Material Content Data Sheet Sales Product Name TLE8458G MA# MA000977770 Package PG-DSO-8-16 Issued 28. August 2013 Weight* 83.61 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.909 4.68 0.009 0.01 0.036 0.04 429 0.717 0.86 8578 29.121 34.83 35.74 348317 357431 0.121 0.14 0.14 1445 1445 0.093 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 4.68 46750 46750 107 1114 4.285 5.13 42.199 50.48 55.72 504745 557113 0.814 0.97 0.97 9734 9734 0.650 0.78 0.78 7778 7778 0.363 0.43 1.288 1.54 51254 4345 1.97 15404 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 19749 1000000