ATMEL AT89LS52-16AU 8-bit low-voltage microcontroller with 8k bytes in-system programmable flash Datasheet

Features
• Compatible with MCS®-51 Products
• 8K Bytes of In-System Programmable (ISP) Flash Memory
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– Endurance: 1000 Write/Erase Cycles
2.7V to 4.0V Operating Range
Fully Static Operation: 0 Hz to 16 MHz
Three-level Program Memory Lock
256 x 8-bit Internal RAM
32 Programmable I/O Lines
Three 16-bit Timer/Counters
Eight Interrupt Sources
Full Duplex UART Serial Channel
Low-power Idle and Power-down Modes
Interrupt Recovery from Power-down Mode
Watchdog Timer
Dual Data Pointer
Power-off Flag
Flexible ISP Programming (Byte and Page Modes)
Green (Pb/Halide-free) Packaging Option
1. Description
The AT89LS52 is a low-voltage, high-performance CMOS 8-bit microcontroller with
8K bytes of in-system programmable Flash memory. The device is manufactured
using Atmel’s high-density nonvolatile memory technology and is compatible with the
industry-standard 80C51 instruction set and pinout. The on-chip Flash allows the program memory to be reprogrammed in-system or by a conventional nonvolatile
memory programmer. By combining a versatile 8-bit CPU with in-system programmable Flash on a monolithic chip, the Atmel AT89LS52 is a powerful microcontroller
which provides a highly-flexible and cost-effective solution to many embedded control
applications.
8-bit
Low-Voltage
Microcontroller
with 8K Bytes
In-System
Programmable
Flash
AT89LS52
The AT89LS52 provides the following standard features: 8K bytes of Flash, 256 bytes
of RAM, 32 I/O lines, Watchdog timer, two data pointers, three 16-bit timer/counters, a
six-vector two-level interrupt architecture, a full duplex serial port, on-chip oscillator,
and clock circuitry. In addition, the AT89LS52 is designed with static logic for operation down to zero frequency and supports two software selectable power saving
modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial
port, and interrupt system to continue functioning. The Power-down mode saves the
RAM contents but freezes the oscillator, disabling all other chip functions until the next
external interrupt or hardware reset.
2601B–MICRO–03/05
2. Pin Configurations
2
P1.4
P1.3
P1.2
P1.1 (T2 EX)
P1.0 (T2)
NC
VCC
P0.0 (AD0)
P0.1 (AD1)
P0.2 (AD2)
P0.3 (AD3)
44
43
42
41
40
39
38
37
36
35
34
44-lead TQFP
(T2) P1.0
1
40
VCC
(T2 EX) P1.1
2
39
P0.0 (AD0)
P1.2
3
38
P0.1 (AD1)
P1.3
4
37
P0.2 (AD2)
P1.4
5
36
P0.3 (AD3)
(MOSI) P1.5
1
33
P0.4 (AD4)
(MOSI) P1.5
6
35
P0.4 (AD4)
(MISO) P1.6
2
32
P0.5 (AD5)
(MISO) P1.6
7
34
P0.5 (AD5)
(SCK) P1.7
3
31
P0.6 (AD6)
RST
4
30
P0.7 (AD7)
(RXD) P3.0
5
29
EA/VPP
NC
6
28
NC
PSEN
(INT1) P3.3
9
25
P2.7 (A15)
(T0) P3.4
10
24
P2.6 (A14)
(INT1) P3.3
13
28
P2.7 (A15)
(T1) P3.5
11
23
P2.5 (A13)
(T0) P3.4
14
27
P2.6 (A14)
(T1) P3.5
15
26
P2.5 (A13)
(WR) P3.6
16
25
P2.4 (A12)
(RD) P3.7
17
24
P2.3 (A11)
XTAL2
18
23
P2.2 (A10)
XTAL1
19
22
P2.1 (A9)
GND
20
21
P2.0 (A8)
44-lead PLCC
P1.4
P1.3
P1.2
P1.1 (T2 EX)
P1.0 (T2)
NC
VCC
P0.0 (AD0)
P0.1 (AD1)
P0.2 (AD2)
P0.3 (AD3)
6
5
4
3
2
1
44
43
42
41
40
2.4
14
32
PSEN
(INT1) P3.3
15
31
P2.7 (A15)
(T0) P3.4
16
30
P2.6 (A14)
(T1) P3.5
17
29
P2.5 (A13)
28
ALE/PROG
(INT0) P3.2
(A12) P2.4
33
27
13
(A11) P2.3
NC
(TXD) P3.1
26
34
(A10) P2.2
12
25
EA/VPP
NC
(A9) P2.1
35
24
11
(A8) P2.0
P0.7 (AD7)
(RXD) P3.0
23
36
NC
10
22
P0.6 (AD6)
RST
GND
37
21
9
XTAL1
P0.5 (AD5)
(SCK) P1.7
20
P0.4 (AD4)
38
XTAL2
39
8
19
7
(MISO) P1.6
18
(MOSI) P1.5
22
29
(A12) P2.4
12
21
PSEN
(INT0) P3.2
(A11) P2.3
26
20
8
(A10) P2.2
(INT0) P3.2
19
ALE/PROG
(A9) P2.1
30
18
11
(A8) P2.0
ALE/PROG
(TXD) P3.1
17
27
GND
7
16
(TXD) P3.1
GND
EA/VPP
15
31
XTAL1
10
14
(RXD) P3.0
XTAL2
P0.7 (AD7)
13
P0.6 (AD6)
32
12
33
9
(RD) P3.7
8
RST
(WR) P3.6
(SCK) P1.7
(RD) P3.7
2.2
2.3
40-lead PDIP
(WR) P3.6
2.1
42-lead PDIP
RST
(RXD) P3.0
(TXD) P3.1
(INT0) P3.2
(INT1) P3.3
(T0) P3.4
(T1) P3.5
(WR) P3.6
(RD) P3.7
XTAL2
XTAL1
GND
PWRGND
(A8) P2.0
(A9) P2.1
(A10) P2.2
(A11) P2.3
(A12) P2.4
(A13) P2.5
(A14) P2.6
(A15) P2.7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
P1.7 (SCK)
P1.6 (MISO)
P1.5 (MOSI)
P1.4
P1.3
P1.2
P1.1
P1.0
VDD
PWRVDD
P0.0 (AD0)
P0.1 (AD1)
P0.2 (AD2)
P0.3 (AD3)
P0.4 (AD4)
P0.5 (AD5)
P0.6 (AD6)
P0.7 (AD7)
EA/VPP
ALE/PROG
PSEN
AT89LS52
2601B–MICRO–03/05
AT89LS52
3. Block Diagram
P0.0 - P0.7
P2.0 - P2.7
PORT 0 DRIVERS
PORT 2 DRIVERS
VCC
GND
RAM ADDR.
REGISTER
B
REGISTER
PORT 0
LATCH
RAM
PORT 2
LATCH
FLASH
PROGRAM
ADDRESS
REGISTER
STACK
POINTER
ACC
BUFFER
TMP2
TMP1
PC
INCREMENTER
ALU
INTERRUPT, SERIAL PORT,
AND TIMER BLOCKS
PROGRAM
COUNTER
PSW
PSEN
ALE/PROG
EA / VPP
TIMING
AND
CONTROL
INSTRUCTION
REGISTER
DUAL DPTR
RST
WATCH
DOG
PORT 3
LATCH
PORT 1
LATCH
ISP
PORT
PROGRAM
LOGIC
OSC
PORT 3 DRIVERS
P3.0 - P3.7
PORT 1 DRIVERS
P1.0 - P1.7
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2601B–MICRO–03/05
4. Pin Description
4.1
VCC
Supply voltage.
4.2
GND
Ground.
4.3
Port 0
Port 0 is an 8-bit open drain bi-directional I/O port. As an output port, each pin can sink eight TTL
inputs. When 1s are written to port 0 pins, the pins can be used as high-impedance inputs.
Port 0 can also be configured to be the multiplexed low-order address/data bus during accesses
to external program and data memory. In this mode, P0 has internal pull-ups.
Port 0 also receives the code bytes during Flash programming and outputs the code bytes during program verification. External pull-ups are required during program verification.
4.4
Port 1
Port 1 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 1 output buffers can
sink/source four TTL inputs. When 1s are written to Port 1 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 1 pins that are externally being pulled low
will source current (IIL) because of the internal pull-ups.
