Allegro A1262LLHLT-X-T 2d, dual-channel, ultrasensitive hall-effect latch Datasheet

A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
FEATURES AND BENEFITS
DESCRIPTION
• 2D magnetic sensing via planar and vertical Hall elements
• Phase separation between the two channels is inherently 90°
• Dual-channel output allows independent use of Z-axis
planar Hall in conjunction with vertical Hall:
□□ Y-axis (default option)
□□ X-axis (with -X option)
• High sensitivity, BOP typically 17 G
• Automotive grade
□□ AEC-Q100 qualified for use in automotive applications
□□ Output short-circuit protection
□□ Resistant to physical stress
□□ Reverse-battery protection
□□ Solid-state reliability
□□ Superior temperature stability
□□ Supply voltage Zener clamp
• Small size
The A1262 integrated circuit is an ultrasensitive Hall-effect
latch. It features operation with traditional planar magnetic field
direction as well as vertical. The dual operation of the planar
and vertical Hall elements allows the end user to achieve 90°
of phase separation that is inherently independent of magnetic
pole spacing. The quadrature outputs of the A1262 allow
rotation direction to be determined, such as when sensing a
rotating ring-magnet target.
PACKAGES:
The A1262 is available in two options that allow flexibility in
end-system magnetic design. Both options feature a planar Hall
plate that is sensitive to magnetic fields perpendicular to the
face of the package (Z). The primary option features a vertical
Hall plate that is sensitive to magnetic fields parallel with the
face of the package across the leaded edges of the package (Y).
The -X option features a vertical Hall plate that is sensitive to
magnetic fields parallel with the face of the package across
the leadless edges of the package (X), resulting in lower total
effective air gap.
On a single silicon chip, the device includes: two Hall plates (one
planar and one vertical), a multiplexer, a small-signal amplifier,
chopper stabilization, a Schmitt trigger, and two short-circuit
protected NMOS output transistors to sink up to 20 mA. The
A1262 features circuitry that provides automotive ruggedness
and allows operation from 4 to 24 V over a temperature range
5-Pin SOT23W (Suffix LH)
Continued on the next page…
Not to scale
VDD
Regulator
To All
Subcircuits
OUTPUTA
Z Hall
Low-Pass
Filter
Amp
Sample, Hold
& Averaging
Demultiplexer
X/Y Hall
Dynamic Offset
Cancellation &
Multiplexer
Current
Limit
OUTPUTB
Current
Limit
GND
Functional Block Diagram
A1262-DS, Rev. 1
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
Description (continued)
of –40°C to 85°C (E temperature range option) or –40°C to 150°C
(K temperature range option).
The A1262 is available in a 5-pin SOT23W surface-mount package,
magnetically optimized for a variety of orientations. The package is
RoHS compliant and lead (Pb) free, with 100% matte-tin leadframe
plating.
The small geometries of the BiCMOS process allow these devices
to be offered in an ultrasmall package suitable for most applications.
SPECIFICATIONS
Selection Guide
Part Number
A1262ELHLT-T
A1262ELHLX-T
A1262LLHLT-T
A1262LLHLX-T
A1262ELHLT-X-T*
A1262ELHLX-X-T*
A1262LLHLT-X-T*
A1262LLHLX-X-T*
Packing
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
7-in. reel, 3000 pieces/reel
13-in. reel, 10000 pieces/reel
Package
5-pin SOT-23W surface mount
5-pin SOT-23W surface mount
5-pin SOT-23W surface mount
5-pin SOT-23W surface mount
5-pin SOT-23W surface mount
5-pin SOT-23W surface mount
5-pin SOT-23W surface mount
5-pin SOT-23W surface mount
RoHS
COMPLIANT
Temperature Range, TA (°C)
Description
–40 to 85
2 Outputs of Y and Z
–40 to 150
–40 to 85
2 Outputs of X and Z
–40 to 150
* Contact Allegro regarding availability.
Terminal List Table
4
OUTPUTA
2
3
Number
GND
Symbol
1
VDD
2
OUTPUTA
3
OUTPUTB
4
GND
Ground
5
GND
Ground
GND
OUTPUTB
Description
Connects power supply to chip
Output of Z magnetic field direction1
Default option: Output of Y magnetic field direction
With -X option: Output of X magnetic field direction
Z-axis recommended for use as the speed channel in a speed and direction application,
due to better repeatability.
