OPA2 34 OPA2 OPA2 234 OPA234 OPA2234 OPA4234 OPA 4234 34 SBOS055B – MAY 1996 – REVISED APRIL 2008 Low-Power, Precision SINGLE-SUPPLY OPERATIONAL AMPLIFIERS FEATURES OPA234 ● WIDE SUPPLY RANGE: Single Supply: VS = +2.7V to +36V Dual Supply: VS = ±1.35V to ±18V ● SPECIFIED PERFORMANCE: +2.7V, +5V, and ±15V ● LOW QUIESCENT CURRENT: 250µA/amp ● LOW INPUT BIAS CURRENT: 25nA max ● LOW OFFSET VOLTAGE: 100µV max ● HIGH CMRR, PSRR, and AOL Offset Trim 1 8 NC –In 2 7 V+ +In 3 6 Output V– 4 5 Offset Trim 8 V+ 7 Out B 6 –In B 5 +In B SO-8, MSOP-8 ● SINGLE, DUAL, and QUAD VERSIONS OPA2234 DESCRIPTION The OPA234 series low-cost op amps are ideal for single-supply, low-voltage, low-power applications. The series provides lower quiescent current than older “1013”-type products and comes in current industrystandard packages and pinouts. The combination of low offset voltage, high common-mode rejection, high power-supply rejection, and a wide supply range provides excellent accuracy and versatility. Single, dual, and quad versions have identical specifications for maximum design flexibility. These general-purpose op amps are ideal for portable and battery-powered applications. The OPA234 series op amps operate from either single or dual supplies. In single-supply operation, the input common-mode range extends below ground and the output can swing to within 50mV of ground. Excellent phase margin makes the OPA234 series ideal for demanding applications, including high load capacitance. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. Single version packages are in an SO-8 surface-mount and a space-saving MSOP-8 surface-mount. Dual packages are in an SO-8 surface-mount. Quad packages are in an SO-14 surface-mount. All are specified for –40°C to +85°C operation. Out A –In A 1 A 2 +In A 3 V– 4 B SO-8 OPA4234 Out A 1 –In A 2 A 14 Out D 13 –In D D +In A 3 12 +In D V+ 4 11 V– +In B 5 10 +In C B C –In B 6 9 –In C Out B 7 8 Out C SO-14 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 1996-2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ELECTRICAL CHARACTERISTICS: VS = +5V At TA = 25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted. OPA234UA, EA OPA2234UA OPA4234UA, U OPA234U, E OPA2234U PARAMETER OFFSET VOLTAGE Input Offset Voltage OPA234E, EA vs Temperature(1) vs Power Supply vs Time Channel Separation (Dual, Quad) CONDITION VOS dVOS/dT PSRR INPUT BIAS CURRENT Input Bias Current(2) Input Offset Current NOISE Input Voltage Noise Density Current Noise Density INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection IB IOS FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time: 0.1% 0.01% Overload Recovery Time TEMPERATURE RANGE Specified Range Operating Range Storage Thermal Resistance 8-Pin DIP SO-8 Surface-Mount MSOP-8 Surface-Mount 14-Pin DIP SO-14 Surface-Mount MAX Operating Temperature Range VS = +2.7V to +30V, VCM = 1.7V ±40 ±100 ±0.5 3 0.2 0.3 VCM = 2.5V VCM = 2.5V –15 ±1 VCM = 2.5V MIN TYP MAX UNITS ±100 ±150 ±3 10 ✻ ✻ ✻ ✻ ✻ ✻ ±250 ±350 ✻ 20 µV µV µV/°C µV/V µV/mo µV/V –30 ±5 ✻ ✻ –50 ✻ nA nA f = 1kHz CMRR AOL GBW SR ✻ ✻ 25 80 VCM = –0.1V to 4V –0.1 91 VO = 0.25V to 4V RL = 10kΩ RL = 2kΩ 108 86 CL = 100pF ✻ 86 120 96 100 ✻ 0.35 0.2 15 25 16 G = 1, 3V Step, CL = 100pF G = 1, 3V Step, CL = 100pF (VIN) (Gain) = VS RL = 10kΩ to VS /2 RL = 10kΩ to VS /2 RL = 10kΩ to Ground RL = 10kΩ to Ground (V+) –1 106 107 || 5 1010 || 6 VCM = 2.5V OUTPUT Voltage Output: Positive Negative Positive Negative Short-Circuit Current ISC Capacitive Load Drive (Stable Operation)(3) POWER SUPPLY Specified