In addition, P1.0 and P1.1 can be configured to be the timer/counter 2 external count input
(P1.0/T2) and the timer/counter 2 trigger input (P1.1/T2EX), respectively, as shown in the following table.
Port 1 also receives the low-order address bytes during Flash programming and verification.
4.5
Port Pin
Alternate Functions
P1.0
T2 (external count input to Timer/Counter 2), clock-out
P1.1
T2EX (Timer/Counter 2 capture/reload trigger and direction control)
P1.5
MOSI (used for In-System Programming)
P1.6
MISO (used for In-System Programming)
P1.7
SCK (used for In-System Programming)
Port 2
Port 2 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 2 output buffers can
sink/source four TTL inputs. When 1s are written to Port 2 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 2 pins that are externally being pulled low
will source current (IIL) because of the internal pull-ups.
Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @ DPTR). In this
application, Port 2 uses strong internal pull-ups when emitting 1s. During accesses to external
data memory that use 8-bit addresses (MOVX @ RI), Port 2 emits the contents of the P2 Special
Function Register.
4
AT89LS52
2601B–MICRO–03/05
AT89LS52
Port 2 also receives the high-order address bits and some control signals during Flash programming and verification.
4.6
Port 3
Port 3 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 3 output buffers can
sink/source four TTL inputs. When 1s are written to Port 3 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 3 pins that are externally being pulled low
will source current (IIL) because of the pull-ups.
Port 3 receives some control signals for Flash programming and verification.
Port 3 also serves the functions of various special features of the AT89LS52, as shown in the
following table.
4.7
Port Pin
Alternate Functions
P3.0
RXD (serial input port)
P3.1
TXD (serial output port)
P3.2
INT0 (external interrupt 0)
P3.3
INT1 (external interrupt 1)
P3.4
T0 (timer 0 external input)
P3.5
T1 (timer 1 external input)
P3.6
WR (external data memory write strobe)
P3.7
RD (external data memory read strobe)
RST
Reset input. A high on this pin for two machine cycles while the oscillator is running resets the
device. This pin drives High for 98 oscillator periods after the Watchdog times out. The DISRTO
bit in SFR AUXR (address 8EH) can be used to disable this feature. In the default state of bit
DISRTO, the RESET HIGH out feature is enabled.
4.8
ALE/PROG
Address Latch Enable (ALE) is an output pulse for latching the low byte of the address during
accesses to external memory. This pin is also the program pulse input (PROG) during Flash
programming.
In normal operation, ALE is emitted at a constant rate of 1/6 the oscillator frequency and may be
used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to external data memory.
If desired, ALE operation can be disabled by setting bit 0 of SFR location 8EH. With the bit set,
ALE is active only during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled high.
Setting the ALE-disable bit has no effect if the microcontroller is in external execution mode.
4.9
PSEN
Program Store Enable (PSEN) is the read strobe to external program memory.
When the AT89LS52 is executing code from external program memory, PSEN is activated twice
each machine cycle, except that two PSEN activations are skipped during each access to external data memory.
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2601B–MICRO–03/05
4.10
EA/VPP
External Access Enable. EA must be strapped to GND in order to enable the device to fetch
code from external program memory locations starting at 0000H up to FFFFH. Note, however,
that if lock bit 1 is programmed, EA will be internally latched on reset.
EA should be strapped to VCC for internal program executions.
This pin also receives the 12-volt programming enable voltage (VPP) during Flash programming.
4.11
XTAL1
Input to the inverting oscillator amplifier and input to the internal clock operating circuit.
4.12
XTAL2
Output from the inverting oscillator amplifier.
5. Special Function Registers
A map of the on-chip memory area called the Special Function Register (SFR) space is shown in
Table 5-1.
Note that not all of the addresses are occupied, and unoccupied addresses may not be implemented on the chip. Read accesses to these addresses will in general return random data, and
write accesses will have an indeterminate effect.
User software should not write 1s to these unlisted locations, since they may be used in future
products to invoke new features. In that case, the reset or inactive values of the new bits will
always be 0.
Timer 2 Registers: Control and status bits are contained in registers T2CON (shown in Table 52) and T2MOD (shown in Table 10-2) for Timer 2. The register pair (RCAP2H, RCAP2L) are the
Capture/Reload registers for Timer 2 in 16-bit capture mode or 16-bit auto-reload mode.
Interrupt Registers: The individual interrupt enable bits are in the IE register. Two priorities can
be set for each of the six interrupt sources in the IP register.
6
AT89LS52
2601B–MICRO–03/05
AT89LS52
Table 5-1.
AT89LS52 SFR Map and Reset Values
0F8H
0F0H
0FFH
B
00000000
0F7H
0E8H
0E0H
0EFH
ACC
00000000
0E7H
0D8H
0DFH
0D0H
PSW
00000000
0C8H
T2CON
00000000
0D7H
T2MOD
XXXXXX00
RCAP2L
00000000
RCAP2H
00000000
TL2
00000000
TH2
00000000
0CFH
0C0H
0C7H
0B8H
IP
XX000000
0BFH
0B0H
P3
11111111
0B7H
0A8H
IE
0X000000
0AFH
0A0H
P2
11111111
98H
SCON
00000000
90H
P1
11111111
88H
TCON
00000000
TMOD
00000000
TL0
00000000
TL1
00000000
TH0
00000000
TH1
00000000
80H
P0
11111111
SP
00000111
DP0L
00000000
DP0H
00000000
DP1L
00000000
DP1H
00000000
AUXR1
XXXXXXX0
WDTRST
XXXXXXXX
0A7H
SBUF
XXXXXXXX
9FH
97H
AUXR
XXX00XX0
8FH
PCON
0XXX0000
87H
7
2601B–MICRO–03/05
Table 5-2.
T2CON – Timer/Counter 2 Control Register
T2CON Address = 0C8H
Reset Value = 0000 0000B
Bit Addressable
TF2
EXF2
RCLK
TCLK
EXEN2
TR2
C/T2
CP/RL2
7
6
5
4
3
2
1
0
Bit
Symbol
Function
TF2
Timer 2 overflow flag set by a Timer 2 overflow and must be cleared by software. TF2 will not be set when either RCLK = 1
or TCLK = 1.
EXF2
Timer 2 external flag set when either a capture or reload is caused by a negative transition on T2EX and EXEN2 = 1.
When Timer 2 interrupt is enabled, EXF2 = 1 will cause the CPU to vector to the Timer 2 interrupt routine. EXF2 must be
cleared by software. EXF2 does not cause an interrupt in up/down counter mode (DCEN = 1).
RCLK
Receive clock enable. When set, causes the serial port to use Timer 2 overflow pulses for its receive clock in serial port
Modes 1 and 3. RCLK = 0 causes Timer 1 overflow to be used for the receive clock.
TCLK
Transmit clock enable. When set, causes the serial port to use Timer 2 overflow pulses for its transmit clock in serial port
Modes 1 and 3. TCLK = 0 causes Timer 1 overflows to be used for the transmit clock.
EXEN2
Timer 2 external enable. When set, allows a capture or reload to occur as a result of a negative transition on T2EX if Timer
2 is not being used to clock the serial port. EXEN2 = 0 causes Timer 2 to ignore events at T2EX.
TR2
Start/Stop control for Timer 2. TR2 = 1 starts the timer.
C/T2
Timer or counter select for Timer 2. C/T2 = 0 for timer function. C/T2 = 1 for external event counter (falling edge triggered).
CP/RL2
Capture/Reload select. CP/RL2 = 1 causes captures to occur on negative transitions at T2EX if EXEN2 = 1. CP/RL2 = 0
causes automatic reloads to occur when Timer 2 overflows or negative transitions occur at T2EX when EXEN2 = 1. When
either RCLK or TCLK = 1, this bit is ignored and the timer is forced to auto-reload on Timer 2 overflow.
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AT89LS52
2601B–MICRO–03/05
AT89LS52
Table 5-3.
