® CLD-DS39 Rev 6 Product family data sheet ® Cree XLamp ML-B LEDs Product Description The Cree brings and XLamp Table of Contents • Available in white (2200 K and Characteristics............................ 2 reliability 2600 K to 8300 K CCT) and Flux Characteristics...................... 2 1/4-watt 80-, 85- and 90-CRI minimum Relative Spectral Power ML-B lighting-class performance FEATURES to LED LEDs. The XLamp ML-B expands • ANSI-compatible sub-bins Distribution................................ 3 Cree’s • Maximum drive current: Relative Flux vs. Junction lighting-class leadership to linear and distributed lighting applications. With XLamp lightingclass reliability, a wide viewing angle, uniform light output, and industry-leading chromaticity 175 mA • 120° viewing angle, uniform chromaticity profile • Electrically neutral thermal path Temperature............................... 3 Electrical Characteristics............... 4 Relative Flux vs. Current.............. 4 Thermal Design........................... 5 Typical Spatial Distribution............ 5 binning in a 3.5-mm X 3.5‑mm • RoHS and REACh-compliant Reflow Soldering Characteristics.... 6 package, • UL-recognized component Notes......................................... 7 LED of the continues XLamp Cree’s segment-focused ML-B history (E349212) Mechanical Dimensions................ 9 product Tape and Reel............................10 innovation in LEDs for lighting Packaging..................................11 applications. The XLamp ML-B LED brings high performance and a smooth look to a wide range of lighting www. cree.com/Xlamp applications, including linear lighting, fluorescent retrofits and retail-display lighting. Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 XLamp ML-B LEDs Characteristics Characteristics Unit Thermal resistance, junction to solder point °C/W 25 degrees 120 Viewing angle (FWHM) Temperature coefficient of voltage Minimum mV/°C Typical Maximum -3.5 ESD classification (HBM per Mil-Std-883D) Class 2 DC forward current mA 175 Reverse voltage V 5 Forward voltage (@ 80 mA) V LED junction temperature °C 3.3 3.5 150 Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp ML-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp ML-B LED Binning and Labeling document. Color Cool White Warm White 80-CRI Warm White 85-CRI Warm White 90-CRI Warm White CCT Range Base Order Codes Min. Luminous Flux (lm) @ 80 mA Order Code Min. Max. Group Flux (lm) 4500 K 8300 K J0 23.5 MLBAWT-A1-0000-000W51 3700 K 4300 K J0 23.5 MLBAWT-A1-0000-000WE5 H0 18.1 MLBAWT-A1-0000-000VE5 2800 K 3200 K J0 23.5 MLBAWT-A1-0000-000WE7 H0 18.1 MLBAWT-A1-0000-000VE7 2000 K 2400 K G0 13.9 MLBAWT-A1-0000-000UEA 3700 K 4300 K H0 18.1 MLBAWT-H1-0000-000VE5 2800 K 3200 K H0 18.1 MLBAWT-H1-0000-000VE7 3700 K 4300 K H0 18.1 MLBAWT-P1-0000-000VE5 2800 K 3200 K H0 18.1 MLBAWT-P1-0000-000VE7 3700 K 4300 K H0 18.1 MLBAWT-U1-0000-000VE5 2800 K 3200 K H0 18.1 MLBAWT-U1-0000-000VE7 Notes: • Cree maintains a tolerance of ± 7% on flux measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ± 2% for CRI measurements, • Typical CRI for Cool White (4300 K – 8300 K CCT) is 75. • Typical CRI for Warm White (2600 K – 4300 K CCT) is 80. • Minimum CRI for 80-CRI White is 80. • Minimum CRI for 85-CRI White is 85. • Minimum CRI for 90-CRI White is 90. Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 2 XLamp ML-B LEDs Relative Spectral Power Distribution Relative Radiant Power (%) 100 80 5000K - 8300K CCT 3500K - 5000K CCT 60 2600K - 3500K CCT 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Relative Flux vs. Junction Temperature (IF = 80 mA) 100% Relative Luminous Flux 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 3 XLamp ML-B LEDs Electrical Characteristics (TJ = 25 °C) 180 Forward Current (mA) 160 140 120 100 80 60 40 20 0 2.50 2.75 3.00 3.25 3.50 3.75 4.00 Forward Voltage (V) Relative Flux vs. Current (TJ = 25 °C) Relative Luminous Flux (%) 200% 180% 160% 140% 120% 100% 80% 60% 40% 20% 0% 0 25 50 75 100 125 150 175 Forward Current (mA) Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 4 XLamp ML-B LEDs Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 200 180 Maximum Current (mA) 160 140 120 100 80 Rj-a = 30°C/W 60 Rj-a = 40°C/W 40 Rj-a = 50°C/W 20 Rj-a = 60°C/W 0 0 25 50 75 100 125 150 Ambient Temperature (ºC) Typical Spatial Distribution Relative Luminous Intensity (%) 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 5 XLamp ML-B LEDs Reflow Soldering Characteristics In testing, Cree has found XLamp ML-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C 60-120 seconds 60-180 seconds 183 °C 217 °C 60-150 seconds 60-150 seconds 215 °C 260 °C 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Average Ramp-Up Rate (Tsmax to Tp) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. Note: While the high reflow temperatures (above) have been approved, Cree’s best practice guideline for reflow is to use as low a temperature as possible during the reflow soldering process for these LEDs. Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 6 XLamp ML-B LEDs Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity Maximum Percent Relative Humidity XLamp ML-B LEDs are shipped in sealed, moisture-barrier Temp. bags (MBB) designed for long shelf life. If XLamp ML-B LEDs 30% 40% 50% 60% 70% 80% 90% 35 ºC - - - 17 1 .5 .5 are exposed to moist environments after opening the MBB 30 ºC - - - 28 1 1 1 packaging but before soldering, damage to the LED may occur 25 ºC - - - - 2 1 1 during the soldering operation. The derating table at right 20 ºC - - - - 2 1 1 defines the maximum exposure time (in days) for an XLamp ML-B LED in the listed humidity and temperature conditions. LEDs with exposure time longer than the time specified below must be baked according to the baking conditions listed below. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. Baking Conditions It is not necessary to bake all XLamp ML-B LEDs. Only the LEDs that meet all of the following criteria must be baked: 1. LEDs that have been removed from the original MBB packaging. 2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above. 3. LEDs that have not been soldered. LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking. Do not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 7 XLamp ML-B LEDs Storage Conditions XLamp ML-B LEDs that have been removed from the original MBB packaging but not soldered should be stored in one of the following ways: • Store the parts in a rigid metal container with a tight-fitting lid. Verify that the storage temperature is <30 °C, and place fresh desiccant and an RH indicator in the container to verify that the RH is no greater than 60%. • Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater than 60%. • For short-term store only: LEDs can be resealed in the original MBB bag soon after opening. Fresh desiccant may be needed. Use the included humidity indicator card to verify <60% RH. If an environment of <60% RH is not available for storage, XLamp ML-B LEDs should be baked (described above) before reflow soldering. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as amended through June 8, 2011. RoHS Declarations for this product can be obtain from your Cree representative or obtained from the Product Ecology section of www.cree.com. REACh Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notices of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh Declaration. Historical REACh banned substance information (substances restricted or banned in the EU prior to 2010) is also available upon request. UL Recognized Component Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the Cree LED Eye Safety Application Note (www.cree.com/xlamp_app_notes/led_eye_safety). Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 8 XLamp ML-B LEDs Mechanical Dimensions (TA = 25 °C) MX3535 Pad Layout are ±.13 mm unless otherwise indicated. All measurements Top View Top View Bottom View Side View Recommended FR4 Solder Pad Recommended MCPCB Solder Pad Alternative Solder Pad Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 9 6 5 4 3 2 1 REVISONS NOTICE EE CONFIDENTIAL. THIS PLOT AND THE INFORMATION NTAINED WITHIN ARE THE PROPRIETARY AND NFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT Y NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY AUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT CREE INC. REV DESCRIPTION BY DATE A Released J.L. 7/1/09 B ADDED CATHODE AND ANODE NOTES DC 2/26/12 1.5±.1 4.0±.1 XLamp ML-B LEDs 8.0±.1 1.75±.10 APP'D 2.5±.1 D Cathode Side Tape and Reel +.3 12.0 tapes conform to EIA-481D, Automated Component Handling Systems Standard. All Cree carrier .0 All dimensions in mm. Cathode Anode Side Mark (denoted by + and circle) (4 ) ( (8 ) 1.5 ) C User Feed Direction (1.75 ) CATHODE SIDE END (1.55 ) START (12 ) Trailer 160mm (min) of empty Trailerpockets 160mm with (min) oftape sealed empty pockets (20sealed pockets with tapemin.) Loaded Pockets (1,000 Lamps) Loaded Pockets (1,400 pcs /Reel (20 pockets min.) ANODE SIDE Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) B User Feed Direction Cover Tape THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° DATE DRAWN BY D. Seibel DATE APPROVED DATE 5 4 3 Phone (919) 313-5300 Fax (919) 313-5558 A TITLE Carrier Loading Specification-MX6 MATERIAL SIZE FINAL PROTECTIVE FINISH SCALE SURFACE FINISH: 1.6 6 4600 Silicon Drive Durham, N.C 27703 7/1/09 CHECK Pocket Tape 2 C 4.000 REV. DRAWING NO. 2402-00005 SHEET 1 13mm 7" Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 10 B OF 1 /2 XLamp ML-B LEDs Packaging Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Dessicant (inside bag) Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Qty, Reel ID, PO # Humidity Indicator Card (inside bag) Label with Cree Bin Code, Qty, Reel ID Boxed Reel Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Patent Label (on bottom of box) Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 11