1
Package LH, 5-Pin SOT23W Pinout
ΔZ
ΔZ
Y
Δ
Y
Δ
1
1
Δ
X
5
X
1
Δ
VDD
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
Absolute Maximum Ratings
Characteristic
Symbol
Notes
Rating
Unit
26.5
V
Forward Supply Voltage
VDD
Reverse Supply Voltage
VRDD
–16
V
B
Unlimited
G
VOUT
26.5
V
Magnetic Flux Density
Output Off Voltage
Output Sink Current
IOUT(Sink)
Internally Limited
mA
Range E
–40 to 85
°C
Range L
Operating Ambient Temperature
TA
–40 to 150
°C
Maximum Junction Temperature2
TJ(MAX)
165
°C
Tstg
–65 to 170
°C
Storage Temperature
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Characteristic
Symbol
Package Thermal Resistance
Notes
RθJA
Package LH-5 4-layer board based on the JEDEC standard
Rating
Unit
124
°C/W
Power Dissipation, PD (mW)
* Additional thermal information available on the Allegro website.
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
4-L
ay
er
P
(R CB,
θJ
P
A=
12 ack
4ºC ag
/W e LH
)
-5
20
40
60
80
100
120
140
160
180
Temperature (°C)
Maximum Power Dissipation versus Ambient Temperature
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
ELECTRICAL CHARACTERISTICS: Valid over full operating voltage and ambient temperature ranges, unless otherwise specified.
Characteristics
Supply Voltage
Symbol
VDD
Output Leakage Current
Output On Voltage
IOUTOFF
VOUT(SAT)
Supply Current
IDD
Reverse-Battery Current
IRDD
Supply Zener Clamp Voltage
VZ
Test Conditions
Min.
Typ.1
Max.
Unit
Operating, TJ < 165°C
4
–
24
V
B < BRP
–
–
10
µA
IOUT = 20 mA, B > BOP
–
180
500
mV
–
3
7.5
mA
VRDD = –16 V
–
–
–5
mA
ICC = 5 mA; TA = 25°C
28
34
–
V
–
–
20
mA
–
60
mA
Output Sink Current
IOUTPUT(SINK)
Output Sink Current, Continuous
IOUTPUT(SINK)C
TJ < TJ(max), VOUT = 12 V
30
Output Sink Current, Peak
IOUTPUT(SINK)P
t < 3 seconds
–
–
110
mA
–
800
–
kHz
Chopping Frequency
fC
Output Rise Time 2,3
tr
RL = 820 Ω, CS = 20 pF
–
0.2
–
µs
Output Fall Time 2,3
tf
RL = 820 Ω, CS = 20 pF
–
0.1
–
µs
Both channels
–
32
48
µs
Power-On Time
2
Power-On State
1
2
3
tON
POS
Low
Typical data are at TA = 25°C and VDD = 4 V, and are for initial design estimations only.
Power-on time, rise time, and fall time are guaranteed through device characterization.
CS = oscilloscope probe capacitance.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
MAGNETIC CHARACTERISTICS: Valid over full operating voltage and temperature ranges, unless otherwise specified.
Characteristics
Operate Point 5
Release Point
5
Hysteresis
Symbol
Test Conditions
BOP
BRP
BHYS
BOP – BRP
Min.
Typ.
Max.
Unit 4
1
17
40
G
–40
–17
–1
G
15
34
68
G
Symmetry: Channel A, Channel B,
BOP(A) + BRP(A), BOP(B) + BRP(B)
BSYM(A),
BSYM(B)
–35
–
35
G
Operate Symmetry: BOP(A) – BOP(B)
BSYM(AB,OP)
–25
–
25
G
Release Symmetry: BRP(A) – BRP(B)
BSYM(AB,RP)
–25
–
25
G
41
G (gauss) = 0.1 mT (millitesla)
5 Applicable to all directions (X/Y and Z).
N
S
N
N
S
Y
X
S
Z
The A1262 output is turned on when presented with a south polarity magnetic field beyond BOP in the orientations illustrated above.
