Coilcraft LPO2506I-153L Smt power inductor Datasheet

Document 208-1
SMT Power Inductors - LPO2506 Series
• On-board style – 1.65 mm high
• InBoard® style – only 1.19 high
Designer’s Kit C332 contains 3 of all InBoard® styles
Designer’s Kit C333 contains 3 of all On-board styles
Core material Ferrite
Core and winding loss See www.coilcraft.com/coreloss
Terminations RoHS compliant silver-palladium-platinum-glass frit.
Other terminations available at additional cost.
Weight 240 – 260 mg
Ambient temperature –40°C to +85°C with Irms current, +85°C to
+125°C with derated current
Storage temperature Component: –40°C to +125°C.
Packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
Packaging 1000/13″ reel Plastic tape: 12 mm wide, 0.23 mm thick,
8 mm pocket spacing, 1.37 mm pocket depth
PCB washing Only pure water or alcohol recommended
InBoard style
part number1
LPO2506I-472L_
LPO2506I-682L_
LPO2506I-822L_
LPO2506I-103L_
LPO2506I-153L_
LPO2506I-223L_
LPO2506I-333L_
LPO2506I-473L_
LPO2506I-683L_
LPO2506I-104L_
LPO2506I-154L_
LPO2506I-224L_
LPO2506I-334L_
LPO2506I-474L_
LPO2506I-684L_
LPO2506I-105L_
On-board style
part number1
LPO2506O-472L_
LPO2506O-682L_
LPO2506O-822L_
LPO2506O-103L_
LPO2506O-153L_
LPO2506O-223L_
LPO2506O-333L_
LPO2506O-473L_
LPO2506O-683L_
LPO2506O-104L_
LPO2506O-154L_
LPO2506O-224L_
LPO2506O-334L_
LPO2506O-474L_
LPO2506O-684L_
LPO2506O-105L_
L ±20%2
(µH)
4.7
6.8
8.2
10
15
22
33
47
68
100
150
220
330
470
680
1000
1. When ordering, please specify termination and packaging codes:
LPO2506O-105LD
Termination: L = RoHS compliant silver-palladium-platinum-glass frit
Special order: T = RoHS tin-silver-copper (95.5/4/0.5) or
S = non-RoHS tin-lead (63/37).
Packaging: D = 13″ machine-ready reel. EIA-481 embossed plastic
tape (1000 parts per full reel).
B = Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge), use
code letter D instead.
DCR max
(Ohms)
0.145
0.165
0.200
0.240
0.300
0.420
0.550
0.765
1.10
1.60
2.50
3.65
4.65
6.75
9.15
14.20
SRF typ
(MHz)
90
75
65
60
45
35
30
22
20
15
12
10
8.0
6.5
5.5
4.5
Irms4
(A)
1.9
1.7
1.5
1.5
1.3
1.0
0.90
0.70
0.60
0.50
0.40
0.32
0.28
0.24
0.20
0.16
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP
4263B LCR meter or equivalent.
3. DC current at which the inductance drops 10% (typ) from its value
without current.
4. Current that causes a 40°C temperature rise from 25°C ambient.
5. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Specifications subject to change without notice.
Please check our website for latest information.
© Coilcraft, Inc. 2009
Isat3
(A)
1.6
1.3
1.0
1.0
0.90
0.70
0.60
0.50
0.40
0.30
0.25
0.22
0.18
0.14
0.12
0.10
Document 208-1
Revised 10/14/08
Document 208-2
SMT Power Inductors - LPO2506 Series
Typical L vs Frequency
Typical L vs Current
Current Derating
10000
10000
120
110
100
1000 µH
100 µH
100
10 µH
10 µH
10
10
90
80
70
60
50
40
25°C
100 µH
100
Percent of rated Irms
Inductance (µH)
Inductance (µH)
1000 µH
1000
1000
30
20
10
1
1
0.01
0.1
1
10
Frequency (MHz)
0
0.01
1
0.1
On-board Style
-20
0
20
40
0.065 max
1,65
0.061max
1,55
0.360 max
9,14
0.254 max
6,45
Mounting plane:
through board
0.285 max
7,24
0.285
7,24
Recommended
Land Pattern
0.048
1,21
0.285
7,24
0.230
5,84
∅0.284
∅7,21
hole through
board
0.047 max
1,19
0.380 max
9,65
0.030
0,76
Specifications subject to change without notice.
Please check our website for latest information.
© Coilcraft, Inc. 2009
120 140
0.380 max
9,65
InBoard Style
0.205
5,21
100
0.230
5,84
0.030
0,76
0.190
4,83
80
Recommended
Land Pattern
0.048
1,21
0.205
5,21
0.254 max
6,45
0.310 max
7,87
60
Ambient temperature (°C)
103
0.190
4,83
0.285 max
7,24
-40
Dash
number
0.360 max
9,14
0.310 max
7,87
10
Current (A)
Document 208-2
Revised 10/14/08
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