$GYDQFHG 3RZHU 026)(7 IRF710A FEATURES BVDSS = 400 V ♦ Avalanche Rugged Technology ♦ Rugged Gate Oxide Technology RDS(on) = 3.6Ω ♦ Lower Input Capacitance ♦ Improved Gate Charge ID = 2 A ♦ Extended Safe Operating Area ♦ Lower Leakage Current: 10µA (Max.) @ VDS = 400V TO-220 ♦ Low RDS(ON): 2.815Ω (Typ.) 1 2 3 1.Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID Characteristic Drain-to-Source Voltage V Continuous Drain Current (TC=100°C) 1.3 VGS Gate-to-Source Voltage EAS Single Pulsed Avalanche Energy IAR Avalanche Current EAR dv/dt TL 400 2 Drain Current-Pulsed TJ , TSTG Units Continuous Drain Current (TC=25°C) IDM PD Value A 6 A ±30 V (2) 114 mJ (1) 2 A Repetitive Avalanche Energy (1) 3.6 mJ Peak Diode Recovery dv/dt (3) 4.0 V/ns 36 W 0.29 W/°C (1) Total Power Dissipation (TC=25°C) Linear Derating Factor Operating Junction and - 55 to +150 Storage Temperature Range °C Maximum Lead Temp. for Soldering 300 Purposes, 1/8 from case for 5-seconds Thermal Resistance Symbol Characteristic Typ. Max. RθJC Junction-to-Case -- 3.44 RθCS Case-to-Sink 0.5 -- RθJA Junction-to-Ambient -- 62.5 Units °C/W Rev. B ©1999 Fairchild Semiconductor Corporation 1&+$11(/ 32:(5 026)(7 IRF710A Electrical Characteristics (TC=25°C unless otherwise specified) Symbol Characteristic BVDSS Drain-Source Breakdown Voltage 400 -- -- ∆BV/∆TJ Breakdown Voltage Temp. Coeff. -- 0.53 -- 2.0 -- 4.0 Gate-Source Leakage , Forward -- -- 100 Gate-Source Leakage , Reverse -- -- -100 -- -- 10 -- -- 100 -- -- 3.6 IGSS IDSS RDS(on) Gate Threshold Voltage Drain-to-Source Leakage Current Static Drain-Source On-State Resistance gfs Forward Transconductance -- 1.29 -- Ciss Input Capacitance -- 215 280 Coss Output Capacitance -- 35 42 Crss Reverse Transfer Capacitance -- 13 17 td(on) Turn-On Delay Time -- 11 30 Rise Time -- 15 40 Turn-Off Delay Time -- 38 90 Fall Time -- 13 35 tr td(off) tf Qg Total Gate Charge -- 10 14 Qgs Gate-Source Charge -- 1.8 -- Qgd Gate-Drain ( Miller ) Charge -- 5.4 -- V Test Condition VGS=0V,ID=250µA V/°C ID=250µA V nA µA Ω Ω VGS(th) Min. Typ. Max. Units pF See Fig 7 VDS=5V,ID=250µA VGS=30V VGS=-30V VDS=400V VDS=320V,TC=125°C VGS=10V,ID=1A (4) VDS=50V,ID=1A (4) VGS=0V,VDS=25V,f =1MHz See Fig 5 VDD=200V,ID=2A, ns RG=24Ω See Fig 13 (4) (5) VDS=320V,VGS=10V, nC ID=2A See Fig 6 & Fig 12 (4) (5) Source-Drain Diode Ratings and Characteristics Symbol Characteristic IS Continuous Source Current Min. Typ. Max. Units -- -- 2 A Test Condition Integral reverse pn-diode ISM Pulsed-Source Current (1) -- -- 6 VSD Diode Forward Voltage (4) -- -- 1.5 V TJ=25°C,IS=2A,VGS=0V trr Reverse Recovery Time -- 224 -- ns TJ=25°C,IF=2A Qrr Reverse Recovery Charge -- 0.87 -- µC diF/dt=100A/µs Notes; (1) Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature (2) L=50mH, IAS=2A, VDD=50V, RG=27Ω, Starting TJ =25°C (3) ISD ≤ 2A, di/dt ≤ 80A/µs, VDD ≤ BVDSS , Starting TJ =25°C (4) Pulse Test: Pulse Width = 250µs, Duty Cycle ≤ 2% (5) Essentially Independent of Operating Temperature in the MOSFET (4) 1&+$11(/ 32:(5 026)(7 IRF710A Fig 1. Output Characteristics Fig 2. Transfer Characteristics VGS 15 V 10 V 8.0 V 7.0 V 6.0 V 5.5 V 5.0 V Bottom : 4.5 V 100 ID , Drain Current [A] ID , Drain Current [A] Top : 10-1 @ Notes : 1. 