The X-axis field response is only applicable to the -X option; the Y-axis field response is only applicable to the default option.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
CHARACTERISTIC DATA
Average Supply Current vs. Supply Voltage
8
8
7
7
6
4V
5
24 V
4
3
2
1
0
Supply Current, IDD (mA)
Supply Current, IDD (mA)
Average Supply Current vs. Ambient Temperature
-40°C
6
25°C
5
150°C
4
3
2
1
0
-60
-40
-20
0
20
40
60
80
100 120 140 160
2
6
10
Ambient Temperature, TA (°C)
VOUT(SAT)-B
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
Output Leakage Current, IOUTOFF (µA)
Output On Voltage, VOUT(SAT) (mV)
VOUT(SAT)-A
-60 -40 -20
Avg. OUTPUTA Operate Point vs. Ambient
Temperature
30
25
20
4V
24 V
5
26
0
10
8
IOUT(OFF)-A
6
IOUT(OFF)-B
4
2
0
-60
-40
-20
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
40
Operate Point, BOP (G)
Operate Point, BOP (G)
35
10
22
Avg. OUTPUTA Operate Point vs. Supply Voltage
40
15
18
Avg. Output Leakage Current vs. Ambient
Temperature
Avg. Output On Voltage vs. Ambient Temperature
500
450
400
350
300
250
200
150
100
50
0
14
Supply Voltage, VDD (V)
35
-40°C
30
25°C
25
150°C
20
15
10
5
0
-60
-40
-20
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
2
6
10
14
18
22
26
Supply Voltage, VDD (V)
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
CHARACTERISTIC DATA (continued)
Avg. OUTPUTB Operate Point vs. Ambient
Temperature
Avg. OUTPUTB Operate Point vs. Supply Voltage
40
35
30
25
20
15
4V
10
24 V
5
Operate Point, BOP (G)
Operate Point, BOP (G)
40
0
-60
-40
-20
0
20
40
60
80
35
25°C
25
150°C
20
15
10
5
0
100 120 140 160
2
Ambient Temperature, TA (°C)
6
14
18
22
26
Avg. OUTPUTA Release Point vs. Supply Voltage
0
0
-5
-10
-15
-20
-25
4V
-30
24 V
-35
Release Point, BRP (G)
-5
-40
-10
-15
-20
-25
-40°C
-30
25°C
-35
150°C
-40
-60
-40
-20
0
20
40
60
80
100 120 140 160
2
6
Ambient Temperature, TA (°C)
10
14
18
22
26
Supply Voltage, VDD (V)
Avg. OUTPUTB Release Point vs. Supply Voltage
Avg. OUTPUTB Release Point vs. Ambient
Temperature
0
0
-5
-5
-10
-15
-20
-25
4V
-30
24 V
-35
Release Point, BRP (G)
Release Point, BRP (G)
10
Supply Voltage, VDD (V)
Avg. OUTPUTA Release Point vs. Ambient
Temperature
Release Point, BRP (G)
-40°C
30
-10
-15
-20
-25
-40°C
-30
25°C
-35
150°C
-40
-40
-60
-40
-20
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
2
6
10
14
18
22
26
Supply Voltage, VDD (V)
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
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A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
CHARACTERISTIC DATA (continued)
Avg. OUTPUTA Hysteresis vs. Ambient
Temperature
Avg. OUTPUTA Hysteresis vs. Supply Voltage
70
60
4V
50
24 V
40
30
20
10
Hysteresis, BHYS (G)
Hysteresis, BHYS (G)
70
-40°C
60
25°C
50
150°C
40
30
20
10
-60
-40
-20
0
20
40
60
80
100 120 140 160
2
6
10
Ambient Temperature, TA (°C)
Avg. OUTPUTB Hysteresis vs. Ambient
Temperature
40
30
Hysteresis, BHYS (G)
Hysteresis, BHYS (G)
24 V
20
10
26
-40°C
60
25°C
50
150°C
40
30
20
10
-60
-40
-20
0
20
40
60
80
100 120 140 160
2
6
10
Ambient Temperature, TA (°C)
14
18
22
26
Supply Voltage, VDD (V)
Avg. BOP(A)+BRP(A) Symmetry vs. Ambient
Temperature
Avg. BOP(B)+BRP(B) Symmetry vs. Ambient
Temperature
15
10
4V
5
24 V
0
-5
-10
-15
Symmetry, BSYM(B) (G)
15
Symmetry, BSYM(A) (G)
22
70
4V
50
18
Avg. OUTPUTB Hysteresis vs. Supply Voltage
70
60
14
Supply Voltage, VDD (V)
10
4V
5
24 V
0
-5
-10
-15
-60
-40
-20
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
-60
-40
-20
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
CHARACTERISTIC DATA (continued)
Avg. BOP(A)–BOP(B) Symmetry vs. Ambient
Temperature
Avg. BRP(A)–BRP(B) Symmetry vs. Ambient
Temperature
15
10
4V
5
24 V
0
-5
-10
-15
Symmetry, BSYM(AB,RP) (G)
Symmetry, BSYM(AB,OP) (G)
15
10
4V
5
24 V
0
-5
-10
-15
-60
-40
-20
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
-60
-40
-20
0
20
40
60
80
100 120 140 160
Ambient Temperature, TA (°C)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
FUNCTIONAL DESCRIPTION
Operation
V+
This built-in hysteresis allows clean switching of the output even
in the presence of external mechanical vibration and electrical
noise. The device will power-on in the low output state, even
when powering-on in the hysteresis region, between BOP and BRP.
