Power LNK353G Enhanced, energy efficient, low power off-line switcher ic Datasheet

LNK353/354
®
LinkSwitch-HF Family
Enhanced, Energy Efficient, Low Power
Off-Line Switcher IC
Product Highlights
Features Optimized for Lowest System Cost
• Fully integrated auto-restart for short-circuit and open
loop protection
• Self-biased supply – saves transformer auxiliary winding
and associated bias supply components
• Tight tolerances and negligible temperature variation on
key parameters eases design and lowers cost
• High maximum switching frequency allows very low
flux density transformer designs, practically eliminating
audible noise
• Frequency jittering greatly reduces EMI
• Packages with large creepage to high voltage pin
• Lowest component count switcher solution
Much Better Performance over Linear/RCC
• Lower system cost than RCC, discrete PWM and other
integrated solutions
• Universal input range allows worldwide operation
• Simple ON/OFF control – no loop compensation needed
• No bias winding – simpler, lower cost transformer
• High frequency switching – smaller and lower cost
transformer
• Very low component count – higher reliability and single
side printed circuit board
• High bandwidth provides fast turn on with no overshoot
and excellent transient load response
• Current limit operation rejects line frequency ripple
• Built-in current limit and hysteretic thermal shutdown
protection
®
EcoSmart – Extremely Energy Efficient
• No-load consumption <300 mW without bias winding at
265 VAC input
• Meets California Energy Commission (CEC), Energy
Star, and EU requirements
Applications
• Chargers for cell/cordless phones, PDAs, digital cameras,
MP3/portable audio devices, shavers etc.
• Standby and auxiliary supplies
Description
LinkSwitch-HF integrates a 700 V power MOSFET, oscillator,
simple ON/OFF control scheme, a high voltage switched current
+
DC
Output
Wide Range
HV DC Input
D
LinkSwitch-HF
+
FB
BP
S
PI-3855-022704
Figure 1. Typical Standby Application.
OUTPUT POWER TABLE
PRODUCT(3)
230 VAC ±15%
Adapter(1)
85-265 VAC
Open
Open
Adapter(1)
Frame(2)
Frame(2)
LNK353 P or G
3W
4W
LNK354 P or G
3.5 W
5W
2.5 W(4)
3W
(4)
3W
4.5 W
Table 1. Notes: 1. Typical continuous power in a non-ventilated
enclosed adapter measured at 50 °C ambient. 2. Maximum practical
continuous power in an open frame design with adequate heat
sinking, measured at 50 °C ambient. 3. Packages: P: DIP-8B,
G: SMD-8B. For lead-free package options, see Part Ordering
Information. 4. For designs without a Y capacitor, the available power
may be lower (see Key Applications Considerations).
source, frequency jittering, cycle-by-cycle current limit, and
thermal shutdown circuitry onto a monolithic IC. The start-up
and operating power are derived directly from the DRAIN pin,
eliminating the need for a bias winding and associated circuitry.
The 200 kHz maximum switching frequency allows very
low flux transformer designs, practically eliminating audible
noise with the simple ON/OFF control scheme using standard
varnished transformer construction. Efficient operation at this
high switching frequency is achieved due to the optimized
switching characteristics and small capacitances of the integrated
power MOSFET. The fully integrated auto-restart circuit safely
limits output power during fault conditions such as output short
circuit or open loop, reducing component count and secondary
feedback circuitry cost. The internal oscillator frequency is
jittered to significantly reduce both the quasi-peak and average
EMI, minimizing filtering cost.
February 2005
LNK353/354
BYPASS
(BP)
DRAIN
(D)
REGULATOR
5.8 V
FAULT
PRESENT
AUTORESTART
COUNTER
CLOCK
RESET
+
5.8 V
4.85 V
BYPASS PIN
UNDER-VOLTAGE
-
CURRENT LIMIT
COMPARATOR
6.3 V
+
VI
-
LIMIT
JITTER
CLOCK
DCMAX
OSCILLATOR
FEEDBACK
(FB)
THERMAL
SHUTDOWN
1.65 V -VT
S
Q
R
Q
LEADING
EDGE
BLANKING
SOURCE
(S)
PI-2367-021105
Figure 2. Functional Block Diagram.