AUXR: Auxiliary Register
AUXR
Address = 8EH
Reset Value = XXX00XX0B
Not Bit Addressable
Bit
–
–
–
WDIDLE
DISRTO
–
–
DISALE
7
6
5
4
3
2
1
0
–
Reserved for future expansion
DISALE
Disable/Enable ALE
DISRTO
DISALE
Operating Mode
0
ALE is emitted at a constant rate of 1/6 the oscillator frequency
1
ALE is active only during a MOVX or MOVC instruction
Disable/Enable Reset out
DISRTO
WDIDLE
0
Reset pin is driven High after WDT times out
1
Reset pin is input only
Disable/Enable WDT in IDLE mode
WDIDLE
0
WDT continues to count in IDLE mode
1
WDT halts counting in IDLE mode
Dual Data Pointer Registers: To facilitate accessing both internal and external data memory, two banks of 16-bit Data
Pointer Registers are provided: DP0 at SFR address locations 82H-83H and DP1 at 84H-85H. Bit DPS = 0 in SFR AUXR1
selects DP0 and DPS = 1 selects DP1. The user should always initialize the DPS bit to the appropriate value before
accessing the respective Data Pointer Register.
Power Off Flag: The Power Off Flag (POF) is located at bit 4 (PCON.4) in the PCON SFR. POF is set to “1” during power
up. It can be set and rest under software control and is not affected by reset.
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2601B–MICRO–03/05
Table 5-4.
AUXR1: Auxiliary Register 1
AUXR1
Address = A2H
Reset Value = XXXXXXX0B
Not Bit Addressable
Bit
–
–
–
–
–
–
–
DPS
7
6
5
4
3
2
1
0
–
Reserved for future expansion
DPS
Data Pointer Register Select
DPS
0
Selects DPTR Registers DP0L, DP0H
1
Selects DPTR Registers DP1L, DP1H
6. Memory Organization
MCS-51 devices have a separate address space for Program and Data Memory. Up to 64K
bytes each of external Program and Data Memory can be addressed.
6.1
Program Memory
If the EA pin is connected to GND, all program fetches are directed to external memory.
On the AT89LS52, if EA is connected to VCC, program fetches to addresses 0000H through
1FFFH are directed to internal memory and fetches to addresses 2000H through FFFFH are
directed to external memory.
6.2
Data Memory
The AT89LS52 implements 256 bytes of on-chip RAM. The upper 128 bytes occupy a parallel
address space to the Special Function Registers. This means that the upper 128 bytes have the
same addresses as the SFR space but are physically separate from SFR space.
When an instruction accesses an internal location above address 7FH, the address mode used
in the instruction specifies whether the CPU accesses the upper 128 bytes of RAM or the SFR
space. Instructions which use direct addressing access of the SFR space.
For example, the following direct addressing instruction accesses the SFR at location 0A0H
(which is P2).
MOV 0A0H, #data
Instructions that use indirect addressing access the upper 128 bytes of RAM. For example, the
following indirect addressing instruction, where R0 contains 0A0H, accesses the data byte at
address 0A0H, rather than P2 (whose address is 0A0H).
MOV @R0, #data
Note that stack operations are examples of indirect addressing, so the upper 128 bytes of data
RAM are available as stack space.
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AT89LS52
2601B–MICRO–03/05
AT89LS52
7. Watchdog Timer (One-time Enabled with Reset-out)
The WDT is intended as a recovery method in situations where the CPU may be subjected to
software upsets. The WDT consists of a 14-bit counter and the Watchdog Timer Reset
(WDTRST) SFR. The WDT is defaulted to disable from exiting reset. To enable the WDT, a user
must write 01EH and 0E1H in sequence to the WDTRST register (SFR location 0A6H). When
the WDT is enabled, it will increment every machine cycle while the oscillator is running. The
WDT timeout period is dependent on the external clock frequency. There is no way to disable
the WDT except through reset (either hardware reset or WDT overflow reset). When WDT overflows, it will drive an output RESET HIGH pulse at the RST pin.
7.1
Using the WDT
To enable the WDT, a user must write 01EH and 0E1H in sequence to the WDTRST register
(SFR location 0A6H). When the WDT is enabled, the user needs to service it by writing 01EH
and 0E1H to WDTRST to avoid a WDT overflow. The 14-bit counter overflows when it reaches
16383 (3FFFH), and this will reset the device. When the WDT is enabled, it will increment every
machine cycle while the oscillator is running. This means the user must reset the WDT at least
every 16383 machine cycles. To reset the WDT the user must write 01EH and 0E1H to
WDTRST. WDTRST is a write-only register. The WDT counter cannot be read or written. When
WDT overflows, it will generate an output RESET pulse at the RST pin. The RESET pulse duration is 98xTOSC, where TOSC=1/FOSC. To make the best use of the WDT, it should be
serviced in those sections of code that will periodically be executed within the time required to
prevent a WDT reset.
7.2
WDT During Power-down and Idle
In Power-down mode the oscillator stops, which means the WDT also stops. While in Powerdown mode, the user does not need to service the WDT. There are two methods of exiting
Power-down mode: by a hardware reset or via a level-activated external interrupt which is
enabled prior to entering Power-down mode. When Power-down is exited with hardware reset,
servicing the WDT should occur as it normally does whenever the AT89LS52 is reset. Exiting
Power-down with an interrupt is significantly different. The interrupt is held low long enough for
the oscillator to stabilize. When the interrupt is brought high, the interrupt is serviced. To prevent
the WDT from resetting the device while the interrupt pin is held low, the WDT is not started until
the interrupt is pulled high. It is suggested that the WDT be reset during the interrupt service for
the interrupt used to exit Power-down mode.
To ensure that the WDT does not overflow within a few states of exiting Power-down, it is best to
reset the WDT just before entering Power-down mode.
Before going into the IDLE mode, the WDIDLE bit in SFR AUXR is used to determine whether
the WDT continues to count if enabled. The WDT keeps counting during IDLE (WDIDLE bit = 0)
as the default state. To prevent the WDT from resetting the AT89LS52 while in IDLE mode, the
user should always set up a timer that will periodically exit IDLE, service the WDT, and reenter
IDLE mode.
With WDIDLE bit enabled, the WDT will stop to count in IDLE mode and resumes the count
upon exit from IDLE.
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2601B–MICRO–03/05
8. UART
The UART in the AT89LS52 operates the same way as the UART in the AT89C51 and
AT89C52. For further information on the UART operation, please click on the document link
below:
http://www.atmel.com/dyn/resources/prod_documents/DOC4316.PDF
9. Timer 0 and 1
Timer 0 and Timer 1 in the AT89LS52 operate the same way as Timer 0 and Timer 1 in the
AT89C51 and AT89C52. For further information on the timers’ operation, please click on the
document link below:
http://www.atmel.com/dyn/resources/prod_documents/DOC4316.PDF
10. Timer 2
Timer 2 is a 16-bit Timer/Counter that can operate as either a timer or an event counter. The
type of operation is selected by bit C/T2 in the SFR T2CON (shown in Table 5-2). Timer 2 has
three operating modes: capture, auto-reload (up or down counting), and baud rate generator.
The modes are selected by bits in T2CON, as shown in Table 5-2. Timer 2 consists of two 8-bit
registers, TH2 and TL2. In the Timer function, the TL2 register is incremented every machine
cycle. Since a machine cycle consists of 12 oscillator periods, the count rate is 1/12 of the oscillator frequency.
Table 10-1.
Timer 2 Operating Modes
RCLK +TCLK
CP/RL2
TR2
MODE
0
0
1
16-bit Auto-reload
0
1
1
16-bit Capture
1
X
1
Baud Rate Generator
X
X
0
(Off)
In the Counter function, the register is incremented in response to a 1-to-0 transition at its corresponding external input pin, T2. In this function, the external input is sampled during S5P2 of
every machine cycle. When the samples show a high in one cycle and a low in the next cycle,
the count is incremented. The new count value appears in the register during S3P1 of the cycle
following the one in which the transition was detected. Since two machine cycles (24 oscillator
periods) are required to recognize a 1-to-0 transition, the maximum count rate is 1/24 of the
oscillator frequency. To ensure that a given level is sampled at least once before it changes, the
level should be held for at least one full machine cycle.
12
AT89LS52
2601B–MICRO–03/05
AT89LS52
10.1
Capture Mode
In the capture mode, two options are selected by bit EXEN2 in T2CON. If EXEN2 = 0, Timer 2 is
a 16-bit timer or counter which upon overflow sets bit TF2 in T2CON. This bit can then be used
to generate an interrupt. If EXEN2 = 1, Timer 2 performs the same operation, but a 1-to-0 transition at external input T2EX also causes the current value in TH2 and TL2 to be captured into
RCAP2H and RCAP2L, respectively. In addition, the transition at T2EX causes bit EXF2 in
T2CON to be set. The EXF2 bit, like TF2, can generate an interrupt. The capture mode is illustrated in Figure 10-1.
