TI1 LM2931CMX Series low dropout regulator Datasheet

LM2931-N
www.ti.com
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
LM2931-N Series Low Dropout Regulators
Check for Samples: LM2931-N
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
•
The LM2931-N positive voltage regulator features a
very low quiescent current of 1mA or less when
supplying 10mA loads. This unique characteristic and
the extremely low input-output differential required for
proper regulation (0.2V for output currents of 10mA)
make the LM2931-N the ideal regulator for standby
power systems. Applications include memory standby
circuits, CMOS and other low power processor power
supplies as well as systems demanding as much as
100mA of output current.
1
2
•
Very Low Quiescent Current
Output Current in Excess of 100 mA
Input-output Differential Less than 0.6V
Reverse Battery Protection
60V Load Dump Protection
−50V Reverse Transient Protection
Short Circuit Protection
Internal Thermal Overload Protection
Mirror-image Insertion Protection
Available in TO-220, TO-92, TO-263, or SOIC-8
Packages
Available as Adjustable with TTL Compatible
Switch
Designed originally for automotive applications, the
LM2931-N and all regulated circuitry are protected
from reverse battery installations or 2 battery jumps.
During line transients, such as a load dump (60V)
when the input voltage to the regulator can
momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut
down to protect both internal circuits and the load.
The LM2931-N cannot be harmed by temporary
mirror-image insertion. Familiar regulator features
such as short circuit and thermal overload protection
are also provided.
The LM2931-N family includes a fixed 5V output
(±3.8% tolerance for A grade) or an adjustable output
with ON/OFF pin. Both versions are available in a
TO-220 power package, DDPAK/TO-263 surface
mount package, and an 8-lead SOIC package. The
fixed output version is also available in the TO-92
plastic package.
Connection Diagrams
FIXED VOLTAGE OUTPUT
Figure 1. TO-220 3-Lead Power Package
Front View
Figure 2. DDPAK/TO-263 Surface-Mount Package
Top View
Figure 3. Side View
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
*NC = Not internally connected. Must be electrically isolated from the rest of the circuit for the DSBGA package.
Figure 4. 8-Pin SOIC
Top View
Figure 5. TO-92 Plastic Package
Bottom View
Figure 6. 6-Bump DSBGA
Top View
(Bump Side Down)
Figure 7. DSBGA Laser Mark
ADJUSTABLE OUTPUT VOLTAGE
Figure 8. TO-220 5-Lead Power Package
Front View
Figure 9. DDPAK/TO-263
5-Lead Surface-Mount Package
Top View
2
Submit Documentation Feedback
Figure 10. Side View
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
LM2931-N
www.ti.com
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
Figure 11. 8-Pin SOIC
Top View
Typical Applications
*Required if regulator is located far from power supply filter.
**C2 must be at least 100 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator. The equivalent series resistance (ESR) of this capacitor is critical; see curve.
Figure 12. LM2931-N Fixed Output
Note: Using 27k for R1 will automatically compensate for errors in VOUT due to the input bias current of the ADJ pin
(approximately 1 μA).
Figure 13. LM2931-N Adjustable Output
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
3
LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2)
Input Voltage
Operating Range
26V
Overvoltage Protection
LM2931A, LM2931C (Adjustable)
60V
LM2931-N
50V
Internal Power Dissipation
(3) (4)
Internally Limited
Operating Ambient Temperature
−40°C to +85°C
Range
Maximum Junction Temperature
125°C
−65°C to +150°C
Storage Temperature Range
Lead Temp. (Soldering, 10 seconds)
ESD Tolerance
(1)
(2)
(3)
(4)
(5)
230°C
(5)
2000V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its rated operating conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
The maximum power dissipation is a function of maximum junction temperature TJmax, total thermal resistance θJA, and ambient
temperature TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92
package, θJA is 195°C/W; in the SOIC-8 package, θJA is 160°C/W, and in the TO-220 package, θJA is 50°C/W; in the DDPAK/TO-263
package, θJA is 73°C/W; and in the 6-Bump DSBGA package θJA is 290°C/W. If the TO-220 package is used with a heat sink, θJA is the
sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal
interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally
connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W;
and with 1.6 or more square inches of copper area, θJA is 32°C/W.
Human body model, 100 pF discharged through 1.5 kΩ.
ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION
VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100μF (unless otherwise specified)
(1)
LM2931-N-3.3
Parameter
Conditions
Output Voltage
Typ
3.3
4V ≤ VIN ≤ 26V, IO = 100 mA
−40°C ≤ TJ ≤ 125°C
Limit
Units
3.465
3.135
VMAX
VMIN
3.630
2.970
VMAX
VMIN
(2)
Line Regulation
4V ≤ VIN ≤ 26V
4
33
mVMAX
Load Regulation
5mA ≤ IO ≤ 100mA
10
50
mVMAX
Output Impedance
100mADC and 10mArms,
100Hz - 10kHz
200
Quiescent Current
IO ≤ 10mA, 4V ≤ VIN ≤ 26V
0.4
mΩ
1.0
mAMAX
−40°C ≤ TJ ≤ 125°C
Output Noise Voltage
IO = 100mA, VIN = 14V, TJ = 25°C
15
10Hz -100kHz, COUT = 100μF
330
μVrms
13
mV/1000 hr
80
dB
Long Term Stability
Ripple Rejection
(1)
(2)
4
fO = 120Hz
mA
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
All limits are specified for TJ = 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold
type face).
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
LM2931-N
www.ti.com
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION (continued)
VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100μF (unless otherwise specified) (1)
LM2931-N-3.3
Parameter
Conditions
Dropout Voltage
Limit
Units
0.05
0.30
0.2
0.6
VMAX
Typ
IO = 10mA
IO = 100mA
Maximum Operational Input Voltage
(2)
33
26
VMIN
Maximum Line Transient
RL = 500Ω, VO ≤ 5.5V,
T = 1ms, τ ≤ 100ms
70
50
VMIN
Reverse Polarity Input Voltage, DC
VO ≥ −0.3V, RL = 500Ω
−30
−15
VMIN
Reverse Polarity Input Voltage,
Transient
T = 1ms, τ ≤ 100ms, RL = 500Ω
−80
−50
VMIN
ELECTRICAL CHARACTERISTICS FOR FIXED 5V VERSION
VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100 μF (unless otherwise specified)
(1)
LM2931A-5.0
Parameter
Conditions
Output Voltage
Typ
5
6.0V ≤ VIN ≤ 26V, IO = 100mA
−40°C ≤ TJ ≤ 125°C
Line Regulation
9V ≤ VIN ≤ 16V
6V ≤ VIN ≤ 26V
Load Regulation
Output Impedance
Quiescent Current
LM2931-N-5.0
Limit
Limit
Units
5.25
4.75
VMAX
VMIN
5.5
4.5
VMAX
VMIN
2
4
10
30
mVMAX
14
50
mVMAX
(2)
Typ
5.19
4.81
5
5.25
4.75
(2)
2
4
10
30
5 mA ≤ IO ≤ 100mA
14
50
100mADC and 10mArms,
100Hz -10kHz
200
IO ≤ 10mA, 6V ≤ VIN ≤ 26V
0.4
1.0
IO = 100mA, VIN = 14V, TJ = 25°C
15
30
10Hz -100kHz, COUT = 100μF
500
500
μVrms
20
20
mV/1000
hr
200
0.4
mΩ
1.0
mAMAX
−40°C ≤ TJ ≤ 125°C
Output Noise Voltage
Long Term Stability
15
mAMAX
Ripple Rejection
fO = 120 Hz
80
55
80
Dropout Voltage
IO = 10mA
IO = 100mA
0.05
0.3
0.2
0.6
0.05
0.3
0.2
0.6
VMAX
33
26
33
26
VMIN
Maximum Operational Input
Voltage
dBMIN
Maximum Line Transient
RL = 500Ω, VO ≤ 5.5V,
T = 1ms, τ ≤ 100ms
70
60
70
50
VMIN
Reverse Polarity Input Voltage,
DC
VO ≥ −0.3V, RL = 500Ω
−30
−15
−30
−15
VMIN
Reverse Polarity Input Voltage,
Transient
T = 1ms, τ ≤ 100ms, RL = 500Ω
−80
−50
−80
−50
VMIN
(1)
(2)
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
All limits are specified for TJ = 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold
type face).