Unlike dual-planar Hall-effect sensors, which have two planar
Hall-effect sensing elements spaced apart across the width of the
package, both the vertical and planar sensing elements on the
A1262 are located in essentially the same location on the IC.
Switch to High
VOUTPUT
B-
BRP
VOUT(ON)
0
BOP
Removal of the magnetic field will leave the device output
latched on if the last crossed switchpoint is BOP, or latched off if
the last crossed switchpoint is BRP.
VOUT(OFF)
Switch to Low
The outputs of the A1262 switch low (turn on) when the corresponding Hall element is presented with a perpendicular south
magnetic field of sufficient strength. OUTPUTA switches low if
the Z-axis direction exceeds the operate point (BOP), and OUTPUTB switches low if the Y-axis direction (A1262 with default
option) or X-axis direction (A1262 with -X option) exceeds BOP.
After turn-on, the output voltage is VOUT(SAT). The device outputs
switch high (turn off) when the strength of a perpendicular north
magnetic field exceeds the release point (BRP). The difference in
the magnetic operate and release points is the hysteresis (BHYS)
of the device. See Figure 1.
B+
BHYS
Figure 1: Switching Behavior of Latches
On the horizontal axis, the B+ direction indicates increasing
south polarity magnetic field strength, and the B– direction
indicates decreasing south polarity field strength (including
the case of increasing north polarity
With dual-planar Hall sensors, the ring magnet must be properly
designed and optimized for the physical Hall spacing (distance)
in order to have the outputs of the two latches to be in quadrature, or 90 degrees out of phase. With the A1262, which uses one
planar and one vertical Hall-effect sensing element, no target
optimization is required. When the face of the IC is facing the
ring magnet, the planar Hall senses the magnet poles and the
vertical Hall senses the transition between poles, therefore the
Dual-Planar
Sensor
A1262
Figure 2: Ring magnet optimized for a dual-planar Hall-effect sensor resulting in output
quadrature also results in quadrature for the A1262.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
two channels will inherently be in quadrature, irrespective of the
ring-magnet pole spacing.
Figure 2 above shows a ring magnet optimized for the E1-to-E2
spacing of a dual-planar sensor, resulting in quadrature, or 90
degrees phase separation between channels. This same target
also results in quadrature for the 2D sensing A1262. However
when a different ring magnet is used which is not optimized for
the E1-to-E2 spacing, the dual-planar sensor exhibits diminished
phase separation, making signal processing the outputs into speed
and direction less robust. Using a different ring-magnet geometry has no effect on the A1262, and the two channels remain in
quadrature (see Figure 3 below).
The relationship of the various signals and the typical system timing is shown in Figure 4.
Dual-Planar
Sensor
A1262
Figure 3: Ring magnet not optimized for a dual-planar Hall-effect sensor resulting in significantly reduced output phase separation, however still results in quadrature for the A1262.
Figure 4: Typical System Timing
The Planar (P) and Vertical (V) signals represent the magnetic input signal, which is converted to the device outputs,
OUTPUTA and OUTPUTB, respectively. While the A1262 does not process the signals into Speed and Direction, these
could be determined by the user based on the individual output signals.
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
A1262 Sensor and Relationship to Target
Power-On Sequence and Timing
The A1262 is available in two sensing options: with Z-axis planar
Hall and the Y-axis vertical Hall active (default option), or with
the Z-axis planar Hall and the X-axis vertical Hall active (-X
option). This offers incredible flexibility for positioning the IC
within various applications.