Figure 10-1. Timer in Capture Mode
÷12
OSC
C/T2 = 0
TH2
TL2
TF2
OVERFLOW
CONTROL
TR2
C/T2 = 1
CAPTURE
T2 PIN
RCAP2H RCAP2L
TRANSITION
DETECTOR
TIMER 2
INTERRUPT
T2EX PIN
EXF2
CONTROL
EXEN2
10.2
Auto-reload (Up or Down Counter)
Timer 2 can be programmed to count up or down when configured in its 16-bit auto-reload
mode. This feature is invoked by the DCEN (Down Counter Enable) bit located in the SFR
T2MOD (see Table 10-2). Upon reset, the DCEN bit is set to 0 so that timer 2 will default to
count up. When DCEN is set, Timer 2 can count up or down, depending on the value of the
T2EX pin.
Figure 10-2 shows Timer 2 automatically counting up when DCEN=0. In this mode, two options
are selected by bit EXEN2 in T2CON. If EXEN2 = 0, Timer 2 counts up to 0FFFFH and then sets
the TF2 bit upon overflow. The overflow also causes the timer registers to be reloaded with the
16-bit value in RCAP2H and RCAP2L. The values in Timer in Capture ModeRCAP2H and
RCAP2L are preset by software. If EXEN2 = 1, a 16-bit reload can be triggered either by an
overflow or by a 1-to-0 transition at external input T2EX. This transition also sets the EXF2 bit.
Both the TF2 and EXF2 bits can generate an interrupt if enabled.
Setting the DCEN bit enables Timer 2 to count up or down, as shown in Figure 10-2. In this
mode, the T2EX pin controls the direction of the count. A logic 1 at T2EX makes Timer 2 count
up. The timer will overflow at 0FFFFH and set the TF2 bit. This overflow also causes the 16-bit
value in RCAP2H and RCAP2L to be reloaded into the timer registers, TH2 and TL2,
respectively.
A logic 0 at T2EX makes Timer 2 count down. The timer underflows when TH2 and TL2 equal
the values stored in RCAP2H and RCAP2L. The underflow sets the TF2 bit and causes 0FFFFH
to be reloaded into the timer registers.
The EXF2 bit toggles whenever Timer 2 overflows or underflows and can be used as a 17th bit
of resolution. In this operating mode, EXF2 does not flag an interrupt.
13
2601B–MICRO–03/05
Figure 10-2. Timer 2 Auto Reload Mode (DCEN = 0)
÷12
OSC
C/T2 = 0
TH2
TL2
OVERFLOW
CONTR OL
TR2
C/T2 = 1
RELO AD
T2 PIN
RCAP2H
TIMER 2
INTERRUPT
RCAP2L
TF2
TRANSITION
DETECTOR
EXF2
T2EX PIN
CONTROL
EXEN2
Table 10-2.
T2MOD – Timer 2 Mode Control Register
T2MOD Address = 0C9H
Reset Value = XXXX XX00B
Not Bit Addressable
Bit
–
–
–
–
–
–
T2OE
DCEN
7
6
5
4
3
2
1
0
Symbol
Function
–
Not implemented, reserved for future
T2OE
Timer 2 Output Enable bit
DCEN
When set, this bit allows Timer 2 to be configured as an up/down counter
14
AT89LS52
2601B–MICRO–03/05
AT89LS52
Figure 10-3. Timer 2 Auto Reload Mode (DCEN = 1)
TOGGLE
(DOWN COUNTING RELOAD VALUE)
0FFH
OSC
0FFH
÷ 12
EXF2
OVERFLOW
C/T2 = 0
TH2
TL2
TF2
CONTROL
TR2
TIMER 2
INTERRUPT
C/T2 = 1
T2 PIN
RCAP2H RCAP2L
COUNT
DIRECTION
1=UP
0=DOWN
(UP COUNTING RELOAD VALUE)
T2EX PIN
Figure 10-4. Timer 2 in Baud Rate Generator Mode
TIMER 1 OVERFLOW
÷2
"0"
"1"
NOTE: OSC. FREQ. IS DIVIDED BY 2, NOT 12
SMOD1
OSC
÷2
C/T2 = 0
"1"
TH2
"0"
TL2
RCLK
CONTROL
TR2
÷ 16
Rx
CLOCK
C/T2 = 1
"1"
"0"
T2 PIN
TCLK
RCAP2H RCAP2L
TRANSITION
DETECTOR
÷ 16
T2EX PIN
EXF2
Tx
CLOCK
TIMER 2
INTERRUPT
CONTROL
EXEN2
15
2601B–MICRO–03/05
11. Baud Rate Generator
Timer 2 is selected as the baud rate generator by setting TCLK and/or RCLK in T2CON (Table
5-2). Note that the baud rates for transmit and receive can be different if Timer 2 is used for the
receiver or transmitter and Timer 1 is used for the other function. Setting RCLK and/or TCLK
puts Timer 2 into its baud rate generator mode, as shown in Figure 10-4.
The baud rate generator mode is similar to the auto-reload mode, in that a rollover in TH2
causes the Timer 2 registers to be reloaded with the 16-bit value in registers RCAP2H and
RCAP2L, which are preset by software.
The baud rates in Modes 1 and 3 are determined by Timer 2’s overflow rate according to the following equation.
2 Overflow RateModes 1 and 3 Baud Rates = Timer
----------------------------------------------------------16
The Timer can be configured for either timer or counter operation. In most applications, it is configured for timer operation (CP/T2 = 0). The timer operation is different for Timer 2 when it is
used as a baud rate generator. Normally, as a timer, it increments every machine cycle (at 1/12
the oscillator frequency). As a baud rate generator, however, it increments every state time (at
1/2 the oscillator frequency). The baud rate formula is given below.
Modes 1 and 3
Oscillator Frequency
--------------------------------------- = -------------------------------------------------------------------------------------Baud Rate
32 x [65536-RCAP2H,RCAP2L)]
where (RCAP2H, RCAP2L) is the content of RCAP2H and RCAP2L taken as a 16-bit unsigned
integer.
Timer 2 as a baud rate generator is shown in Figure 10-4. This figure is valid only if RCLK or
TCLK = 1 in T2CON. Note that a rollover in TH2 does not set TF2 and will not generate an interrupt. Note too, that if EXEN2 is set, a 1-to-0 transition in T2EX will set EXF2 but will not cause a
reload from (RCAP2H, RCAP2L) to (TH2, TL2). Thus, when Timer 2 is in use as a baud rate
generator, T2EX can be used as an extra external interrupt.
Note that when Timer 2 is running (TR2 = 1) as a timer in the baud rate generator mode, TH2 or
TL2 should not be read from or written to. Under these conditions, the Timer is incremented
every state time, and the results of a read or write may not be accurate. The RCAP2 registers
may be read but should not be written to, because a write might overlap a reload and cause
write and/or reload errors. The timer should be turned off (clear TR2) before accessing the Timer
2 or RCAP2 registers.
16
AT89LS52
2601B–MICRO–03/05
AT89LS52
Figure 11-1. Timer 2 in Clock-Out Mode
OSC
TL2
(8-BITS)
÷2
TH2
(8-BITS)
TR2
RCAP2L RCAP2H
C/T2 BIT
P1.0
(T2)
÷2
T2OE (T2MOD.1)
TRANSITION
DETECTOR
P1.1
(T2EX)
EXF2
TIMER 2
INTERRUPT
EXEN2
12. Programmable Clock Out
A 50% duty cycle clock can be programmed to come out on P1.0, as shown in Figure 11-1. This
pin, besides being a regular I/O pin, has two alternate functions. It can be programmed to input
the external clock for Timer/Counter 2 or to output a 50% duty cycle clock ranging from 61 Hz to
4 MHz (for a 16 MHz operating frequency).
To configure the Timer/Counter 2 as a clock generator, bit C/T2 (T2CON.1) must be cleared and
bit T2OE (T2MOD.1) must be set. Bit TR2 (T2CON.2) starts and stops the timer.
The clock-out frequency depends on the oscillator frequency and the reload value of Timer 2
capture registers (RCAP2H, RCAP2L), as shown in the following equation.