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
5
LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
ELECTRICAL CHARACTERISTICS FOR ADJUSTABLE VERSION
VIN = 14V, VOUT = 3V, IO = 10 mA, TJ = 25°C, R1 = 27k, C2 = 100 μF (unless otherwise specified)
Parameter
Conditions
Reference Voltage
(1)
Typ
Limit
Units Limit
1.20
1.26
VMAX
1.14
VMIN
IO ≤ 100 mA, −40°C ≤ Tj ≤ 125°C, R1 = 27k
1.32
VMAX
Measured from VOUT to Adjust Pin
1.08
VMIN
24
VMAX
Output Voltage Range
3
VMIN
mV/VMAX
Line Regulation
VOUT + 0.6V ≤ VIN ≤ 26V
0.2
1.5
Load Regulation
5 mA ≤ IO ≤ 100 mA
0.3
1
Output Impedance
100 mADC and 10 mArms, 100 Hz–10 kHz
40
Quiescent Current
IO = 10 mA
0.4
Output Noise Voltage
%MAX
mΩ/V
1
mAMAX
1
mAMAX
IO = 100 mA
15
During Shutdown RL = 500Ω
0.8
10 Hz–100 kHz
100
μVrms/V
0.4
%/1000 hr
Long Term Stability
mA
Ripple Rejection
fO = 120 Hz
0.02
Dropout Voltage
IO ≤ 10 mA
0.05
0.2
VMAX
%/V
IO = 100 mA
0.3
0.6
VMAX
33
26
VMIN
70
60
VMIN
−30
−15
VMIN
−80
−50
VMIN
On
2.0
1.2
VMAX
Off
2.2
3.25
VMIN
20
50
μAMAX
Maximum Operational Input
Voltage
Maximum Line Transient
IO = 10 mA, Reference Voltage ≤ 1.5V
T = 1 ms, τ ≤ 100 ms
Reverse Polarity Input
VO ≥ −0.3V, RL = 500Ω
Voltage, DC
Reverse Polarity Input
T = 1 ms, τ ≤ 100 ms, RL = 500Ω
Voltage, Transient
On/Off Threshold Voltage
VO=3V
On/Off Threshold Current
(1)
6
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
LM2931-N
www.ti.com
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Dropout Voltage
Dropout Voltage
Figure 14.
Figure 15.
Low Voltage Behavior
Output at Voltage Extremes
Figure 16.
Figure 17.
Line Transient Response
Load Transient Response
Figure 18.
Figure 19.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
7
LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
8
Peak Output Current
Quiescent Current
Figure 20.
Figure 21.
Quiescent Current
Quiescent Current
Figure 22.
Figure 23.
Ripple Rejection
Ripple Rejection
Figure 24.
Figure 25.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
LM2931-N
www.ti.com
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Output Impedance
Operation During Load
Dump
Figure 26.
Figure 27.
Reference Voltage
Maximum Power Dissipation
(SOIC-8)
Figure 28.
Figure 29.
Maximum Power Dissipation
(TO-220)
Maximum Power Dissipation
(TO-92)
Figure 30.
Figure 31.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
9
LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Maximum Power Dissipation
(TO-263) (1)
On/Off Threshold
Figure 32.
Figure 33.
Output Capacitor ESR
Figure 34.
(1)
10
The maximum power dissipation is a function of maximum junction temperature TJmax, total thermal resistance θJA, and ambient
temperature TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92
package, θJA is 195°C/W; in the SOIC-8 package, θJA is 160°C/W, and in the TO-220 package, θJA is 50°C/W; in the DDPAK/TO-263
package, θJA is 73°C/W; and in the 6-Bump DSBGA package θJA is 290°C/W. If the TO-220 package is used with a heat sink, θJA is the
sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal
interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally
connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W;
and with 1.6 or more square inches of copper area, θJA is 32°C/W.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
LM2931-N
www.ti.com
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
SCHEMATIC DIAGRAM
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
11
LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
APPLICATION HINTS
One of the distinguishing factors of the LM2931-N series regulators is the requirement of an output capacitor for
device stability. The value required varies greatly depending upon the application circuit and other factors. Thus
some comments on the characteristics of both capacitors and the regulator are in order.
High frequency characteristics of electrolytic capacitors depend greatly on the type and even the manufacturer.
As a result, a value of capacitance that works well with the LM2931-N for one brand or type may not necessary
be sufficient with an electrolytic of different origin. Sometimes actual bench testing, as described later, will be the
only means to determine the proper capacitor type and value. Experience has shown that, as a rule of thumb, the
more expensive and higher quality electrolytics generally allow a smaller value for regulator stability. As an
example, while a high-quality 100 μF aluminum electrolytic covers all general application circuits, similar stability
can be obtained with a tantalum electrolytic of only 47μF. This factor of two can generally be applied to any
special application circuit also.
Another critical characteristic of electrolytics is their performance over temperature. While the LM2931-N is
designed to operate to −40°C, the same is not always true with all electrolytics (hot is generally not a problem).
The electrolyte in many aluminum types will freeze around −30°C, reducing their effective value to zero. Since
the capacitance is needed for regulator stability, the natural result is oscillation (and lots of it) at the regulator
output. For all application circuits where cold operation is necessary, the output capacitor must be rated to
operate at the minimum temperature. By coincidence, worst-case stability for the LM2931-N also occurs at
minimum temperatures. As a result, in applications where the regulator junction temperature will never be less
than 25°C, the output capacitor can be reduced approximately by a factor of two over the value needed for the
entire temperature range. To continue our example with the tantalum electrolytic, a value of only 22μF would
probably thus suffice. For high-quality aluminum, 47μF would be adequate in such an application.
