ON MC74LCX139M Dual low−voltage cmos 2−to−4 decoder/demultiplexer with 5v−tolerant input Datasheet

MC74LCX139
Dual Low−Voltage CMOS
2−to−4 Decoder/Demultiplexer
With 5V−Tolerant Inputs
The MC74LCX139 is a high performance, 2−to−4 decoder/
demultiplexer operating from a 2.3 to 3.6 V supply. High impedance
TTL compatible inputs significantly reduce current loading to input
drivers while TTL compatible outputs offer improved switching noise
performance. A VI specification of 5.5 V allows MC74LCX139 inputs
to be safely driven from 5 V devices. The MC74LCX139 is suitable
for memory address decoding and other TTL level bus oriented
applications.
The MC74LCX139 high−speed 2−to−4 decoder/demultiplexer
accepts two binary weighted inputs (A0, A1) and, when enabled,
provides four mutually exclusive active−LOW outputs. The LCX139
features an active low Enable input. All outputs will be HIGH unless
En is LOW. The LCX139 can be used as an 8−output demultiplexer by
using one of the active−LOW Enable inputs as the data input and the
other Enable input as a strobe. The Enable inputs which are not used
must be permanently tied to ground.
Current drive capability is 24 mA at the outputs.
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MARKING
DIAGRAMS
16
SOIC−16
D SUFFIX
CASE 751B
16
1
LCX139
AWLYWW
1
16
16
1
TSSOP−16
DT SUFFIX
CASE 948F
LCX
139
ALYW
Features
•
•
•
•
•
•
1
Designed for 2.3 to 3.6 V VCC Operation
5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
SOEIAJ−16
M SUFFIX
CASE 966
LVTTL Compatible
LVCMOS Compatible
16
74LCX139
ALYW
1
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA
•
• ESD Performance:
•
16
Human Body Model >2000 V
Machine Model >200 V
Pb−Free Packages are Available*
1
A
L, WL
Y
W, WW
=
=
=
=
Assembly Location
Wafer Lot
Year
Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 4
1
Publication Order Number:
MC74LCX139/D
MC74LCX139
Ea
1
16
VCC
A0a
2
15
Eb
3
A1a
14
A0b
X/Y
A1a
3
A0a
2
2
1
Ea
1
EN
2
Y0a
4
13
A1b
Y1a
5
12
Y0b
Y2a
6
11
Y1b
A1b 13
A0b 14
Y3a
7
10
Y2b
Eb 15
GND
8
9
Y3b
1
0
3
Address Inputs
Enable Inputs
Outputs
A0a
A1a
Ea
TRUTH TABLE
Inputs
E
A1
H
L
L
L
L
X
L
L
H
H
Outputs
A0
X
L
H
L
H
Y0
H
L
H
H
H
Y1 Y2
H
H
L
H
H
H
H
H
L
H
6 Y2a
7 Y3a
12 Y0b
Ea
1
DMUX
0
0
G
3
1
1
0
2
3
A1b 13
A0b 14
Eb 15
4 Y0a
5 Y1a
6 Y2a
7 Y3a
12 Y0b
11 Y1b
10 Y2b
9 Y3b
Figure 2. IEC Logic Diagram
ADDRESS
INPUTS
A0n−A1n
En
Y0n−Y3n
A0a
3
2
10 Y2b
9 Y3b
PIN NAMES
Function
A1a
11 Y1b
Figure 1. Pin Assignment
Pins
4 Y0a
5 Y1a
Y3
H
H
H
H
L
ADDRESS
INPUTS
A0b
A1b
2
3
4
Y0a
5 Y1a
6
Y2a
7
Y3a
1
14
12
13
11
10
9
Eb
H = High Voltage Level;
L = Low Voltage Level;
Z = High Impedance State
Y0b
Y1b
Y2b
Y3b
15
Figure 3. Logic Diagram
En
Y0
Y1
A0
Y2
Y3
A1
Figure 4. Expanded Logic Diagram
(1/2 of Device)
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2
ACTIVE−LOW
OUTPUTS
ACTIVE−LOW
OUTPUTS
MC74LCX139
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
Value
Condition
Unit
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
V
−0.5 ≤ VO ≤ VCC + 0.5
Output in HIGH or LOW State. (Note 1)
V
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Operating
Data Retention Only
Min
Typ
Max
Unit
2.0
1.5
2.3 to 3.3
3.6
3.6
V
0
5.5
V
0
VCC
V
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
mA
IOL
LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
mA
TA
Operating Free−Air Temperature
−40
+85
°C