The states of OUTPUTA and OUTPUT B are only valid when the
supply voltage is within the specified operating range (VDD(MIN)
≤ VDD ≤ VDD(MAX)) and the power-on time has elapsed (t > tON).
Refer to Figure 7: Power-On Sequence and Timing for an illustration of the power-on sequence.
The Z-Y option supports the traditional configuration with the
face of the package facing the ring magnet (Figure 5a), with the
axis of rotation going cross the leads, or with the either of the
leaded sides of the package facing the ring magnet (Figure 5b).
V
VOUT(OFF)
Planar
(Z)
Output Undefined for
VDD < VDD(MIN)
VOUT(ON)
0
POS
V
Output Responds According
to Magnetic Field Input
B > BOP or B < BRP
t > tON(MAX)
time
VOUT(OFF)
Vertical
(X/Y)
Output Undefined for
VDD < VDD(MIN)
VOUT(ON)
0
POS
Output Responds According
to Magnetic Field Input
B > BOP or B < BRP
t > tON(MAX)
time
V
VDD(MIN)
Figure 5a
Figure 5b
The Z-X option supports having the IC positioned with the face
of the package facing the ring magnet, and the axis of rotation
(Figure 6a) lengthwise along the package body, or with either of
the non-leaded sides of the package facing the ring magnet (Figure 6b). This latter configuration has the advantage of being able
to be mounted extremely close to the ring magnet, since there are
no leads or solder pads to accommodate for in that dimension.
Figure 6a
VDD
0
t ON
time
Figure 7: Power-On Sequence and Timing
Once the supply voltage is within the operational range, the
outputs will be in the low state (power-on state), irrespective of
the magnetic field. The outputs will remain low until the sensor
is fully powered on (t > tON), at which point, both outputs will
respond to the corresponding magnetic field presented to the sensor (the vertical Hall channel typically responds before the planar
Hall channel).
Figure 6b
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115 Northeast Cutoff
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12
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
Applications
It is strongly recommended that an external capacitor be connected (in close proximity to the Hall sensor) between the supply
and ground of the device to reduce both external noise and noise
generated by the chopper stabilization technique. As shown in
Figure 8, a 0.1 µF capacitor is typical.
VS
VDD
CBYP
0.1 µF
A1262
RLOAD
RLOAD
OUTPUTA
OUTPUTB
Sensor
Outputs
GND
GND
Figure 8: Typical Application Circuit
Extensive applications information on magnets and Hall-effect
sensors is available in:
• Hall-Effect IC Applications Guide, AN27701,
• Hall-Effect Devices: Guidelines for Designing Subassemblies
Using Hall-Effect Devices AN27703.1
• Soldering Methods for Allegro’s Products – SMD and
Through-Hole, AN26009
All are provided on the Allegro website:
www.allegromicro.com
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
13
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
Chopper Stabilization Technique
When using Hall-effect technology, a limiting factor for switchpoint accuracy is the small signal voltage developed across the
Hall element. This voltage is disproportionally small relative to
the offset that can be produced at the output of the Hall sensor.
This makes it difficult to process the signal while maintaining an
accurate, reliable output over the specified operating temperature
and voltage ranges.
Chopper stabilization is a proven approach used to minimize
Hall offset on the chip. The patented Allegro technique, namely
Dynamic Quadrature Offset Cancellation, removes key sources
of output drift induced by thermal and mechanical stresses. This
technique is based on a signal modulation-demodulation process.
The undesired offset signal is separated from the magnetic fieldinduced signal in the frequency domain, through modulation.
The subsequent demodulation acts as a modulation process for
the offset, causing the magnetic field induced signal to recover
its original spectrum at baseband, while the dc offset becomes a
high-frequency signal. The magnetic sourced signal then can pass
through a low-pass filter, while the modulated DC offset is suppressed. This configuration is illustrated in Figure 3.
The chopper stabilization technique uses a 400 kHz highfrequency clock. For demodulation process, a sample, hold, and
averaging technique is used, where the sampling is performed
at twice the chopper frequency (800 kHz). This high-frequency
operation allows a greater sampling rate, which results in higher
accuracy and faster signal-processing capability. This approach
desensitizes the chip to the effects of thermal and mechanical stresses, and produces devices that have extremely stable
quiescent Hall output voltages and precise recoverability after
temperature cycling. This technique is made possible through the
use of a BiCMOS process, which allows the use of low-offset,
low-noise amplifiers in combination with high-density logic and
sample-and-hold circuits.
The repeatability of magnetic field-induced switching is affected
slightly by a chopper technique. However, the Allegro highfrequency chopping approach minimizes the effect of jitter and
makes it imperceptible in most applications. Applications that are
more likely to be sensitive to such degradation are those requiring precise sensing of alternating magnetic fields—for example,
speed sensing of ring-magnet targets. For such applications,
Allegro recommends its digital sensor families with lower sensitivity to jitter. For more information on those devices, contact
your Allegro sales representative.
Multiplexer
VDD
Low-Pass
Filter
Sample, Hold &
Averaging
Amp.
Figure 9: Model of Chopper Stabilization Technique
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
14
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
POWER DERATING
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance (RθJA) is a figure of merit summarizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity (K)
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case (RθJC) is relatively
small component of RθJA. Ambient air temperature (TA) and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ at PD.
A worst-case estimate (PD(max)) represents the maximum allowable power level (VDD(max), IDD(max)), without exceeding TJ(max),
at a selected RθJA and TA.
Example: Reliability for VDD at TA = 150°C, package LH5, using
low-K PCB.
Observe the worst-case ratings for the device, specifically:
RθJA = 124°C/W, TJ(max) = 165°C, VDD(max) = 24 V, and
IDD(max) = 7.5 mA.
Calculate the maximum allowable power level (PD(max)). First,
invert equation 3:
∆Tmax = TJ(max) – TA = 165°C – 150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = ∆Tmax ÷ RθJA = 15°C ÷ 124°C/W = 121 mW
Finally, invert equation 1 with respect to voltage:
PD = VIN × IIN
(1)
VDD(est) = PD(max) ÷ IDD(max)
∆T = PD × RθJA
(2)
VDD(est) = 121 mW ÷ 7.5 mA
TJ = TA + ∆T
(3)
VDD(est) = 16.1 V
For example, given common conditions such as: TA = 25°C,
VDD = 12 V, IDD = 3 mA, and RθJA = 124°C/W for the LH5 package, then:
PD = VDD × IDD = 12 V × 3.0 mA = 36.0 mW
∆T = PD × RθJA = 36.0 mW × 124°C/W = 4.5°C
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤ VDD(est).
Compare VDD(est) to VDD(max). If VDD(est) ≤ VDD(max), then reliable operation between VDD(est) and VDD(max) requires enhanced
RθJA. If VDD(est) ≥ VDD(max), then operation between VDD(est) and
VDD(max) is reliable under these conditions.
TJ = TA + ∆T = 25°C + 4.5°C = 29.5°C
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
15
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
PACKAGE OUTLINE DRAWING
For Reference Only – Not for Tooling Use
(Reference DWG-9069)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.12
2.98
–0.08
+0.020
0.180
–0.053
D
0.11
REF
2.90
4° ±4°
A
5
D1 D
D1 D
+0.10
–0.20
1.91
+0.19
–0.06
D3 D
D D2
1
0.17
D REF
2
D2 D
0.25 MIN
D D3
0.55
REF
D3 D
0.25 BSC
Branded Face
SEATING PLANE
GAUGE PLANE
8X 12°
REF
1.00 ±0.13
D D2
+0.10
0.05
–0.05
0.40 ±0.10
0.95
BSC
D1 D
0.20 MIN
NNN
2.40
1.00
0.70
0.95
B PCB Reference Layout View
C
Standard Branding Reference View
A
Active Area Depth, 0.28 ±0.04
B
Reference land pattern layout; all pads a minimum of 0.20 mm from all adjacent pads;
adjust as necessary to meet application process requirements and PCB layout tolerances
C
Branding Scale and appearance at supplier discretion
D
Hall Elements (D1, D2, and D3), not to scale; D2 and D3 are active in the A1262LLH-T;
D1 and D3 are active in the A1262LLH-X-T
Figure 10: Package LH, 5-Pin SOT23-W
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
16
A1262
2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
Revision History
Number
Date
Description
–
September 21, 2015
Initial release
1
February 10, 2016
Added E temperature range option and magnetic switchpoint symmetry specifications
Copyright ©2016, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
17