<TRANSISTOR ARRAY> M54562FP 8-UNIT 500mA DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE SOURCE TYPE DESCRIPTION PIN CONFIGURATION M54562FP is an eight-circuit output-sourcing darlington transistor array. The circuits are made of PNP and NPN NC transistors. This semiconductor integrated circuit performs high 1 ○ NC 20 IN1→ 2 19 →O1 IN2→ 3 18 →O2 IN3→ 4 17 →O3 IN4→ 5 16 →O4 IN5→ 6 15 →O5 ● With clamping diodes IN6→ 7 14 →O6 ● Driving available with PMOS IC output of 6 ~ 16V or IN7→ 8 13 →O7 IN8→ 9 12 →O8 current driving with extremely low input-current supply. FEATURES ● High breakdown voltage (BVCEO > 50V) INPUT ● High-current driving (Io(max) = –500mA) with TTL output ● Output current-sourcing type Vs 11 10 Package type APPLICATIONS OUTPUT GND 20P2N-A NC : No connection Drives of relays, printers, LEDs, fluorescent display tubes and lamps, and interfaces between MOS-bipolar logic systems CIRCUIT DIAGRAM and relays, solenoids, or small motors. VS FUNCTION 20K The M54562FP each have eight circuits, which are made of input inverters and current-sourcing outputs. 8.5K The outputs are made of PNP transistors and NPN INPUT Darlington transistors. The PNP transistor base current is 7.2K 3K 1.5K constant. A clamping diode is provided between each output OUTPUT and GND. VS and GND are used commonly among the eight GND circuits. The inputs have resistance of 8.5kΩ, and voltage of up to 30V The eight circuits share the VS and GND. is applicable. Output current is 500 mA maximum. Supply The diode, indicated with the dotted line, is parasitic, and cannot be used. Unit :Ω voltage VS is 50V maximum. ABSOLUTE MAXIMUM RATINGS (Unless otherwise noted, Ta = –20 ~ +75°C) Symbol VCEO # VS VI IO IF # VR Pd Topr Tstg Parameter Collector-emitter voltage Supply voltage Input voltage Output current Clamping diode forward current Clamping diode reverse voltage Power dissipation Operating temperature Storage temperature Conditions Output , L Current per circuit output, H Ta = 25℃, when mounted on board # : Unused Input pins must be connected to GND. 2012.May 1 Ratings –0.5 ~ +50 50 –0.5 ~ +30 – 500 – 500 50 1.10 –20 ~ +75 –55 ~ +125 Unit V V V mA mA V W ℃ ℃ <TRANSISTOR ARRAY> M54562FP 8-UNIT 500mA DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE SOURCE TYPE RECOMMENDED OPERATING (Unless otherwise noted, Ta = –20 ~ +75℃) Symbol Parameter VS Supply voltage Output current (Current per 1 circuit when 8 circuits are coming on simultaneously) IO min 0 Limits typ - max 50 0 - –350 0 - –100 Duty Cycle no more than 5% Duty Cycle no more than 30% Unit V mA VIH “H” input voltage 2.4 5.0 30 V VIL “L” input voltage 0 - 0.2 V ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta = -20~+75℃) Symbol Parameter IS(leak) # Supply leak current VCE(sat) Collector-emitter saturation voltage II Input current IS Supply current Clamping diode forward voltage Clamping diode reverse current VF # IR Test conditions VS = 50V, VS = 10V, VS = 10V, VI = 5V VI = 25V VS = 50V, VI = 0.2V VI = 2.4V, IO = -350mA VI = 2.4V, IO = -100mA VI = 5V (all input) IF = -350mA VR = 50V min Limits typ* max — — — — — — — 1.75 1.5 0.48 2.8 5.6 100 2.4 2.0 0.75 4.7 15.0 — -1.2 -2.4 V 100 μA — — Unit μA V mA mA *:The typical values are those measured under ambient temperature (Ta) of 25℃. There is no guarantee that these values are obtained under any conditions. # : Unused