NSC LMV951MKNOPB 2.7 mhz, rail-to-rail input and output amplifier with shutdown option Datasheet

LMV951
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LMV951 1V, 2.7 MHz, Rail-to-Rail Input and Output Amplifier with Shutdown Option
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FEATURES
DESCRIPTION
•
•
•
•
•
The LMV951 amplifier is capable of operating at
supply voltages from 0.9V to 3V with specified specs
at 1V and 1.8V single supply.
1
2
•
•
•
•
•
(Typical 1.0V Supply, unless Otherwise Noted)
Ensured 1V Single Supply Operation
Wide Bandwidth
No VOS Glitch over the Input CMVR
No Input IBIAS Current Reversal over VCM
Range
Buffered Output Stage
High Output Drive Capability
Output Short Circuit
– Sink Current 35 mA
– Source Current 45 mA
Rail-to-Rail Buffered Output
– At 600Ω Load 32 mV from Either Rail
– At 2 kΩ Load 12 mV from Either Rail
Temperature Range −40°C to 125°C
The input common mode range extends to both
power supply rails without the offset glitch and input
bias current phase reversal inherent to most rail to
rail input amplifiers.
Contrary to a conventional rail to rail output amplifier
the LMV951 has a buffered output stage providing an
open loop gain which is relatively unaffected by
resistive output loading. At 1V supply voltage, the
LMV951 is able to source and sink in excess of 35
mA and offers a gain bandwidth product of 2.7 MHz.
In shutdown mode the LMV951 consumes less than
50 nA of supply current.
APPLICATIONS
•
•
•
Battery Operated Systems
Battery Monitoring
Supply Current Monitoring
VIRTUAL GROUND CIRCUIT
Open Loop Gain and Phase
140
R1
120
VIRTUAL GROUND
R2
SD
V
-
C1
.01 PF
C2
1 PF
GAIN (dB)
+
140
120
PHASE
+
V
160
+
V = 1V
100
100
80
80
60
60
GAIN
40
40
20
20
0
0
-20
1
10
100
1k
10k 100k
PHASE (°)
160
1V
1M
-20
10M
FREQUENCY (Hz)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
ESD Tolerance
(3)
(1) (2)
Human Body Model
Machine Model
Supply Voltage (V+ – V−)
±0.3V
V+ +0.3V, V− −0.3V
Voltage at Input/Output Pin
Current at Input Pin
±10 mA
Junction Temperature
(4)
+150°C
Mounting Temperature
(2)
(3)
(4)
Infrared or Convection (20 sec)
Temperature Range
(1)
(2)
−40°C to +125°C
Supply Voltage
Thermal Resistance (θJA)
(2)
2
235°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.
OPERATING RATINGS
(1)
200V
3.1V
VIN Differential
(1)
2000V
0.9V to 3V
(2)
170°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.
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(1)
1V ELECTRICAL CHARACTERISTICS
Unless otherwise specified, all limits specified for at TA = 25°C, V+ = 1, V− = 0V, VCM = 0.5V, Shutdown = 0V, and RL = 1
MΩ.Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min
(2)
Typ
(3)
VOS
Input Offset Voltage
1.5
TC VOS
Input Offset Average Drift
0.15
IB
Input Bias Current
IOS
Input Offset Current
CMRR
Common Mode Rejection Ratio
PSRR
VCM
32
Power Supply Rejection Ratio
Large Signal Voltage Gain
VOUT
Output Voltage Swing High
Output Voltage Swing Low
IOUT
Output Short Circuit Current
IS
(4)
Supply Current
SR
Slew Rate
GBWP
Gain Bandwidth Product
en
Input - Referred Voltage Noise
in
Input-Referred Current Noise
THD
ISD
VSD
(2)
(3)
(4)
(5)
Units
2.8
3.0
mV
μV/°C
80
85
nA
nA
0V ≤ VCM ≤ 1V
67
55
77
0.1V ≤ VCM ≤ 1V
76
73
85
1V ≤ V+ ≤ 1.8V, VCM = 0.5V
70
67
92
1V ≤ V+ ≤ 3V, VCM = 0.5V
68
65
85
CMRR ≥ 67 dB
0
1.2
CMRR ≥ 55 dB
0
1.2
VOUT = 0.1V to 0.9V
RL = 600Ω to 0.5V
90
85
106
VOUT = 0.1V to 0.9V
RL = 2 kΩ to 0.5V
90
86
112
RL = 600Ω to 0.5V
50
62
25
RL = 2 kΩ to 0.5V
25
36
12
RL = 600Ω to 0.5V
70
85
32
RL = 2 kΩ to 0.5V
35
40
10
Sourcing
VO = 0V, VIN(DIFF) = ±0.2V
20
15
45
Sinking
VO = 1V, VIN(DIFF) = ±0.2V
20
13
35
dB
dB
mV from
rail
mA
370
480
520
Shutdown Mode VSD >0.6V
0.01
1.0
3.0
(5)
μA
1.4
V/μs
2.7
MHz
f = 1 kHz
25
nV/√Hz
f = 1 kHz
0.2
pA/√Hz
Total Harmonic Distortion
f = 1 kHz, AV = 1, RL = 1 kΩ
0.02
Shutdown Pin Current
Active Mode, VSD = 0V
.001
1
Shutdown Mode, VSD = 1V
.001
1
Shutdown Pin Voltage Range
See
V
dB
Active Mode VSD <0.4V
Active Mode
Shutdown Mode
(1)
(2)
0.2
Input Common-Mode Voltage Range
AV
Max
%
0
0.4
0.65
1
µA
V
Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions is very limited selfheating of the device.
All limits are specified by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
The short circuit test is a momentary test, the short circuit duration is 1.5 ms
Number specified is the average of the positive and negative slew rates.
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1.8V ELECTRICAL CHARACTERISTICS
(1)
Unless otherwise specified, all limits specified for at TA = 25°C, V+ = 1.8V, V− = 0V, VCM = 0.9V, Shutdown = 0V, and RL = 1
MΩ.Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min
(2)
Typ
Max
Units
2.8
3.0
mV
(3)
(2)
VOS
Input Offset Voltage
1.5
TC VOS
Input Offset Average Drift
0.15
IB
Input Bias Current
IOS
Input Offset Current
0.2
nA
CMRR
Common Mode Rejection Ratio
0V ≤ VCM ≤ 1.8V
82
80
93
dB
PSRR
Power Supply Rejection Ratio
1V ≤ V+ ≤ 1.8V, VCM = 0.5V
70
67
92
1V ≤ V+ ≤ 3V, VCM = 0.5V
68
65
85
VCM
AV
VOUT
36
CMRR ≥ 82 dB
−0.2
2
CMRR ≥ 80 dB
−0.2
2
Large Signal Voltage Gain
VOUT = 0.2 to 1.6V
RL = 600Ω to 0.9V
86
83
110
VOUT = 0.2 to 1.6V
RL = 2 kΩ to 0.9V
86
83
116
RL = 600Ω to 0.9V
50
60
33
RL = 2 kΩ to 0.9V
25
34
13
RL = 600Ω to 0.9V
80
105
54
RL = 2 kΩ to 0.9V
35
44
17
Sourcing
VO = 0V, VIN(DIFF) = ±0.2V
50
35
85
Sinking
VO = 1.8V, VIN(DIFF) = ±0.2V
45
25
80
Output Voltage Swing High
Output Short Circuit Current
IS
(4)
Supply Current
SR
Slew Rate
GBWP
Gain Bandwidth Product
en
Input - Referred Voltage Noise
in
Input-Referred Current Noise
THD
ISD
VSD
(2)
(3)
(4)
(5)
4
mA
780
880
Shutdown Mode VSD >1.3V
0.3
2.2
10
μA
1.4
V/μs
2.8
MHz
f = 1 kHz
25
nV/√Hz
f = 1 kHz
0.2
pA/Hz
Total Harmonic Distortion
f = 1 kHz, AV = 1, RL = 1 kΩ
0.02
Shutdown Pin Current
Active Mode, VSD = 0V
.001
1
Shutdown Mode, VSD = 1.8V
.001
1
Shutdown Pin Voltage Range
Active Mode
Shutdown Mode
(1)
mV from
rail
570
(5)
V
dB
Active Mode VSD <0.5V
See
nA
dB
Input Common-Mode Voltage
Range
Output Voltage Swing Low
IOUT
μV/°C
80
85
%
0
0.5
1.45
1.8
µA
V
Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions is very limited selfheating of the device.