Oscillator Frequency
Clock-Out Frequency = ------------------------------------------------------------------------------------4 x [65536-(RCAP2H,RCAP2L)]
In the clock-out mode, Timer 2 roll-overs will not generate an interrupt. This behavior is similar to
when Timer 2 is used as a baud-rate generator. It is possible to use Timer 2 as a baud-rate generator and a clock generator simultaneously. Note, however, that the baud-rate and clock-out
frequencies cannot be determined independently from one another since they both use
RCAP2H and RCAP2L.
17
2601B–MICRO–03/05
13. Interrupts
The AT89LS52 has a total of six interrupt vectors: two external interrupts (INT0 and INT1), three
timer interrupts (Timers 0, 1, and 2), and the serial port interrupt. These interrupts are all shown
in Figure 13-1.
Each of these interrupt sources can be individually enabled or disabled by setting or clearing a
bit in Special Function Register IE. IE also contains a global disable bit, EA, which disables all
interrupts at once.
Note that Table 13-1 shows that bit position IE.6 is unimplemented. User software should not
write 1 to this bit position, since it may be used in future AT89 products.
Timer 2 interrupt is generated by the logical OR of bits TF2 and EXF2 in register T2CON. Neither of these flags is cleared by hardware when the service routine is vectored to. In fact, the
service routine may have to determine whether it was TF2 or EXF2 that generated the interrupt,
and that bit will have to be cleared in software.
The Timer 0 and Timer 1 flags, TF0 and TF1, are set at S5P2 of the cycle in which the timers
overflow. The values are then polled by the circuitry in the next cycle. However, the Timer 2 flag,
TF2, is set at S2P2 and is polled in the same cycle in which the timer overflows.
Table 13-1.
Interrupt Enable (IE) Register
(MSB)
EA
(LSB)
–
ET2
ES
ET1
EX1
ET0
EX0
Enable Bit = 1 enables the interrupt.
Enable Bit = 0 disables the interrupt.
Symbol
Position
Function
EA
IE.7
Disables all interrupts. If EA = 0, no interrupt is
acknowledged. If EA = 1, each interrupt source is
individually enabled or disabled by setting or clearing its
enable bit.
–
IE.6
Reserved.
ET2
IE.5
Timer 2 interrupt enable bit.
ES
IE.4
Serial Port interrupt enable bit.
ET1
IE.3
Timer 1 interrupt enable bit.
EX1
IE.2
External interrupt 1 enable bit.
ET0
IE.1
Timer 0 interrupt enable bit.
EX0
IE.0
External interrupt 0 enable bit.
User software should never write 1s to reserved bits, because they may be used in future AT89 products.
18
AT89LS52
2601B–MICRO–03/05
AT89LS52
Figure 13-1. Interrupt Sources
0
INT0
IE0
1
TF0
0
INT1
IE1
1
TF1
TI
RI
TF2
EXF2
14. Oscillator Characteristics
XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier that can be
configured for use as an on-chip oscillator, as shown in Figure 16-1. Either a quartz crystal or
ceramic resonator may be used. To drive the device from an external clock source, XTAL2
should be left unconnected while XTAL1 is driven, as shown in Figure 16-2. There are no
requirements on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum voltage high and low
time specifications must be observed.
15. Idle Mode
In idle mode, the CPU puts itself to sleep while all the on-chip peripherals remain active. The
mode is invoked by software. The content of the on-chip RAM and all the special functions registers remain unchanged during this mode. The idle mode can be terminated by any enabled
interrupt or by a hardware reset.
Note that when idle mode is terminated by a hardware reset, the device normally resumes program execution from where it left off, up to two machine cycles before the internal reset
algorithm takes control. On-chip hardware inhibits access to internal RAM in this event, but
access to the port pins is not inhibited. To eliminate the possibility of an unexpected write to a
port pin when idle mode is terminated by a reset, the instruction following the one that invokes
idle mode should not write to a port pin or to external memory.
19
2601B–MICRO–03/05
16. Power-down Mode
In the Power-down mode, the oscillator is stopped, and the instruction that invokes Power-down
is the last instruction executed. The on-chip RAM and Special Function Registers retain their
values until the Power-down mode is terminated. Exit from Power-down mode can be initiated
either by a hardware reset or by activation of an enabled external interrupt (INT0 or INT1). Reset
redefines the SFRs but does not change the on-chip RAM. The reset should not be activated
before VCC is restored to its normal operating level and must be held active long enough to allow
the oscillator to restart and stabilize.
Figure 16-1. Oscillator Connections
C2
XTAL2
C1
XTAL1
GND
Note:
C1, C2 = 30 pF ± 10 pF for Crystals
= 40 pF ± 10 pF for Ceramic Resonators
Figure 16-2. External Clock Drive Configuration
NC
XTAL2
EXTERNAL
OSCILLATOR
SIGNAL
XTAL1
GND
20
AT89LS52
2601B–MICRO–03/05
AT89LS52
Table 16-1.
Status of External Pins During Idle and Power-down Modes
Mode
Program Memory
ALE
PSEN
PORT0
PORT1
PORT2
PORT3
Idle
Internal
1
1
Data
Data
Data
Data
Idle
External
1
1
Float
Data
Address
Data
Power-down
Internal
0
0
Data
Data
Data
Data
Power-down
External
0
0
Float
Data
Data
Data
17. Program Memory Lock Bits
The AT89LS52 has three lock bits that can be left unprogrammed (U) or can be programmed (P)
to obtain the additional features listed in Table 17-1.
Table 17-1.
Lock Bit Protection Modes
Program Lock Bits
1
LB1
LB2
LB3
Protection Type
U
U
U
No program lock features
2
P
U
U
MOVC instructions executed from external program memory are
disabled from fetching code bytes from internal memory, EA is
sampled and latched on reset, and further programming of the
Flash memory is disabled
3
P
P
U
Same as mode 2, but verify is also disabled
4
P
P
P
Same as mode 3, but external execution is also disabled
When lock bit 1 is programmed, the logic level at the EA pin is sampled and latched during reset.
If the device is powered up without a reset, the latch initializes to a random value and holds that
value until reset is activated. The latched value of EA must agree with the current logic level at
that pin in order for the device to function properly.
18. Programming the Flash – Parallel Mode
The AT89LS52 is shipped with the on-chip Flash memory array ready to be programmed. The
programming interface needs a high-voltage (12-volt) program enable signal and is compatible
with conventional third-party Flash or EPROM programmers.
The AT89LS52 code memory array is programmed byte-by-byte.
Programming Algorithm: Before programming the AT89LS52, the address, data, and control
signals should be set up according to the Flash programming mode table (Table 20-1) and Figure 20-1 and Figure 20-2. To program the AT89LS52, take the following steps:
1. Input the desired memory location on the address lines.
2. Input the appropriate data byte on the data lines.
3. Activate the correct combination of control signals.
4. Raise EA/VPP to 12V.
5. Pulse ALE/PROG once to program a byte in the Flash array or the lock bits. The bytewrite cycle is self-timed and typically takes no more than 50 µs. Repeat steps 1
through 5, changing the address and data for the entire array or until the end of the
object file is reached.
21
2601B–MICRO–03/05
Data Polling: The AT89LS52 features Data Polling to indicate the end of a byte write cycle. During a write cycle, an attempted read of the last byte written will result in the complement of the
written data on P0.7. Once the write cycle has been completed, true data is valid on all outputs,
and the next cycle may begin. Data Polling may begin any time after a write cycle has been
initiated.
Ready/Busy: The progress of byte programming can also be monitored by the RDY/BSY output
signal. P3.0 is pulled low after ALE goes high during programming to indicate BUSY. P3.0 is
pulled high again when programming is done to indicate READY.
Program Verify: If lock bits LB1 and LB2 have not been programmed, the programmed code
data can be read back via the address and data lines for verification. The status of the individual lock bits can be verified directly by reading them back.
Reading the Signature Bytes: The signature bytes are read by the same procedure as a normal verification of locations 000H, 100H, and 200H, except that P3.6 and P3.7 must be pulled to
a logic low. The values returned are as follows.
(000H) = 1EH indicates manufactured by Atmel
(100H) = 62H indicates 89LS52
(200H) = 06H
Chip Erase: In the parallel programming mode, a chip erase operation is initiated by using the
proper combination of control signals and by pulsing ALE/PROG low for a duration of 200 ns 500 ns.