Pin Functional Description
DRAIN (D) Pin:
Power MOSFET drain connection. Provides internal operating
current for both start-up and steady-state operation.
BYPASS (BP) Pin:
Connection point for a 0.1 µF external bypass capacitor for the
internally generated 5.8 V supply.
FEEDBACK (FB) Pin:
During normal operation, switching of the power MOSFET is
controlled by this pin. MOSFET switching is terminated when
a current greater than 49 µA is delivered into this pin.
SOURCE (S) Pin:
This pin is the power MOSFET source connection. It is also the
ground reference for the BYPASS and FEEDBACK pins.
2
F
2/05
P Package (DIP-8B)
G Package (SMD-8B)
S
1
8
S
S
2
7
S
BP
3
FB
4
5
D
PI-3491-111903
Figure 3. Pin Configuration.
LNK353/354
LinkSwitch-HF combines a high voltage power MOSFET
switch with a power supply controller in one device. Unlike
conventional PWM (pulse width modulator) controllers,
LinkSwitch-HF uses a simple ON/OFF control to regulate the
output voltage. The LinkSwitch-HF controller consists of an
oscillator, feedback (sense and logic) circuit, 5.8 V regulator,
BYPASS pin under-voltage circuit, over-temperature protection,
frequency jittering, current limit circuit, leading edge blanking
and a 700 V power MOSFET. The LinkSwitch-HF incorporates
additional circuitry for auto-restart.
Oscillator
The typical oscillator frequency is internally set to an average
of 200 kHz. Two signals are generated from the oscillator: the
maximum duty cycle signal (DCMAX) and the clock signal that
indicates the beginning of each cycle.
The LinkSwitch-HF oscillator incorporates circuitry that
introduces a small amount of frequency jitter, typically 16 kHz
peak-to-peak, to minimize EMI emission. The modulation rate of
the frequency jitter is set to 1.5 kHz to optimize EMI reduction
for both average and quasi-peak emissions. The frequency
jitter should be measured with the oscilloscope triggered at
the falling edge of the DRAIN waveform. The waveform in
Figure 4 illustrates the frequency jitter of the LinkSwitch-HF.
Feedback Input Circuit
The feedback input circuit at the FB pin consists of a low
impedance source follower output set at 1.65 V. When the current
delivered into this pin exceeds 49 µA, a low logic level (disable)
is generated at the output of the feedback circuit. This output
is sampled at the beginning of each cycle on the rising edge of
the clock signal. If high, the power MOSFET is turned on for
that cycle (enabled), otherwise the power MOSFET remains off
(disabled). Since the sampling is done only at the beginning of
each cycle, subsequent changes in the FB pin voltage or current
during the remainder of the cycle are ignored.
5.8 V Regulator and 6.3 V Shunt Voltage Clamp
The 5.8 V regulator charges the bypass capacitor connected
to the BYPASS pin to 5.8 V by drawing a current from the
voltage on the DRAIN, whenever the MOSFET is off. The
BYPASS pin is the internal supply voltage node for the
LinkSwitch-HF. When the MOSFET is on, the LinkSwitch-HF
runs off of the energy stored in the bypass capacitor. Extremely
low power consumption of the internal circuitry allows the
LinkSwitch-HF to operate continuously from the current drawn
from the DRAIN pin.Abypass capacitor value of 0.1 µF is sufficient
for both high frequency decoupling and energy storage.
In addition, there is a 6.3 V shunt regulator clamping the
BYPASS pin at 6.3 V when current is provided to the BYPASS
pin through an external resistor. This facilitates powering of
LinkSwitch-HF externally through a bias winding to decrease
the no-load consumption to less than 50 mW.
BYPASS Pin Under-Voltage
The BYPASS pin under-voltage circuitry disables the power
MOSFET when the BYPASS pin voltage drops below 4.85 V.
Once the BYPASS pin voltage drops below 4.85 V, it must rise
back to 5.8 V to enable (turn-on) the power MOSFET.
Over-Temperature Protection
The thermal shutdown circuitry senses the die temperature.
The threshold is set at 142 °C typical with a 75 °C hysteresis.
When the die temperature rises above this threshold (142 °C) the
power MOSFET is disabled and remains disabled until the die
temperature falls by 75 °C, at which point it is re-enabled.
