Features ■ For use with Model 3682 and 3683 digital pushbutton precision potentiometers H-385 - Panel Seal Assembly Physical Characteristics1 Material (Boot) ........................................................................................... Clear silicone rubber Material (Frame) .............................................................................................Rigid black plastic Expected Life ................................................................................ 100,000 actuations minimum Weight H-385-2 ...............................................................................................Approximately 8.50 gm H-385-3 ...............................................................................................Approximately 9.92 gm H-385 MOUNTING INSTRUCTIONS 1. Cut out and drill panel1 per chart. 2. Install snap-in potentiometer2. 3. Locate silicone boot3 and frame4 over potentiometer and holes. 4. Attach panel seal assembly to panel with two #6 screws (not supplied). Application Data • • • • Protects front of the pot from unwanted entry of rain, dust, grease or oils Transparent for easy viewing of numerals Tear resistant for long life Matte finish black plastic frame to complement most front panels 1 2 3 4 Bourns® Model H-385 Panel Seal Assembly minimizes accidental entry of liquids or foreign matter through the front of the Model 3682 and 3683 Potentiometers. PANEL CUT-OUT/HOLE DIMENSIONS RECOMMENDED HOLE FOR TWO #6 SCREWS (NOT SUPPLIED) 10.54 ± .13 (.415 ± .005) .25 "C" ± (.010) 21.08 ± .25 (.830 ± .010) 41.40 ± .38 (1.63 ± .015) .25 "A" ± (.010) 6.73 ± .13 (.265 ± .005) .25 "B" ± (.010) For Use With Part Number Frame Dimensions “C” 3682 3683 H-385-2 H-385-3 50.60 (1.992) 60.76 (2.392) Panel Cutout/ Hole Dimensions “A” “B” 25.91 (1.020) 36.07 (1.420) 39.37 (1.550) 49.53 (1.950) 1At room ambient: +25 °C nominal and 50 % relative humidity nominal, except as noted. DIMENSIONS: MM (INCHES) REV. 01/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.