All limits are specified by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
The short circuit test is a momentary test, the short circuit duration is 1.5 ms
Number specified is the average of the positive and negative slew rates.
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CONNECTION DIAGRAM
1
6
OUTPUT
V
-
5
2
+
+IN
3
+
V
SHUTDOWN
4
-IN
Figure 1. 6-Pin SOT23- Top View
See Package Number DDC
SIMPLIFIED SCHEMATIC
+
ABOVE V
GENERATOR
5
SHUTDOWN
V
+
6
INTERNAL
GAIN STAGE
IN-
IN+
1
OUTPUT
4
3
2
V
-
-
BELOW V
GENERATOR
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TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
Supply Current
vs.
Supply Voltage
Supply Current
vs.
Supply Voltage in Shutdown Mode
1.6
120
100
SUPPLY CURRENT (nA)
SUPPLY CURRENT (mA)
1.4
1.2
1
125°C
0.8
25°C
0.6
-40°C
0.4
1.2
1.6
2.4
2
60
125°C
40
25°C
2.8
0
0.8
3.2
1.2
1.6
2
2.4
2.8
3.2
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 2.
Figure 3.
Supply Current
vs.
Shutdown Voltage
Supply Current
vs.
Shutdown Voltage
0.5
0.8
+
125°C
V = 1V
25°C
25°C
125°C
0.4
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
-40°C
20
0.2
0.8
80
0.3
-40°C
0.2
0.1
+
V = 1.8V
0.6
0.4
-40°C
0.2
0
0
0
0.2
0.4
0.6
0.8
0.3
0
1
0.6
0.9
1.2
1.5
SHUTDOWN VOLTAGE (V)
SHUTDOWN VOLTAGE (V)
Figure 4.
Figure 5.
Supply Current
vs.
Shutdown Voltage
VOS
vs.
VCM
2
1.8
2
+
V = 3V
25°C
1.8
125°C
25°C
1.2
VOS (mV)
SUPPLY CURRENT (mA)
125°C
1.6
-40°C
0
1.6
1.4
-40°C
0.4
1.2
0
1
+
V = 1V
0
6
0.5
1
1.5
2
2.5
3
0
0.2
0.4
0.6
SHUTDOWN VOLTAGE (V)
VCM (V)
Figure 6.
Figure 7.
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0.8
1
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
VOS
vs.
VCM
VOS
vs.
VCM
1.4
1.6
125°C
1.2
125°C
VOS ( mV)
VOS (mV)
1.5
25°C
1.4
1.3
1
25°C
0.8
-40°C
0.6
-40°C
+
+
V = 3V
V = 1.8V
0.4
1.2
0.3
0
0.6
0.9
1.2
1.5
1.8
0.5
0
1
VCM (V)
1.5
2
2.5
3
VCM (V)
Figure 8.
Figure 9.
VOS
vs.
Supply Voltage
IBIAS
vs.
VCM
1.9
40
+
125°C
V = 1V
125°C
25°C
35
IBIAS (nA)
VOS (mV)
1.5
1.1
25°C
-40°C
30
25
0.7
-40°C
0.3
20
1.2
0.8
1.6
2
2.4
2.8
3.2
0
0.6
Figure 10.
Figure 11.
IBIAS
vs.
VCM
IBIAS
vs.
VCM
0.8
1
+
+
V = 3V
V = 1.8V
40
0.4
VCM (V)
46
41
0.2
SUPPLY VOLTAGE (V)
43
125°C
125°C
IBIAS (nA)
IBIAS (nA)
39
-40°C
38
40
25°C
-40°C
37
37
25°C
34
36
31
35
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
0
0.5
1
1.5
VCM (V)
VCM (V)
Figure 12.
Figure 13.
2
2.5
3
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
Sourcing Current
vs.
Supply Voltage
Sinking Current
vs
Supply Voltage
160
200
140
170
-40°C
-40°C
140
25°C
ISINK (mA)
ISOURCE (mA)
120
100
80
125°C
25°C
110
80
60
125°C
50
40
20
0.8
1.2
1.6
2.4
2.8
2
SUPPLY VOLTAGE (V)
20
0.8
3.2
1.2
1.6
2
Figure 14.