Another regulator characteristic that is noteworthy is that stability decreases with higher output currents. This
sensible fact has important connotations. In many applications, the LM2931-N is operated at only a few milliamps
of output current or less. In such a circuit, the output capacitor can be further reduced in value. As a rough
estimation, a circuit that is required to deliver a maximum of 10mA of output current from the regulator would
need an output capacitor of only half the value compared to the same regulator required to deliver the full output
current of 100mA. If the example of the tantalum capacitor in the circuit rated at 25°C junction temperature and
above were continued to include a maximum of 10mA of output current, then the 22μF output capacitor could be
reduced to only 10μF.
In the case of the LM2931CT adjustable regulator, the minimum value of output capacitance is a function of the
output voltage. As a general rule, the value decreases with higher output voltages, since internal loop gain is
reduced.
At this point, the procedure for bench testing the minimum value of an output capacitor in a special application
circuit should be clear. Since worst-case occurs at minimum operating temperatures and maximum operating
currents, the entire circuit, including the electrolytic, should be cooled to the minimum temperature. The input
voltage to the regulator should be maintained at 0.6V above the output to keep internal power dissipation and die
heating to a minimum. Worst-case occurs just after input power is applied and before the die has had a chance
to heat up. Once the minimum value of capacitance has been found for the brand and type of electrolytic in
question, the value should be doubled for actual use to account for production variations both in the capacitor
and the regulator. (All the values in this section and the remainder of the data sheet were determined in this
fashion.)
LM2931-N DSBGA Light Sensitivity
When the LM2931-N DSBGA package is exposed to bright sunlight, normal office fluorescent light, and other
LED's, it operates within the limits specified in the electrical characteristic table.
12
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
LM2931-N
www.ti.com
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
Definition of Terms
Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further
reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value
obtained at 14V input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip temperature is
not significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured
over a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage at
a specified frequency.
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
13
LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision F (April 2013) to Revision G
•
14
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2931-N
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM2931AM-5.0
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
2931A
M-5.0
LM2931AM-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2931A
M-5.0
LM2931AMX-5.0
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
2931A
M-5.0
LM2931AMX-5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2931A
M-5.0
LM2931AS-5.0
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 85
LM2931
AS5.0
LM2931AS-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 85
LM2931
AS5.0
LM2931ASX-5.0
ACTIVE
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
-40 to 85
LM2931
AS5.0
LM2931ASX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 85
LM2931
AS5.0
LM2931AT-5.0
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 85
LM2931
AT5.0
LM2931AT-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 85
LM2931
AT5.0
LM2931AZ-5.0/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SN
Level-1-NA-UNLIM
LM293
1AZ-5
LM2931AZ-5.0/LFT3
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM293
1AZ-5
LM2931AZ-5.0/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM293
1AZ-5
LM2931AZ-5.0/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 85
LM293
1AZ-5
LM2931CM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LM29
31CM
LM2931CM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM29
31CM
LM2931CMX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
LM29
31CM
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM2931CMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM29
31CM
LM2931CS
ACTIVE
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 85
LM2931CS
LM2931CS/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 85
LM2931CS
LM2931CT
ACTIVE
TO-220
KC
5
45
TBD
Call TI
Call TI
-40 to 85
LM2931CT
LM2931CT/LF03
ACTIVE
TO-220
NDH
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
LM2931CT
LM2931CT/LF04
ACTIVE
TO-220
NEB
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
LM2931CT
LM2931CT/NOPB
ACTIVE
TO-220
KC
5
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 85
LM2931CT
LM2931M-5.0
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
2931
M-5.0
LM2931M-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2931
M-5.0
LM2931MX-5.0
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
2931
M-5.0
LM2931MX-5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2931
M-5.0
LM2931S-5.0
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 85
LM2931S
5.0
LM2931S-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 85
LM2931S
5.0
LM2931T-5.0
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 85
LM2931T
5.0
LM2931T-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 85
LM2931T
5.0
LM2931Z-5.0/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SN
Level-1-NA-UNLIM
LM293
1Z-5
LM2931Z-5.0/LFT2
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SN
Level-1-NA-UNLIM
LM293
1Z-5
LM2931Z-5.0/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
Addendum-Page 2
-40 to 85
LM293
1Z-5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM2931AMX-5.0
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
D
8
2500
330.0
12.4
6.5
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
5.4
2.0
8.0
12.0
Q1
LM2931AMX-5.0/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2931ASX-5.0
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2931ASX-5.0/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2931CMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2931CMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2931MX-5.0
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2931MX-5.0/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2931AMX-5.0
SOIC
D
8
2500
367.0
367.0
35.0
LM2931AMX-5.0/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2931ASX-5.0
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2931ASX-5.0/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2931CMX
SOIC
D
8
2500
367.0
367.0
35.0
LM2931CMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2931MX-5.0
SOIC
D
8
2500
367.0
367.0
35.0
LM2931MX-5.0/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
MECHANICAL DATA
NEB0005F
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated