Gilway GHB-1206-YG2 3.2x1.6mm smd chip led lamp Datasheet

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-1206-YG2
Features
!3.2mmx1.6mm
!LOW POWER
!WIDE
!IDEAL
Description
SMT LED, 1.1mm THICKNESS.
The Mega Green source color devices are made
CONSUMPTION.
VIEWING ANGLE.
with DH InGaAlP on GaAs substrate Light
FOR BACKLIGHT AND INDICATOR.
Emitting Diode.
!VARIOUS
COLORS AND LENS TYPES AVAILABLE.
!PACKAGE
: 2000PCS / REEL.
3.2x1.6mm SMD CHIP LED LAMP
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
REV NO: V.2
DATE:DEC/05/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No
No.
o..
v (mcd)
IIv
((mcd
m c dd)
@ 20 mA
Lens
Typ
L
e
ens
nss T
Typ
Tyy p e
Diic
ce
Miin
n.
in.
GHB-1206-YG2
MEGA GREEN (InGaAIP)
WATER CLEAR
18
V
Viewin
Viiewing
i ew i n g
Angle
T
Typ
Ty
yyp
pp..
70
12 0
Note:
1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
its
Un
nit
t io nss
o n d iition
T
Test
e
est
ss t C
Cond
574
nm
I F =20mA
MEGA GREEN
568
nm
I F =20mA
S pectral Line Half-width
MEGA GREEN
26
nm
I F =20mA
C
Capacitance
MEGA GREEN
20
pF
V F =0V;f =1MHz
VF
Forward Voltage
MEGA GREEN
2.1
2.5
V
IF =20mA
IR
Reverse Current
MEGA GREEN
10
uA
V R = 5V
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r a m e t er
peak
Peak Wavelength
MEGA GREEN
D
Dominate Wavelength
1/2
ev ic e
De
evic
xx..
ax
Ma
TTyyyp
pp..
Absolute Maximum Ratings at TA=25 C
P
Paramete
Pa
a
arameter
r am et er
Mega
eg a Green
G
Gree
r een
U
Unit
n
nit
i ts
Power dissipation
1 05
mW
DC Forward Current
30
mA
Peak Forward Current [1]
1 50
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.2
DATE:DEC/05/2002
PAGE: 2 OF 4
REV NO: V.2
DATE:DEC/05/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.2
DATE:DEC/05/2002
PAGE: 4 OF 4
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