Figure 15.
Sourcing Current
vs.
Output Voltage
Sinking Current
vs.
Output Voltage
60
2.8
3.2
50
+
+
V = 1V
V = 1V
50
40
-40°C
-40°C
40
ISINK (mA)
ISOURCE (mA)
2.4
SUPPLY VOLTAGE (V)
25°C
30
125°C
30
25°C
20
20
125°C
10
10
0
0
0
0.2
0.4
0.6
0.8
1
0
0.2
0.4
0.6
0.8
VOUT
VOUT (V)
Figure 16.
Figure 17.
Sourcing Current
vs.
Output Voltage
Sinking Current
vs.
Output Voltage
120
100
1
+
+
V = 1.8V
V = 1.8V
-40°C
90
25°C
ISINK (mA)
ISOURCE (mA)
75
50
125°C
-40°C
60
25°C
30
25
125°C
0
0
0
8
0.3
0.6
0.9
1.2
1.5
1.8
0
0.3
0.6
0.9
1.2
VOUT (V)
VOUT (V)
Figure 18.
Figure 19.
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1.8
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
Sourcing Current
vs.
Output Voltage
Sinking Current
vs.
Output Voltage
160
210
+
+
V = 3V
V = 3V
140
180
-40°C
150
100
ISINK (mA)
ISOURCE (mA)
120
25°C
80
125°C
60
25°C
90
60
40
125°C
30
20
0
-40°C
120
0.5
0
1
2
1.5
2.5
0
0
3
0.5
1
VOUT (V)
Figure 21.
Positive Output Swing
vs.
Supply Voltage
Negative Output Swing
vs.
Supply Voltage
RL = 2 k:
40
VOUT FROM RAIL (mV)
30
125°C
20
25°C
10
125°C
20
10
0
0.8
1.2
1.6
2
2.4
2.8
-40°C
0
0.8
3.2
25°C
30
-40°C
1.2
1.6
2
2.4
2.8
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 22.
Figure 23.
Positive Output Swing
vs.
Supply Voltage
Negative Output Swing
vs.
Supply Voltage
3.2
140
70
RL = 600:
RL = 600:
120
60
125°C
VOUT FROM RAIL (mV)
VOUT FROM RAIL (mV)
3
50
RL = 2 k:
50
2.5
Figure 20.
40
VOUT FROM RAIL (mV)
2
1.5
VOUT (V)
25°C
40
-40°C
30
100
125°C
25°C
80
60
40
-40°C
20
0.8
1.2
1.6
2
2.4
2.8
3.2
20
0.8
1.2
1.6
2
2.4
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 24.
Figure 25.
2.8
3.2
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
Open Loop Gain and Phase with Capacitive Load
Open Loop Gain and Phase with Resistive Load
100
100
100
100
10 k:
20 pF
50 pF
60
80
60
60
40
40
80
PHASE
2 k:
20
20
20 pF 0
0
-20
-40
-20
50 pF
+
V = 1V
100 pF
RL = 2 k:
200 pF
-60
1k
100k
10k
1M
GAIN (dB)
200 pF
GAIN
PHASE (°)
GAIN (dB)
40
40
GAIN
10 k:
20
20
0
0
600:
-20
V = 1V
-40
-40
CL = 20 pF
10M
-60
100M
-60
1k
100k
10k
1M
Figure 26.
Open Loop Gain and Phase with Resistive Load
100
100
100
100
10 k:
20 pF
PHASE
60
80
80
50 pF
60
60
40
40
80
PHASE
2 k:
20 pF
20
0
0
GAIN (dB)
20
PHASE (°)
200 pF
GAIN
60
600:
100 pF
40
-60
100M
Figure 27.
Open Loop Gain and Phase with Capacitive Load
GAIN (dB)
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
80
-20
2 k:
+
-40
60
600:
100 pF
PHASE (°)
80
PHASE
40
GAIN
10 k:
20
20
0
0
PHASE (°)
80
600:
-20
-20
-20
50 pF
+
-40
-40
1M
10M
-60
100M
-60
1k
-40
100k
10k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 28.
