ON MC74AC240 Octal buffer/line driver with 3−state output Datasheet

MC74AC240, MC74ACT240
Octal Buffer/Line Driver
with 3−State Outputs
The MC74AC240/74ACT240 is an octal buffer and line driver
designed to be employed as a memory address driver, clock driver and
bus oriented transmitter or receiver which provides improved PC
board density.
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Features
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
•
•
•
PDIP−20
N SUFFIX
CASE 738
Registers
Outputs Source/Sink 24 mA
′ACT240 Has TTL Compatible Inputs
Pb−Free Packages are Available
1
SOIC−20W
DW SUFFIX
CASE 751D
TRUTH TABLE
Inputs
Outputs
OE1
D
(Pins 12, 14, 16, 18)
L
L
H
L
H
X
H
L
Z
NOTE:
1
TSSOP−20
DT SUFFIX
CASE 948E
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
1
SOEIAJ−20
M SUFFIX
CASE 967
TRUTH TABLE
Inputs
Outputs
OE2
D
(Pins 3, 5, 7, 9)
L
L
H
L
H
X
H
L
Z
NOTE:
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
VCC
OE2
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
OE1
GND
Figure 1. Pinout: 20−Lead Packages Conductors
(Top View)
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 8
1
Publication Order Number:
MC74AC240/D
MC74AC240, MC74ACT240
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
VOUT
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
IIN
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
tr, tf
Parameter
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
°C
−40
25
85
°C
Supply Voltage
DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Unit
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
ns/V
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
MC74AC240, MC74ACT240
DC CHARACTERISTICS
74AC
Symbol
Parameter
VCC
(V)
74AC
TA = +25°C
Typ
VIH
VIL
VOH
VOL
TA =−40°C to +85°C
Unit
Conditions
Guaranteed Limits
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
Maximum Low Level
Output Voltage
IOUT = −50 mA
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 mA
V
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
IIN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
IOZ
Maximum
3−State
Current
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
IOLD
IOHD
ICC
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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3
MC74AC240, MC74ACT240
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74AC
Symbol
Parameter
VCC*
TA = +25°C
(V)
CL = 50 pF
74AC
TA = −40°C
to +85°C
Unit
CL = 50 pF
Fig.
No.
Min
Typ
Max
Min
Max
1.5
1.5
6.0
4.5
8.0
6.5
1.0
1.0
9.0
7.0
ns
3−5
tPLH
Propagation Delay
Data to Output
3.3
5.0
tPHL
Propagation Delay
Data to Output
3.3
5.0
1.5
1.5
5.5
4.5
8.0
6.0
1.0
1.0
8.5
6.5
ns
3−5
tPZH
Output Enable Time
3.3
5.0
1.5
1.5
6.0
5.0
10.5
7.0
1.0
1.0
11.0
8.0
ns
3−7
tPZL
Output Enable Time
3.3
5.0
1.5
1.5
7.0
5.5
10.0
8.0
1.0
1.0
11.0
8.5
ns
3−8
tPHZ
Output Disable Time
3.3
5.0
1.5
1.5
7.0
6.5
10.0
9.0
1.0
1.0
10.5
9.5
ns
3−7
tPLZ
Output Disable Time
3.3
5.0
1.5
1.5
7.5
6.5
10.5
9.0
1.0
1.0
11.5
9.5
ns
3−8
* Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74ACT
74ACT
TA = +25°C
TA = −40°C to +85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
Maximum
3−State
Current
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
VOL
IIN
DICCT
IOZ
IOLD
IOHD
ICC
Maximum Low Level
Output Voltage
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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4
V
V
IOUT = −50 mA
*VIN = VIL or VIH
IOH −24 mA
−24 mA
IOUT = 50 mA
MC74AC240, MC74ACT240
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
Parameter
(V)
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay Data to Output
5.0
1.5
6.0
8.5
1.5
9.5
ns
3−5
tPHL
Propagation Delay Data to Output
5.0
1.5
5.5
7.5
1.5
8.5
ns
3−5
tPZH
Output Enable Time
5.0
1.5
7.0
8.5
1.0
9.5
ns
3−7
tPZL
Output Enable Time
5.0
2.0
7.0
9.5
1.5
10.5
ns
3−8
tPHZ
Output Disable Time
5.0
2.0
8.0
9.5
2.0
10.5
ns
3−7
tPLZ
Output Disable Time
5.0
2.5
6.5
10.0
2.0
10.5
ns
3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Value
Parameter
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
45
pF
VCC = 5.0 V
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5
MC74AC240, MC74ACT240
ORDERING INFORMATION
Device
Package
MC74AC240N
PDIP−20
MC74AC240NG
PDIP−20
(Pb−Free)
MC74ACT240N
PDIP−20
MC74ACT240NG
PDIP−20
(Pb−Free)
MC74AC240DW
SOIC−20
MC74AC240DWG
SOIC−20
(Pb−Free)
MC74AC240DWR2
SOIC−20
MC74AC240DWR2G
SOIC−20
(Pb−Free)
MC74ACT240DW
SOIC−20
MC74ACT240DWG
SOIC−20
(Pb−Free)
MC74ACT240DWR2
SOIC−20
MC74ACT240DWR2G
SOIC−20
(Pb−Free)
MC74AC240DTR2
TSSOP−20*
MC74AC240DTR2G
TSSOP−20*
MC74ACT240DTR2
TSSOP−20*
MC74ACT240DTR2G
TSSOP−20*
MC74AC240MEL
SOEIAJ−20
MC74AC240MELG
SOEIAJ−20
(Pb−Free)
MC74ACT240MEL
SOEIAJ−20
MC74ACT240MELG
SOEIAJ−20
(Pb−Free)
Shipping †
18 Units / Rail
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
1000 / Tape & Reel
2500 / Tape & Reel
2000 / Tape & Reel
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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6
MC74AC240, MC74ACT240
MARKING DIAGRAMS
PDIP−20
SOIC−20W
TSSOP−20
20
20
20
20
AC
240
ALYWG
G
AC240
AWLYYWWG
MC74AC240N
AWLYYWWG
SOEIAJ−20
1
74AC240
AWLYWWG
1
1
1
20
20
20
20
ACT
240
ALYWG
G
ACT240
AWLYYWWG
MC74ACT240N
AWLYYWWG
1
1
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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7
74ACT240
AWLYWWG
1
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
−A−
20
11
1
10
B
L
C
−T−
K
SEATING
PLANE
M
N
E
G
F
J
D
20 PL
0.25 (0.010)
20 PL
0.25 (0.010)
M
T A
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
M
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
11
X 45 _
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
A
B
M
D
18X
e
A1
SEATING
PLANE
C
T
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8
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
−U−
L
PIN 1
IDENT
SECTION N−N
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
6.40
6.60
0.252
0.260
B
4.30
4.50
0.169
0.177
−−−
−−− 0.047
C
1.20
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
−W−
H
0.27
0.37
0.011
0.015
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
20
LE
11
Q1
E HE
1
M_
L
10
DETAIL P
Z
D
VIEW P
e
A
c
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.15
0.25
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.006
0.010
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.032
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