Operating Voltage Operating Voltage Range Quiescent Current (per amplifier) TYP vn in INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain MIN (V+) –1 0.25 (V+) –1 0.1 G = +1 ✻ ✻ ✻ ✻ (V+) –0.65 0.05 (V+) –0.65 0.05 ±11 1000 IQ IO = 0 250 –40 –40 –55 ✻ ✻ V dB ✻ ✻ Ω || pF Ω || pF ✻ ✻ dB dB ✻ ✻ ✻ ✻ ✻ MHz V/µs µs µs µs ✻ ✻ ✻ ✻ ✻ ✻ V V V V mA pF ✻ +5 +2.7 +36 300 ✻ +85 +125 +125 ✻ ✻ ✻ ✻ θJA 100 150 220 80 110 nV/√Hz fA/√Hz ✻ ✻ ✻ ✻ ✻ ✻ ✻ V V µA ✻ ✻ ✻ °C °C °C °C/W °C/W °C/W °C/W °C/W ✻ Specifications same as OPA234U, E. NOTES: (1) Wafer-level tested to 95% confidence level. (2) Positive conventional current flows into the input terminals. (3) See Small-Signal Overshoot vs Load Capacitance typical curve. 2 OPA234, OPA2234, OPA4234 www.ti.com SBOS055B ELECTRICAL CHARACTERISTICS: VS = +2.7V At TA = 25°C, VS = +2.7V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted. OPA234UA, EA OPA2234UA OPA4234UA, U OPA234U, E OPA2234U PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage OPA234E, EA vs Temperature(1) vs Power Supply vs Time Channel Separation (Dual, Quad) TYP MAX Operating Temperature Range VS = +2.7V to +30V, VCM = 1.7V ±40 ±100 ±0.5 3 0.2 0.3 VCM = 1.35V VCM = 1.35V –15 ±1 VOS dVOS/dT PSRR INPUT BIAS CURRENT Input Bias Current(2) Input Offset Current NOISE Input Voltage Noise Density Current Noise Density INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection VCM = 1.35V IB IOS FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time: 0.1% 0.01% Overload Recovery Time CMRR TEMPERATURE RANGE Specified Range Operating Range Storage Thermal Resistance 8-Pin DIP SO-8 Surface-Mount MSOP-8 Surface-Mount 14-Pin DIP SO-14 Surface-Mount TYP MAX UNITS ±100 ±150 ±3 10 ✻ ✻ ✻ ✻ ✻ ✻ ±250 ±350 ✻ 20 µV µV µV/°C µV/V µV/mo µV/V –30 ±5 ✻ ✻ –50 ✻ nA n AOL GBW SR ✻ ✻ 25 80 VCM = –0.1V to 1.7V –0.1 91 VO = 0.25V to 1.7V RL = 10kΩ RL = 2kΩ 108 86 CL = 100pF ✻ 86 125 96 100 86 0.35 0.2 6 16 8 G = 1, 1V Step, CL = 100pF G = 1, 1V Step, CL = 100pF (VIN) (Gain) = VS RL = 10kΩ to VS /2 RL = 10kΩ to VS /2 RL = 10kΩ to Ground RL = 10kΩ to Ground (V+) –1 106 107 || 5 1010 || 6 VCM = 1.35V OUTPUT Voltage Output: Positive Negative Positive Negative Short-Circuit Current ISC Capacitive Load Drive (Stable Operation)(3) POWER SUPPLY Specified Operating Voltage Operating Voltage Range Quiescent Current (per amplifier) MIN f = 1kHz vn in INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain MIN (V+) –1 0.25 (V+) –1 0.1 G = +1 ✻ ✻ ✻ ✻ (V+) –0.6 0.05 (V+) –0.65 0.05 ±8 1000 IQ IO = 0 250 –40 –40 –55 ✻ ✻ V dB ✻ ✻ Ω || pF Ω || pF ✻ ✻ dB dB ✻ ✻ ✻ ✻ ✻ MHz V/µs µs µs µs ✻ ✻ ✻ ✻ ✻ ✻ V V V V mA pF ✻ +2.7 +2.7 +36 300 ✻ +85 +125 +125 ✻ ✻ ✻ ✻ θJA 100 150 220 80 110 nV/√Hz fA/√Hz ✻ ✻ ✻ ✻ ✻ ✻ ✻ V V µA ✻ ✻ ✻ °C °C °C °C/W °C/W °C/W °C/W °C/W ✻ Specifications same as OPA234U, E. NOTES: (1) Wafer-level tested to 95% confidence level. (2) Positive conventional current flows into the input terminals. (3) See Small-Signal Overshoot vs Load Capacitance typical curve. OPA234, OPA2234, OPA4234 SBOS055B www.ti.com 3 ELECTRICAL CHARACTERISTICS: VS = ±15V At TA = 25°C, VS = ±15V, and RL = 10kΩ connected to ground, unless otherwise noted. OPA234UA, EA OPA2234UA OPA4234UA, U OPA234U, E OPA2234U PARAMETER OFFSET VOLTAGE Input Offset Voltage OPA4234U Model vs Temperature(1) vs Power Supply vs Time Channel Separation (Dual, Quad) CONDITION VOS dVOS/dT PSRR INPUT BIAS CURRENT Input Bias Current(2) Input Offset Current NOISE Input Voltage Noise Density Current Noise Density INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection IB