Current Limit
The current limit circuit senses the current in the power MOSFET.
When this current exceeds the internal threshold (ILIMIT), the
power MOSFET is turned off for the remainder of that cycle.
The leading edge blanking circuit inhibits the current limit
comparator for a short time (tLEB) after the power MOSFET
is turned on. This leading edge blanking time has been set so
that current spikes caused by capacitance and rectifier reverse
recovery time will not cause premature termination of the
switching pulse.
Auto-Restart
In the event of a fault condition such as output overload, output
short circuit, or an open loop condition, LinkSwitch-HF enters
into auto-restart operation. An internal counter clocked by the
oscillator gets reset every time the FB pin is pulled high. If
the FB pin is not pulled high for 30 ms, the power MOSFET
switching is disabled for 650 ms. The auto-restart alternately
enables and disables the switching of the power MOSFET until
the fault condition is removed.
600
500
V
PI-3857-022504
LinkSwitch-HF Functional
Description
DRAIN
400
300
200
100
0
208 kHz
192 kHz
6.4
0
Figure 4. Frequency Jitter.
Time (µs)
F
2/05
3
LNK353/354
CY1
100 pF
D6
SS14
T1
EE16
D1
1N4005
D2
1N4005
R1
100 kΩ
RF1
8.2 Ω
2.5 W
C3
2.2 nF
400 V
R3
200 Ω
5 4 5
J1
C1
4.7 µF
400 V
85-265
VAC
NC NC
C2
4.7 µF
400 V
J2
LinkSwitch-HF
D3
1N4005
8
3
D5
1N4007GP
9
U1
LNK354P
D4
1N4005
L1
1 mH
D
FB
R4
5.1 kΩ
R5
68 Ω
C5
2.2 nF
5.7 V,
400 mA
J3-2
C6
330 µF
16 V
R6
6.8 Ω
R7
220 Ω
RTN
J3-1
Q1
MMST
3906
VR1
BZX79B5V1
5.1 V, 2%
R8
390 Ω
R9
200 Ω
BP
S
C4
100 nF
U2B
U2A
PC817D PC817D
R10
2.4 Ω
1W
PI-3891-070204
Figure 5. Universal Input, 5.7 V, 400 mA, Constant Voltage, Constant Current Battery Charger Using LinkSwitch-HF.
Applications Example
A 2.4 W CC/CV Charger Adapter
The circuit shown in Figure 5 is a typical implementation of
a 5.7 V, 400 mA, constant voltage, constant current (CV/CC)
battery charger.
The input bridge formed by diodes D1-D4, rectifies the AC
input voltage. The rectified AC is then filtered by the bulk
storage capacitors C1 and C2. Resistor RF1 is a flameproof,
fusible, wire wound type and functions as a fuse, inrush current
limiter and, together with the π filter formed by C1, C2 and L1,
differential mode noise attenuator.
This simple EMI filtering, together with the frequency jittering
of LinkSwitch-HF (U1), a small value Y1 capacitor (CY1),
and shield windings within T1, and a secondary-side RC
snubber (R5, C5), allows the design to meet both conducted
and radiated EMI limits. The low value of CY1 is important
to meet the requirement of low line frequency leakage current,
in this case <10 µA.
The rectified and filtered input voltage is applied to the primary
winding of T1. The other side of the transformer primary is
driven by the integrated MOSFET in U1. Diode D5, C3, R1
and R3 form the primary clamp network. This limits the peak
drain voltage due to leakage inductance. Resistor R3 allows the
use of a slow, low cost rectifier diode by limiting the reverse
current through D5 when U1 turns on. The selection of a slow
diode improves efficiency and conducted EMI.
4
F
2/05
Output rectification is provided by Schottky diode D6. The low
forward voltage provides high efficiency across the operating
range and the low ESR capacitor C6 minimizes output voltage
ripple.
In constant voltage (CV) mode, the output voltage is set by the
Zener diode VR1 and the emitter-base voltage of PNP transistor
Q1. The VBE of Q1 divided by the value of R7 sets the bias
current through VR1 (~2.7 mA). When the output voltage
exceeds the threshold voltage determined by Q1 and VR1, Q1
is turned on and current flows through the LED of U2. As the
LED current increases, the current fed into the FEEDBACK
pin increases, disabling further switching cycles of U1. At
very light loads, almost all switching cycles will be disabled,
giving a low effective switching frequency and providing low
no-load consumption.