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
0
10
ns/V
(HIGH or LOW State)
ORDERING INFORMATION
Package
Shipping †
MC74LCX139D
SOIC−16
48 Units / Rail
MC74LCX139DR2
SOIC−16
2500 Tape & Reel
MC74LCX139DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LCX139DT
TSSOP−16*
96 Units / Rail
MC74LCX139DTR2
TSSOP−16*
2500 Tape & Reel
MC74LCX139M
SOEIAJ−16
48 Units / Rail
MC74LCX139MEL
SOEIAJ−16
2000 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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3
MC74LCX139
DC ELECTRICAL CHARACTERISTICS
TA = −40°C to +85°C
Symbol
VIH
VIL
VOH
VOL
Characteristic
HIGH Level Input Voltage (Note 2)
LOW Level Input Voltage (Note 2)
HIGH Level Output Voltage
LOW Level Output Voltage
Condition
Min
2.3 V ≤ VCC ≤ 2.7 V
1.7
2.7 V ≤ VCC ≤ 3.6 V
2.0
Max
V
2.3 V ≤ VCC ≤ 2.7 V
0.7
2.7 V ≤ VCC ≤ 3.6 V
0.8
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
VCC − 0.2
VCC = 2.3 V; IOH = −8 mA
1.7
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Unit
V
V
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
VCC = 2.3 V; IOL= 8 mA
0.7
VCC = 2.7 V; IOL= 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
V
II
Input Leakage Current
2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V
±5
mA
ICC
Quiescent Supply Current
2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC
10
mA
2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V
±10
2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V
500
DICC
Increase in ICC per Input
mA
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
Limits
TA= −40°C to +85°C
VCC= 3.0 V to 3.6 V
VCC= 2.7 V
VCC= 2.3 V to 2.7 V
CL= 50 pF
CL= 50 pF
CL= 30pF
Parameter
Min
Max
Min
Max
Min
Max
Unit
tPLH
Propagation Delay
0.8
6.2
1.0
7.3
0.8
9.3
ns
tPHL
A to Y
0.8
6.2
1.0
7.3
0.8
9.3
ns
tPLH
Propagation Delay
0.8
4.7
1.0
5.2
0.8
7.2
ns
tPHL
E to Y
0.8
4.7
1.0
5.2
0.8
7.2
ns
Symbol
tOSHL
Output−to−Output Skew (Note 3)
tOSLH
1.0
ns
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
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4
MC74LCX139
A
VCC
50%
E
GND
50%
tPHL
tPLH
Y
VCC
tPHL
50% VCC
GND
50% VCC
Y
Figure 5. Waveform 1 Prop Delays
tPLH
Figure 6. Waveform 2 Output Enable
VCC
PULSE
GENERATOR
DUT
RT
CL
CL = 50 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 7. Test Circuit
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5
RL
MC74LCX139
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−A−
16
9
1
8
−B−
P
8 PL
0.25 (0.010)
M
B
S
G
R
K
DIM
A
B
C
D
F
G
J
K
M
P
R
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
S
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
S
K
ÉÉ
ÇÇ
ÇÇ
ÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
8
1
N
0.15 (0.006) T U
S
0.25 (0.010)
A
−V−
M
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
D
DETAIL E
G
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6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
−−− 0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC74LCX139
PACKAGE DIMENSIONS
SOEIAJ−16
M SUFFIX
CASE 966−01
ISSUE O
16
LE
9
Q1
M_
E HE
1
8
L
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
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7
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
0_
10 _
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.031
MC74LCX139
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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