IOS FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time: 0.1% 0.01% Overload Recovery Time TEMPERATURE RANGE Specified Range Operating Range Storage Thermal Resistance 8-Pin DIP SO-8 Surface-Mount MSOP-8 Surface-Mount 14-Pin DIP SO-14 Surface-Mount MAX VCM = 0V ±70 ±250 Operating Temperature Range VS = ±1.35V to ±18V, VCM = 0V ±0.5 3 0.2 0.3 VCM = 0V VCM = 0V –12 ±1 MIN TYP MAX UNITS ±5 10 ✻ ±70 ✻ ✻ ✻ ✻ ±500 ±250 ✻ 20 µV µV µV/°C µV/V µV/mo µV/V –25 ±5 ✻ ✻ –50 ✻ nA nA f = 1kHz CMRR AOL GBW SR VCM = –15V to 14V (V–) 91 VO = –14.5V to 14V (V+) –1 106 110 CL = 100pF 120 100 0.35 0.2 41 47 22 ✻ ✻ (V+) –1 (V+) –0.7 (V–) +0.5 (V–) +0.15 ±22 1000 G = +1 ✻ 86 107 || 5 1010 || 6 G = 1, 10V Step, CL = 100pF G = 1, 10V Step, CL = 100pF (VIN) (Gain) = VS ±1.35 IQ ✻ ✻ 25 80 VCM = 0V OUTPUT Voltage Output: Positive Negative Short-Circuit Current ISC Capacitive Load Drive (Stable Operation)(3) POWER SUPPLY Specified Operating Voltage Operating Voltage Range Quiescent Current (per amplifier) TYP vn in INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain MIN IO = 0 ±15 ±275 –40 –40 –55 ✻ ✻ V dB ✻ ✻ Ω || pF Ω || pF ✻ dB ✻ ✻ ✻ ✻ ✻ MHz V/µs µs µs µs ✻ ✻ ✻ ✻ V V mA pF ✻ ±18 ±350 ✻ +85 +125 +125 ✻ ✻ ✻ ✻ θJA 100 150 220 80 110 nV/√Hz fA/√Hz ✻ ✻ ✻ ✻ ✻ ✻ ✻ V V µA ✻ ✻ ✻ °C °C °C °C/W °C/W °C/W °C/W °C/W ✻ Specifications same as OPA234U, E. NOTES: (1) Wafer-level tested to 95% confidence level. (2) Positive conventional current flows into the input terminals. (3) See Small-Signal Overshoot vs Load Capacitance typical curve. 4 OPA234, OPA2234, OPA4234 www.ti.com SBOS055B ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ABSOLUTE MAXIMUM RATINGS Supply Voltage, V+ to V– .................................................................... 36V Input Voltage ..................................................... (V–) –0.7V to (V+) +0.7V Output Short-Circuit(1) .............................................................. Continuous Operating Temperature .................................................. –40°C to +125°C Storage Temperature ..................................................... –55°C to +125°C Junction Temperature ...................................................................... 150°C Lead Temperature (soldering, 10s) ................................................. 300°C NOTE: (1) Short-circuit to ground, one amplifier per package. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE INFORMATION PRODUCT Single OPA234EA OPA234E OPA234UA OPA234U PACKAGE PACKAGE MARKING MSOP-8 Surface-Mount A34 " " SO-8 Surface-Mount OPA234UA OPA234U " Dual OPA2234UA OPA2234U SO-8 Surface-Mount Quad OPA4234UA OPA4234U SO-8 Surface-Mount " " OPA2234UA OPA2234U OPA4234UA OPA4234U NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. OPA234, OPA2234, OPA4234 SBOS055B www.ti.com 5 TYPICAL CHARACTERISTIC CURVES At TA = +25°C and RL = 10kΩ, unless otherwise noted. POWER-SUPPLY AND COMMON-MODE REJECTION vs FREQUENCY OPEN-LOOP GAIN/PHASE vs FREQUENCY 140 VS = +2.7V 0 120 –60 80 φ –90 60 –120 40 VO = 0.25V 20 –150 G V VO = S 2 0 PSR, CMR (dB) –30 Phase (°) VS = +5V ±15V 100 Voltage Gain (dB) CL = 100pF –180 –20 0.1 1 10 100 1k 10k 100k 120 110 100 90 80 70 60 50 40 30 20 10 0 +PSR CMR VS = +2.7V, +5V or ±15V VS = +2.7V or +5V VS = ±15V 10 1M 100 –PSR 1k 10k 100k 1M Frequency (Hz) Frequency (Hz) INPUT NOISE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY CHANNEL SEPARATION vs FREQUENCY 1k 160 Channel Separation (dB) Voltage Noise (nV/√Hz) Current Noise (fA/√Hz) RL = 10kΩ Current Noise 100 140 120 100 Voltage Noise 10 80 10 1 100 1k 10k 100k 10 1k 10k 100k Frequency (Hz) INPUT BIAS AND INPUT OFFSET CURRENT vs TEMPERATURE INPUT BIAS CURRENT vs INPUT COMMON-MODE VOLTAGE –17 VS = +2.7V, +5V –15 VS = +5V –16 Input Bias Current (nA) Input Bias, Input Offset Current (nA) 100 Frequency (Hz) –20 IB VS = ±15V –10 –5 IOS 0 –15 VS = +2.7V –14 –13 VS = ±15V –12 –11 –10 +5 –75 –50 –25 0 25 50 75 100 –15 125 Ambient Temperature (°C) 6 Dual and quad devices. G = 1, all channels. Quad measured channel A to D or B to C—other combinations yield improved rejection. –10 –5 0 5 Common-Mode Voltage (V) 10 15 OPA234, OPA2234, OPA4234 www.ti.com SBOS055B TYPICAL CHARACTERISTIC CURVES (Cont.) At TA = +25°C and RL = 10kΩ, unless otherwise noted. OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET VOLTAGE PRODUCTION DISTRIBUTION 30 25 15 10 5 0.1% 0.3% 0.1% Typical production distribution of packaged units. Single, dual, and quad units included. VS = ±15V 20 15 10 0.7% 0.3% 5 0.5% 0.1% 0.2% 500 400 300 200 100 0 –100 –200 –500 175 200 150 125 75 100 50 0 25 25 75 50 100 125 150 175 200 –300 0 0 –400 20 VS = +2.7V, +5V Typical production distribution of packaged units. Single, dual, and quad units included. Percent of Amplifiers (%) Percent of Amplifiers (%) 25 Offset Voltage (µV) Offset Voltage (µV) OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION 35 35 25 30 Percent of Amplifiers (%) 20 15 10 0.3% 5 0.2% 0.1% 0.1% 25 20 15 10 0.3% 0.5% 0.2% 0.1% 5 0.1% OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION Typical production distribution of packaged units. Single, dual, and quad units included. 15 10 0.4% 0.3% 0.2% 0.1% 0.1% 0.1% 0.1% 120 5 4.5 4 3.5 PSR 110 CMR 100 90 80 70 0 VS = +2.7V VS = +5V VS = ±15V AOL 130 20 5 3 140 AOL, CMR, PSR (dB) 25 2.5 AOL, CMR, AND PSR vs TEMPERATURE 30 VS = ±15V 2 1.5 0.5 5 4 3.5 3 2.5 2 1.5 1 0.5 4.5 Offset Voltage Drift (µV/°C) Offset Voltage Drift (µV/°C) Percent of Amplifiers (%) 0.1% 0 0 1 Percent of Amplifiers (%) 30 Typical production distribution of packaged units. Single, dual, and quad units included. VS = +5V Typical production distribution of packaged units. Single, dual, and quad units included. VS = +2.7V VCM = (V–) –0.02V to (V+) –1V 8 7.5 7 6.5 6 5 5.5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 60 –75 –25 0 25 50 75 100 125 Ambient Temperature (°C) Offset Voltage Drift (µV/°C) OPA234, OPA2234, OPA4234 SBOS055B –50 www.ti.com 7 TYPICAL CHARACTERISTIC CURVES (Cont.) At TA = +25°C and RL = 10kΩ, unless otherwise noted. SMALL-SIGNAL STEP RESPONSE G = 1, CL = 100pF, VS = +5V 20mV/div 20mV/div SMALL-SIGNAL STEP RESPONSE G = 1, CL = 10,000pF, VS = +5V 2µs/div 20µs/div LARGE-SIGNAL STEP RESPONSE G = 1, CL = 100pF, VS = +5V SETTLING TIME vs CLOSED-LOOP GAIN 1000 1V/div Settling Time (µs) CL = 100pF VS = ±15V, 10V Step 100 10 VS = +5V, 3V Step VS = +2.7V, 1V Step 0.1% 0.01% 1 ±1 10µs/div ±10 ±100 Gain (V/V) SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE V+ (V+) –0.5 (V+) –1.0 (V+) –1.5 (V+) –2.0 (V+) –2.5 (V+) –3.0 70 25°C 60 VO = 100mVp-p –55°C 125°C 85°C (V–) +3.0 (V–) +2.5 (V–) +2.0 (V–) +1.5 (V–) +1.0 (V–) +0.5 V– –40°C 85°C –40°C –55°C 25°C 125°C 0 Overshoot (%) Output Voltage Swing (V) OUTPUT VOLTAGE SWING vs OUTPUT CURRENT ±5 ±10 ±15 G = –1, G = +2 30 10 G = +1, VS = ±15V G = ±10 G = +1, VS = +2.7, +5V 0 10pF 100pF 1nF 10nF 100nF Load Capacitance Output Current (mA) 8 40 20 High output current may not be available at low supply voltages due to output swing limitations. G = –2 50 OPA234, OPA2234, OPA4234 www.ti.com SBOS055B TYPICAL CHARACTERISTIC CURVES (Cont.) At TA = +25°C and RL = 10kΩ, unless otherwise noted. MAXIMUM OUTPUT VOLTAGE vs FREQUENCY QUIESCENT CURRENT AND SHORT-CIRCUIT CURRENT vs TEMPERATURE VS = +2.7V VS = +5V VS = +2.7V or +5V VS = ±15V 450 25 VS = ±15V Quiescent Current (µA) Output Voltage (Vp-p) 70 525 Maximum output voltage without slew-rate induced distortion. 