During load transients, R6 and R8 ensure that the ratings of Q1 are
not exceeded while R4 prevents C4 from being discharged.
Resistors R9 and R10 form the constant current (CC) sense
circuit. Above approximately 400 mA, the voltage across the
sense resistor exceeds the optocoupler diode forward conduction
voltage of approximately 1 V. The current through the LED
is therefore determined by the output current and CC control
dominates over the CV feedback loop. CC control is maintained
even under output short circuit conditions.
LNK353/354
Key Application Considerations
LinkSwitch-HF Design Considerations
Output Power Table
Data sheet maximum output power table (Table 1) represents
the maximum practical continuous output power level that can
be obtained under the following assumed conditions:
1. The minimum DC input voltage is 90 V or higher for 85 VAC
input, or 240 V or higher for 230 VAC input or 115 VAC
with a voltage doubler. The value of the input capacitance
should be large enough to meet these criteria for AC input
designs.
2. Secondary output of 5.5 V with a Schottky rectifier diode.
3. Assumed efficiency of 70%.
4. Operating frequency of fOSC(min) and ILIMIT(min).
5. Voltage only output (no secondary side constant current
circuit).
6. Continuous mode operation (0.6 ≤ KP ≤ 1).
7. The part is board mounted with SOURCE pins soldered
to a sufficient area of copper to keep the SOURCE pin
temperature at or below 100 °C.
8. Ambient temperature of 50 °C for open frame designs
and an internal enclosure temperature of 60 °C for adapter
designs.
Below a value of 1, KP is the ratio of ripple to peak primary
current. Above a value of 1, KP is the ratio of primary MOSFET
off time to the secondary diode conduction time.
Operating at a lower effective switching frequency can simplify
meeting conducted and radiated EMI limits, especially for
designs where the safety Y capacitor must be eliminated. By
using a lower effective full load frequency, the calculated
value of the primary inductance is higher than required for
power delivery. However, the maximum power capability at
this lower operating frequency will be lower than the values
shown in Table 1.
Audible Noise
The cycle skipping mode of operation used in LinkSwitch-HF
can generate audio frequency components in the transformer.
To limit this audible noise generation, the transformer should
be designed such that the peak core flux density is below
1250 Gauss (125 mT). Following this guideline and using the
standard transformer production technique of dip varnishing
practically eliminates audible noise. Higher flux densities
are possible however, careful evaluation of the audible noise
performance should be made using production transformer
samples before approving the design.
Ceramic capacitors that use dielectrics such as Z5U, when used
in clamp circuits, may also generate audio noise. If this is the
case, try replacing them with a capacitor having a different
dielectric, for example a polyester film type.
LinkSwitch-HF Layout Considerations
See Figure 6 for a recommended circuit board layout for
LinkSwitch-HF.
Single Point Grounding
Use a single point ground connection from the input filter
capacitor to the area of copper connected to the SOURCE
pins.
Bypass Capacitor (CBP)
The BYPASS pin capacitor should be located as near as possible
to the BYPASS and SOURCE pins.
Primary Loop Area
The area of the primary loop that connects the input filter
capacitor, transformer primary and LinkSwitch-HF together
should be kept as small as possible.
Primary Clamp Circuit
A clamp is used to limit peak voltage on the DRAIN pin at turn
off. This can be achieved by using an RCD clamp (as shown
in Figure 5) or a Zener (~200 V) and diode clamp across the
primary winding. In all cases, to minimize EMI, care should be
taken to minimize the circuit path from the clamp components
to the transformer and LinkSwitch-HF.
Thermal Considerations
The copper area underneath the LinkSwitch-HF acts not only
as a single point ground, but also as a heatsink. As this area is
connected to the quiet source node, this area should be maximized
for good heatsinking of LinkSwitch-HF. The same applies to
the cathode of the output diode.
