NTLJS3113P Power MOSFET −20 V, −7.7 A, Single P−Channel, 2x2 mm, WDFN Package Features • Recommended Replacement Device − NTLUS3A40P • WDFN Package Provides Exposed Drain Pad for Excellent Thermal • • • • • Conduction 2x2 mm Footprint Same as SC−88 Package Lowest RDS(on) Solution in 2x2 mm Package 1.5 V RDS(on) Rating for Operation at Low Voltage Logic Level Gate Drive Low Profile (< 0.8 mm) for Easy Fit in Thin Environments These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant www.onsemi.com V(BR)DSS ID MAX (Note 1) RDS(on) MAX 40 mW @ −4.5 V 50 mW @ −2.5 V −20 V −7.7 A 75 mW @ −1.8 V 200 mW @ −1.5 V S G Applications • DC−DC Converters (Buck and Boost Circuits) • Optimized for Battery and Load Management Applications in Portable Equipment such as, Cell Phones, PDA’s, Media Players, etc. D P−CHANNEL MOSFET • High Side Load Switch MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain Current (Note 1) Power Dissipation (Note 1) Steady State TA = 25°C t≤5s TA = 25°C Steady State Symbol Value Unit VDSS −20 V VGS ±8.0 V ID −5.8 A TA = 85°C Power Dissipation (Note 2) Pulsed Drain Current PIN CONNECTIONS 3.3 ID TA = 85°C TA = 25°C A −3.5 −2.5 PD 0.7 W IDM −23 A TJ, TSTG −55 to 150 °C Source Current (Body Diode) (Note 2) IS −2.8 A Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C tp = 10 ms Operating Junction and Storage Temperature May, 2016 − Rev. 6 D 1 D 2 G 3 D S 6 D 5 D 4 S (Top View) ORDERING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces). 2. Surface Mounted on FR4 Board using the minimum recommended pad size, (30 mm2, 2 oz Cu). © Semiconductor Components Industries, LLC, 2016 6 5 4 J8 = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) W 1.9 1 2 J8MG G 3 Pin 1 TA = 25°C TA = 25°C Steady State WDFN6 CASE 506AP −7.7 PD MARKING DIAGRAM D −4.4 t≤5s Continuous Drain Current (Note 2) S 1 Device Package Shipping† NTLJS3113PT1G WDFN6 (Pb−Free) 3000/Tape & Reel NTLJS3113PTAG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NTLJS3113P/D NTLJS3113P THERMAL RESISTANCE RATINGS Symbol Max Junction−to−Ambient – Steady State (Note 3) Parameter RqJA 65 Junction−to−Ambient – t ≤ 5 s (Note 3) RqJA 38 Junction−to−Ambient – Steady State Min Pad (Note 4) RqJA 180 Unit °C/W 3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces). 4. Surface Mounted on FR4 Board using the minimum recommended pad size (30 mm2, 2 oz Cu). MOSFET ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Symbol Test Conditions Min −20 Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = −250 mA Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/TJ ID = −250 mA, Ref to 25°C Zero Gate Voltage Drain Current IDSS Gate−to−Source Leakage Current VDS = −16 V, VGS = 0 V V −10.1 mV/°C TJ = 25°C −1.0 TJ = 85°C −10 IGSS VDS = 0 V, VGS = ±8.0 V Gate Threshold Voltage VGS(TH) VGS = VDS, ID = −250 mA Negative Gate Threshold Temperature Coefficient VGS(TH)/TJ ±1.0 mA mA ON CHARACTERISTICS (Note 5) Drain−to−Source On−Resistance RDS(on) Forward Transconductance gFS −0.45 −0.67 −1.0 2.68 V mV/°C VGS = −4.5, ID = −3.0 A 32 40 VGS = −2.5, ID = −3.0 A 44 50 VGS = −1.8, ID = −2.0 A 67 75 VGS = −1.5, ID = −1.8 A 90 200 VDS = −16 V, ID = −3.0 A 5.9 S 1329 pF mW CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS VGS = 0 V, f = 1.0 MHz, VDS = −16 V 213 120 Total Gate Charge QG(TOT) Threshold Gate Charge QG(TH) Gate−to−Source Charge QGS Gate−to−Drain Charge QGD 2.9 RG 14.4 W td(ON) 6.9 ns Gate Resistance 13 VGS = −4.5 V, VDS = −16 V, ID = −3.0 A 15.7 nC 1.5 2.2 SWITCHING CHARACTERISTICS (Note 6) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time tr td(OFF) VGS = −4.5 V, VDD = −10 V, ID = −3.0 A, RG = 3.0 W tf 17.5 60 56.5 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Recovery Voltage Reverse Recovery Time VSD TJ = 25°C −0.78 TJ = 125°C −0.67 tRR Charge Time ta Discharge Time tb Reverse Recovery Time VGS = 0 V, IS = −1.0 A 70.8 VGS = 0 V, dISD/dt = 100 A/ms, IS = −1.0 A QRR 14.3 www.onsemi.com 2 V 106 ns 56.4 44 5. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. 6. Switching characteristics are independent of operating junction temperatures. −1.2 nC NTLJS3113P TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) TJ = 25°C 9 −ID, DRAIN CURRENT (AMPS) −1.6 V 6 −1.5 V 5 4 −1.4 V 3 −1.3 V 2 −1.2 V 1 0 RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) VGS = −1.7 V to −8 V −1.1 V 0 1 4 3 2 6 5 VDS ≥ 10 V 8 7 6 5 4 3 TJ = 25°C 2 1 TJ = 125°C 0 0 3 Figure 2. Transfer Characteristics TJ = 100°C 0.03 TJ = 25°C TJ = −55°C 0.02 1.0 1.5 2.5 2.0 3.0 0.08 TJ = 25°C 0.07 VGS = −1.8 V 0.06 0.05 VGS = −2.5 V 0.04 0.03 VGS = −4.5 V 0.02 0.01 1 2 −ID, DRAIN CURRENT (AMPS) 100000 −IDSS, LEAKAGE (nA) 1.3 1.1 0.9 0 25 50 75 100 4 6 5 7 Figure 4. On−Resistance versus Drain Current and Gate Voltage ID = −6 A VGS = −4.5 V −25 3 −ID, DRAIN CURRENT (AMPS) Figure 3. On−Resistance versus Drain Current RDS(on), DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) 2.5 2 Figure 1. On−Region Characteristics VGS = −4.5 V 0.7 −50 1.5 1 0.5 −VGS, GATE−TO−SOURCE VOLTAGE (VOLTS) 0.04 1.5 TJ = −55°C −VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) −ID, DRAIN CURRENT (AMPS) 7 125 150 VGS = 0 V 10000 TJ = 150°C 1000 TJ = 100°C 100 10 2 4 6 8 10 12 14 16 18 TJ, JUNCTION TEMPERATURE (°C) −VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure 5. On−Resistance Variation with Temperature Figure 6. Drain−to−Source Leakage Current versus Voltage www.onsemi.com 3 20 NTLJS3113P VDS = VGS = 0 V C, CAPACITANCE (pF) 2400 TJ = 25°C Ciss 2000 1600 1200 Crss 800 Coss 400 0 5 VGS 0 VDS 5 10 15 20 QT 4 0 −Is, SOURCE CURRENT (AMPS) td(off) tf 100 tr td(on) 10 10 RG, GATE RESISTANCE (OHMS) 0 4 8 QG, TOTAL GATE CHARGE (nC) −ID, DRAIN CURRENT (AMPS) 10 VGS = 0 V 2.5 2 1.5 1 TJ = 150°C 0.5 TJ = 25°C 0.2 100 ms 1 ms 10 ms 1 0.01 RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.1 0.4 0.6 0.8 1.0 Figure 10. Diode Forward Voltage versus Current See Note 2, Page 1 SINGLE PULSE TC = 25°C 0.1 0 −VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS) Figure 9. Resistive Switching Time Variation versus Gate Resistance 100 12 4 Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge 0 0 100 8 QGD ID = −3.0 A TJ = 25°C 3 VDD = −15 V ID = −3.0 A VGS = −4.5 V 12 VGS 1 1000 t, TIME (ns) VDS 2 QGS Figure 7. Capacitance Variation 1 16 3 GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) 1 20 5 -V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS) 2800 -V GS, GATE-TO-SOURCE VOLTAGE (VOLTS) TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) dc 10 1 100 −VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area www.onsemi.com 4 NTLJS3113P EFFECTIVE TRANSIENT THERMAL RESISTANCE TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted) 1000 100 D = 0.5 0.2 0.1 10 0.05 P(pk) 0.02 0.01 1 0.1 0.000001 See Note 2 on Page 1 D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) − TA = P(pk) RqJA(t) t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.00001 0.0001 0.001 0.01 0.1 t, TIME (sec) Figure 12. Thermal Response www.onsemi.com 5 1 10 100 1000 NTLJS3113P PACKAGE DIMENSIONS WDFN6 2x2 CASE 506AP ISSUE B D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. CENTER TERMINAL LEAD IS OPTIONAL. TERMINAL LEAD IS CONNECTED TO TERMINAL LEAD # 4. 6. PINS 1, 2, 5 AND 6 ARE TIED TO THE FLAG. A B PIN ONE REFERENCE 0.10 C 2X 2X ÍÍÍ ÍÍÍ ÍÍÍ E DIM A A1 A3 b b1 D D2 E E2 e K L L2 J J1 0.10 C A3 0.10 C A 7X 0.08 C A1 C D2 6X L SOLDERING FOOTPRINT* SEATING PLANE 4X 1 2.30 e L2 3 b1 6X B 1 b J J1 0.60 1.25 NOTE 5 4 6X 0.35 0.43 0.05 C 6 1.10 6X 0.10 C A E2 K MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.25 0.35 0.51 0.61 2.00 BSC 1.00 1.20 2.00 BSC 1.10 1.30 0.65 BSC 0.15 REF 0.20 0.30 0.20 0.30 0.27 REF 0.65 REF 0.35 6X 0.10 C A 0.05 C B 0.34 NOTE 3 BOTTOM VIEW 0.65 PITCH 0.66 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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