Input pins must be connected to GND. SWITCHING CHARACTERISTICS (Unless otherwise noted, Ta = 25℃) Symbol ton toff Parameter Test conditions Turn-on time Turn-off time CL = 15pF(note 1) max — — VS Measured device INPUT 50% 50% OUTPUT PG 50Ω RL OUTPUT CL 50% ton (1) Pulse generator (PG) characteristics: PRR = 1kHz, tw = 10ms, tr = 6ns, tf = 6ns, ZO = 50Ω ,VI = 0 to 2.4V (2) Input-output conditions : RL = 30Ω, VS = 10V (3) Electrostatic capacity CL includes floating capacitance at connections and input capacitance at probes 2012.May Limits typ 110 5200 TIMING DIAGRAM NOTE 1 TEST CIRCUIT INPUT min — — 2 50% toff Unit ns ns <TRANSISTOR ARRAY> M54562FP 8-UNIT 500mA DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE SOURCE TYPE TYPICAL CHARACTERISTICS Output Saturation Voltage Thermal Derating Factor Characteristics Collector Current Characteristics 2.0 -500 Output current IO (mA) Power dissipation Pd (W) VS=10V VI=2.4V 1.5 1.0 0.5 0 0 25 50 75 -400 -300 Ta=75℃ -200 Ta=25℃ -100 0 Ta=-20℃ 100 0 0.5 1.0 1.5 2.0 2.5 Collector saturation voltage VCE(sat) (V) Ambient temperature Ta (℃) Duty-Cycle-Output current Characteristics Duty-Cycle-Output current Characteristics -500 -500 Output current IO (mA) Output current IO (mA) ① -400 -300 ② -200 ③ -100 ④ ⑤ ⑦⑥ ⑧ •The collector current values represent the current per circuit. •Repeated frequency ≥10Hz •The value in the circle represents the value of the simultaneously-operated circuit. •Ta = 25℃ 0 0 20 40 60 -400 -300 ① -200 -100 0 80 100 0 20 80 100 500 -500 Forward bias current IF (mA) VS=20V VS-VO=4V Output current IO (mA) 60 Clamping Diode Characteristics Grounded Emitter Transfer Characteristics -400 -300 Ta=75℃ -200 Ta=25℃ Ta=-20℃ -100 0 0.2 0.4 0.6 0.8 400 300 200 Ta=25℃ Ta=75℃ Ta=-20℃ 100 0 1.0 Input voltage VI (V) 2012.May 40 Duty cycle (%) Duty cycle (%) 0 ② ③ ④⑤ ⑥⑦ ⑧ •The collector current values represent the current per circuit. •Repeated frequency ≥10Hz •The value in the circle represents the value of the simultaneously-operated circuit. •Ta = 75℃ 0 0.5 1.0 1.5 Forward bias voltage VF (V) 3 2.0 <TRANSISTOR ARRAY> M54562FP 8-UNIT 500mA DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE SOURCE TYPE Input Characteristics Input Characteristics 1.0 5 VS=20V 0.6 Input current II (mA) Input current II (mA) VS=20V 0.8 Ta=-20℃ Ta=25℃ 0.4 Ta=75℃ 0.2 0 0 1 2 3 4 Ta=-20℃ 3 Ta=25℃ 2 Ta=75℃ 1 0 5 Input voltage VI (V) 2012.May 4 0 5 10 15 Input voltage VI (V) 4 20 25 <TRANSISTOR ARRAY> M54562FP 8-UNIT 500mA DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE SOURCE TYPE PACKAGE OUTLINE 2012.May 5 <TRANSISTOR ARRAY> M54562FP 8-UNIT 500mA DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE SOURCE TYPE Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials •These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. •Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any thirdparty’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. •All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/). •When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. •Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. •The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. •If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. •Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. © 2012 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. 2012.May 6