Y-Capacitor
The placement of the Y-capacitor should be directly from
the primary input filter capacitor positive terminal to the
common/return terminal of the transformer secondary. Such
a placement will route high magnitude common mode surge
currents away from the LinkSwitch-HF device. Note that if an
input π (C, L, C) EMI filter is used, then the inductor in the
filter should be placed between the negative terminals of the
input filter capacitors.
Optocoupler
Place the optocoupler physically close to the LinkSwitch-HF to
minimize the primary side trace lengths. Keep the high current,
high voltage drain and clamp traces away from the optocoupler
to prevent noise pick up.
Output Diode
For best performance, the area of the loop connecting the
secondary winding, the output diode and the output filter
capacitor should be minimized. In addition, sufficient copper
area should be provided at the anode and cathode terminals
F
2/05
5
LNK353/354
of the diode for heatsinking. A larger area is preferred at the
quiet cathode terminal. A large anode area can increase high
frequency radiated EMI.
Quick Design Checklist
As with any power supply design, all LinkSwitch-HF designs
should be verified on the bench to make sure that component
specifications are not exceeded under worst-case conditions. The
following minimum set of tests is strongly recommended:
1. Maximum drain voltage – Verify that VDS does not exceed
675 V at the highest input voltage and peak (overload) output
power.
2. Maximum drain current – At maximum ambient temperature,
maximum input voltage and peak output (overload) power,
verify drain current waveforms for any signs of transformer
saturation and excessive leading edge current spikes at
startup. Repeat under steady state conditions and verify that
TOP VIEW
the leading edge current spike event is below ILIMIT(MIN) at the
end of the tLEB(MIN). Under all conditions, the maximum drain
current should be below the specified absolute maximum
ratings.
3. Thermal Check – At specified maximum output power,
minimum input voltage and maximum ambient temperature,
verify that the temperature specifications are not exceeded
for LinkSwitch-HF, transformer, output diode, and output
capacitors. Enough thermal margin should be allowed for
part-to-part variation of the RDS(ON) of LinkSwitch-HF as
specified in the data sheet. Under low line, maximum power,
a maximum LinkSwitch-HF SOURCE pin temperature of
100 °C is recommended to allow for these variations.
Design Tools
Up-to-date information on design tools can be found at the
Power Integrations website: www.powerint.com.
Input Filter
Capacitor
Y1Capacitor
+
HV DC
Input
-
PRI
S
T
r
a
n
s
f
o
r
m
e
r
+
DC
Out
-
Output Filter
Capacitor
SEC
D
S
LinkSwitch-HF
S
S
BP
FB
Optocoupler
CBP
Figure 6. Recommended Printed Circuit Layout for LinkSwitch-HF in a Flyback Converter Configuration.
6
F
2/05
Maximize hatched copper
areas (
) for optimum
heatsinking
PI-3890-102704
LNK353/354
ABSOLUTE MAXIMUM RATINGS(1,5)
DRAIN Voltage .................................................. -0.3 V to 700 V
Peak DRAIN Current......................................400 mA (750 mA)(2)
FEEDBACK Voltage ................................................ -0.3 V to 9 V
FEEDBACK Current .................................................... 100 mA
BYPASS Voltage...................................................... -0.3 V to 9 V
Storage Temperature .......................................... -65 °C to 150 °C
Operating Junction Temperature(3) ..................... -40 °C to 150 °C
Lead Temperature(4).......................................................... 260 °C
Notes:
1. All voltages referenced to SOURCE, TA = 25 °C.
2. The higher peak DRAIN current is allowed while the
DRAIN voltage is less than 400 V.
3. Normally limited by internal circuitry.
4. 1/16 in. from case for 5 seconds.
5. Maximum ratings specified may be applied, one at a time,
without causing permanent damage to the product.
Exposure to Absolute Maximum Rating conditions for
extended periods of time may affect product reliability.
THERMAL IMPEDANCE
Thermal Impedance: P or G Package:
Notes:
(θJA) ........................... 70 °C/W(2); 60 °C/W(3) 1. Measured on pin 2 (SOURCE) close to plastic interface.