250 µs Pulse Test 2. TC = 25 oC 150 oC 10-1 @ Notes : 1. VGS = 0 V 2. VDS = 50 V 3. 250 µs Pulse Test 25 oC - 55 oC -2 10 100 -2 10-1 100 10 101 2 4 6 8 10 VGS , Gate-Source Voltage [V] VDS , Drain-Source Voltage [V] Fig 3. On-Resistance vs. Drain Current Fig 4. Source-Drain Diode Forward Voltage IDR , Reverse Drain Current [A] RDS(on) , [ Ω ] Drain-Source On-Resistance 8 VGS = 10 V 6 4 VGS = 20 V 2 @ Note : TJ = 25 oC 0 0 1 2 3 4 5 100 10-1 150 oC 25 oC 10-2 0.2 6 0.4 0.6 @ Notes : 1. VGS = 0 V 2. 250 µs Pulse Test 0.8 1.0 1.2 ID , Drain Current [A] VSD , Source-Drain Voltage [V] Fig 5. Capacitance vs. Drain-Source Voltage Fig 6. Gate Charge vs. Gate-Source Voltage 400 Ciss= Cgs+ Cgd ( Cds= shorted ) Coss= Cds+ Cgd Crss= Cgd C iss 200 @ Notes : 1. VGS = 0 V 2. f = 1 MHz C oss 100 C rss 00 10 101 VDS , Drain-Source Voltage [V] VGS , Gate-Source Voltage [V] Capacitance [pF] 300 VDS = 80 V 10 VDS = 200 V VDS = 320 V 5 @ Notes : ID = 2.0 A 0 0 2 4 6 QG , Total Gate Charge [nC] 8 10 1&+$11(/ 32:(5 026)(7 IRF710A Fig 7. Breakdown Voltage vs. Temperature Fig 8. On-Resistance vs. Temperature 3.0 RDS(on) , (Normalized) Drain-Source On-Resistance BVDSS , (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 0.9 0.8 -75 @ Notes : 1. VGS = 0 V 2. ID = 250 µA -50 -25 0 25 50 75 100 125 150 2.5 2.0 1.5 1.0 @ Notes : 1. VGS = 10 V 2. ID = 1.0 A 0.5 0.0 -75 175 -50 -25 TJ , Junction Temperature [oC] 0 25 50 75 100 125 150 175 TJ , Junction Temperature [oC] Fig 9. Max. Safe Operating Area Fig 10. Max. Drain Current vs. Case Temperature Operation in This Area is Limited by R DS(on) ID , Drain Current [A] 101 100 µs 1 ms 10 ms 100 DC -1 @ Notes : 1. TC = 25 oC 10 2.0 1.5 1.0 0.5 2. TJ = 150 oC 3. Single Pulse 10-2 0 10 101 102 0.0 25 103 50 75 100 Tc , Case Temperature [oC] VDS , Drain-Source Voltage [V] Thermal Response Fig 11. Thermal Response D=0.5 0 10 0.2 @ Notes : 1. Zθ J C (t)=3.44 o C/W Max. 2. Duty Factor, D=t1 /t2 3. TJ M -TC =PD M *Zθ J C (t) 0.1 0.05 10- 1 0.02 0.01 PDM t1 single pulse t2 θ Z JC(t) , ID , Drain Current [A] 2.5 10- 5 10- 4 10- 3 10- 2 10- 1 t1 , Square Wave Pulse Duration 100 [sec] 101 125 150 1&+$11(/ 32:(5 026)(7 IRF710A Fig 12. Gate Charge Test Circuit & Waveform Current Regulator VGS Same Type as DUT 50kΩ Qg 200nF 12V 10V 300nF VDS Qgs VGS Qgd DUT 3mA R1 R2 Current Sampling (IG) Resistor Charge Current Sampling (ID) Resistor Fig 13. Resistive Switching Test Circuit & Waveforms RL Vout Vout 90% VDD Vin ( 0.5 rated VDS ) RG DUT Vin 10% 10V td(on) tr td(off) t on tf t off Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD LL VDS Vary tp to obtain required peak ID BVDSS IAS ID RG C DUT ID (t) VDD VDS (t) VDD 10V tp tp Time 1&+$11(/ 32:(5 026)(7 IRF710A Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS -- IS L Driver VGS RG VGS VGS ( Driver ) Same Type as DUT VDD dv/dt controlled by RG IS controlled by Duty Factor D Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf Body Diode Forward Voltage Drop VDD TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 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