In the serial programming mode, a chip erase operation is initiated by issuing the Chip Erase
instruction. In this mode, chip erase is self-timed and takes about 500 ms.
During chip erase, a serial read from any address location will return 00H at the data output.
19. Programming the Flash – Serial Mode
The Code memory array can be programmed using the serial ISP interface while RST is pulled
to VCC. The serial interface consists of pins SCK, MOSI (input) and MISO (output). After RST is
set high, the Programming Enable instruction needs to be executed first before other operations
can be executed. Before a reprogramming sequence can occur, a Chip Erase operation is
required.
The Chip Erase operation turns the content of every memory location in the Code array into
FFH.
Either an external system clock can be supplied at pin XTAL1 or a crystal needs to be connected
across pins XTAL1 and XTAL2. The maximum serial clock (SCK) frequency should be less than
1/16 of the crystal frequency. With a 16 MHz oscillator clock, the maximum SCK frequency is 1
MHz.
22
AT89LS52
2601B–MICRO–03/05
AT89LS52
19.1
Serial Programming Algorithm
To program and verify the AT89LS52 in the serial programming mode, the following sequence is
recommended:
1. Power-up sequence:
a. Apply power between VCC and GND pins.
b.
Set RST pin to “H”.
If a crystal is not connected across pins XTAL1 and XTAL2, apply a 3 MHz to 16 MHz clock to
XTAL1 pin and wait for at least 10 milliseconds.
2. Enable serial programming by sending the Programming Enable serial instruction to pin
MOSI/P1.5. The frequency of the shift clock supplied at pin SCK/P1.7 needs to be less
than the CPU clock at XTAL1 divided by 16.
3. The Code array is programmed one byte at a time in either the Byte or Page mode. The
write cycle is self-timed and typically takes less than 1 ms at 2.7V.
4. Any memory location can be verified by using the Read instruction which returns the
content at the selected address at serial output MISO/P1.6.
5. At the end of a programming session, RST can be set low to commence normal device
operation.
Power-off sequence (if needed):
1. Set XTAL1 to “L” (if a crystal is not used).
2. Set RST to “L”.
3. Turn VCC power off.
Data Polling: The Data Polling feature is also available in the serial mode. In this mode, during
a byte write cycle an attempted read of the last byte written will result in the complement of the
MSB of the serial output byte on MISO.
19.2
Serial Programming Instruction Set
The Instruction Set for Serial Programming follows a 4-byte protocol and is shown in Table 22-1.
23
2601B–MICRO–03/05
20. Programming Interface – Parallel Mode
Every code byte in the Flash array can be programmed by using the appropriate combination of control signals. The write
operation cycle is self-timed and once initiated, will automatically time itself to completion.
Most major worldwide programming vendors offer worldwide support for the Atmel microcontroller series. Please contact
your local programming vendor for the appropriate software revision.
Table 20-1.
Flash Programming Modes
Mode
VCC
RST
PSEN
P0.7-0
P2.4-0
P1.7-0
ALE/
EA/
PROG
VPP
P2.6
P2.7
P3.3
P3.6
P3.7
Data
12V
L
H
H
H
H
DIN
A12-8
A7-0
H
L
L
L
H
H
DOUT
A12-8
A7-0
12V
H
H
H
H
H
X
X
X
12V
H
H
H
L
L
X
X
X
12V
H
L
H
H
L
X
X
X
H
H
H
L
H
L
P0.2,
P0.3,
P0.4
X
X
12V
H
L
H
L
L
X
X
X
Address
(2)
Write Code Data
5V
H
L
Read Code Data
5V
H
L
Write Lock Bit 1
5V
H
L
Write Lock Bit 2
5V
H
L
Write Lock Bit 3
5V
H
L
5V
H
L
Chip Erase
5V
H
L
Read Atmel ID
5V
H
L
H
H
L
L
L
L
L
1EH
X 0000
00H
Read Device ID
5V
H
L
H
H
L
L
L
L
L
62H
X 0001
00H
Read Device ID
5V
H
L
H
H
L
L
L
L
L
06H
X 0010
00H
H
(3)
(3)
(3)
Read Lock Bits
1, 2, 3
H
(1)
Notes:
24
1.
2.
3.
4.
5.
Each PROG pulse is 200 ns - 500 ns for Chip Erase.
Each PROG pulse is 200 ns - 500 ns for Write Code Data.
Each PROG pulse is 200 ns - 500 ns for Write Lock Bits.
RDY/BSY signal is output on P3.0 during programming.
X = don’t care.
AT89LS52
2601B–MICRO–03/05
AT89LS52
Figure 20-1. Programming the Flash Memory (Parallel Mode)
4.5V - 5.5V
AT89LS52
A0 - A7
ADDR.
0000H/1FFFH
A8 - A12
VCC
P1.0-P1.7
P2.0 - P2.4
P0
P2.6
P2.7
P3.3
P3.6
SEE FLASH
PROGRAMMING
MODES TABLE
PGM
DATA
ALE
PROG
EA
VIH/VPP
P3.7
XTAL2
3-16 MHz
XTAL1
GND
P3.0
RDY/
BSY
RST
VIH
PSEN
Figure 20-2. Verifying the Flash Memory (Parallel Mode)
4.5V - 5.5V
AT89LS52
A0 - A7
ADDR.
0000H/1FFFH
A8 - A12
SEE FLASH
PROGRAMMING
MODES TABLE
P1.0-P1.7
VCC
P2.0 - P2.4
P0
P2.6
P2.7
P3.3
P3.6
P3.7
PGM DATA
(USE 10K
PULLUPS)
ALE
VIH
XTAL 2
EA
XTAL1
RST
3-16 MHz
GND
VIH
PSEN
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2601B–MICRO–03/05
21. Flash Programming and Verification Characteristics (Parallel Mode)
TA = 20°C to 30°C, VCC = 4.5V to 5.5V
Symbol
Parameter
Min
Max
Units
VPP
Programming Supply Voltage
11.5
12.5
V
IPP
Programming Supply Current
10
mA
ICC
VCC Supply Current
30
mA
1/tCLCL
Oscillator Frequency
16
MHz
tAVGL
Address Setup to PROG Low
48tCLCL
tGHAX
Address Hold After PROG
48tCLCL
tDVGL
Data Setup to PROG Low
48tCLCL
tGHDX
Data Hold After PROG
48tCLCL
tEHSH
P2.7 (ENABLE) High to VPP
48tCLCL
tSHGL
VPP Setup to PROG Low
10
µs
tGHSL
VPP Hold After PROG
10
µs
tGLGH
PROG Width
0.2
tAVQV
Address to Data Valid
48tCLCL
tELQV
ENABLE Low to Data Valid
48tCLCL
tEHQZ
Data Float After ENABLE
tGHBL
PROG High to BUSY Low
1.0
µs
tWC
Byte Write Cycle Time
50
µs
3
1
0
µs
48tCLCL
Figure 21-1. Flash Programming and Verification Waveforms – Parallel Mode
PROGRAMMING
ADDRESS
P1.0 - P1.7
P2.0 - P2.4
VERIFICATION
ADDRESS
tAVQV
PORT 0
DATA IN
tAVGL
tDVGL
tGHDX
DATA OUT
tGHAX
ALE/PROG
tSHGL
tGLGH
VPP
tGHSL
LOGIC 1
LOGIC 0
EA/VPP
tEHSH
tEHQZ
tELQV
P2.7
(ENABLE)
tGHBL
P3.0
(RDY/BSY)
BUSY
READY
tWC
26
AT89LS52
2601B–MICRO–03/05
AT89LS52
Figure 21-2. Flash Memory Serial Downloading
VCC
AT89LS52
VCC
INSTRUCTION
INPUT
P1.5/MOSI
DATA OUTPUT
P1.6/MISO
P1.7/SCK
CLOCK IN
XTAL2
3-16 MHz
XTAL1
VIH
RST
GND
22. Flash Programming and Verification Waveforms – Serial Mode
Figure 22-1. Serial Programming Waveforms
7
6
5
4
3
2
1
0
27
2601B–MICRO–03/05
Table 22-1.
Serial Programming Instruction Set
Byte 3
Byte 4
Operation
1010 1100
0101 0011
xxxx xxxx
xxxx xxxx
0110 1001
(Output on MISO)
Enable Serial Programming
while RST is high
1010 1100
100x xxxx
xxxx xxxx
xxxx xxxx
Chip Erase Flash memory
array
Read Program Memory
(Byte Mode)
0010 0000
xxx
D3
D2
D1
D0
Read data from Program
memory in the byte mode
Write Program Memory
(Byte Mode)
0100 0000
xxx
D3
D2
D1
D0
Write data to Program
memory in the byte mode
Write Lock Bits(1)
1010 1100
1110 00
xxxx xxxx
xxxx xxxx
0010 0100
xxxx xxxx
xxxx xxxx
xxx
0010 1000
xxx
0011 0000
xxx
0101 0000
xxx
A3
A2
A1
A0
A3
A2
A1
A0
A7
A6
A5
A4
A7
A6
A5
A4
A11
A10
A9
A8
B1
B2
A11
A10
A9
A8
A12
Chip Erase
A12
Programming Enable
Note:
A11
A10
A9
A8
A7
A12
Read back current status of
the lock bits (a programmed
lock bit reads back as a “1”)
Signature Byte
Byte 0
Byte 1... Byte 255
Read data from Program
memory in the Page Mode
(256 bytes)
Byte 0
Byte 1... Byte 255
Write data to Program
memory in the Page Mode
(256 bytes)
1. B1 = 0, B2 = 0 ---> Mode 1, no lock protection
B1 = 0, B2 = 1 ---> Mode 2, lock bit 1 activated
B1 = 1, B2 = 0 ---> Mode 3, lock bit 2 activated
B1 = 1, B1 = 1 ---> Mode 4, lock bit 3 activated
xxx xxx0
xx
A11
A10
A9
A8
Write Program Memory
(Page Mode)
A12
Read Program Memory
(Page Mode)
A12
Read Signature Bytes
Write Lock bits. See Note 1.
A11
A10
A9
A8
Read Lock Bits
LB2
LB1
Byte 2
LB3
Instruction
D7
D6
D5
D4
Byte 1
D7
D6
D5
D4
Instruction Format
}
Read Signature Byte
Each of the lock bit modes needs to be activated sequentially
before Mode 4 can be executed.
After Reset signal is high, SCK should be low for at least 64 system clocks before it goes high to clock in the enable data
bytes. No pulsing of Reset signal is necessary. SCK should be no faster than 1/16 of the system clock at XTAL1.
For Page Read/Write, the data always starts from byte 0 to 255. After the command byte and upper address byte are
latched, each byte thereafter is treated as data until all 256 bytes are shifted in/out. Then the next instruction will be ready
to be decoded.
28
AT89LS52
2601B–MICRO–03/05
AT89LS52
23. Serial Programming Characteristics
Figure 23-1. Serial Programming Timing
MOSI
tOVSH
SCK
tSHOX
tSLSH
tSHSL
MISO
tSLIV
Table 23-1.
Serial Programming Characteristics, TA = -40°C to 85°C, VCC = 2.7V - 4.0V (Unless otherwise noted)
Symbol
Parameter
1/tCLCL
Oscillator Frequency
tCLCL
Oscillator Period
tSHSL
Min
Typ
3
Max
Units
16
MHz
62.5
ns
SCK Pulse Width High
8 tCLCL
ns
tSLSH
SCK Pulse Width Low
8 tCLCL
ns
tOVSH
MOSI Setup to SCK High
tCLCL
ns
tSHOX
MOSI Hold after SCK High
2 tCLCL
ns
tSLIV
SCK Low to MISO Valid
tERASE
Chip Erase Instruction Cycle Time
tSWC
Serial Byte Write Cycle Time
10
16
32
ns
500
ms
64 tCLCL + 400
µs
24. Absolute Maximum Ratings*
Operating Temperature.................................. -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground .....................................-1.0V to +7.0V
Maximum Operating Voltage ............................................ 6.6V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
DC Output Current...................................................... 15.0 mA
29
2601B–MICRO–03/05
25. DC Characteristics
The values shown in this table are valid for TA = -40°C to 85°C and VCC = 2.7V to 4.0V, unless otherwise noted.
Symbol
Parameter
Condition
Min
Max
Units
VIL
Input Low Voltage
(Except EA)
-0.5
0.7
V
VIL1
Input Low Voltage (EA)
-0.5
0.2 VCC-0.3
V
VIH
Input High Voltage
0.2 VCC+0.9
VCC+0.5
V
VIH1
Input High Voltage
0.7 VCC
VCC+0.5
V
IOL = 0.8 mA
0.45
V
IOL = 1.6 mA
0.45
V
VOL
(Except XTAL1, RST)
(XTAL1, RST)
Output Low Voltage
(1)
(Ports 1,2,3)
(1)
VOL1
Output Low Voltage
(Port 0, ALE, PSEN)
VOH
Output High Voltage
(Ports 1,2,3, ALE, PSEN)
IOH = -60 µA, VCC = 5V ± 10%
2.4
V
IOH = -25 µA
0.65 VCC
V
IOH = -10 µA
0.80 VCC
V
2.4
V
IOH = -300 µA
0.75 VCC
V
IOH = -80 µA
0.9 VCC
V
IOH = -800 µA, VCC = 5V ± 10%
VOH1
Output High Voltage
(Port 0 in External Bus Mode)
IIL
Logical 0 Input Current (Ports 1,2,3)
VIN = 0.45V
-50
µA
ITL
Logical 1 to 0 Transition Current
(Ports 1,2,3)
VIN = 2V, VCC = 5V ± 10%
-150
µA
ILI
Input Leakage Current (Port 0, EA)
0.45 < VIN < VCC
±10
µA
RRST
Reset Pulldown Resistor
300
KΩ
CIO
Pin Capacitance
Test Freq. = 1 MHz, TA = 25°C
10
pF
Active Mode, 12 MHz
25
mA
Idle Mode, 12 MHz
6.5
mA
VCC = 4.0V
30
µA
50
Power Supply Current
ICC
Power-down Mode
Notes:
30
(1)
1. Under steady state (non-transient) conditions, IOL must be externally limited as follows:
Maximum IOL per port pin: 10 mA
Maximum IOL per 8-bit port:
Port 0: 26 mA
Ports 1, 2, 3: 15 mA
Maximum total IOL for all output pins: 71 mA
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater
than the listed test conditions.
2. Minimum VCC for Power-down is 2V.
AT89LS52
2601B–MICRO–03/05
AT89LS52
26. AC Characteristics
Under operating conditions, load capacitance for Port 0, ALE/PROG, and PSEN = 100 pF; load capacitance for all other
outputs = 80 pF.
26.1
External Program and Data Memory Characteristics
16 MHz Oscillator
Variable Oscillator
Min
Min
Max
Units
0
16
MHz
Symbol
Parameter
Max
1/tCLCL
Oscillator Frequency
tLHLL
ALE Pulse Width
85
2tCLCL-40
ns
tAVLL
Address Valid to ALE Low
22
tCLCL-40
ns
tLLAX
Address Hold After ALE Low
32
tCLCL-30
ns
tLLIV
ALE Low to Valid Instruction In
tLLPL
ALE Low to PSEN Low
32
tCLCL-30
ns
tPLPH
PSEN Pulse Width
142
3tCLCL-45
ns
tPLIV
PSEN Low to Valid Instruction In
tPXIX
Input Instruction Hold After PSEN
tPXIZ
Input Instruction Float After PSEN
tPXAV
PSEN to Address Valid
tAVIV
Address to Valid Instruction In
207
5tCLCL-105
ns
tPLAZ
PSEN Low to Address Float
10
10
ns
tRLRH
RD Pulse Width
275
6tCLCL-100
ns
tWLWH
WR Pulse Width
275
6tCLCL-100
ns
tRLDV
RD Low to Valid Data In
tRHDX
Data Hold After RD
tRHDZ
Data Float After RD
65
2tCLCL-60
ns
tLLDV
ALE Low to Valid Data In
350
8tCLCL-150
ns
tAVDV
Address to Valid Data In
397
9tCLCL-165
ns
tLLWL
ALE Low to RD or WR Low
137
3tCLCL+50
ns
tAVWL
Address to RD or WR Low
122
4tCLCL-130
ns
tQVWX
Data Valid to WR Transition
13
tCLCL-50
ns
tQVWH
Data Valid to WR High
287
7tCLCL-150
ns
tWHQX
Data Hold After WR
13
tCLCL-50
ns
tRLAZ
RD Low to Address Float
tWHLH
RD or WR High to ALE High
150
4tCLCL-100
82
0
3tCLCL-105
0
37
75
tCLCL-8
0
5tCLCL-165
3tCLCL-50
0
23
103
tCLCL-40
ns
ns
0
239
ns
ns
tCLCL-25
147
ns
ns
ns
0
ns
tCLCL+40
ns
31
2601B–MICRO–03/05
27. External Program Memory Read Cycle
tLHLL
ALE
tAVLL
tLLIV
tLLPL
tPLIV
PSEN
tPXAV
tPLAZ
tPXIZ
tLLAX
tPXIX
A0 - A7
PORT 0
tPLPH
INSTR IN
A0 - A7
tAVIV
A8 - A15
PORT 2
A8 - A15
28. External Data Memory Read Cycle
tLHLL
ALE
tWHLH
PSEN
tLLDV
tRLRH
tLLWL
RD
tLLAX
tAVLL
PORT 0
tRLDV
tRLAZ
A0 - A7 FROM RI OR DPL
tRHDZ
tRHDX
DATA IN
A0 - A7 FROM PCL
INSTR IN
tAVWL
tAVDV
PORT 2
32
P2.0 - P2.7 OR A8 - A15 FROM DPH
A8 - A15 FROM PCH
AT89LS52
2601B–MICRO–03/05
AT89LS52
29. External Data Memory Write Cycle
tLHLL
ALE
tWHLH
PSEN
tLLWL
WR
tAVLL
PORT 0
tLLAX
tQVWX
A0 - A7 FROM RI OR DPL
tWLWH
tQVWH
DATA OUT
tWHQX
A0 - A7 FROM PCL
INSTR IN
tAVWL
PORT 2
P2.0 - P2.7 OR A8 - A15 FROM DPH
A8 - A15 FROM PCH
30. External Clock Drive Waveforms
tCHCX
VCC - 0.5V
tCHCX
tCLCH
tCHCL
0.7 VCC
0.2 VCC - 0.1V
0.45V
tCLCX
tCLCL
31. External Clock Drive
Symbol
Parameter
1/tCLCL
Oscillator Frequency
tCLCL
Clock Period
tCHCX
Min
Max
Units
0
16
MHz
62.5
ns
High Time
20
ns
tCLCX
Low Time
20
ns
tCLCH
Rise Time
20
ns
tCHCL
Fall Time
20
ns
33
2601B–MICRO–03/05
32. Serial Port Timing: Shift Register Mode Test Conditions
The values in this table are valid for VCC = 2.7V to 4.0V and Load Capacitance = 80 pF.
12 MHz Osc
Variable Oscillator
Symbol
Parameter
Min
Max
Min
Max
tXLXL
Serial Port Clock Cycle Time
1.0
12 tCLCL
µs
tQVXH
Output Data Setup to Clock Rising Edge
700
10 tCLCL-133
ns
tXHQX
Output Data Hold After Clock Rising Edge
50
2 tCLCL-80
ns
tXHDX
Input Data Hold After Clock Rising Edge
0
0
ns
tXHDV
Clock Rising Edge to Input Data Valid
700
Units
10 tCLCL-133
ns
33. Shift Register Mode Timing Waveforms
INSTRUCTION
ALE
0
1
2
3
4
5
6
7
8
tXLXL
CLOCK
tQVXH
tXHQX
WRITE TO SBUF
0
1
2
tXHDV
OUTPUT DATA
CLEAR RI
3
4
5
6
tXHDX
VALID
VALID
VALID
7
SET TI
VALID
VALID
VALID
VALID
VALID
SET RI
INPUT DATA
34. AC Testing Input/Output Waveforms(1)
VCC - 0.5V
0.2 VCC + 0.9V
TEST POINTS
0.2 VCC - 0.1V
0.45V
Note:
1. AC Inputs during testing are driven at VCC - 0.5V
for a logic 1 and 0.45V for a logic 0. Timing measurements are made at VIH min. for a logic 1 and VIL max. for a logic 0.
35. Float Waveforms(1)
V LOAD+
0.1V
V LOAD -
34
0.1V
V OL +
0.1V
Timing Reference
Points
V LOAD
Note:
V OL -
0.1V
1. For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins to
float when a 100 mV change from the loaded VOH/VOL level occurs.
AT89LS52
2601B–MICRO–03/05
AT89LS52
36. Ordering Information
36.1
Standard Package
Speed
(MHz)
16
36.2
Power
Supply
2.7V to 4.0V
Ordering Code
Package
Operation Range
AT89LS52-16AC
AT89LS52-16JC
AT89LS52-16PC
AT89LS52-16SC
44A
44J
40P6
42PS6
Commercial
(0°C to 70°C)
AT89LS52-16AI
AT89LS52-16JI
AT89LS52-16PI
AT89LS52-16SI
44A
44J
40P6
42PS6
Industrial
(-40°C to 85°C)
Green Package Option (Pb/Halide-free)
Speed
(MHz)
Power
Supply
16
2.7V to 4.0V
Ordering Code
Package
AT89LS52-16AU
AT89LS52-16JU
AT89LS52-16PU
44A
44J
40P6
Operation Range
Industrial
(-40°C to 85°C)
Package Type
44A
44-lead, Thin Plastic Gull Wing Quad Flatpack (TQFP)
44J
44-lead, Plastic J-leaded Chip Carrier (PLCC)
40P6
40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP)
42PS6
42-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP)
35
2601B–MICRO–03/05
37. Packaging Information
37.1
44A
PIN 1
B
PIN 1 IDENTIFIER
E1
e
E
D1
D
C
0˚~7˚
A1
A2
A
L
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
SYMBOL
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
11.75
12.00
12.25
D1
9.90
10.00
10.10
E
11.75
12.00
12.25
E1
9.90
10.00
10.10
B
0.30
–
0.45
C
0.09
–
0.20
L
0.45
–
0.75
e
NOTE
Note 2
Note 2
0.80 TYP
10/5/2001
R
36
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
DRAWING NO.
REV.
44A
B
AT89LS52
2601B–MICRO–03/05
AT89LS52
37.2
44J
1.14(0.045) X 45˚
PIN NO. 1
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
E1
D2/E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
17.399
–
17.653
D1
16.510
–
16.662
E
17.399
–
17.653
E1
16.510
–
16.662
D2/E2
14.986
–
16.002
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
44J
B
37
2601B–MICRO–03/05
37.3
40P6
D
PIN
1
E1
A
SEATING PLANE
A1
L
B
B1
e
E
0º ~ 15º
C
COMMON DIMENSIONS
(Unit of Measure = mm)
REF
MIN
NOM
MAX
A
–
–
4.826
A1
0.381
–
–
D
52.070
–
52.578
E
15.240
–
15.875
E1
13.462
–
13.970
B
0.356
–
0.559
B1
1.041
–
1.651
L
3.048
–
3.556
C
0.203
–
0.381
eB
15.494
–
17.526
SYMBOL
eB
Notes:
1. This package conforms to JEDEC reference MS-011, Variation AC.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
e
NOTE
Note 2
Note 2
2.540 TYP
09/28/01
R
38
2325 Orchard Parkway
San Jose, CA 95131
TITLE
40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)
DRAWING NO.
40P6
REV.
B
AT89LS52
2601B–MICRO–03/05
AT89LS52
37.4
42PS6 – PDIP
D
PIN
1
E1
A
SEATING PLANE
A1
L
B
B1
e
E
0º ~ 15º
C
COMMON DIMENSIONS
(Unit of Measure = mm)
REF
MIN
NOM
MAX
A
–
–
4.83
A1
0.51
–
–
D
36.70
–
36.96
E
15.24
–
15.88
E1
13.46
–
13.97
B
0.38
–
0.56
B1
0.76
–
1.27
L
3.05
–
3.43
C
0.20
–
0.30
eB
–
–
18.55
SYMBOL
eB
Notes:
1. This package conforms to JEDEC reference MS-011, Variation AC.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
e
NOTE
Note 2
Note 2
1.78 TYP
11/6/03
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
42PS6, 42-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)
DRAWING NO.
42PS6
REV.
A
39
2601B–MICRO–03/05
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Regional Headquarters
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2601B–MICRO–03/05
/0M