(θJC)(1) ............................................... 11 °C/W 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
Conditions
Parameter
Symbol
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 7
(Unless Otherwise Specified)
Min
Typ
Max
186
200
214
Units
CONTROL FUNCTIONS
Output Frequency
Maximum Duty
Cycle
FEEDBACK Pin
Turnoff Threshold
Current
FEEDBACK Pin
Voltage
DRAIN Supply
Current
BYPASS Pin
Charge Current
BYPASS Pin
Voltage
BYPASS Pin
Voltage Hysteresis
fOSC
TJ = 25 °C
Average
Peak-Peak Jitter
16
kHz
DCMAX
S2 Open
60
63
%
IFB
TJ = 25 °C
30
49
68
µA
VFB
IFB = 49 µA
1.54
1.65
1.76
V
IS1
VFB ≥2 V
(MOSFET Not Switching)
See Note A
200
275
µA
IS2
FEEDBACK Open
(MOSFET Switching)
See Notes A, B
280
365
µA
ICH1
VBP = 0 V, TJ = 25 °C
See Note C
-5.5
-3.3
-1.8
ICH2
VBP = 4 V, TJ = 25 °C
See Note C
-3.8
-2.1
-1.0
VBP
5.55
5.8
6.10
V
VBPH
0.8
0.95
1.2
V
mA
F
2/05
7
LNK353/354
Conditions
Parameter
Symbol
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 7
(Unless Otherwise Specified)
Min
Typ
Max
Units
CONTROL FUNCTIONS (cont)
BYPASS Pin
Supply Current
IBPSC
See Note D
68
µA
CIRCUIT PROTECTION
di/dt = 90 mA/µs
TJ = 25 °C
Current Limit
ILIMIT
(See
Note E)
tLEB
Thermal
Shutdown
Temperature
TSD
Thermal
Shutdown
Hysteresis
TSHD
OFF-State Drain
Leakage Current
Breakdown
Voltage
RDS(ON)
F
2/05
300
336
LNK353
390
470
610
LNK354
280
360
500
170
215
135
142
See Note G
LNK353
ID = 25 mA
LNK354
ID = 25 mA
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
Measured in a Typical Flyback
Converter Application
150
°C
°C
34
40
54
63
24
28
38
45
50
700
ns
ns
75
TJ = 25 °C
VBP = 6.2 V, VFB ≥2 V,
TJ = 25 °C
tF
8
264
LNK354
BVDSS
Fall Time
274
268
VBP = 6.2 V, VFB ≥2 V,
VDS = 560 V,
TJ = 125 °C
tR
245
250
IDSS
Rise Time
215
233
TJ = 25 °C
See Note F
OUTPUT
ON-State
Resistance
198
mA
di/dt = 115 mA/µs
TJ = 25 °C
tON(MIN)
Leading Edge
Blanking Time
185
LNK353
di/dt = 400 mA/µs
TJ = 25 °C
di/dt = 500 mA/µs
TJ = 25 °C
Minimum On Time
172
Ω
µA
V
50
ns
50
ns
LNK353/354
Conditions
Parameter
Symbol
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 7
(Unless Otherwise Specified)
Min
Typ
Max
Units
OUTPUT (cont)
DRAIN Supply
Voltage
50
Output Enable
Delay
tEN
Output Disable
Setup Time
tDST
Auto-Restart
ON-Time
tAR
Auto-Restart Duty
Cycle
V
See Figure 9
TJ = 25 °C
See Note H
DCAR
10
µs
0.5
µs
31
ms
5
%
NOTES:
A. Total current consumption is the sum of IS1 and IDSS when FEEDBACK pin voltage is ≥2 V (MOSFET not
switching) and the sum of IS2 and IDSS when FEEDBACK pin is shorted to SOURCE (MOSFET switching).
B Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the
DRAIN. An alternative is to measure the BYPASS pin current at 6 V.
C. See Typical Performance Characteristics section Figure 14 for BYPASS pin start-up charging waveform.
D. This current is only intended to supply an optional optocoupler connected between the BYPASS and FEEDBACK
pins and not any other external circuitry.
E. For current limit at other di/dt values, refer to Figure 13.
F. This parameter is guaranteed by design.
G. This parameter is derived from characterization.
H. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to
frequency).
F
2/05
9
LNK353/354
470 Ω
5W
470 kΩ
D
S1
FB
S2
BP
50 V
S
S
S
S
50 V
0.1 µF
PI-3490-060204
Figure 7. LinkSwitch-HF General Test Circuit.