Figure 29.
Open Loop Gain and Phase with Capacitive Load
100
100
20 pF
PHASE
10 k:
80
80
60
60
40
40
80
2 k:
PHASE
50 pF
60
-60
100M
Open Loop Gain and Phase with Resistive Load
100
100
80
V = 1.8V
CL = 20 pF
200 pF
100k
-20
2 k:
+
100 pF
-40 V = 1.8V
RL = 2 k:
-60
1k
10k
600:
60
20
20 pF
0
0
50 pF
-20
-40 V = 3V
RL = 2 k:
-60
1k
10k
-20
200 pF
100k
1M
10M
10 k:
20
20
0
0
600:
-20
100 pF
+
10
20
40
GAIN
2 k:
+
-40
-40
V = 3V
PHASE (°)
200 pF
GAIN
GAIN (dB)
40
PHASE (°)
GAIN (dB)
100 pF
-20
-40
CL = 20 pF
-60
100M
-60
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 30.
Figure 31.
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-60
100M
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
Large Signal Transient Response, AV = +1
10 mV/DIV
200 mV/DIV
Small Signal Transient Response, AV = +1
INPUT = 20 mVPP
f = 500 kHz
INPUT = 0.8 VPP
f = 100 kHz
+
+
V = 1V
V = 1V
2 PV/DIV
Figure 32.
Figure 33.
Small Signal Transient Response, AV = +1
Large Signal Transient Response, AV = +1
10 mV/DIV
200 mV/DIV
500 ns/DIV
INPUT = 20 mVPP
f = 500 kHz
INPUT = 0.8 VPP
f = 100 kHz
+
+
V = 1.8V
V = 1.8V
500 ns/DIV
2 PV/DIV
Figure 35.
Small Signal Transient Response, AV = +1
Large Signal Transient Response, AV = +1
10 mV/DIV
200 mV/DIV
Figure 34.
INPUT = 20 mVPP
f = 500 kHz
INPUT = 0.8 VPP
f = 100 kHz
+
+
V = 3V
V = 3V
500 ns/DIV
2 PV/DIV
Figure 36.
Figure 37.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
Phase Margin
vs.
Capacitive Load (stability)
100
Phase Margin
vs.
Capacitive Load (stability)
100
+
+
V = 1V
V = 1.8V
75
PHASE MARGIN (°)
PHASE MARGIN (°)
75
600:
50
2 k:
10 k:
25
0
10
100
1000
600:
50
2 k:
10 k:
25
0
10
10000
100
CAPACITIVE LOAD (pF)
1000
Figure 38.
Figure 39.
Phase Margin
vs.
Capacitive Load (stability)
PSRR
vs.
Frequency
100
10000
CAPACITIVE LOAD (pF)
120
+
V = 3V
1.8V
100
1V
600:
+PSRR
80
PSRR (dB)
PHASE MARGIN (°)
75
50
2 k:
3V
60
-PSRR
40
10 k:
1V, 1.8V, 3V
25
20
0
10
100
1000
0
100
10000
1k
CAPACITIVE LOAD (pF)
110
10k
100k
1M
FREQUENCY (Hz)
Figure 40.
Figure 41.
CMRR
vs.
Frequency
Input Referenced Voltage Noise
vs.
Frequency
140
+
V = 1.8V
CMRR (dB)
90
+
V = 3V
VOLTAGE NOISE (nV/ Hz)
100
+
V = 1V
80
70
60
50
40
100
+
V = 1V
100
V+ = 1.8V
80
+
V = 3V
60
40
+
V = 1V
20
1k
10k
100k
1M
0
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 42.
12
120
Figure 43.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 1V, V− = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
THD+N
vs.
Frequency
THD+N
vs.
Frequency
0.16
0.18
+
+
V = 1.8V
V = 1V
0.14
0.15
600:
0.12
600:
0.1
THD+N (%)
THD+N (%)
0.12
0.09
0.08
0.06
0.06
100 k:
0.04
100 k:
0.03
0.02
0
0
10
100
1k
10k
100k
10
100
FREQUENCY (Hz)
0.14
1k
10k
100k
FREQUENCY (Hz)
Figure 44.