20 15 10 VS = +5V 5 375 60 50 ±IQ 300 40 30 225 150 20 ±ISC 10 75 VS = ±2.7V 0 0 0 10k 1k 100k Short-Circuit Current (mA) 30 –75 –50 –25 0 Frequency (Hz) 25 50 75 100 125 Temperature (°C) APPLICATIONS INFORMATION V+ The OPA234 series op amps are unity-gain stable and suitable for a wide range of general-purpose applications. Power-supply pins should be bypassed with 10nF ceramic capacitors. 10nF OPA234 single op amp only. Use offset adjust pins only to null offset voltage of op amp—see text. 7 2 6 3 OPA234 5 OPERATING VOLTAGE 1 The OPA234 series op amps operate from single (+2.7V to +36V) or dual (±1.35V to ±18V) supplies with excellent performance. Specifications are production tested with +2.7V, +5V, and ±15V supplies. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are shown in the Typical Characterisitc curves. 10nF 4 100kΩ Trim Range: ±4mV typ (V–) = 0V for single supply operation. V– FIGURE 1. OPA234 Offset Voltage Trim Circuit. OFFSET VOLTAGE TRIM Offset voltage of the OPA234 series amplifiers is laser trimmed and usually requires no user adjustment. The OPA234 (single op amp version) provides offset voltage trim connections on pins 1 and 5. Offset voltage can be adjusted by connecting a potentiometer, as shown in Figure 1. This adjustment should be used only to null the offset of the op amp, not to adjust system offset or offset produced by the signal source. Nulling offset could degrade the offset drift behavior of the op amp. While it is not possible to predict the exact change in drift, the effect is usually small. OPA234, OPA2234, OPA4234 SBOS055B www.ti.com 9 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) OPA2234P OBSOLETE PDIP P 8 TBD Call TI Call TI OPA2234PA OBSOLETE PDIP P 8 TBD Call TI Call TI OPA2234U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA2234U-2/2K5 OBSOLETE SOIC D 8 TBD Call TI Call TI OPA2234U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Op Temp (°C) Device Marking (4/5) -40 to 85 OPA 2234U Level-3-260C-168 HR -40 to 85 OPA 2234U OPA2234U/2K5E4 PREVIEW SOIC D 8 TBD Call TI Call TI -40 to 85 OPA2234U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 2234U OPA2234UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 2234U A OPA2234UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 2234U A TBD Call TI Call TI -40 to 85 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TBD Call TI Call TI -40 to 85 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TBD Call TI Call TI -40 to 85 OPA2234UA/2K5E4 PREVIEW SOIC D 8 OPA2234UA/2K5G4 ACTIVE SOIC D 8 OPA 2234U A OPA2234UAE4 PREVIEW SOIC D 8 OPA2234UAG4 ACTIVE SOIC D 8 OPA2234UE4 PREVIEW SOIC D 8 OPA2234UG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA 2234U OPA234E/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 125 A34 OPA234E/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 A34 OPA234E/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 125 A34 OPA234E/2K5E4 PREVIEW VSSOP DGK 8 TBD Call TI Call TI -40 to 125 Addendum-Page 1 OPA 2234U A Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA234E/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 A34 OPA234EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 125 A34 