DCMAX
t2
HV 90%
(internal signal)
t1
tP
90%
FB
DRAIN
VOLTAGE
0V
t
D= 1
t2
VDRAIN
10%
tP =
tEN
1
fOSC
PI-3707-112503
PI-2048-033001
Figure 8. LinkSwitch-HF Duty Cycle Measurement.
10
F
2/05
Figure 9. LinkSwitch-HF Output Enable Timing.
LNK353/354
Typical Performance Characteristics
1.0
PI-2680-012301
1.2
Output Frequency
(Normalized to 25 °C)
PI-2213-012301
1.0
0.8
0.6
0.4
0.2
0
0.9
-50 -25
0
25
50
-50
75 100 125 150
-25
Junction Temperature (°C)
1.0
0.8
Normalized di/dt
di/dt = 1
di/dt = 6
0.6
0.4
0.2
50
100
100 125
PI-3892-061604
1.2
1.0
0.8
TBD
Normalized
0.6
0.4
LNK353
LNK354
0.2
LNK353
LNK354
150
Temperature (°C)
Figure 12. Current Limit vs. Temperature at
Normalized di/dt.
di/dt = 1
90 mA/µs
115 mA/µs
Normalized
Current
Limit = 1
185 mA
250 mA
6
1
2
3
4
5
Normalized di/dt
Figure 13. Current Limit vs. di/dt.
PI-2240-012301
7
BYPASS Pin Voltage (V)
75
0
0
5
4
3
2
1
400
350
DRAIN Current (mA)
0
-50
50
1.4
Normalized Current Limit
PI-3709-111203
Current Limit
(Normalized to 25 °C)
1.2
25
Figure 11. Frequency vs. Temperature.
Figure 10. Breakdown vs. Temperature.
1.4
0
Junction Temperature (°C)
PI-3949-102004
Breakdown Voltage
(Normalized to 25 °C)
1.1
25 °C
300
100 °C
250
200
Scaling Factors:
LNK353
0.7
LNK354
1.0
150
100
50
0
0
0
0.2
0.4
0.6
0.8
Time (ms)
Figure 14. BYPASS Pin Start-up Waveform.
1.0
0
2
4
6
8 10 12 14 16 18 20
DRAIN Voltage (V)
Figure 15. Output Characteristics.
F
2/05
11
LNK353/354
Typical Performance Characteristics (cont.)
PI-3888-052104
Drain Capacitance (pF)
1000
100
10
1
0
100
200
300
400
500
600
Drain Voltage (V)
Figure 16. COSS vs. Drain Voltage.
PART ORDERING INFORMATION
LinkSwitch Product Family
HF Series Number
Package Identifier
G
Plastic Surface Mount DIP
P
Plastic DIP
Lead Finish
Blank Standard (Sn Pb)
N
Pure Matte Tin (Pb-Free)
Tape & Reel and Other Options
LNK 354 G N - TL
12
F
2/05
Blank Standard Configurations
TL
Tape & Reel, 1 k pcs minimum, G Package only
LNK353/354
DIP-8B
⊕ D S .004 (.10)
-E-
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clockwise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
.137 (3.48)
MINIMUM
.240 (6.10)
.260 (6.60)
Pin 1
-D-
.367 (9.32)
.387 (9.83)
.125 (3.18)
.145 (3.68)
-T-
.015 (.38)
MINIMUM
SEATING
PLANE
.100 (2.54) BSC
.057 (1.45)
.068 (1.73)
(NOTE 6)
.008 (.20)
.015 (.38)
.120 (3.05)
.140 (3.56)
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
.048 (1.22)
.053 (1.35)
.014 (.36)
.022 (.56) ⊕ T E D S .010 (.25) M
P08B
PI-2551-121504
SMD-8B
⊕ D S .004 (.10)
.137 (3.48)
MINIMUM
-E-
.372 (9.45)
.388 (9.86)
⊕ E S .010 (.25)
.240 (6.10)
.260 (6.60)
Pin 1
.100 (2.54) (BSC)
-D-
.367 (9.32)
.387 (9.83)
.057 (1.45)
.068 (1.73)
(NOTE 5)
.125 (3.18)
.145 (3.68)
.032 (.81)
.037 (.94)
.048 (1.22)
.053 (1.35)
Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
.420
3. Pin locations start with Pin 1,
and continue counter-clock.046 .060 .060 .046
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
4. Minimum metal to metal
.080
spacing at the package body
Pin 1
for the omitted lead location
is .137 inch (3.48 mm).