Figure 45.
THD+N
vs.
Frequency
Closed Loop Output Impedance
vs.
Frequency
1000
+
V = 3V
+
V = 1V
OUTPUT IMPEDANCE (:)
0.12
THD+N (%)
0.1
600:
0.08
0.06
100 k:
0.04
100
10
1
0.1
0.02
0
10
100
1k
10k
100k
0.01
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 46.
Figure 47.
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APPLICATION INFORMATION
CIRCUIT DESCRIPTION AND ADVANTAGE OF THE LMV951
The LMV951 utilizes an internal voltage generator which allows for rail to rail input and output operation from 1 to
3V supplies. An internal switching frequency between 10 MHz and 15 MHz is used for generating the internal
voltages.
The bipolar input stage provides rail to rail input operation with no input bias current phase reversal and a
constant input offset voltage over the entire input common mode range.
The CMOS output stage provides a gain that is virtually independent of resistive loads and an output drive
current in excess of 35 mA at 1V. A further benefit of the output stage is that the LMV951 is stable in positive
unity gain at capacitive loads in excess of 1000 pF.
BATTERY OPERATED SYSTEMS
The maximum operating voltage is 3V and the operating characteristics are ensured down to 1V which makes
the LMV951 an excellent choice for battery operated systems using one or two NiCd or NiMH cells. The LMV951
is also functional at 0.9V making it an appropriate choice for a single cell alkaline battery.
SHUTDOWN CAPABILITY
While in shutdown mode, the LMV951 typically consumes less than 50 nA of supply current making it ideal for
power conscious applications. Full functionality is restored within 3 μs of enable.
SMALL SIZE
The small footprint of the LMV951 package is ideal for high density board systems. By using the small 6-Pin
SOT23 package, the amplifier can be placed closer to the signal source, reducing noise pickup and increasing
signal integrity.
POWER SUPPLY BYPASSING
As in any high performance IC, proper power supply bypassing is necessary for optimizing the performance of
the LMV951. The internal voltage generator needs proper bypassing for optimum operation. A surface mount
ceramic .01 µF capacitor must be located as close as possible to the V+ and V− pins (pins 2 and 6). This
capacitor needs to have low ESR and a self resonant frequency above 15 MHz. A small tantalum or electrolytic
capacitor with a value between 1 µF and 10 µF also needs to be located close to the LMV951.
DRIVING CAPACITIVE LOAD
The unity gain follower is the most sensitive op amp configuration to capacitive loading; the LMV951 can drive up
to 10,000 pF in this configuration without oscillation. If the application requires a phase margin greater than those
shown in the datasheet graphs, a snubber network is recommended. The snubber offers the advantage of
reducing the output signal ringing while maintaining the output swing which ensures a wider dynamic range; this
is especially important at lower supply voltages.
VCC
-
V
+
VOUT
+
-
V
+
VIN
VEE
RS
RL
CL
CS
-
Figure 48. Snubber Network to Improve Phase Margin
14
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The chart below gives recommended values for some common values of large capacitors. For these values RL =
2 kΩ;
RS
CS
500 pF
330Ω
6800 pF
680 pF
270Ω
8200 pF
1000 pF
220Ω
.015 μF
25 mV/DIV
25 mV/DIV
CL
+
+
V = 1V
V = 1V
1 Ps/DIV
1 Ps/DIV
Figure 49. 1000 pF and no Snubber
Figure 50. 1000 pF with Snubber
BRIDGE CONFIGURATION AMPLIFIER
Some applications may benefit from doubling the voltage across the load. With V+ = 1V a bridge configuration
can provide a 2 VPP output to the load with a resistance as low as 300Ω. The output stage of the LMV951
enables it to drive a load of 120Ω and still swing at least 70% of the supply rails.
The bridge configuration shown in Figure 51 enables the amplifier to maintain a low dropout voltage thus
maximizing its dynamic range. It has been configured in a gain of 1 and uses the fewest number of parts.
Resistor values have been selected to keep the current consumption to a minimum and voltage errors due to
bias currents negligible. Using the selected resistor values makes this circuit quite practical in a battery operated
design. R1, R2 and R5, R6 set up a virtual ground that is half of V+. Note that the accuracy of the resistor values
will establish how well the two virtual grounds match. Any errors in the virtual grounds will show as current
across RL when there is no input signal.
