forward current IF = ƒ (VF) Forward current IF = ƒ (T S) TA = Parameter BAR66 10 0 A 220 mA 10 -1 180 160 IF IF 10 -2 140 120 10 -3 100 -40 °C 25 °C 85 °C 125 °C 10 -4 80 60 10 -5 40 20 10 -6 0 0.2 0.4 0.6 0.8 V 0 0 1.2 VF 20 40 60 80 100 120 °C 150 TS 3 2007-04-19 BAR66... Permissible Puls Load RthJS = ƒ (tp) Permissible Pulse Load BAR66 IFmax / I FDC = ƒ (t p) BAR66 10 3 10 2 I Fmax/IFDC K/W R thJS 10 2 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 - 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 tP 10 -5 10 -4 10 -3 10 -2 s 10 0 tP 4 2007-04-19 Package SOT23 BAR66... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 5 2007-04-19 BAR66... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19