.086
5. Lead width measured at
.186
package body.
.286
6. D and E are referenced
Solder Pad Dimensions
datums on the package
body.
.004 (.10)
.009 (.23)
.004 (.10)
.012 (.30)
.036 (0.91)
.044 (1.12)
0°- 8°
G08B
PI-2546-121504
F
2/05
13
LNK353/354
Notes
14
F
2/05
LNK353/354
Notes
F
2/05
15
LNK353/354
Revision Notes
Date
D
1) Released Final Data Sheet.
10/04
E
1) Added lead-free ordering information.
12/04
F
1) Minor error corrections.
2/05
For the latest updates, visit our website: www.powerint.com
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume
any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY
DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
PATENT INFORMATION
The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S.
and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrationsʼ patents
may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm.
LIFE SUPPORT POLICY
POWER INTEGRATIONSʼ PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:
1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform,
when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, EcoSmart, PI Expert and PI FACTS are trademarks of
Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2005, Power Integrations, Inc.
Power Integrations Worldwide Sales Support Locations
WORLD HEADQUARTERS
5245 Hellyer Avenue
San Jose, CA 95138, USA.
Main: +1-408-414-9200
Customer Service:
Phone: +1-408-414-9665
Fax: +1-408-414-9765
e-mail: [email protected]
GERMANY
Rueckertstrasse 3
D-80336, Munich
Germany
Phone: +49-89-5527-3910
Fax: +49-89-5527-3920
e-mail: [email protected]
JAPAN
Keihin Tatemono 1st Bldg 2-12-20
Shin-Yokohama, Kohoku-ku,
Yokohama-shi, Kanagawa ken,
Japan 222-0033
Phone: +81-45-471-1021
Fax: +81-45-471-3717
e-mail: [email protected]
TAIWAN
5F, No. 318, Nei Hu Rd., Sec. 1
Nei Hu Dist.
Taipei, Taiwan 114, R.O.C.
Phone: +886-2-2659-4570
Fax: +886-2-2659-4550
e-mail: [email protected]
CHINA (SHANGHAI)
Rm 807-808A,
Pacheer Commercial Centre,
555 Nanjing Rd. West
Shanghai, P.R.C. 200041
Phone: +86-21-6215-5548
Fax: +86-21-6215-2468
e-mail: [email protected]
INDIA
261/A, Ground Floor
7th Main, 17th Cross,
Sadashivanagar
Bangalore, India 560080
Phone: +91-80-5113-8020
Fax: +91-80-5113-8023
e-mail: [email protected]
KOREA
RM 602, 6FL
Korea City Air Terminal B/D, 159-6
Samsung-Dong, Kangnam-Gu,
Seoul, 135-728, Korea
Phone: +82-2-2016-6610
Fax: +82-2-2016-6630
e-mail: [email protected]
EUROPE HQ
1st Floor, St. Jamesʼs House
East Street, Farnham
Surrey, GU9 7TJ
United Kingdom
Phone: +44 (0) 1252-730-140
Fax: +44 (0) 1252-727-689
e-mail: [email protected]
CHINA (SHENZHEN)
Rm 2206-2207, Block A,
Electronics Science & Technology Bldg.
2070 Shennan Zhong Rd.
Shenzhen, Guangdong,
China, 518031
Phone: +86-755-8379-3243
Fax: +86-755-8379-5828
e-mail: [email protected]
ITALY
Via Vittorio Veneto 12
20091 Bresso MI
Italy
Phone: +39-028-928-6000
Fax: +39-028-928-6009
e-mail: [email protected]
SINGAPORE
51 Newton Road,
#15-08/10 Goldhill Plaza,
Singapore, 308900
Phone: +65-6358-2160
Fax: +65-6358-2015
e-mail: [email protected]
APPLICATIONS HOTLINE
World Wide +1-408-414-9660
16
F
2/05
APPLICATIONS FAX
World Wide +1-408-414-9760