AC coupling the input signal sets the DC bias point of this signal to the virtual ground of the circuit. Using the
large resistor values with a 1 µF capacitor (C1) sets the frequency rolloff of this circuit below 10 Hz.
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LMV951
SNOSAI3C – OCTOBER 2006 – REVISED APRIL 2013
+
R7
10 k:
+
C1
1 PF 5V
V
A2
A1
R2
100 k:
-
RL
-
V
VL
R5
100 k:
+
V
+
VIN
C4
.1 PF
-
-
R1
100 k:
C3
.01 PF
C2
.01 PF
+
V
www.ti.com
V
R6
100 k:
SD
SD
R3
100 k:
R4
100 k:
Figure 51. Bridge Amplifier
•
•
•
C2 and C3 are .01 μF ceramic capacitors that must be located as close as possible to pin 6, the V+ pin. As
covered in the power supply bypassing section these capacitors must have low ESR and a self resonant
frequency above 15 MHz.
C4 is a 1 μF tantalum or electrolytic capacitor that should also be located close to the supply pin.
To use the shutdown feature tie pin 5 of the two parts together and connect through a 470 kΩ resistor to V+.
Add a switch between pin 5 and ground. Closing the switch keeps the parts in the active mode, opening the
switch sets the parts in the shutdown mode without adding any additional current to V+.
VIRTUAL GROUND CIRCUIT
The front page of this data sheet shows the LMV951 being used in a system establishing a virtual ground.
Having a buffered output stage gives this part the ability to handle load currents higher than 35 mA at 1V.
R3 and R4 are used to set the voltage of the virtual ground. To maintain low noise the values should be between
1 kΩ and 10 kΩ. C1 and C2 provide the recommended bypassing for the LMV951. These caps must be placed as
close as possible to pins 2 and 6.
TWO WIRE LINE TRANSMISSION
The robust output stage of the LMV951 makes it an excellent choice for driving long cables. The circuit shown
below in Figure 52 can drive a long cable using only two wires; power and ground.
When many sensors are located remotely from the control area the wiring becomes a significant expense. Using
only two wires helps minimize the wiring expense in a large project such as an industrial plant. Figure 53 shows
a 25 kHz signal after passing though 1000 ft. of twisted pair cable. Figure 54 shows a 200 kHz signal after
passing through 50 ft. of twisted pair cable.
16
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R3
1 k:
R1
10 k:
C2
10 PF
C6
.01 PF
+
V
+
C1
1 PF
SENSOR
C3
20 PF
CABLE
3V
3V
3V
R4
1 k:
R5
10 k:
R2
10 k:
-
V
+
A1
-
V
C4
1 PF
R6
10 k:
SD
+
A2
-
C5
10 PF
C6
.01 PF
OUTPUT
-
V
SD
200 mV/DIV
200 mV/DIV
Figure 52. Two Wire Line Driver
INPUT = 1 VPP
INPUT = 1 VPP
5 Ps/DIV
1 Ps/DIV
Figure 53. 25 kHz Through 1000 ft.
Figure 54. 200 kHz Through 50 ft.
The power supply of 3V is recommended to power this system. A1 and A2 are set up as unity gain buffers. It is
easy to configure A1 with the required gain if a gain of greater than one is required. C1 along with R1 and R2 are
used to ensure the correct DC operating point at the input of A1. C4 along with R5 and R6 are used to setup the
correct DC operating point for A2. C1, C3, and C4 have been selected to give about a 20% droop with a 1 kHz
square wave input.
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LMV951
SNOSAI3C – OCTOBER 2006 – REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
18
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 17
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LMV951MK/NOPB
ACTIVE
SOT
DDC
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
AS3A
LMV951MKX/NOPB
ACTIVE
SOT
DDC
6
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
AS3A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LMV951MK/NOPB
SOT
DDC
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV951MKX/NOPB
SOT
DDC
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV951MK/NOPB
SOT
DDC
6
1000
210.0
185.0
35.0
LMV951MKX/NOPB
SOT
DDC
6
3000
210.0
185.0
35.0
Pack Materials-Page 2
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