OPA234EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 A34 OPA234EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 125 A34 OPA234EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 A34 OPA234P OBSOLETE PDIP P 8 TBD Call TI Call TI OPA234PA OBSOLETE PDIP P 8 TBD Call TI Call TI OPA234U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA 234U OPA234U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA 234U OPA234U/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA 234U OPA234UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA 234U A OPA234UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA 234U A OPA234UA/2K5E4 PREVIEW SOIC D 8 TBD Call TI Call TI -40 to 125 OPA234UA/2K5G4 ACTIVE SOIC D 8 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 2500 OPA 234U A OPA234UAE4 PREVIEW SOIC D 8 TBD Call TI Call TI -40 to 125 OPA234UAG4 OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 OPA234UG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 OPA 234U OPA4234PA OBSOLETE PDIP N 14 TBD Call TI Call TI OPA4234U ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4234U Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty OPA4234U/2K5 ACTIVE SOIC D 14 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 Device Marking (4/5) OPA4234U OPA4234U/2K5E4 PREVIEW SOIC D 14 TBD Call TI Call TI -40 to 85 OPA4234U/2K5G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4234U OPA4234UA ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4234U A OPA4234UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4234U A TBD Call TI Call TI -40 to 85 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TBD Call TI Call TI -40 to 85 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TBD Call TI Call TI -40 to 85 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4234UA/2K5E4 PREVIEW SOIC D 14 OPA4234UA/2K5G4 ACTIVE SOIC D 14 OPA4234UAE4 PREVIEW SOIC D 14 OPA4234UAG4 ACTIVE SOIC D 14 OPA4234UE4 PREVIEW SOIC D 14 OPA4234UG4 ACTIVE SOIC D 14 OPA4234U A OPA4234U A OPA4234U (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 18-Oct-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF OPA2234 : • Military: OPA2234M NOTE: Qualified Version Definitions: • Military - QML certified for Military and Defense Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 9-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device OPA2234U/2K5 Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2234UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA234E/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA234E/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA234EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA234EA/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA234U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA234UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4234U/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 OPA4234UA/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2234U/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA2234UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA234E/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA234E/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0 OPA234EA/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA234EA/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0 OPA234U/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA234UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA4234U/2K5 SOIC D 14 2500 367.0 367.0 38.0 OPA4234UA/2K5 SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated