CD4148WP SMALL SIGNAL SWITCHING DIODE FEATURES Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 0805 & 0603 Leadfree and RoHS compliance components MECHANICAL CHARACTERISTICS Size: 1206 Weight: approx. 10mg Marking: Cathode terminal DIMENSIONS Dimension/mm 1206 L W T C 3.2±0.2 1.5±0.2 0.85±0.1 0.55±0.2 THERMAL CHARACTERISTICS1) Parameter at Tamb=25oC1) Symbol Forward Power Dissipation Power derating above 25oC Ptot Junction Temperature Thermal Resistance Junction to Ambient air Operating& Storage Temperature range Tj RθJA Tstg 1) Valid provided that electrodes are kept at ambient temperature. www.shunyegroup.com.cn Value Unit 400 mW 3.2 mW/ oC 150 375 -55 to 150 o C C/W o C o MAXIMUM RATING1) Parameter at Tamb=25oC1) Symbol Value Unit VRRM 75 V IF(AV) 150 mA IFRM 300 mA 500 mA 1000 mA Value Unit 1.0 MAX 1.25 MAX 0.025 MAX 5 MAX 4 MAX 4 MAX V V uA uA pF ns Repetitive Peak Reverse Voltage Average rectified current sin half wave rectification with resistive load Repetitive Peak Forward Current at Tamb=25°C Non-Repetitive Surge Forward Current at t<1s and Tj=25oC at t≦8.3ms and Tj=25oC IFSM 1) Valid provided that electrodes are kept at ambient temperature. ELECTRICAL CHARACTERISTICS1) Parameter at Tamb=25oC1) Symbol Forward Voltage at IF=10mA at IF=100mA Leakage Current at VR=20V Leakage Current at VR=75V Capacitance at VR=0V, f=1MHz Reverse Recovery Time at IF =IR=10mA,RL=100Ω VF IR Ctot trr 1) Valid provided that electrodes are kept at ambient temperature. TYPICAL CHARACTERISTICS Figure 1. Forward Characteristic Figure 2. Power De-rating 500 300 Dissipation/ mW Ptot-Admissible Power 400 200 100 0 0 20 40 60 80 100 120 140 160 180 200 Tamb-Ambient Temperature/oC www.shunyegroup.com.cn Figure 3. Forward Current De-rating Figure 4. Reverse Voltage De-rating 500 200 400 150 100 . VR/ V 200 . IF/ mA 300 50 100 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 Tamb-Ambient Temperature/oC 40 60 80 100 120 140 160 180 200 Tamb-Ambient Temperature/oC TEST CHARACTERISTICS Test Item Test Condition Requirement Solderability Sn bath at 245±5oC for 2±0.5s >95% area tin covered Resistance to Soldering Heat Sn bath at 260±5oC for 10±2s VF,VR & IR within spec; no mechanical damage Humidity Steady State At 85oC 85%RH for 168hrs VF,VR & IR within spec Continue Forward Operating Life At 25oC IF =1.1IF for 1000hrs VF,VR & IR within spec o o Thermal Shock -55 ±5 C/5min to 150±5 C/5min for 10cycles VF,VR & IR within spec Bending Strength Bending up to 2mm for 1cycle VF,VR & IR within spec; no mechanical damage www.shunyegroup.com.cn APPLICATIONS Function: Fast switching, suit for small signal switching application Soldering Condition: Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2) Recommended Profile Condition Ramp-up rate (from pre-heat stage) Pre-heat Temperature & Time Soldering Temperature & Time Peak Temperature Time within 5oC of peak temperature Ramp-down rate Time 25oC to peak temperature Sn-Pb Soldering <3oC/s 100-150 oC 60-120s 183 oC 60-150s 230±5oC <260oC 10-20s <6oC/s <6min Leadfree Soldering <3oC/s 150-200 oC 60-120s 217 oC 60-150s 245±5oC <260oC 20-30s <6oC/s <8min Wave Soldering △T<150oC 100-150 oC 60-120s 260±5oC 5±2s 260±5oC <6oC/s - Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body Recommended Soldering Profile o T/ C t/s Fig1: Reflow soldering profile for lead-free solder (SnAgCu) www.shunyegroup.com.cn o T/ C t/s Fig2: Wave soldering profile *1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58 *2. Chip diodes are able to stand maximum soldering temperature up to 260oC max for 10s, and the soldering cycles with max 3 times, referring to IEC-60068-2-58 ■ Recommended Soldering Footprint: Reflow/Wave Soldering Product Size 1206 Dimension/ mm A B C D 3.8-4.6 2.2 0.8-1.2 1.5-1.7 www.shunyegroup.com.cn Storage Condition: Product termination solderability can degrade due to high temperature and humidity or chemical environment. Storage condition must be in an ambient temperature of <40oC and ambient humidity of <75%RH, and free from chemical. ENVIRONMENTAL CHARACTERISTICS Hazardous Substance or Element/ppm Product Product Pb Cd Hg Cr6+ PBB PBDE <1000 <100 <1000 <1000 <1000 <1000 Halogen Substance/ ppm Cl Br I F <900 <900 <900 <900 PACKING METHOD Product Quality/Reel Reel Size Tape 5,000pcs 7” Paper www.shunyegroup.com.cn Total <1500