MURA105T3G, MURA110T3G, SURA8110T3G Preferred Devices Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com ULTRAFAST RECTIFIERS 1 AMPERE, 50−100 VOLTS Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.66 V Max @ 1.0 A, TJ = 150C) AEC−Q101 Qualified and PPAP Capable SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb−Free* SMA CASE 403D MARKING DIAGRAM Mechanical Characteristics Case: Epoxy, Molded Weight: 70 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C) U4x AYWW G U4x = x = = A = Y = WW = G = Specific Device Code A for MURA105T3 B for MURA110T3, SURA8110T3 Assembly Location Year Work Week Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† MURA105T3G SMA (Pb−Free) 5, 000 / Tape & Reel MURA110T3G SMA (Pb−Free) 5,000 / Tape & Reel SURA8110T3G SMA (Pb−Free) 5,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 5 1 Publication Order Number: MURA105T3/D MURA105T3G, MURA110T3G, SURA8110T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA105T3G MURA110T3G, SURA8110T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 155C @ TL = 135C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature Range TJ Value Unit V 50 100 1.0 2.0 50 −65 to +175 A A C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) Symbol Max Unit PsiJL (Note 2) RqJA 24 C/W 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25C) (iF = 1.0 A, TJ = 150C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 150C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. http://onsemi.com 2 Max 0.875 0.66 2.0 50 30 Unit V mA ns MURA105T3G, MURA110T3G, SURA8110T3G 100 IR, REVERSE CURRENT (mA) 1 TJ = 100C 0.1 0.01 0.001 IF, INSTANTANEOUS FORWARD CURRENT (A) TJ = 175C 10 TJ = 25C 0 20 40 60 80 TJ = 25C 20 0 40 60 80 100 Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 100C 25C 1 0.1 0.4 1 VR, REVERSE VOLTAGE (VOLTS) TC = 175C 0.3 TJ = 100C VR, REVERSE VOLTAGE (VOLTS) 10 0.01 TJ = 175C 10 0.1 100 0.5 0.6 0.7 0.8 0.9 1 1.1 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (mA) 100 10 100C TC = 175C 25C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.4 0.5 0.6 0.7 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 3 1.1 MURA105T3G, MURA110T3G, SURA8110T3G 60 50 NOTE: MAXIMUM CAPACITANCE AT 0 V = 48 pF 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 40 35 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 45 30 25 20 15 10 8 12 16 20 28 24 36 32 0 40 4 8 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance IF, AVERAGE FORWARD CURRENT (A) RqJL = 24C/W TJ = 175C dc 2.5 SQUARE WAVE 2 1.5 1 0.5 100 110 0 VR, REVERSE VOLTAGE (VOLTS) 3 0 20 VR, REVERSE VOLTAGE (VOLTS) 120 130 140 150 160 170 180 RqJA = 216C/W TJ = 175C dc 1 SQUARE WAVE 0.5 0 0 20 40 60 TJ = 175C 2 dc SQUARE WAVE 1 0.5 0 0.5 100 120 140 160 Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) 2.5 0 80 TA, AMBIENT TEMPERATURE (C) Figure 7. Current Derating, Lead 1.5 36 1.5 TL, LEAD TEMPERATURE (C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 4 0 4 3.5 30 10 5 0 40 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 4 3.5 40 MURA105T3G, MURA110T3G, SURA8110T3G PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE F HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.006 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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